CN102424154A - Hot sealing encapsulation assembly - Google Patents
Hot sealing encapsulation assembly Download PDFInfo
- Publication number
- CN102424154A CN102424154A CN2011102279044A CN201110227904A CN102424154A CN 102424154 A CN102424154 A CN 102424154A CN 2011102279044 A CN2011102279044 A CN 2011102279044A CN 201110227904 A CN201110227904 A CN 201110227904A CN 102424154 A CN102424154 A CN 102424154A
- Authority
- CN
- China
- Prior art keywords
- heat seal
- cutting die
- hot sealing
- film
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title abstract description 19
- 238000007789 sealing Methods 0.000 title abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000003814 drug Substances 0.000 abstract description 4
- 239000000741 silica gel Substances 0.000 abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 abstract description 4
- 239000002537 cosmetic Substances 0.000 abstract description 2
- 238000002955 isolation Methods 0.000 abstract 2
- 238000003723 Smelting Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 78
- 238000012856 packing Methods 0.000 description 33
- 238000004806 packaging method and process Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Abstract
The invention discloses a hot sealing encapsulation assembly, which comprises a hot sealing cutting die, wherein a positioning isolation element linked with the hot sealing cutting die is arranged at the side surface of the hot sealing cutting die and is a high-temperature-resistance silica gel sheet, the high-temperature-resistance silica gel sheet is tightly pasted on the side surface of the hot sealing cutting die, and the lower end surface on the high-temperature-resistance silica gel sheet and for tightly pressing a film is higher than the lower end surface of the hot sealing cutting die for hot sealing. The hot sealing encapsulation assembly is characterized in that firstly, two layers of films are tightly pressed by the positioning isolation element, on one hand, the films isare reliably positioned so that the hot sealing encapsulation is favorably realized, simultaneously, the air circulation between an encapsulation line and a package cavity can be completely isolated, and the secondary pollution on package objects caused by harmful gas generated by film decomposition during the hot smelting is avoided. The hot sealing encapsulation assembly is applicable to the hot sealing encapsulation on objects such as food, medicine, cosmetics and the like.
Description
The application be to application number be 201010142151.2 application for a patent for invention divide an application the applying date of original application: on April 9th, 2010, the denomination of invention of original application: a kind of heat seal method for packing of plastic sheeting and heat seal package assembling.
Technical field
The present invention relates to the packing technique field, especially relate to a kind of heat seal package assembling that is used for blister-pack.
Background technology
At present, the heat seal of plastic sheeting encapsulation is widely used in the packing of food, medicine and cosmetics, and it has that cost is low, packaging efficiency is high and plurality of advantages such as moisture-proof and seepage-proof leakage.Concrete application mode has following several kinds: (1) liquid is packed continuously, and film raw material is the long strap of double-ply film, its dual-side involution.During packing, in strap, pour into packing material, horizontal involution in the two ends of strap and cut-out then, thus accomplish encapsulation; (2) unit packaging, the packing material of in the plastic bag of one one end opening or single cavity, packing into is used the opening involution of heat seal package assembling with plastic bag or single cavity then; (3) have at least thin film to be provided with cavity in the double-layer films to be used to place packing material; The heat-fastening knife of heat seal package assembling is molded as the shape consistent with the packaging line that requires; Then with double-layer films at the packaging line place involution, this manner of packing can be an individual packaging, also can be many bodies packings; Packaging line is all arranged between a plurality of packing materials, thereby a plurality of packing materials are spaced from each other.The groundwork of above-mentioned heat seal encapsulation is: on the heat seal package assembling, be provided with the heat seal cutting die; The shape of heat seal cutting die is identical with the shape of packaging line, and the heat seal package assembling heats the heat seal cutting die through heating arrangement, and makes on its temperature that maintains a setting; The heat seal cutting die is pressed close to and is compressed film; Bond each other after the film melted by heating, the heat seal cutting die resets, and encapsulation is also accomplished in the film cooling.Though film for packaging is harmless to human body; But film when encapsulation because of receiving high temperature fusion meeting to produce a small amount of deletrious decomposition gas; And decomposition gas enters in the packing cavity and get in the food, medicine of packing, thereby causes the secondary pollution to packing material.Above-mentioned food or the medicine that receives light contamination of the long-term absorption of human body can produce adverse influence to health.At present; Some comparatively advanced heat-sealing machines are arranged; Like high-frequency thermocompressor, supersonic heat-conglutinating machine and the heat-sealing machine that adopts laser technology are though the quality of its heat seal encapsulation and efficient etc. have significant improvement; But between the film of heat seal still through melt bonded together, thereby can't avoid packing material is caused secondary pollution.Even we are the polythene bag of usefulness at ordinary times, when opening and using, also often be prone to smell residual melten gel in it and decompose the smell that just has.
