CN102424154B - Hot sealing encapsulation assembly - Google Patents
Hot sealing encapsulation assembly Download PDFInfo
- Publication number
- CN102424154B CN102424154B CN 201110227904 CN201110227904A CN102424154B CN 102424154 B CN102424154 B CN 102424154B CN 201110227904 CN201110227904 CN 201110227904 CN 201110227904 A CN201110227904 A CN 201110227904A CN 102424154 B CN102424154 B CN 102424154B
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- China
- Prior art keywords
- heat seal
- cutting die
- hot sealing
- film
- high temperature
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- 238000005538 encapsulation Methods 0.000 title abstract description 19
- 238000007789 sealing Methods 0.000 title abstract description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 8
- 238000000354 decomposition reaction Methods 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003814 drug Substances 0.000 abstract description 4
- 239000000741 silica gel Substances 0.000 abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 abstract description 4
- 239000002537 cosmetic Substances 0.000 abstract description 2
- 238000002955 isolation Methods 0.000 abstract 2
- 238000003723 Smelting Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 78
- 238000012856 packing Methods 0.000 description 34
- 238000004806 packaging method and process Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Abstract
The invention discloses a hot sealing encapsulation assembly, which comprises a hot sealing cutting die, wherein a positioning isolation element linked with the hot sealing cutting die is arranged at the side surface of the hot sealing cutting die and is a high-temperature-resistance silica gel sheet, the high-temperature-resistance silica gel sheet is tightly pasted on the side surface of the hot sealing cutting die, and the lower end surface on the high-temperature-resistance silica gel sheet and for tightly pressing a film is higher than the lower end surface of the hot sealing cutting die for hot sealing. The hot sealing encapsulation assembly is characterized in that firstly, two layers of films are tightly pressed by the positioning isolation element, on one hand, the films isare reliably positioned so that the hot sealing encapsulation is favorably realized, simultaneously, the air circulation between an encapsulation line and a package cavity can be completely isolated, and the secondary pollution on package objects caused by harmful gas generated by film decomposition during the hot smelting is avoided. The hot sealing encapsulation assembly is applicable to the hot sealing encapsulation on objects such as food, medicine, cosmetics and the like.
Description
The application be to application number be 201010142151.2 application for a patent for invention divide an application the applying date of original application: on April 9th, 2010, the denomination of invention of original application: a kind of heat seal method for packing of plastic sheeting and heat seal package assembling.
Technical field
The present invention relates to the packing technique field, especially relate to a kind of heat seal package assembling for blister-pack.
Background technology
At present, the heat seal of plastic sheeting encapsulation is widely used in the packing of food, medicine and cosmetics, and it has that cost is low, packaging efficiency is high and plurality of advantages such as moisture-proof and seepage-proof leakage.Concrete application mode has following several: (1) liquid is packed continuously, and film raw material is double-deck long strap of film, its dual-side involution.During packing, in strap, pour into packing material, the horizontal involution in the two ends of strap and cut-out then, thus finish encapsulation; (2) unit packaging, the packing material of packing in the plastic bag of an end opening or single cavity uses the heat seal package assembling with the opening involution of plastic bag or single cavity then; (3) have at least thin film to be provided with cavity to be used for placing packing material in the double-layer films, the heat-fastening knife of heat seal package assembling is molded as the shape consistent with the packaging line that requires, then with double-layer films at packaging line place involution, this manner of packing can be individual packaging, also can be many body packings, packaging line is all arranged between a plurality of packing materials, thereby a plurality of packing materials are spaced from each other.The groundwork of above-mentioned heat seal encapsulation is: be provided with the heat seal cutting die at the heat seal package assembling, the shape of heat seal cutting die is identical with the shape of packaging line, the heat seal package assembling heats the heat seal cutting die by heating arrangement, and make on its temperature that maintains a setting, the heat seal cutting die is pressed close to and is compressed film, bond mutually after the film melted by heating, the heat seal cutting die resets, and encapsulation is also finished in the film cooling.Though film for packaging is harmless to human body, but film produces poisonous decomposition gas on a small quantity in when encapsulation because being subjected to high temperature fusion meeting, and decomposition gas enters in the packing cavity and enters in the food, medicine of packing, thereby causes the secondary pollution to packing material.Above-mentioned food or the medicine that is subjected to light contamination of the long-term absorption of human body can produce adverse influence to health.At present, some comparatively advanced heat-sealing machines are arranged, as high-frequency thermocompressor, supersonic heat-conglutinating machine and the heat-sealing machine that adopts laser technology, though the quality of its heat seal encapsulation and efficient etc. have significant improvement, but between the film of heat seal still by melt bonded together, thereby can't avoid packing material is caused secondary pollution.Even we are the polythene bag of usefulness at ordinary times, when opening and using, also often easily smell residual melten gel in it and decompose the smell that just has.
Disclosed on the Chinese patent literature " a kind of fluid encapsulated moulding device and method ", its publication number is CN101337593A, by settling upper film and following film respectively at middle die holder and die shoe, and perfusion of fluid is on following film, vacuum cavity by valve closed mold seat and die shoe place, can utilize the gas in the vacuum pump unit extracting vacuum cavity and form near vacuum state, again by with middle die holder, the seat that seals that die shoe forms butt joint up and down carries out Heat Sealing, the periphery that makes upper film and following film is near vacuum state involution and coat fluid next time, and fluid not have bubble residual.This invention will be packed cavity and be evacuated in when encapsulation, be conducive to prolong the shelf-life of packing material, but the micro-decomposition gas can't avoid encapsulating equally the time is to the secondary pollution of packing material.
Summary of the invention
The present invention be for overcome existing heat seal packaged type both package assembling easily packing material is produced the deficiency of secondary pollution, provide a kind of and can effectively completely cut off the heat seal package assembling that decomposition gas enters the interior plastic sheeting of packing cavity.
To achieve these goals, the present invention is by the following technical solutions:
A kind of heat seal package assembling, comprise the heat seal cutting die, be provided with the location separating element with its interlock in the side of heat seal cutting die, described location separating element is the high temperature resistant silicon film, the high temperature resistant silicon film is close to the side of heat seal cutting die, exceeds the lower surface that the heat seal cutting die is used for heat seal in order to the lower surface that compresses film on the high temperature resistant silicon film.High temperature resistant silica gel has better elastic and insulating power, can bear simultaneously the heat-seal temperature of heat seal cutting die, owing to be provided with its interlock in the side of heat seal cutting die and be higher than the high temperature resistant silicon film of heat seal cutting die, therefore, can guarantee that the high temperature resistant silicon film contacts with film earlier before the heat seal cutting die carries out packaging by hot pressing, and utilize the elasticity of high temperature resistant silicon film that film is compressed, thereby play in advance location and the effect that cuts off of film, the decomposition gas that produces when guaranteeing packaging by hot pressing can not enter in the packing cavity.Because high temperature resistant silicon film and heat seal cutting die link, therefore be conducive to simplified structure and action step, improve packaging efficiency.
As preferably, described high temperature resistant silicon film is being fitted with metal sheeting for the end face that compresses film, thereby make its end face that is used to compress film that enough hardness be arranged, and then guarantee that it cuts off effect, metal sheeting has better radiating effect simultaneously, thereby can avoid the film decomposes near packaging line.
As preferably, described high temperature resistant silicon film is being provided with the groove that transmits for the heat that reduces between heat seal cutting die and the high temperature resistant silicon film near heat seal cutting die one side, at the high temperature resistant silicon film groove is set, can reduce the area of contact with the heat seal cutting die, thereby reduce the transmission of heat between the two, be conducive to prolong the service life of high temperature resistant silicon film; The lower surface of described high temperature resistant silicon film exceeds heat seal cutting die lower surface 1mm-5mm, thereby can guarantee that the high temperature resistant silicon film can position film and cuts off prior to the heat seal cutting die, and maintains enough pressure, and is reliable with what guarantee to cut off.
As preferably, be respectively equipped with the location separating element in the two sides of heat seal cutting die, thereby can avoid decomposition gas to enter the cavity of packaging line both sides, be applicable to that all there are many body packings of packing material the packaging line both sides.
Therefore, the present invention has following beneficial effect: (1) cuts off the decomposition gas in when encapsulation, avoids packing material to be subjected to secondary pollution; (2) the location separating element is simple in structure, is convenient to adopt.
Description of drawings
Fig. 1 is the structural representation of the heat seal package assembling of embodiments of the invention 1;
Fig. 2 is the structural representation of location separating element when contacting with film of the heat seal package assembling of embodiment 1;
Fig. 3 is the structural representation of heat seal cutting die when Heat Sealing of the heat seal package assembling of embodiment 1;
Fig. 4 is the structural representation of the heat seal package assembling of embodiments of the invention 2;
Fig. 5 is the structural representation of location separating element when contacting with film of the heat seal package assembling of embodiment 2;
Fig. 6 is the structural representation of heat seal cutting die when Heat Sealing of the heat seal package assembling of embodiment 2.
The specific embodiment
The present invention will be further described below in conjunction with accompanying drawing and the specific embodiment.
Embodiment 1: a kind of heat seal package assembling as shown in Figure 1; what it adopted is the hot melt adhesive mode; be mainly used in the monomer encapsulation; include a heat seal cutting die 1; the location separating element that sheet is fixedly arranged in a side of heat seal cutting die; described location separating element is high temperature resistant silicon film 2; its thickness and heat seal cutting die are basic identical; and be close to the side of heat seal cutting die; while arranges separated groove 21 in the centre of the side of high temperature resistant silicon film and the applying of heat seal cutting die, and the degree of depth of groove is about 1mm.For guaranteeing that the high temperature resistant silicon film can compress film 4 reliably, the high temperature resistant silicon film exceeds heat seal cutting die end face 3mm in order to the end face that compresses film, and be the metal sheeting 5 of 1mm at its end face bonding one layer thickness, described metal sheeting can adopt corrosion-resistant steel to make, the existing certain rigidity of corrosion-resistant steel and elasticity, good heat-conducting is arranged again, and can avoid getting rusty.When the heat seal package assembling of present embodiment carries out the heat seal encapsulation at the heat seal cutting die to film, the packing cavity 7 built-in packing materials that are placed with that constituted by double-layer films 4 up and down, film is transported to heat seal station 6, the action of heat seal this moment package assembling, the heat seal cutting die descends and close film, as shown in Figure 2, the metal sheeting that is close on the high temperature resistant silicon film of heat seal cutting die side at first joins with film, and the elastic force that utilizes high temperature resistant silicon film compressive deformation to produce compresses the location with film, and then the airiness between partition packaging line and the packing cavity, heat seal cutting die and film join (as shown in Figure 3) then, the heat seal cutting die is delivered to heat at the packaging line place of film, the film melted by heating also is bonded together mutually, because the high temperature resistant silicon film is close to the setting of heat seal cutting die, therefore, very close to each other between the partition line ball that packaging line that the heat seal cutting die forms and high temperature resistant silicon film form, film decomposes the gas that produces and is being cut off fully by the high temperature resistant silicon film near packing cavity one side when being heated, finally the two ends from film surface or packaging line shed; Because the flash heat transfer of the metal sheeting that corrosion-resistant steel is made, the temperature of cutting off the line ball place on the film is lower than the dissociation temperature of film all the time, therefore not only can guarantee to pack and not have decomposition gas in the cavity and enter, the neat appearance of the packaging line that forms after also being conducive to simultaneously encapsulate is to improve the class of product.
Embodiment 2: a kind of heat seal package assembling as shown in Figure 4, what it adopted is the high frequency heat seal mode, be mainly used in many body encapsulation, include a heat seal cutting die 1, the shape of cross section of heat seal cutting die is consistent with packaging line, the location separating element that sheet is fixedly arranged respectively in the two sides of heat seal cutting die, the high temperature resistant silicon film 2 of the employing of described location separating element and embodiment 2 same materials, structure.When the heat seal package assembling of present embodiment carries out the heat seal encapsulation at the heat seal cutting die to film 4, the packing cavity 7 built-in packing materials that are placed with that constituted by double-layer films 4 up and down, film is transported to heat seal station 6, the action of heat seal this moment package assembling, the heat seal cutting die descends and close film, as shown in Figure 5, the metal sheeting 5 that is close on the high temperature resistant silicon film of heat seal cutting die two sides at first joins with film, and the elastic force that utilizes high temperature resistant silicon film compressive deformation to produce compresses the location with film, and then the airiness between partition packaging line and the two sides packing cavity, heat seal cutting die and film join (as shown in Figure 6) then, film generates heat under the effect of high-frequency electric field, and it is bonding mutually under the pressure effect of heat seal cutting die, because being close to heat seal cutting die both sides, the high temperature resistant silicon film arranges, therefore, the packing cavity of the placing packing material partition line ball complete closed that separating element forms that is positioned, film on the packaging line decomposes the gas that produces and is cut off fully by the high temperature resistant silicon film of both sides when being heated, finally the two ends from film surface or packaging line shed, thereby make packing material avoid secondary pollution.
Claims (3)
1. heat seal package assembling, comprise the heat seal cutting die, it is characterized in that, be provided with the location separating element with its interlock in the side of heat seal cutting die (1), described location separating element is high temperature resistant silicon film (2), the high temperature resistant silicon film is close to the side of heat seal cutting die, exceeds the lower surface that the heat seal cutting die is used for heat seal in order to the lower surface that compresses film (4) on the high temperature resistant silicon film, and it is 1 millimeter metal sheeting (5) that described high temperature resistant silicon film is fitted with thickness at the end face that is used for compressing film.
2. heat seal package assembling according to claim 1, it is characterized in that, described high temperature resistant silicon film is being provided with the groove (21) that transmits for the heat that reduces between heat seal cutting die and the high temperature resistant silicon film near heat seal cutting die one side, the lower surface of described high temperature resistant silicon film exceeds heat seal cutting die lower surface 1mm-5mm.
3. heat seal package assembling according to claim 1 and 2 is characterized in that, is respectively equipped with the location separating element in the two sides of heat seal cutting die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110227904 CN102424154B (en) | 2010-04-09 | 2010-04-09 | Hot sealing encapsulation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110227904 CN102424154B (en) | 2010-04-09 | 2010-04-09 | Hot sealing encapsulation assembly |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101421512A Division CN101817408B (en) | 2010-04-09 | 2010-04-09 | Thermal sealing package method and assembly of plastic films |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102424154A CN102424154A (en) | 2012-04-25 |
| CN102424154B true CN102424154B (en) | 2013-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110227904 Expired - Fee Related CN102424154B (en) | 2010-04-09 | 2010-04-09 | Hot sealing encapsulation assembly |
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| Country | Link |
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| CN (1) | CN102424154B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281868B (en) * | 2013-06-19 | 2015-08-05 | 苏州工业园区格米克精密机械有限公司 | Flexible circuit board hot pressing Yi Jiaobunian heating head mechanism |
| JP6904253B2 (en) * | 2015-10-02 | 2021-07-14 | 凸版印刷株式会社 | Anvil and ultrasonic sealing equipment |
| CN108045659A (en) * | 2017-12-24 | 2018-05-18 | 无锡市创恒机械有限公司 | Packaging bag sealing secondary compression mechanism |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20017318U1 (en) * | 2000-10-06 | 2001-01-25 | GEVAS Verpackungsmaschinen GmbH, 33790 Halle | Device for welding and cutting foils |
| CN2752179Y (en) * | 2004-12-14 | 2006-01-18 | 胡作平 | Matched transverse sealing device for liquid packing machine |
| CN201205984Y (en) * | 2008-05-07 | 2009-03-11 | 杭州中亚机械有限公司 | Soft bag-type package and lateral sealing cut-off device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4683990B2 (en) * | 2005-04-22 | 2011-05-18 | キユーピー株式会社 | Plastic container sealing device |
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2010
- 2010-04-09 CN CN 201110227904 patent/CN102424154B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20017318U1 (en) * | 2000-10-06 | 2001-01-25 | GEVAS Verpackungsmaschinen GmbH, 33790 Halle | Device for welding and cutting foils |
| CN2752179Y (en) * | 2004-12-14 | 2006-01-18 | 胡作平 | Matched transverse sealing device for liquid packing machine |
| CN201205984Y (en) * | 2008-05-07 | 2009-03-11 | 杭州中亚机械有限公司 | Soft bag-type package and lateral sealing cut-off device |
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| Publication number | Publication date |
|---|---|
| CN102424154A (en) | 2012-04-25 |
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