CN102424995A - Tin-indium alloy electroplating liquid - Google Patents
Tin-indium alloy electroplating liquid Download PDFInfo
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- CN102424995A CN102424995A CN2011104245678A CN201110424567A CN102424995A CN 102424995 A CN102424995 A CN 102424995A CN 2011104245678 A CN2011104245678 A CN 2011104245678A CN 201110424567 A CN201110424567 A CN 201110424567A CN 102424995 A CN102424995 A CN 102424995A
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- acid
- sulfonic acid
- alloy electroplating
- electroplating liquid
- sequestrant
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Abstract
The invention discloses a tin-indium alloy electroplating liquid, comprising an aqueous solution, wherein, the aqueous solution comprises metastannate (IV), trivalent indium salts of organic carboxylic acid or trivalent indium salts of sulfonic acid, chelating agent and caustic alkali having the pH value of 8-10. The tin-indium alloy electroplating liquid provided herein has stable property in storage, transportation and using. After electroplating, an electroplating film having excellent smoothness and brightness is formed, and the toughness of the film is obviously improved.
Description
Technical field
The invention belongs to the electroplate liquid field, be specifically related to a kind of Sn-In alloy electroplating liquid.
Background technology
Soil and phreatic pollution have become the topic that people pay close attention in recent years, and this pollution is because of causing through acid rain wash-out lead from the tin-lead alloy that is used for useless household electrical appliance.This is because tin-lead alloy is widely used in assembling electronic element.Thereby people place hope on and develop lead-free field weld alloy or welding plating.As a kind of electro-plating method that can not cause the problems referred to above, Sn-In alloy is electroplated and is considered to likely.So far, tin/indium alloy is electroplated and is used to carry out the lower melting point plating, and in the Sn-In alloy electro-plating method of many routines, the content of indium is 40～60 Wt.%.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of Sn-In alloy electroplating liquid that is formed with the some plated film of excellent slipperiness and brightness.
For solving the problems of the technologies described above; The technical scheme that the present invention adopted is: a kind of Sn-In alloy electroplating liquid, and it comprises a kind of aqueous solution, and the said aqueous solution comprises inclined to one side tin (IV) hydrochlorate; The trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid, sequestrant and pH value are 8～10 caustic alkali.
Said organic acid have carboxylic acid or sulfonic acid be selected from following at least a: methanesulfonic, ethane sulfonic acid, propane sulfonic acid, hydroxyl methanesulfonic, 2-hydroxyethanesulfonic acid, 2-hydroxypropanesulfonic acid, α-carboxyl ethane sulfonic acid, 1; 2-dihydroxyl ethane sulfonic acid, 1; 2-dicarboxyl ethane sulfonic acid, sulfo-succinic acid, Phenylsulfonic acid, adjacent phenol sulfonic acid, a phenol sulfonic acid, sulfocarbolic acid, formic acid, acetate, propionic acid, butyric acid, valeric acid, concentration 1 2～3 0g/L of the trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid.
Sequestrant be selected from following at least a: lithium, sodium and the sylvite of nicotinic acid, pyridine-3-sulphonic acid, quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline, YD 30, ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetate, iminodiethanoic acid Hydrocerol A, tartrate, glyconic acid, enanthic acid, oxysuccinic acid and xitix, the total concn of sequestrant is 50～350g/L.
Caustic alkali is to be selected from least a in following: Lithium Hydroxide MonoHydrate, sodium hydroxide and Pottasium Hydroxide, its total concn are 10～200g/L.
Beneficial effect of the present invention: a kind of Sn-In alloy electroplating liquid provided by the present invention, stable performance in storing transportation and use is formed with the some plated film of excellent slipperiness and brightness after the plating, and the toughness of coating improves significantly.
Embodiment
Embodiment 1
Prepare a kind of electroplate liquid (pH=9.5), it comprises the metastannic acid potassium (Sn of 27g/L
4+), the ethane sulfonic acid (In of 13g/L
3+), the nicotinic acid of 150g/L and 100g/L be as the Pottasium Hydroxide of pH regulator agent.Adopt this electroplate liquid, under the electric current of 2A, electroplated 5 minutes.Estimate the outward appearance of the electroplating film of formation with mode relatively.As relatively, prepare and a kind ofly replace ethane sulfonic acid (In with indium sulfate
3+) electroplate liquid, adopt seignette salt as sequestrant, without methylsulfonic acid as the conduction salt forming agent.Then, adopt this electroplate liquid of relatively using, with as above identical condition under carry out the Hull cell experiment, test-results shows that effect of the present invention is more even, smooth, bright.
Embodiment 2
Prepare a kind of electroplate liquid (pH=10), it comprises the sodium metastannate (Sn of 16g/L
4+), propane sulfonic acid and propionic acid and the sulfo-succinic acid (In of 30g/L
3+), the YD 30 of 340g/L and quinoline-2-sulfonic acid and 180g/L be as the sodium hydroxide of pH regulator agent.Adopt this electroplate liquid, under the electric current of 4A, electroplated 10 minutes.Estimate the outward appearance of the electroplating film of formation with mode relatively.As relatively, prepare a kind of with indium sulfate replacement propane sulfonic acid and propionic acid and sulfo-succinic acid (In
3+) electroplate liquid, adopt seignette salt as sequestrant, without methylsulfonic acid as the conduction salt forming agent.Then, adopt this electroplate liquid of relatively using, with as above identical condition under carry out the Hull cell experiment, test-results shows that effect of the present invention is more even, smooth, bright.
Claims (4)
1. Sn-In alloy electroplating liquid, it comprises a kind of aqueous solution, and the said aqueous solution comprises inclined to one side tin (IV) hydrochlorate, the trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid, sequestrant and pH value are 8～10 caustic alkali.
2. Sn-In alloy electroplating liquid according to claim 1; It is characterized in that; Said organic acid have carboxylic acid or sulfonic acid be selected from following at least a: methanesulfonic, ethane sulfonic acid, propane sulfonic acid, hydroxyl methanesulfonic, 2-hydroxyethanesulfonic acid, 2-hydroxypropanesulfonic acid, α-carboxyl ethane sulfonic acid, 1; 2-dihydroxyl ethane sulfonic acid, 1; 2-dicarboxyl ethane sulfonic acid, sulfo-succinic acid, Phenylsulfonic acid, adjacent phenol sulfonic acid, a phenol sulfonic acid, sulfocarbolic acid, formic acid, acetate, propionic acid, butyric acid, valeric acid, the concentration 12～30g/L of the trivalent indium salt of the trivalent indium salt of organic carboxyl acid or sulfonic acid.
3. Sn-In alloy electroplating liquid according to claim 1; It is characterized in that; Sequestrant be selected from following at least a: lithium, sodium and the sylvite of nicotinic acid, pyridine-3-sulphonic acid, quinoline, quinolinic acid, quinoline-3-sulfonic acid, quinoline-2-sulfonic acid, hydroxyquinoline, YD 30, ethylenediamine triacetic acid, ethylenediamine-N,N'-diacetic acid(EDDA), nitrotrimethylolmethane acetate, iminodiethanoic acid Hydrocerol A, tartrate, glyconic acid, enanthic acid, oxysuccinic acid and xitix, the total concn of sequestrant is 50～350g/L.
4. Sn-In alloy electroplating liquid according to claim 1 is characterized in that, caustic alkali is to be selected from least a in following: Lithium Hydroxide MonoHydrate, sodium hydroxide and Pottasium Hydroxide, its total concn are 10～200g/L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104245678A CN102424995A (en) | 2011-12-17 | 2011-12-17 | Tin-indium alloy electroplating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104245678A CN102424995A (en) | 2011-12-17 | 2011-12-17 | Tin-indium alloy electroplating liquid |
Publications (1)
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| CN102424995A true CN102424995A (en) | 2012-04-25 |
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| CN2011104245678A Pending CN102424995A (en) | 2011-12-17 | 2011-12-17 | Tin-indium alloy electroplating liquid |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106544665A (en) * | 2016-11-27 | 2017-03-29 | 湖南金裕化工有限公司 | Nigrescence minute surface adds lustre to anticorrodent and preparation method thereof |
| CN106676594A (en) * | 2016-06-10 | 2017-05-17 | 太原工业学院 | Low-cost cyanide-free copper-zinc-tin alloy electroplating solution and copper-zinc-tin alloy electroplating technology thereof |
| CN106756957A (en) * | 2016-11-27 | 2017-05-31 | 湖南金裕化工有限公司 | A kind of environmentally friendly nigrescence minute surface adds lustre to anticorrodent and preparation method thereof |
| CN106756958A (en) * | 2016-11-27 | 2017-05-31 | 湖南金裕化工有限公司 | A kind of environmentally friendly hair blackening liquid and preparation method thereof |
| JP2020503383A (en) * | 2016-12-23 | 2020-01-30 | エスセエ フランス | Compounds based on elements from the boron group and their use in electrolyte compositions |
| US11686007B2 (en) | 2017-12-18 | 2023-06-27 | New Mexico Tech University Research Park Corporation | Tin-indium alloy electroplating solution |
Citations (6)
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|---|---|---|---|---|
| JPH0633498B2 (en) * | 1990-10-17 | 1994-05-02 | 株式会社コサク | Tin-lead alloy electroplating bath composition |
| CN1314501A (en) * | 2000-01-17 | 2001-09-26 | 日本麦克德米德株式会社 | Sn-In alloy electroplating liquid and its preparing method |
| JP3366851B2 (en) * | 1997-12-18 | 2003-01-14 | 株式会社ジャパンエナジー | Tin alloy electroplating solution and plating method |
| CN1570219A (en) * | 2003-04-07 | 2005-01-26 | 罗姆和哈斯电子材料有限责任公司 | Electroplating compositions and methods |
| CN1590596A (en) * | 2003-08-08 | 2005-03-09 | 罗姆和哈斯电子材料有限责任公司 | Electroplating on composite substrates |
| CN1742118A (en) * | 2003-01-24 | 2006-03-01 | 石原药品株式会社 | Tin-containing plating bath |
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2011
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Patent Citations (6)
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| JPH0633498B2 (en) * | 1990-10-17 | 1994-05-02 | 株式会社コサク | Tin-lead alloy electroplating bath composition |
| JP3366851B2 (en) * | 1997-12-18 | 2003-01-14 | 株式会社ジャパンエナジー | Tin alloy electroplating solution and plating method |
| CN1314501A (en) * | 2000-01-17 | 2001-09-26 | 日本麦克德米德株式会社 | Sn-In alloy electroplating liquid and its preparing method |
| CN1742118A (en) * | 2003-01-24 | 2006-03-01 | 石原药品株式会社 | Tin-containing plating bath |
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| 徐瑞东: "锡合金镀层工艺的研究现状与展望", 《电镀与涂饰》, vol. 22, no. 3, 30 June 2003 (2003-06-30), pages 44 - 50 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106676594A (en) * | 2016-06-10 | 2017-05-17 | 太原工业学院 | Low-cost cyanide-free copper-zinc-tin alloy electroplating solution and copper-zinc-tin alloy electroplating technology thereof |
| CN106544665A (en) * | 2016-11-27 | 2017-03-29 | 湖南金裕化工有限公司 | Nigrescence minute surface adds lustre to anticorrodent and preparation method thereof |
| CN106756957A (en) * | 2016-11-27 | 2017-05-31 | 湖南金裕化工有限公司 | A kind of environmentally friendly nigrescence minute surface adds lustre to anticorrodent and preparation method thereof |
| CN106756958A (en) * | 2016-11-27 | 2017-05-31 | 湖南金裕化工有限公司 | A kind of environmentally friendly hair blackening liquid and preparation method thereof |
| JP2020503383A (en) * | 2016-12-23 | 2020-01-30 | エスセエ フランス | Compounds based on elements from the boron group and their use in electrolyte compositions |
| US11228057B2 (en) | 2016-12-23 | 2022-01-18 | Sce France | Compounds based on an element from the boron group, and use thereof in electrolyte compositions |
| JP7055817B2 (en) | 2016-12-23 | 2022-04-18 | エスセエ フランス | Element-based compounds from the Boron group, and their use in electrolyte compositions |
| US11686007B2 (en) | 2017-12-18 | 2023-06-27 | New Mexico Tech University Research Park Corporation | Tin-indium alloy electroplating solution |
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Application publication date: 20120425 |