Disclosed on the Chinese patent document " a kind of fluid encapsulated moulding device and method "; Its publication number is CN101337593A; Through settling upper film and following film respectively at middle die holder and die shoe, and perfusion of fluid is on film down, the vacuum cavity that belongs to through die holder and die shoe in the valve sealing; Be the gas in the vacuum pump unit extracting vacuum cavity capable of using and forming near vacuum state; Carry out Heat Sealing through forming the seat that seals that dock up and down with middle die holder, die shoe again, the periphery that makes upper film and following film is near vacuum state involution and coat fluid next time, and fluid not have bubble residual.This invention will be packed cavity and be evacuated in when encapsulation, help prolonging the shelf-life of packing material, but the micro-decomposition gas can't avoid encapsulating equally the time is to the secondary pollution of packing material.
Summary of the invention
The present invention be for overcome existing heat seal packaged type both package assembling easily packing material is produced the deficiency of secondary pollution, provide a kind of and can effectively completely cut off the heat seal package assembling that decomposition gas gets into the interior plastic sheeting of packing cavity.
To achieve these goals, the present invention adopts following technical scheme:
A kind of heat seal package assembling; Comprise the heat seal cutting die; Be provided with location separating element with its interlock in the side of heat seal cutting die; Said location separating element is the high temperature resistant silicon film, and the high temperature resistant silicon film is close to the side of heat seal cutting die, exceeds the lower surface that the heat seal cutting die is used for heat seal in order to the lower surface that compresses film on the high temperature resistant silicon film.High temperature resistant silica gel has better elastic and insulating power; Can bear simultaneously the heat-seal temperature of heat seal cutting die; Owing to be provided with its interlock in the side of heat seal cutting die and be higher than the high temperature resistant silicon film of heat seal cutting die; Therefore, can guarantee that the high temperature resistant silicon film contacts with film earlier before the heat seal cutting die carries out packaging by hot pressing, and utilize the elasticity of high temperature resistant silicon film that film is compressed; Thereby play in advance location and the effect that cuts off of film, the decomposition gas that produces when guaranteeing packaging by hot pressing can not get in the packing cavity.Because high temperature resistant silicon film and heat seal cutting die link, therefore help simplified structure and action step, improve packaging efficiency.
As preferably; Said high temperature resistant silicon film is fitted with metal sheeting being used to compress on the end face of film; Thereby make its end face that is used to compress film that enough hardness arranged; And then guarantee that it cuts off effect, metal sheeting has better radiating effect simultaneously, thereby can avoid the film decomposes near packaging line.
As preferably; Said high temperature resistant silicon film is at the groove that is provided with the heat transmission that is used to reduce between heat seal cutting die and the high temperature resistant silicon film near heat seal cutting die one side; On the high temperature resistant silicon film, groove is set; Can reduce the area of contact with the heat seal cutting die, thereby reduce the transmission of heat between the two, help prolonging the service life of high temperature resistant silicon film; The lower surface of said high temperature resistant silicon film exceeds heat seal cutting die lower surface 1mm-5mm, thereby can guarantee that the high temperature resistant silicon film can position film and cuts off prior to the heat seal cutting die, and maintains enough pressure, and is reliable with what guarantee to cut off.
As preferably, on the two sides of heat seal cutting die, be respectively equipped with the location separating element, thereby can avoid decomposition gas to get into the cavity of packaging line both sides, be applicable to that all there are many body packings of packing material the packaging line both sides.
Therefore, the present invention has following beneficial effect: (1) cuts off the decomposition gas in when encapsulation, avoids packing material to receive secondary pollution; (2) the location separating element is simple in structure, is convenient to adopt.
Description of drawings
Fig. 1 is the structural representation of the heat seal package assembling of embodiments of the invention 1;
Fig. 2 is the structural representation of location separating element when contacting with film of the heat seal package assembling of embodiment 1;
Fig. 3 is the structural representation of heat seal cutting die when Heat Sealing of the heat seal package assembling of embodiment 1;
Fig. 4 is the structural representation of the heat seal package assembling of embodiments of the invention 2;
Fig. 5 is the structural representation of location separating element when contacting with film of the heat seal package assembling of embodiment 2;
Fig. 6 is the structural representation of heat seal cutting die when Heat Sealing of the heat seal package assembling of embodiment 2.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is done further description.
Embodiment 1: a kind of heat seal package assembling as shown in Figure 1; What it adopted is the hot melt adhesive mode, is mainly used in the monomer encapsulation, includes a heat seal cutting die 1; Be fixed with the location separating element of sheet in a side of heat seal cutting die; Said location separating element is a high temperature resistant silicon film 2, and its thickness and heat seal cutting die are basic identical, and is close to the side of heat seal cutting die; While is provided with separated groove 21 in the centre of the side of high temperature resistant silicon film and the applying of heat seal cutting die, and the degree of depth of groove is about 1mm.For guaranteeing that the high temperature resistant silicon film can compress film 4 reliably; The high temperature resistant silicon film exceeds heat seal cutting die end face 3mm in order to the end face that compresses film; And bonding one layer thickness is the metal sheeting 5 of 1mm on its end face, and said metal sheeting can adopt corrosion-resistant steel to process, existing certain rigidity of corrosion-resistant steel and elasticity; Good heat-conducting is arranged again, and can avoid getting rusty.The heat seal package assembling of present embodiment carries out heat seal when encapsulation at the heat seal cutting die to film, and the packing cavity 7 built-in packing materials that are placed with by double-layer films 4 up and down constitutes are transported to heat seal station 6 with film; The action of heat seal this moment package assembling; The heat seal cutting die descends and near film, and is as shown in Figure 2, and the metal sheeting that is close on the high temperature resistant silicon film of heat seal cutting die side at first joins with film; And the elastic force that utilizes high temperature resistant silicon film compressive deformation to produce compresses the location with film; And then cut off the airiness between packaging line and the packing cavity, and heat seal cutting die and film join (as shown in Figure 3) then, and the heat seal cutting die is delivered to heat at the packaging line place of film; The film melted by heating also bonds together each other; Because it is the high temperature resistant silicon film is close to the heat seal cutting die and is provided with, therefore, very close to each other between the partition line ball that packaging line that the heat seal cutting die forms and high temperature resistant silicon film form; Film decomposes the gas that produces and is being cut off fully by the high temperature resistant silicon film near packing cavity one side when being heated, finally the two ends from film surface or packaging line shed; Because the flash heat transfer of the metal sheeting that corrosion-resistant steel is processed; The temperature of cutting off the line ball place on the film is lower than the dissociation temperature of film all the time; Therefore not only can guarantee to pack and not have the decomposition gas entering in the cavity; The neat appearance of the packaging line that forms after also helping simultaneously encapsulating is to improve the class of product.
Embodiment 2: a kind of heat seal package assembling as shown in Figure 4; What it adopted is the high frequency heat seal mode; Be mainly used in many body encapsulation, include a heat seal cutting die 1, the shape of cross section of heat seal cutting die is consistent with packaging line; Be fixed with the location separating element of sheet respectively in the two sides of heat seal cutting die, the high temperature resistant silicon film 2 of employing of said location separating element and embodiment 2 same materials, structure.The heat seal package assembling of present embodiment carries out heat seal when encapsulation at the heat seal cutting die to film 4, and the packing cavity 7 built-in packing materials that are placed with by double-layer films 4 up and down constitutes are transported to heat seal station 6 with film; Heat seal package assembling action this moment, heat seal cutting die descend and near film, and be as shown in Figure 5; The metal sheeting 5 that is close on the high temperature resistant silicon film of heat seal cutting die two sides at first joins with film; And the elastic force that utilizes high temperature resistant silicon film compressive deformation to produce compresses the location with film, and then cuts off packaging line and pack the airiness between the cavity with two sides, then heat seal cutting die and film join (as shown in Figure 6); Film generates heat under the effect of high-frequency electric field; And bonding each other under the pressure effect of heat seal cutting die, because being close to heat seal cutting die both sides, the high temperature resistant silicon film is provided with, therefore; The packing cavity of the placing packing material partition line ball complete closed that separating element forms that is positioned; Film on the packaging line decomposes the gas that produces and is cut off fully by the high temperature resistant silicon film of both sides when being heated, finally the two ends from film surface or packaging line shed, thereby make packing material avoid secondary pollution.
Claims (4)
1. heat seal package assembling; Comprise the heat seal cutting die; It is characterized in that be provided with the location separating element with its interlock in the side of heat seal cutting die (1), said location separating element is high temperature resistant silicon film (2); The high temperature resistant silicon film is close to the side of heat seal cutting die, exceeds the lower surface that the heat seal cutting die is used for heat seal in order to the lower surface that compresses film (4) on the high temperature resistant silicon film.
2. heat seal package assembling according to claim 1 is characterized in that, said high temperature resistant silicon film is fitted with metal sheeting (5) being used to compress on the end face of film.
3. heat seal package assembling according to claim 1 and 2; It is characterized in that; Said high temperature resistant silicon film is at the groove (21) that is provided with the heat transmission that is used to reduce between heat seal cutting die and the high temperature resistant silicon film near heat seal cutting die one side, and the lower surface of said high temperature resistant silicon film exceeds heat seal cutting die lower surface 1mm-5mm.
4. heat seal package assembling according to claim 1 and 2 is characterized in that, on the two sides of heat seal cutting die, is respectively equipped with the location separating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110227904 CN102424154B (en) | 2010-04-09 | 2010-04-09 | Hot sealing encapsulation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110227904 CN102424154B (en) | 2010-04-09 | 2010-04-09 | Hot sealing encapsulation assembly |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101421512A Division CN101817408B (en) | 2010-04-09 | 2010-04-09 | Thermal sealing package method and assembly of plastic films |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102424154A true CN102424154A (en) | 2012-04-25 |
| CN102424154B CN102424154B (en) | 2013-08-07 |
Family
ID=45958214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110227904 Expired - Fee Related CN102424154B (en) | 2010-04-09 | 2010-04-09 | Hot sealing encapsulation assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102424154B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281868A (en) * | 2013-06-19 | 2013-09-04 | 苏州工业园区格米克精密机械有限公司 | Flexible circuit board hot-press overflowing glue non-stick heating head mechanism |
| CN108045659A (en) * | 2017-12-24 | 2018-05-18 | 无锡市创恒机械有限公司 | Packaging bag sealing secondary compression mechanism |
| CN108137181A (en) * | 2015-10-02 | 2018-06-08 | 凸版印刷株式会社 | Anvil block and ultrasonic sealing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20017318U1 (en) * | 2000-10-06 | 2001-01-25 | Gevas Verpackungsmaschinen Gmbh | Device for welding and cutting foils |
| CN2752179Y (en) * | 2004-12-14 | 2006-01-18 | 胡作平 | Matched transverse sealing device for liquid packing machine |
| JP2006298453A (en) * | 2005-04-22 | 2006-11-02 | Q P Corp | Sealing device for plastic container |
| CN201205984Y (en) * | 2008-05-07 | 2009-03-11 | 杭州中亚机械有限公司 | Soft bag-type package and lateral sealing cut-off device |
-
2010
- 2010-04-09 CN CN 201110227904 patent/CN102424154B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20017318U1 (en) * | 2000-10-06 | 2001-01-25 | Gevas Verpackungsmaschinen Gmbh | Device for welding and cutting foils |
| CN2752179Y (en) * | 2004-12-14 | 2006-01-18 | 胡作平 | Matched transverse sealing device for liquid packing machine |
| JP2006298453A (en) * | 2005-04-22 | 2006-11-02 | Q P Corp | Sealing device for plastic container |
| CN201205984Y (en) * | 2008-05-07 | 2009-03-11 | 杭州中亚机械有限公司 | Soft bag-type package and lateral sealing cut-off device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281868A (en) * | 2013-06-19 | 2013-09-04 | 苏州工业园区格米克精密机械有限公司 | Flexible circuit board hot-press overflowing glue non-stick heating head mechanism |
| CN103281868B (en) * | 2013-06-19 | 2015-08-05 | 苏州工业园区格米克精密机械有限公司 | Flexible circuit board hot pressing Yi Jiaobunian heating head mechanism |
| CN108137181A (en) * | 2015-10-02 | 2018-06-08 | 凸版印刷株式会社 | Anvil block and ultrasonic sealing device |
| CN108137181B (en) * | 2015-10-02 | 2021-02-26 | 凸版印刷株式会社 | Anvil block and ultrasonic sealing device |
| CN108045659A (en) * | 2017-12-24 | 2018-05-18 | 无锡市创恒机械有限公司 | Packaging bag sealing secondary compression mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102424154B (en) | 2013-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101817408B (en) | Thermal sealing package method and assembly of plastic films | |
| JP5437777B2 (en) | Filling and packaging machine and method for manufacturing packaging container | |
| CN201647145U (en) | Packing machine | |
| WO2008027029A3 (en) | Two-piece container seal and method of manufacture | |
| CN103247825A (en) | Laminated lithium ion battery preparation method and prepared battery | |
| CN102424154B (en) | Hot sealing encapsulation assembly | |
| CN103296314A (en) | Preparation method of laminated lithium-ion battery and battery | |
| CN209658325U (en) | Aluminum plastic film for soft bag lithium ionic cell encapsulates end socket | |
| CN1346323A (en) | Counter rail and counter element in a sealing apparatus and mehtod of manufacturing thereof | |
| CN108630836A (en) | A kind of discoid polymer Li-ion battery of Soft Roll makes edge sealing end socket and method | |
| CN103354278A (en) | Aluminium plastic film and packaging method for polymer lithium ion battery | |
| CN106697363B (en) | For fully-automatic thermal-formation vacuum packaging machine | |
| CN202807457U (en) | Aluminum plastic composite vacuum package bag | |
| EP1147990A3 (en) | Bottle of thermoplastic material and method for the manufacture and filing of same | |
| CN104157802A (en) | Encapsulation head and encapsulation device for flexible package lithium-ion battery cell | |
| CN205525282U (en) | A mould for having more bottle is whole sealed | |
| CN110481070A (en) | Box body processing method and its processing unit (plant) | |
| CN101570254A (en) | Method for encapsulating plastic-aluminum packaging film | |
| CN202703982U (en) | Gas separating and ventilating device for plastic film heat-sealing packaging | |
| CN101870379B (en) | Full-automatic vertical vacuum packing machine | |
| CN201770032U (en) | Full-automatic vertical vacuum packaging machine | |
| CN206451736U (en) | Lithium battery aluminum-plastic film closing device | |
| CN105480446A (en) | Fully-automatic production line for big soft tail-filling double-hard-pipe non-PVC infusion bags | |
| CN202670168U (en) | Mechanical flow separation device for plastic film heat seal packaging | |
| CN103274086B (en) | In avoiding plastic film to encapsulate, pernicious gas enters the mode of cavity package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130807 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |