CN102438429A - Cooling device of electronic equipment and electronic equipment - Google Patents
Cooling device of electronic equipment and electronic equipment Download PDFInfo
- Publication number
- CN102438429A CN102438429A CN2011102642502A CN201110264250A CN102438429A CN 102438429 A CN102438429 A CN 102438429A CN 2011102642502 A CN2011102642502 A CN 2011102642502A CN 201110264250 A CN201110264250 A CN 201110264250A CN 102438429 A CN102438429 A CN 102438429A
- Authority
- CN
- China
- Prior art keywords
- radiator
- passage
- air
- fin
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides the cooling device of electronic equipment and electronic equipment. The cooling device is high in efficiency. A centrifugal fan (101) is configured in an air chamber (110), and a radiator (107) is arranged in the vicinity of the centrifugal fan. A plurality of radiating fins are combined to heat absorption surfaces (107a and 107b) so as to form a plurality of air flow paths. A slit-shaped passage (107) is extended along the direction vertical to the plurality of radiating fins. The air pressurized through the centrifugal fan is discharged through exhaust ports (16) between the plurality of radiating fins and the passage.
Description
Technical field
The high efficiency heat abstractor that the present invention relates in electronic equipment, use, more detailed, relate to the heat abstractor of the rising of the housing temperature that can suppress electronic equipment.
Background technology
Notebook personal computer portable electric appts such as (being called notebook PC later on), the performance of electronic device such as processor or video chip improves in recent years, and perhaps the packing density of cabinet rises, and causes caloric value constantly to increase.The electronic device that holds in the inside of cabinet need make the temperature in the work be no more than permissible value in order to keep function.And because notebook PC takes or be placed on above-knee the operation with hand, the temperature that therefore needs to suppress cabinet rises.
For this purpose, carry the heat abstractor that constitutes by radiator, radiating tube and radiator fan etc. in the inside of notebook PC, through radiator the air that is taken into from the outside is carried out heat exchange and discharge by the strong hand then, dispel the heat internally thus or cool off.Combining the maximum processor of caloric value in electronic equipment via radiating tube on the radiator, so temperature rises.In addition, radiator is configured near the cabinet, and the temperature of cabinet is risen.
Patent documentation 1 discloses the cooling system that is applicable to notebook PC.The cooling system of the document is provided with air entry and metallic plate (plate) near radiator, use the temperature rising of dispelling the heat and suppressing cabinet from metallic plate from the extraneous air of air entry suction.Patent documentation 2 discloses a kind of electronic device cooling apparatus, and it keeps the tube-axial fan of cooling usefulness that air is guided to exhaust outlet through the inner inclination ground at electronic equipment, prevents near the localized heating of the keyboard that CPU is.
Patent documentation 3 discloses and has made air flow smooth and easy, improves the radiator of heat dispersion.The radiator of putting down in writing in the document possesses: can be installed in heated sheet on the thermal source, be arranged on radiating part on the heated sheet, in order to blow cooling air and the cooling fan that is provided with to radiating part.Radiating part possess on the heated sheet with upright heat-conducting plate that is provided with of predetermined space and the fin that between each heat-conducting plate, on vertical direction, disposes, the space is used in the suction and discharge that between the lower end of fin and heated sheet, formed cooling air.
In order to improve the heat-sinking capability of heat abstractor, generally make the air quantity (unit: CFM) increase the thermal resistance that reduces radiator, the area of dissipation of radiator is increased of radiator fan.The air quantity of radiator fan can increase or rotary speed is risen and increase, still, this method is being applied under the situation of notebook PC through the diameter that makes blade, has restriction at aspects such as size, consumes electric power and noises.
The heat-sinking capability of radiator improves through the area of dissipation that increases the fin that contacts with air, aspect size, has restriction when still in notebook PC, adopting.When design during cooling system, based on according to the caloric value (W) of electronic device and the ascending temperature of radiator (℃) thermal resistance value that radiator is required that calculates (℃/W), the area of dissipation of calculating radiator.Forcing in the forced heat radiation mode of blow air to radiator through radiator fan, improving the flow velocity through the air between fin more, thermal resistance reduces more, and heat-sinking capability is high more.
Therefore,,, the area of dissipation of radiator can be further reduced,, the temperature of radiator can be further reduced for identical area of dissipation for identical heat-sinking capability through improving the flow velocity of air.In the thinking of in the past cooling system, the structure of decision radiator in the scope that can in cabinet, hold for the wind speed that makes radiator increases, increases the diameter or the rev up of the blade of radiator fan.The cooling system that in current notebook PC, carries needs to tackle the increase of caloric value when requiring lightness, slimming and miniaturization.And, also require to reduce noise and consumes electric power.Realize having the cooling system of so multiple requirement through existing method, reached the limit.
In most notebook PC, in radiator fan, adopt to be suitable for being contained in the centrifugal fan in the slim cabinet.Centrifugal fan is air-breathing from the direction of principal axis of blade, to square with the axis direction exhaust.In the centrifugal fan, the air flow right angle orientation is crooked sometimes, compares with tube-axial fan, and big eddy current takes place near the discharge side of blade.If this eddy current is rectification, then think to hinder the flow velocity between the fin that should obtain, through suppressing eddy current, can reduce the thermal resistance of radiator.
It is effectively that the method for patent documentation 1 rises for the temperature that suppresses cabinet, but the heat dispersion of radiator is improved.In addition, the method for patent documentation 1 is arranged near the precalculated position the radiator with air entry, therefore, need spend time in order to adjust whole air balance sometimes.In addition, between the bottom surface of metallic plate and cabinet, form the stream of air, therefore, cabinet is thickening correspondingly.
Patent documentation 1: TOHKEMY 2008-112225 communique
Patent documentation 2: TOHKEMY 2000-227822 communique
Patent documentation 3: TOHKEMY 2007-42724 communique
Summary of the invention
Therefore, the object of the present invention is to provide the heat abstractor that is suitable for lightness, slimming and miniaturization.The present invention also aims to provide the heat abstractor that heat-sinking capability is improved.The present invention also aims to provide the heat abstractor of the minimizing that can seek noise and consumes electric power.The present invention also aims to provide the heat abstractor of the temperature rising that can suppress cabinet.The present invention also aims to provide the electronic equipment that has adopted this heat abstractor.
In the air chamber of heat abstractor, held centrifugal fan, in its circumferential arrangement radiator.Radiator possesses for forming a plurality of fin that many air flow circuits combine with the first side wall and second sidewall.So that upwardly extending mode has formed the passage of slit-shaped in the side vertical with respect to the face of a plurality of fin.Through the air after the centrifugal fan pressurization via being discharged from passage between a plurality of fin.The eddy current of the radiator porch that passage suppresses to cause through centrifugal fan, air passes through in air flow circuit swimmingly, makes air circulation improve.
Passage can be formed by the first side wall and the case that constitutes air chamber.Passage can also form the part of radiator.Can on second sidewall, combine radiating tube.The interval that can make fin and the height of passage are about equally.In addition, the height of passage can for the height of radiator more than 3% and be below 13%.
Through the invention provides the heat abstractor that is suitable for lightness, slimming and miniaturization.And, through the invention provides the heat abstractor that heat-sinking capability is improved.And, through the invention provides the heat abstractor of the minimizing that can seek noise and consumes electric power.And, through the invention provides the heat abstractor of the temperature rising that can suppress cabinet.And, through the invention provides the electronic equipment that has adopted this heat abstractor.
Description of drawings
Fig. 1 is from the place ahead and the stereogram of the notebook PC of execution mode of the present invention is observed at the rear.
Fig. 2 is the vertical view of the heat abstractor of this execution mode.
Fig. 3 is the partial perspective view of the heat abstractor of this execution mode.
Fig. 4 is installed in the figure from the observed cross section of A-A direction under the state in the system chassis after the heat abstractor upset that schematically shows Fig. 2 (A).
Fig. 5 is the figure of the heat-sinking capability of explanation heat abstractor.
Fig. 6 is the figure of the delay situation of the air stream in the explanation air chamber.
Fig. 7 is the figure that is illustrated in the example that has formed passage in the radiator.
Symbol description
10 notebook PC
15 system chassiss
100 heat abstractors
101 radiator fans
105,107,301,351 radiators
109 fan covers
110 air chambers
111 channel covers
125,127,129,313,315,367,369 radiating tubes
151 cases
309,361,363 fin
Embodiment
Fig. 1 (A) and Fig. 1 (B) are from the place ahead and the stereogram of the notebook PC of execution mode of the present invention is observed at the rear.Notebook PC10 is in the state that the display case 11 that keeps LCD device (LCD) 12 is opened from system chassis 15.Accommodate central arithmetic processing apparatus (CPU), GPU (GPU), main storage and hard disk drive a large amount of electronic devices such as (HDD) in the inside of system chassis 15.These electronic devices temperature in the course of the work rise and become pyrotoxin, make system chassis 15 temperature inside rise.
On the surface of system chassis 15, disposed keyboard 20 by palmrest 21 and keyboard frame 14 with surrounding.In addition, CD drive (ODD) 13 is installed in the side of system chassis 15, and has formed exhaust outlet 16,17 and air entry 18,19.Held forced air-cooled heat abstractor in the inside of system chassis 15, it is forced to suck extraneous air and from exhaust outlet 16,17 exhausts, inner heat is shed from air entry 18,19.
Fig. 2 is the vertical view of the forced air-cooled heat abstractor 100 of this execution mode.Fig. 3 is the partial perspective view of the heat abstractor 100 of this execution mode.Fig. 2 (A) is illustrated in the state that fan cover 109 and channel cover 111 have been installed on the case 151; The part that Fig. 2 (B) is illustrated in the top of case 151 has been removed the state of fan cover 109 and channel cover 111; Fig. 3 (A) is corresponding with Fig. 2 (A), the situation that Fig. 3 (B) expression has been decomposed channel cover 111 from the state of Fig. 3 (A).
In an example, the spacing of fin is 1mm.In addition, about radiator 105,107, the direction of the rotating shaft 103 of radiator fan 101 is called short transverse, the direction vertical with the plane of fin is called Width, the direction that air is flowed in air flow circuit is called depth direction.When radiator fan rotated, the heat that the portion 123 of being heated obtains was released through radiating tube 125 and radiator 107, and the heat that the portion 121 of being heated obtains is released through radiating tube 127,129 and radiator 105,107.In addition; Contact the air chamber that the back flows into heat abstractor 100 with the electronic device of cabinet inside from air entry 18,19 leaked-in airs; Therefore; Heat abstractor 100 not only can discharge the heat that obtains from the portion of being heated 121,123, can also discharge the heat of other electronic device that is contained in system chassis 15 inside.
Fig. 4 (A) is installed in the figure from the observed cross section of A-A direction under the state in the system chassis 15 after heat abstractor 100 upsets that schematically show Fig. 2 (A).The cross section of the same position when Fig. 4 (B) expression is installed in existing heat abstractor 50 in the identical systems cabinet 15.Fig. 4 (A) is merely with the difference of Fig. 4 (B): the height of radiator 107 is different; In Fig. 4 (A), be provided with channel cover 111, and a heating surface 107a of radiator 107 between formed passage 157.
In Fig. 4 (A), (B), between the bottom surface 22 of keyboard frame 14 and system chassis 15, disposed heat abstractor 100.On case 151, form air entry 153, on fan cover 109, form air entry 155.In Fig. 4 (A); Internal configurations radiator fan 101 at the air chamber 110 that forms through case 151, fan cover 109 and channel cover 111; In Fig. 4 (B), at the internal configurations radiator fan 101 of the air chamber 110 that forms through case 151 and fan cover 109.In exhaust outlet 16 sides of air chamber 110, configuration radiator 107 in Fig. 4 (A), configuration radiator 51 in Fig. 4 (B).
On another heating surface 107b of radiator 107, combine radiating tube 125,127.Sidewall with radiator 107 of heating surface 107a, 107b combines with fin.Existing radiator 51 is L1 highly, and the radiator 107 in this execution mode highly is L2 (L2＜L1).Channel cover 111 is configured in the scope corresponding with heating surface 107a.Radiator 107 is identical structure except height with radiator 51.
When being made as L3 to the height of passage 157, there is the relation of L1=L2+L3.That is, heat abstractor 100 is identical with the height of the case of heat abstractor 50.Cross over the Width of radiator 107 or the integral body of the direction vertical, formed the passage 157 of slit-shaped with equal height with the plane of fin.In addition, for enhance mechanical strength, can be from heating surface 107a support passage lid 111 partly.The height L1 of existing radiator 51 is 17mm in an example.The height L2 of the radiator 107 of this execution mode is 16mm in an example, and at this moment, the height of passage 157 becomes 1mm.In addition, represented only to be provided with the example of passage 157 in the drawings, still, also can passage likewise be set with channel cover to radiator 105 to radiator 107.
In heat abstractor 100, when radiator fan 101 rotation, the air that flow into air chamber 110 from air entry 153,155 is discharged to outside the system chassis 15 after through radiator 107 and exhaust outlet 16.In heat abstractor 100, portion of air is discharged from through passage 157, but in heat abstractor 50, only is discharged from through radiator 51.
Fig. 5 compares the figure that explains through the heat-sinking capability and the heat abstractor 50 of testing heat abstractor 100.In experiment, about heat abstractor 100,50, the rotary speed of radiator fan 101 is fixed as 3300rpm, identical heat load is provided, the height L2 that changes radiator 107 measures the flow velocity of radiator 107,51 and the temperature at each position.The transverse axis of Fig. 5 is represented the height L3 of passage 157 is changed into 2.0mm, 1.5mm, 1.0mm, this level Four of 0.5mm.And, about radiator 51, represent the height L3 of passage 157 with 0mm.
The temperature of line 201 expression heating surface 107b, 51b.The temperature of the position B of line 203 expression bottom surfaces 22, the temperature of the position C of line 205 expression keyboard frames 14.In addition, the wind speed of the outlet of line 207,209 expression radiators 107,51.The wind speed of the short transverse of line 207 expression radiators 107,51 and the center of Width is to be near the wind speed of the position of passage 157 on center, the short transverse on the line 209 expression Widths.
Can know that by Fig. 5 the temperature of heating surface 107b is than heating surface 51b low (line 201), the temperature of the position B of bottom surface 22 under the situation of having carried heat abstractor 100 than the situation of having carried heat abstractor 50 under low (line 203).The temperature of the position C of keyboard frame 14 under the situation of having carried heat abstractor 50 than the situation end that has carried heat abstractor 100 low (line 205).But the temperature of this degree rises can not become substantive issue, in addition, can solve through heat abstractor 100 integral body are moved configuration downwards.About wind speed, at the middle position of the short transverse of radiator 107,51, both do not have difference (line 207), and near the position passage 157 shows significant difference (line 209).In heat abstractor 100, the temperature of comparing heating surface 107b with heat abstractor 50 reduces, and therefore, compares the temperature that can reduce CPU with heat abstractor 50, and can reduce the temperature of bottom surface 22.
Can know that by Fig. 5 heat-sinking capability was the highest when the height L3 of passage 157 was 1.0mm.This height 1.0mm is equivalent to the spacing of fin.Can know that in addition in the gamut from 0.5m to 2.0mm, heat abstractor 100 is higher than the heat-sinking capability of heat abstractor 50.When the height L3 of passage 157 was 0.5mm, the height L2 of radiator 107 became 16.5mm, and the height of passage 157 is 3% with respect to the ratio of the height of radiator 107.In addition, when the height L3 of passage 157 was 2.0mm, the height L2 of radiator became 15mm, and the height of passage 157 is 13% with respect to the ratio of the height of radiator 107.
That is, the passage of the height of 3% to 13% scope of heat abstractor 100 height through forming radiator can make heat-sinking capability improve than the heat abstractor 50 of equal height.In addition,, the rotary speed of radiator fan 101 can be reduced, therefore the minimizing of noise and consumes electric power can be sought in that heat abstractor 100 and heat abstractor 50 are made as under the situation of identical heat-sinking capability.And, when being made as identical heat-sinking capability, can further reducing the height of heat abstractor 100 and seek miniaturization.
Although heat abstractor 100 reduces with respect to the height of heat abstractor 50 radiators, what heat-sinking capability improved the reasons are as follows.Can know that in heat abstractor 50, D produces bigger dynamic pressure in the position of Fig. 6 when the dynamic pressure in the air chamber 110 when making radiator fan 101 rotation are carried out sunykatuib analysis, but E also produces the little dynamic pressure bigger than other position than position D in the position.And can know that in the air flow circuit corresponding with position D, the E of radiator 107,105, flow velocity does not add near the degree corresponding with high dynamic pressure.
Its reason is, in centrifugal radiator fan, in the discharge side of blade bigger eddy current takes place, and the inlet of the air flow circuit that forms at fin, air form eddy current and hinder that air is smooth and easy to be passed through.Relative therewith;, eliminated in passage 157 eddy current when being set; Air can get into the air flow circuit that between fin, forms swimmingly; Therefore shown in line 209, near the flow velocity of the position of each air flow circuit the passage of in Fig. 4 (A), representing with scope 140 157 rises, and can reduce the thermal resistance of fin.And heating surface 107a itself also through the air heat radiation of passage 157, therefore helps the raising of heat-sinking capability.
So far, represented through the heating surface 107a of radiator 107 and the example of channel cover 111 formation passages 157, but the present invention also can become tunnel-shaped the part of radiator.Fig. 7 is the figure that explanation possesses the radiator of passage.In the radiator 301 of Fig. 7 (A), between the outer wall 305 of the inwall 307 of an end that has combined a plurality of fin 309 and radiator 301, formed passage 303.The other end of a plurality of fin 309 combines with the outer wall that possesses heating surface 311.
On the direction vertical, formed to slit-shaped passage 303 with the face of fin 309.In addition, passage 303 also can be used as the opening of complete slit-shaped and forms, and perhaps from the purpose that strengthens, also can outer wall 305 and inwall 303 partly be combined.On the heating surface 311 of the downside that is positioned at radiator 301, combine radiating tube 313,315.The heat that radiating tube 313,315 is obtained is given air through a plurality of fin 309 by conduction.In radiator 301, the circulation of the air near represented each air flow circuit of scope passage 303 310 becomes smooth and easy, and heat-sinking capability improves.
In the radiator 351 of Fig. 7 (B), between outer wall that possesses heating surface 359 and inwall 355, combine a plurality of fin 361, between outer wall that possesses heating surface 365 and inwall 357, combine a plurality of fin 363.Between inwall 35 and inwall 357, on the direction vertical, formed to slit-shaped passage 353 with the face of fin 361,363.On heating surface 359, combine radiating tube 367, on heating surface 365, combine radiating tube 369.
And the heat that heating surface 359 is obtained from radiating tube 367 is given air through fin 361 conduction, and the heat that radiating tube 369 is obtained is given air through fin 363 conduction.The mode that can increase through the height that makes the fin that combines with the heating surface of high temperature more, the position of the passage 353 on the Decision Height direction.In radiator 351, the circulation of the air near each air flow circuit of scope 360 expressions of passage 353 becomes smooth and easy, and heat-sinking capability improves.
So far, the present invention has been described, still, has the invention is not restricted to execution mode shown in the drawings,, certainly adopted known before this arbitrary structures as long as play effect of the present invention according to specific implementations shown in the drawings.
Claims (10)
1. a heat abstractor is characterized in that,
Have: be contained in the centrifugal fan in the air chamber;
Be configured in the periphery of said centrifugal fan, have for forming the radiator of a plurality of fin that many air flow circuits combine with the first side wall and second sidewall; And
The passage that slit-shaped is extended on the direction vertical with respect to the face of said a plurality of fin,
Air through after the said centrifugal fan pressurization is discharged from via said many air flow circuits and said passage.
2. heat abstractor according to claim 1 is characterized in that,
Formed said passage by said the first side wall and the case that constitutes said air chamber.
3. heat abstractor according to claim 1 is characterized in that,
Said tunnel-shaped becomes the part of said radiator.
4. according to each described heat abstractor in the claim 1 to 3, it is characterized in that,
On said second sidewall, combine radiating tube.
5. according to each described heat abstractor in the claim 1 to 4, it is characterized in that,
The interval of said fin and the height of said passage are about equally.
6. according to each described heat abstractor in the claim 1 to 5, it is characterized in that,
The height of said passage be said radiator height more than 3% and be below 13%.
7. electronic equipment is characterized in that having:
System chassis;
Electronic device in the inner heat of said system chassis;
The centrifugal fan that disposes in the air chamber that in said system chassis, carries;
Be configured in the periphery of said centrifugal fan, possess the radiator of a plurality of fin; And
For making the passage that extends through slit-shaped on the direction vertical through the part of air after the said centrifugal fan pressurization with respect to the face of said fin.
8. electronic equipment according to claim 7 is characterized in that,
Said electronic device comprises processor,
Has the radiating tube that combines with said processor and said radiator.
9. electronic equipment is characterized in that having:
System chassis;
Electronic device in the inner heat of said system chassis;
Centrifugal fan; And
Radiator, it possesses and forms a plurality of fin make many air flow circuits that pass through through the air after the said centrifugal fan pressurization and the passage that extends through slit-shaped on the direction vertical with respect to the face of said fin for the air that makes after the said pressurization.
10. a radiator that uses with the centrifugal fan combination is characterized in that,
Have: the first side wall;
Second sidewall;
For forming a plurality of fin that many air flow circuits combine with said the first side wall and said second sidewall; And
The passage that slit-shaped is extended on the direction vertical with respect to the face of said fin,
Air through after the said centrifugal fan pressurization can pass through said air flow circuit and said passage.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010210470A JP5127902B2 (en) | 2010-09-21 | 2010-09-21 | Electronic device heat dissipation device and electronic device |
| JP2010-210470 | 2010-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102438429A true CN102438429A (en) | 2012-05-02 |
| CN102438429B CN102438429B (en) | 2015-03-04 |
Family
ID=45986215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110264250.2A Active CN102438429B (en) | 2010-09-21 | 2011-09-07 | Cooling device of electronic equipment and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5127902B2 (en) |
| CN (1) | CN102438429B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112513468A (en) * | 2018-07-26 | 2021-03-16 | 微软技术许可有限责任公司 | Adaptive airflow guide in an electronic device |
| CN112703830A (en) * | 2018-09-05 | 2021-04-23 | 莲花热学解决方案股份有限公司 | Radiator with fan |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108490421A (en) * | 2018-06-08 | 2018-09-04 | 上海禾赛光电科技有限公司 | A kind of laser radar radiator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396508A (en) * | 2001-07-05 | 2003-02-12 | 株式会社东芝 | Cooling device containing fan and ventilation duct and electronic equipment containg cooling device |
| US20030218850A1 (en) * | 2000-12-11 | 2003-11-27 | Fujitsu Limited | Electronics device unit |
| CN1735330A (en) * | 2004-08-09 | 2006-02-15 | 欧姆龙株式会社 | Heat radiating structure for electronic equipment |
| CN101031195A (en) * | 2006-03-02 | 2007-09-05 | 古河电气工业株式会社 | A heat sink with a centrifugal fan |
| CN101174172A (en) * | 2006-10-30 | 2008-05-07 | 联想（新加坡）私人有限公司 | Housing temperature suppressing structure in electronic device and portable computer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4612609B2 (en) * | 2006-11-08 | 2011-01-12 | 富士通株式会社 | Electronic equipment unit |
-
2010
- 2010-09-21 JP JP2010210470A patent/JP5127902B2/en active Active
-
2011
- 2011-09-07 CN CN201110264250.2A patent/CN102438429B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030218850A1 (en) * | 2000-12-11 | 2003-11-27 | Fujitsu Limited | Electronics device unit |
| CN1396508A (en) * | 2001-07-05 | 2003-02-12 | 株式会社东芝 | Cooling device containing fan and ventilation duct and electronic equipment containg cooling device |
| CN1735330A (en) * | 2004-08-09 | 2006-02-15 | 欧姆龙株式会社 | Heat radiating structure for electronic equipment |
| CN101031195A (en) * | 2006-03-02 | 2007-09-05 | 古河电气工业株式会社 | A heat sink with a centrifugal fan |
| CN101174172A (en) * | 2006-10-30 | 2008-05-07 | 联想（新加坡）私人有限公司 | Housing temperature suppressing structure in electronic device and portable computer |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112513468A (en) * | 2018-07-26 | 2021-03-16 | 微软技术许可有限责任公司 | Adaptive airflow guide in an electronic device |
| CN112513468B (en) * | 2018-07-26 | 2023-02-17 | 微软技术许可有限责任公司 | Adaptive airflow guide in an electronic device |
| CN112703830A (en) * | 2018-09-05 | 2021-04-23 | 莲花热学解决方案股份有限公司 | Radiator with fan |
| CN112703830B (en) * | 2018-09-05 | 2023-09-26 | 莲花热学解决方案股份有限公司 | Radiator with fan |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012069551A (en) | 2012-04-05 |
| CN102438429B (en) | 2015-03-04 |
| JP5127902B2 (en) | 2013-01-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10948953B2 (en) | Optimized vent walls in electronic devices | |
| US10285303B2 (en) | Electronic device with integrated passive and active cooling | |
| US6111748A (en) | Flat fan heat exchanger and use thereof in a computing device | |
| US8482916B2 (en) | Mobile computing apparatus | |
| JP4532422B2 (en) | Heat sink with centrifugal fan | |
| JP2004179631A (en) | Cooling mechanism of electronic device | |
| JP2007047998A (en) | Electronic component cooling structure and information processor | |
| US20080180910A1 (en) | Portable Electronic Apparatus | |
| US20100103616A1 (en) | Electronic device with centrifugal fan | |
| JP2009169752A (en) | Electronic equipment | |
| US20050183848A1 (en) | Coolant tray of liquid based cooling device | |
| JP2009156187A (en) | Electronic apparatus provided with centrifugal fan device | |
| EP2434542A2 (en) | Heat dissipation device with multiple heat conducting pipes | |
| CN102438429B (en) | Cooling device of electronic equipment and electronic equipment | |
| US20050094371A1 (en) | Electronic device and heat-dissipating module thereof | |
| US20110042043A1 (en) | Heat dissipation module | |
| CN201557360U (en) | Cooling fan device and electronic computing system thereof | |
| JP2007122132A (en) | Portable electronic apparatus | |
| US20160070319A1 (en) | Heat sink | |
| CN217484805U (en) | Cabinet | |
| CN105204599A (en) | Laptop cooling device | |
| CN216052952U (en) | Heat dissipation protection device for desktop computer main body | |
| JP7248747B2 (en) | Electronics | |
| CN211827160U (en) | All-in-one machine containing ATX | |
| CN216123363U (en) | Flat panel detector with efficient heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |