CN105204599A - Laptop cooling device - Google Patents
Laptop cooling device Download PDFInfo
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- CN105204599A CN105204599A CN201510711846.0A CN201510711846A CN105204599A CN 105204599 A CN105204599 A CN 105204599A CN 201510711846 A CN201510711846 A CN 201510711846A CN 105204599 A CN105204599 A CN 105204599A
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- heat
- fan
- fin
- heat pipe
- notebook computer
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Abstract
The invention discloses a laptop cooling device. The laptop cooling device comprises a cooling module and a fan, wherein the cooling module comprises a heat pipe, fins connected with one another through the heat pipe and a plurality of cooling plates, one layer of medium is arranged on the surfaces of the cooling plates, the layer of medium is filled between the cooling plates and heating chips covered by the cooling plates; the fan is arranged beside the fins and is used for strengthening the ventilation condition near the fins; taking the back of the fan as an upper fan air outlet which is located at the left side of the device and gives a side-looking to the device; the heat pipe is arranged between the fan air outlet and the fins and is close to the side of fins; the pipe wall outside of the heat pipe and the outer surface of the side, not opposite to the chips, of the cooling plates are provided with temperature decreasing liquid layers.
Description
Technical field
The present invention relates to the parts of computer, be specially a kind of heat radiator for notebook computer.
Background technology
Along with the lifting of moving chip technology and performance thereof, the frequency of operation of electronic component and power consumption are also thereupon above-mentioned, which results in electronic component and discharge more than ever before heat at work, and the generation of heat and release, be related to the stability of whole computer system and the serviceable life of product, especially under market today portability and high performance trend, stable and effective cooling system will certainly be a very crucial technical matters, data display according to statistics, the Computer Hardware Malfunctions of nearly 80% is all because cooling system problem causes electronic component lost efficacy and caused at present.
Notebook computer due to structural volume restricted, the integrated level of each components and parts of working together is very high, heat dissipation problem is also a kind of is relatively one of technical bottleneck of being restricted of this computer development, conventional radiating mode mainly uses fan and the collocation of heat radiation module, also can take some other auxiliary heat dissipation modes, but both increase the equipment in the inside and outside portion of notebook, and its power consumption is less, radiating mode is complicated.
Summary of the invention
The present invention, in order to solve the problem of prior art, provides the simple and heat radiator for notebook computer that heat dispersion is good of a kind of structure.
Heat radiator for notebook computer of the present invention, comprise heat radiation module, fan, described heat radiation module comprises heat pipe, by the interconnective fin of heat pipe and some heat sinks, be provided with a dielectric layer on described heat sink surface, described dielectric layer is filled between the euthermic chip that heat sink and heat sink cover; Described fan is arranged on by fin, for strengthening the air circulation situation near fin; Be that upper fan outlet is positioned at this device of side-looking on the left of it with the back side of fan, described heat pipe to be arranged between fan outlet and fin and near fin side; Outside the tube wall of heat pipe and the outer surface of heat sink not relative with chip side cooling liquid layer is set.
Described heat pipe presents bending in various degree according to use scenes and connects fin and heat sink.
The air outlet of described fan is arranged facing to the radial direction of fin, and described heat pipe is arranged on coboundary near fin side or lower edge.
The each gap of the upper and lower surface at least 1.00mm of described fan and notebook computer component inside.
Described heat pipe is no more than 3 times in notebook computer inner bending, and total angle is not more than 60 degree.
The present invention adopts above technical scheme compared with prior art, has following technique effect:
This heat abstractor have employed the air-cooled means combined with water-cooled two kinds of sinking path, on the basis of traditional heat-dissipating device, adds the heat dispersion that little structure (cooling liquid layer) improves heat abstractor greatly;
Different experiments is carried out in the position of opposite heat tube, searches out optimum arrangement, to be arranged in by heat pipe between fan outlet and fin and temperature obviously rises after fin side makes air-out pass heat pipe, has good temperature reduction performance for the serious chip of heating; And on this basis, heat pipe is arranged near the coboundary of fin side or lower edge to reduce the noise of fan and higher air output.
Accompanying drawing explanation
Below with reference to accompanying drawing, the invention will be further described:
Fig. 1 is experiment heat pipe position general construction schematic diagram;
The heat radiator for notebook computer structure schematic diagram that Fig. 2 provides for this valve;
Wherein, 1-fan, 2-heat pipe, 3-fin, 4-heat sink, 5-lower the temperature liquid layer.
Embodiment
The invention provides a kind of heat radiator for notebook computer, for making object of the present invention, clearly, clearly, and the present invention is described in more detail with reference to accompanying drawing examples for technical scheme and effect.Should be appreciated that concrete enforcement described herein is only in order to explain the present invention, is not intended to limit the present invention.
Heat radiator for notebook computer as shown in Figure 1, comprise heat radiation module, fan 1, described heat radiation module comprises heat pipe 2, by the interconnective fin of heat pipe 23 and some heat sinks 4, be provided with a dielectric layer on described heat sink 4 surface, described dielectric layer is filled between the euthermic chip that heat sink and heat sink cover; It is other that described fan 1 is arranged on fin 3, for strengthening the air circulation situation near fin 3, the each gap of the upper and lower surface at least 1.00mm of fan and notebook computer component inside, to ensure the smooth and easy suction air stream of fan, the impedance of reduction system, if for thinner type, have immediately below fan into air holes, guide with the convection current increasing internal system hot blast and exchange.
As shown in Figure 2, be that upper fan 1 air outlet is positioned at this device of side-looking on the left of it with the back side of fan 1, the fan 1 that the present embodiment provides adopts L80*W80*T12.5mm type centrifugal fan, and attempt nine kinds of heat pipe 2 positions to the impact of fan cooling performance, experiment shows, when heat pipe 2 is arranged between fan outlet and fin and close fin 3 side, the heat dispersion being namely arranged in system during figure P7, P8, P9 position is optimum.
Be as another improvements of the present invention, can outside the tube wall of heat pipe 2 and the outer surface of heat sink 4 not relative with chip side cooling liquid layer 5 is set, using the high liquid of radiating efficiency as heat eliminating medium, strengthen the heat dispersion of this device.
Heat pipe presents bending in various degree according to use scenes and connects fin 3 and heat sink 4, heat pipe carries out the processing procedure bending and flatten in the production of notes heat pipe 2, the performance parameter of heat pipe 2 can be had influence on, because bending flattening can destroy the capillary structure of heat pipe 2 inside, the flattening of colleague's heat pipe can have influence on the vapor flowing space of in heat pipe 2, so under the prerequisite meeting mechanism space, minimizing heat pipe 2 bends and flattens and keeps optimized performance to be vital to it as far as possible, in the present embodiment, heat pipe is no more than 3 times in computer inner bending, and total angle is not more than 60 degree.
Under the condition of same vertical orientations, when heat pipe is in fin 3 middle position, the noise of fan is minimum, but the air quantity when fin 3 middle position is far below the situation on close fin 3 one side, so, when the radial direction that the air outlet of fan faces toward fin 3 is arranged, heat pipe is arranged on coboundary or lower edge, i.e. P7, P9 position in figure of close fin 3 side as far as possible.
Above embodiment is only and technological thought of the present invention is described, can not limit protection scope of the present invention with this, and every technological thought proposed according to the present invention, any change that technical scheme basis is done, all falls within scope.
Claims (5)
1. a heat radiator for notebook computer, comprise heat radiation module, fan, it is characterized in that, described heat radiation module comprises heat pipe, by the interconnective fin of heat pipe and some heat sinks, be provided with a dielectric layer on described heat sink surface, described dielectric layer is filled between the euthermic chip that heat sink and heat sink cover; Described fan is arranged on by fin, for strengthening the air circulation situation near fin; Be that upper fan outlet is positioned at this device of side-looking on the left of it with the back side of fan, described heat pipe to be arranged between fan outlet and fin and near fin side; Outside the tube wall of described heat pipe and the outer surface of heat sink not relative with chip side cooling liquid layer is set.
2. a kind of heat radiator for notebook computer according to claim 1, is characterized in that, described heat pipe presents bending in various degree according to use scenes and connects fin and heat sink.
3. a kind of heat radiator for notebook computer according to claim 1, is characterized in that, the air outlet of described fan is arranged facing to the radial direction of fin, and described heat pipe is arranged on coboundary near fin side or lower edge.
4. a kind of heat radiator for notebook computer according to claim 1, is characterized in that, each gap of the upper and lower surface at least 1.00mm of described fan and notebook computer component inside.
5. a kind of heat radiator for notebook computer according to claim 1, is characterized in that, described heat pipe is no more than 3 times in notebook computer inner bending, and total angle is not more than 60 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510711846.0A CN105204599A (en) | 2015-10-28 | 2015-10-28 | Laptop cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510711846.0A CN105204599A (en) | 2015-10-28 | 2015-10-28 | Laptop cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105204599A true CN105204599A (en) | 2015-12-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510711846.0A Pending CN105204599A (en) | 2015-10-28 | 2015-10-28 | Laptop cooling device |
Country Status (1)
| Country | Link |
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| CN (1) | CN105204599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107357393A (en) * | 2017-07-25 | 2017-11-17 | 合肥铭剑信息技术有限公司 | A kind of fast computer heat radiating device of radiating rate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101344808A (en) * | 2007-07-13 | 2009-01-14 | 华硕电脑股份有限公司 | Heat radiating module |
| CN201475950U (en) * | 2009-06-04 | 2010-05-19 | 何忠亮 | Heat dissipation substrate of LED lamp |
| CN102314196A (en) * | 2010-06-30 | 2012-01-11 | 英业达股份有限公司 | Notebook computer with easily-replaced cooling module |
| US20150189793A1 (en) * | 2013-12-30 | 2015-07-02 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Heat dissipation apparatus |
-
2015
- 2015-10-28 CN CN201510711846.0A patent/CN105204599A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101344808A (en) * | 2007-07-13 | 2009-01-14 | 华硕电脑股份有限公司 | Heat radiating module |
| CN201475950U (en) * | 2009-06-04 | 2010-05-19 | 何忠亮 | Heat dissipation substrate of LED lamp |
| CN102314196A (en) * | 2010-06-30 | 2012-01-11 | 英业达股份有限公司 | Notebook computer with easily-replaced cooling module |
| US20150189793A1 (en) * | 2013-12-30 | 2015-07-02 | Hong Fu Jin Precision Industry (Wuhan) Co., Ltd. | Heat dissipation apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107357393A (en) * | 2017-07-25 | 2017-11-17 | 合肥铭剑信息技术有限公司 | A kind of fast computer heat radiating device of radiating rate |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151230 |