CN102421255B - Processing method of electroplated lead applied to LED printed circuit board - Google Patents
Processing method of electroplated lead applied to LED printed circuit board Download PDFInfo
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- CN102421255B CN102421255B CN 201110226119 CN201110226119A CN102421255B CN 102421255 B CN102421255 B CN 102421255B CN 201110226119 CN201110226119 CN 201110226119 CN 201110226119 A CN201110226119 A CN 201110226119A CN 102421255 B CN102421255 B CN 102421255B
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Abstract
The invention discloses a processing method of an electroplated lead applied to an LED printed circuit board. The processing method comprises the following steps of: 1, manufacturing an outer-layer exposure negative film and a welding-prevention exposure negative film; and 2, carrying out outer-layer pretreatment on a plate which is subjected to copper plating through vertical and continuous electroplating wires, pressing a dry film on the plate through a dry film laminator, drawing the plate subjected to dry film pressing to form the outer-layer exposure negative film and exposing the outer-layer exposure negative film through an exposure machine, developing an outer-layer developing line, making a required outer-layer lead through an acid etching line, carrying out welding-prevention pretreatment, printing ink by a double-table-board printer, prebaking through a frame-type oven, exposing the drawn negative film through the exposure machine, developing the welding-prevention developing line and finally obtaining the electroplated lead required by soft gold electroplating. According to the processing method disclosed by the invention, evenness of an electronickelling gold film is increased, scrap caused by electronickelling over-thickness and poor evenness can be prevented, consumption of gold and nickel is reduced by adjusting current density of electronickelling and electrogilding, production cost is controlled, pollution is reduced, and environment friendliness is facilitated.
Description
Technical field
The present invention relates to a kind of processing method that is applied to the effective electroplating printed circuit board lead-in wire of light-emitting diodes, especially need to carry out the light emitting diode printed circuit board manufacture field that soft golden plate surface is processed.
Background technology
Universal along with global green energy conservation concept, country encourages exploitation LED source technology, and increasing light-emitting diode producer occurs at home.In the printed wire board machining process of the effective support plate of light-emitting diodes, it is one important procedure that the light-emitting diode printed substrate is made that soft gold is electroplated, cost accounts for the 50-70% of the total manufacturing cost of light-emitting diode printed substrate, and soft gold is electroplated good and bad product reliability and the fine ratio of product of directly affecting of making.
Due to the particularity of encapsulation process of light-emitting diode, light-emitting diode printed substrate client is to printed substrate thickness requirement and strict, and the tolerance demand is controlled at ± 0.04mm.And the electroplate lead wire processing method of generally using now exist in soft gold is electroplated manufacturing process light-emitting diode wiring board the distribution density of the electric current of edges of boards electroplating clamp point zone and printed substrate plate angle surrounding than plate in height, cause areas of high current density coating epithelium blocked up, printed wire plate thickness and thickness evenness thereof exceed client's requirement, and generation is scrapped.And the common way of industry to be high Current Zone at surrounding plate angle add that mode that false plating plate shares electric current is electroplated, because vacation plating plate can by electric plated with nickel gold, increase production cost equally.
Summary of the invention
The purpose of this invention is to provide a kind of light-emitting diode electroplating printed circuit board lead-in wire processing method that is applied to overcome above-mentioned weak point, improve the blocked up problem of high current density region coating in soft golden electroplating technology, improve the uniformity of plate thickness and appearance luster, reduce the cost that soft gold is electroplated.
According to technical scheme provided by the invention, a kind of processing method that is applied to light-emitting diode electroplating printed circuit board lead-in wire, feature are to adopt following two main procedure of processings:
The first step: the making of outer exposure film and anti-welding exposure film
(1) minor face is arranged two-layer electroplate lead wire, live width 1mm, conduction limit and minor face ground floor electroplate lead wire, minor face ground floor electroplate lead wire and minor face second layer electroplate lead wire interval 2mm, and the distance every 1cm is arranged an outwardly false copper facing skin on wire, copper sheet width 1mm, length 1.5mm; Be connected with the conduction limit at be separated by between two parties wire that the position of 14～15cm arranges two width 1mm of minor face; Second layer electroplate lead wire evenly arranges three wires and is connected with the ground floor electroplate lead wire, conductor width 1mm; Two wires that connect conduction limit and ground floor electroplate lead wire, overlapping can not appear in three wires that connect ground floor and second layer electroplate lead wire, and the ground floor electroplate lead wire can not directly be connected with the conduction limit with second layer electroplate lead wire two ends;
(2) grow the limit and arrange one deck electroplate lead wire, with the conduction limit at a distance of 2mm, live width 1mm, and arrange an outwards false copper facing skin of projection every the distance of 1cm on lead-in wire, copper sheet width 1mm, length 1.5mm, the wire that a 1.5mm width is set in the centre position on long limit make long limit electroplate lead wire be connected with the conduction limit;
(3) except the circular optical point of anti-welding exposure aligning use, outer contraposition optical point and the hole of cutting into slices can not isolate existence, need with wire and the limit connection of being connected; The first, two layer of electroplate lead wire that one deck electroplate lead wire and minor face are electroplated in long limit can not cover anti-solder ink.
(4) electroplate lead wire is to the plating area connected mode: four limits, plating area evenly arrange three wires On current in the plate; False copper facing skin is arranged on the wire of On current in the plate, and width is 3mm; The electroplate lead wire crosspoint is set as the false copper facing skin of putting 3 х 3mm crosses, and the remainder electroplate lead wire of plating area surrounding covers anti-solder ink;
Second step: the processing of electroplate lead wire
(1) will electroplate copper cash through the vertical continuous of being produced by Mechanology Inc. of Baolong and complete the pretreatment line microetch that the light-emitting diode printed substrate of electro-coppering is made through outer inferior intelligence photoelectricity science and technology, washing, pickling, washing, oven dry is cleaned; Cleaning pan feeding linear speed: 1.8-2.2m/min; Microetch speed: 30-50 microinch; The microetch spray is pressed: 1.5-2.5kg/cm
2Two circulating water wash pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Descaling bath sulfuric acid volumetric concentration: 2-4%; Three circulating water wash pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Bake out temperature: 75-85 ℃;
(2) will produce film laminator through Zhisheng Industrial stock Co., Ltd through pretreated light-emitting diode printed substrate and press dry film, use the exposure of ORC automatic exposure machine and outer exposure film, the developing line of inferior intelligence photoelectricity science and technology production develops, and then making through the acid line etching of Yang Bo science and technology production needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and three sections temperature are respectively 100-110 ℃, and 100-110 ℃, 80-100 ℃, speed 1.5-4.0 m/min; Paste the dry film wheel speeds: 1.8-2.2m/min, roller temperature: 110-120 ℃, roller pressure: 0.3-0.5MPa;
Exposure: energy uniformity is the 10-12 level greater than 85%, 25 grade of exposure progression table test progression;
Develop: development Na
2CO
3Mass concentration 0.8-1.2%, 1.5-1.7 kg/cm is pressed in spray
2, speed 3.0-4.0 m/min, temperature 28-32 ℃; Middle setting-out is washed pressure: 1.2-2.5 kg/cm
2, inflow: 5-10L/min; The compound washing pressure of middle pressure: 1.6-2.0 kg/cm
2, inflow: 5-10L/min; Bake out temperature: 50-65 ℃;
Acid etching: operation is acid etching, washing, striping, washing, oven dry; Etching solution proportion 1.26-1.33, HCl concentration 2.0-2.8mol/L, NaClO
3Concentration 15-50g/L, Cu
2+Concentration 95-140g/L, etch temperature 45-55 ℃, upper spray spray is pressed: 2.2 ± 0.8 kg/cm
2, lower spray spray is pressed: 1.8 ± 0.8 kg/cm
2Washing inflow 4-6L/min, washing pressure: 0.5-3.0 kg/cm
2Striping groove NaOH mass concentration 3-6%, speed: 1.0-2.0m/min, temperature 45-55 ℃; Washing flow of inlet water: 4-6L/min, nozzle exit pressure: 0.5-3.0kg/cm
2Bake out temperature: 55-65 ℃;
(3) the light-emitting diode printed wire boards half-finished product of completing through acid etching is processed through the anti-welding pretreatment line of inferior intelligence photoelectricity science and technology production, the two table top printing machines that join the production of permanent precision optical machinery limited company carry out ink printing, it is pre-baked that Qunyi Industry Co., Ltd. produces the frame-type baking box, the anti-welding exposure film exposure of using the ORC automatic exposure machine and making, the developing line of inferior intelligence photoelectricity science and technology production develops, and obtains final soft gold and electroplates the electroplate lead wire that needs;
Anti-welding preliminary treatment linear speed: 2.5-3.5m/min, microetch speed: 30-50 microinch, circulating water wash inflow: 3-7L/min, bake out temperature: 80-90 ℃;
Anti-solder ink printing: print speed printing speed 3.0 ± 2.5m/min, half tone height＜20mm, squeegee pressure: 0.5 ± 0.3MPa, scraper angle＜20 °;
Pre-baked: 75 ± 3 ℃ of temperature, pre-baked time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity〉80%;
Develop: speed 3.5-3.8m/min, temperature 28-32 ℃, pressure 1.0-2.0kg/cm
2, K
2CO
3Concentration 8-12g/L, washing inflow: 3-6L/min, bake out temperature 50-70 ℃.
The wiring board of making according to light-emitting diode electroplating printed circuit board lead-in wire processing method provided by the invention is used for direct soft gold plating, and following advantage is arranged:
1. improved the uniformity of electronickelling gold plate, the maximum of nickel coating thickness subtracts minimum value 400 microinch, make in special plank plate and the thickness maximum of edges of boards subtracts minimum value and can reach and be reduced to 150 microinch more than 800 microinch, gold-plated maximum subtracts minimum value and is reduced to 3 microinch by 6 microinch, in the situation that satisfy customer requirement, can plate electronickelling by adjustment, the current density of electrogilding reduces the consumption of golden nickel, can well the production control cost, reduce and pollute, be beneficial to environmental protection.
2. edges of boards need not spread copper sheet and Ban Jiao adds the appearance color homogeneous homegeneous production that false copper facing skin can obtain plating nickel gold, have improved the gold-plated blocked up problem of edges of boards nickel plating, and what prevent that electronickelling is blocked up and lack of homogeneity causes scraps; Save simultaneously edges of boards and false copper facing skin to the consumption of potassium auricyanide and electronickelling gold liquid medicine, reduce and pollute, be beneficial to environmental protection.
Description of drawings:
Fig. 1 is electroplate lead wire construction drawing of the present invention.
Fig. 2 is that electroplate lead wire of the present invention connects wire producing figure to the plating area.
Embodiment
The invention will be further described below in conjunction with specific embodiment.
At first make circuit and be depicted as the egative film that skin exposes and anti-welding exposure needs according to outer electroplate lead wire graphics request, making concrete mode and see (Fig. 1) and (Fig. 2) explanation.
(1) minor face 1 is arranged two-layer electroplate lead wire, live width 1mm, conduction limit 12 and minor face ground floor electroplate lead wire 3, minor face ground floor electroplate lead wire 3 and minor face second layer electroplate lead wire 4 interval 2mm, and the distance every 1cm is arranged an outwardly false copper facing skin 16 on wire, copper sheet width 1mm, length 1.5mm; Be connected with conduction limit 12 at be separated by between two parties wire 6,8 that the position of 14～15cm arranges two width 1mm of minor face; Second layer electroplate lead wire 4 evenly arranges three wires 5,7,9 and is connected with ground floor electroplate lead wire 3, conductor width 1mm; Two wires that connect conduction limit and ground floor electroplate lead wire, overlapping can not appear in three wires that connect ground floor and second layer electroplate lead wire, and the ground floor electroplate lead wire can not directly be connected with the conduction limit with second layer electroplate lead wire two ends;
(2) grow limit 2 and arrange one deck electroplate lead wire 10, with the conduction limit at a distance of 2mm, live width 1mm, and arrange an outwards false copper facing skin 16 of projection every the distance of 1cm on lead-in wire, copper sheet width 1mm, length 1.5mm, the wire 11 that a 1.5mm width is set in the centre position on long limit make long limit electroplate lead wire be connected with the conduction limit;
(3) the circular optical point that uses except anti-welding exposure aligning is 13, and outer contraposition optical point 14 and section hole 15 can not isolate existence, need with wire and the limit connection of being connected; The first, two layer of electroplate lead wire 3,4 that one deck electroplate lead wire 10 and minor face are electroplated in long limit can not cover anti-solder ink.
(4) electroplate lead wire is to plating area 17 connected modes: four limits, plating area evenly arrange three wires 20 On current in the plate; False copper facing skin 18 is arranged on the wire of On current in the plate, and width is 3mm; The electroplate lead wire crosspoint is set as the false copper facing skin 19 of putting 3 х 3mm crosses, and the remainder electroplate lead wire of plating area surrounding covers anti-solder ink;
Certain double-deck light-emitting diode printed substrate, sheet material are white BT material, and be as follows by method implementation step of the present invention:
Embodiment one:A kind of processing method that is applied to light-emitting diode electroplating printed circuit board lead-in wire of the present invention, adopt following procedure of processing:
1, will complete the light-emitting diode printed substrate of electro-coppering through the pretreatment line microetch of outer inferior intelligence photoelectricity science and technology production through electroplated copper cash by the vertical continuous of Mechanology Inc. of Baolong production, washing, pickling, washing is cleaned; Cleaning pan feeding linear speed: 1.8m/min; Microetch speed: 30 microinch; The microetch spray is pressed: 1.5kg/cm
2Two circulating water wash pressure: 0.4kg/cm
2, flow of inlet water: 5L/min; Acid rinse bath sulfuric acid volumetric concentration: 2%; Three circulating water wash pressure: 0.4kg/cm
2, flow of inlet water: 5/min; Bake out temperature: 75 ℃;
2, will press dry film through the film laminator of Zhisheng Industrial stock Co., Ltd's production through pretreated light-emitting diode printed substrate, the skin exposure exposure of using the ORC automatic exposure machine and making, the developing line of inferior intelligence photoelectricity science and technology production develops, and then making through the acid line etching of Yang Bo science and technology production needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and temperature is respectively 100 ℃, and 100 ℃, 80 ℃, speed 1.5m/min; Paste dry film wheel speeds: 1.8m/min, the roller temperature: 110 ℃, roller pressure: 0.3MPa;
Exposure: energy uniformity is 10 grades greater than 85%, 25 grade of exposure progression table test progression;
Develop: development Na
2CO
3Mass concentration 0.8%, 1.5kg/cm is pressed in spray
2, speed 3.0m/min, 28 ℃ of temperature; Middle setting-out is washed pressure: 1.2kg/cm
2, inflow: 5L/min; The compound washing pressure of middle pressure: 1.6kg/cm
2, inflow: 5L/min; Bake out temperature: 50 ℃;
Acid etching: operation is acid etching → washing → striping → washing → oven dry; Etching solution proportion 1.26, HCl concentration 2.0mol/L, NaClO
3Concentration 15g/L, Cu
2+Concentration 95g/L, 45 ℃ of etch temperature, upper spray spray is pressed: 1.4kg/cm
2, lower spray spray is pressed: 1.0 kg/cm
2Washing inflow 4L/min, washing pressure: 0.5kg/cm
2Striping groove NaOH mass concentration 3%, speed: 1.0m/min, temperature 45 C; Washing flow of inlet water: 4L/min, nozzle exit pressure: 0.5kg/cm
2Bake out temperature: 55 ℃;
3, the light-emitting diode printed wire boards half-finished product completed of etching is processed through the anti-welding pretreatment line of inferior intelligence, the two table top printing machines that join the production of permanent precision optical machinery limited company carry out ink printing, the frame-type baking box of Qunyi Industry Co., Ltd.'s production is pre-baked, the anti-welding exposure film exposure of using the ORC automatic exposure machine and making, the developing line of inferior intelligence photoelectricity science and technology production develops, and obtains final soft gold and electroplates the electroplate lead wire that needs;
Anti-welding preliminary treatment linear speed: 2.5m/min, microetch speed: 30 microinch, circulating water wash inflow: 3L/min, bake out temperature: 80 ℃;
Anti-solder ink printing: print speed printing speed 1.5m/min, half tone height＜20mm, squeegee pressure: 0.3MPa, scraper angle＜20 °;
Pre-baked: 72 ℃ of temperature, pre-baked time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity〉80%;
Develop: speed 3.5m/min, 28 ℃ of temperature, pressure 1.0kg/cm
2, K
2CO
3Concentration 8g/L, washing inflow: 3L/min, 50 ℃ of bake out temperatures.
Embodiment two:
A kind of processing method that is applied to light-emitting diode electroplating printed circuit board lead-in wire of the present invention, adopt following procedure of processing:
1, will complete the outer inferior intelligence photoelectricity science and technology pretreatment line microetch of light-emitting diode printed substrate process of electro-coppering through electroplated copper cash by the vertical continuous of Mechanology Inc. of Baolong production, washing, pickling, washing is cleaned; Cleaning pan feeding linear speed: 2.0 m/min; Microetch speed: 40 microinch; The microetch spray is pressed: 2.0 kg/cm
2Two circulating water wash pressure: 0.6 kg/cm
2, flow of inlet water: 6 L/min; Descaling bath sulfuric acid volumetric concentration: 3 %; Three circulating water wash pressure: 0.6 kg/cm
2, flow of inlet water: 6 L/min; Bake out temperature: 80 ℃;
2, will press dry film through the film laminator of Zhisheng Industrial stock Co., Ltd's production through pretreated light-emitting diode printed substrate, the outer exposure film exposure of using the ORC automatic exposure machine and making, the developing line of Asia intelligence Electro-optical Technology, INC. (US) 62 Martin Road, Concord, Massachusetts 017 production develops, and then making through the acid line etching of Yang Bo science and technology production needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and temperature is respectively 105 ℃, and 105 ℃, 90 ℃, speed 3.0m/min; Paste the dry film wheel speeds: 2.0 m/min, the roller temperature: 115 ℃, roller pressure: 0.4 MPa;
Exposure: energy uniformity is 11 grades greater than 85%, 25 grade of exposure progression table test progression;
Develop: development Na
2CO
3Mass concentration 1.0%, 1.6 kg/cm are pressed in spray
2, speed 3.5 m/min, 30 ℃ of temperature; Middle setting-out is washed pressure: 2.9 kg/cm
2, inflow: 7.5 L/min; The compound washing pressure of middle pressure: 1.8 kg/cm
2, inflow: 7.5 L/min; Bake out temperature: 58 ℃;
Acid etching: operation is acid etching → washing → striping → washing → oven dry; Etching solution proportion 1.29, HCl concentration 2.4 mol/L, NaClO
3Concentration 35g/L, Cu
2+Concentration 115g/L, 50 ℃ of etch temperature, upper spray spray is pressed: 2.2 kg/cm
2, lower spray spray is pressed: 1.8kg/cm
2Washing inflow 5L/min, washing pressure: 2.0 kg/cm
2Striping groove NaOH mass concentration 4.5%, speed: 1.5 m/min, temperature 50 C; Washing flow of inlet water: 5 L/min, nozzle exit pressure: 2.0 kg/cm
2Bake out temperature: 60 ℃;
3, the light-emitting diode printed wire boards half-finished product completed of etching is through the anti-welding pretreatment line processing of inferior intelligence photoelectricity science and technology productions, the two table top printing machines that join the production of permanent precision optical machinery limited company carry out ink printing, the frame-type baking box of Qunyi Industry Co., Ltd.'s production is pre-baked, the anti-welding exposure film exposure of using the ORC automatic exposure machine and making, the developing line of inferior intelligence photoelectricity science and technology production develops, and obtains final soft gold and electroplates the electroplate lead wire that needs;
Anti-welding preliminary treatment linear speed: 3.0 m/min, microetch speed: 40 microinch, circulating water wash inflow: 5L/min, bake out temperature: 85 ℃;
Anti-solder ink printing: print speed printing speed 3.0m/min, half tone height＜20mm, squeegee pressure: 0.4MPa, scraper angle＜20 °;
Pre-baked: 75 ℃ of temperature, pre-baked time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity〉80%;
Develop: speed 3.65m/min, 30 ℃ of temperature, pressure 1.5kg/cm
2, K
2CO
3Concentration 10g/L, washing inflow: 4.5L/min, 60 ℃ of bake out temperatures.
Embodiment three:
A kind of processing method that is applied to light-emitting diode electroplating printed circuit board lead-in wire of the present invention, adopt following procedure of processing:
1, will complete the outer inferior intelligence pretreatment line microetch of light-emitting diode printed substrate process of electro-coppering through electroplated copper cash by the vertical continuous of Mechanology Inc. of Baolong production, washing, pickling, washing is cleaned; Cleaning pan feeding linear speed: 2.2m/min; Microetch speed: 50 microinch; The microetch spray is pressed: 2.5kg/cm
2Two circulating water wash pressure: 0.8 kg/cm
2, flow of inlet water: 7L/min; Descaling bath sulfuric acid volumetric concentration: 4%; Three circulating water wash pressure: 0.8 kg/cm
2, flow of inlet water: 7L/min; Bake out temperature: 85 ℃;
2, will press dry film through the holy film laminator of will through pretreated light-emitting diode printed substrate, the outer exposure film exposure of using the ORC automatic exposure machine and making, inferior intelligence developing line develops, and then making through the acid line etching of Yang Bo needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and temperature is respectively 110 ℃, and 110 ℃, 100 ℃, speed 4.0 m/min; Paste dry film wheel speeds: 2.2m/min, the roller temperature: 120 ℃, roller pressure: 0.5MPa;
Exposure: energy uniformity is 12 grades greater than 85%, 25 grade of exposure progression table test progression;
Develop: development Na
2CO
3Mass concentration 1.2%, 1.7 kg/cm are pressed in spray
2, speed 4.0 m/min, 32 ℃ of temperature; Middle setting-out is washed pressure: 2.5 kg/cm
2, inflow: 10L/min; The compound washing pressure of middle pressure: 2.0 kg/cm
2, inflow: 10L/min; Bake out temperature: 65 ℃;
Acid etching: operation is acid etching → washing → striping → washing → oven dry; Etching solution proportion 1.33, HCl concentration 2.8mol/L, NaClO
3Concentration 50g/L, Cu
2+Concentration 140g/L, 55 ℃ of etch temperature, upper spray spray is pressed: 3 kg/cm
2, lower spray spray is pressed: 2.6kg/cm
2Washing inflow 6L/min, washing pressure: 3.0 kg/cm
2Striping groove NaOH mass concentration 6%, speed: 2.0m/min, 55 ℃ of temperature; Washing flow of inlet water: 6L/min, nozzle exit pressure: 3.0kg/cm
2Bake out temperature: 65 ℃;
3, the light-emitting diode printed substrate completed of etching is processed through the anti-welding pretreatment line of inferior intelligence, the permanent two table top printing machines of connection carry out ink printing, group's assist frame-type baking box is pre-baked, the anti-welding exposure film exposure of using the ORC automatic exposure machine and making, inferior intelligence developing line develops, and obtains final soft gold and electroplates the electroplate lead wire that needs;
Anti-welding preliminary treatment linear speed: 3.5m/min, microetch speed: 50 microinch, circulating water wash inflow: 7L/min, bake out temperature: 90 ℃;
Anti-solder ink printing: print speed printing speed 4.5m/min, half tone height＜20mm, squeegee pressure: 0.8MPa, scraper angle＜20 °;
Pre-baked: 78 ℃ of temperature, pre-baked time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity〉80%;
Develop: speed 3.8m/min, 32 ℃ of temperature, pressure 2.0kg/cm
2, K
2CO
3Concentration 12g/L, washing inflow: 6L/min, 70 ℃ of bake out temperatures.
The wiring board of completing according to a kind of light-emitting diode electroplating printed circuit board lead-in wire of the present invention processing method case step can add false plating plate and be directly used in soft gold plating, the appearance color homogeneous that obtains plating nickel gold is consistent, nickel plating thickness maximum subtracts approximately 150 microinch of minimum value, the maximum of soft golden thickness subtracts the product of minimum value 3 microinch, reduce edges of boards and false plating plate to the consumption of potassium auricyanide and electronickelling gold liquid medicine, reduce and pollute, be beneficial to environmental protection.
Claims (1)
1. one kind is applied to the processing method that the light-emitting diode electroplating printed circuit board goes between, and it is characterized in that: adopt following procedure of processing:
The first step: the making of outer exposure film and anti-welding exposure film
(1) minor face (1) is arranged two-layer electroplate lead wire, live width 1mm, conduction limit (12) and minor face ground floor electroplate lead wire (3), minor face ground floor electroplate lead wire (3) and minor face second layer electroplate lead wire (4) interval 2mm, and the distance every 1cm is arranged an outwardly false copper facing skin (16) on wire, copper sheet width 1mm, length 1.5mm; Be connected with conduction limit (12) at the minor face wire that the position of 14～15cm arranges two width 1mm of being separated by between two parties; Second layer electroplate lead wire (4) evenly arranges three wires and is connected with ground floor electroplate lead wire (3), conductor width 1mm; Two wires that connect conduction limit and ground floor electroplate lead wire, overlapping can not appear in three wires that connect ground floor and second layer electroplate lead wire, and the ground floor electroplate lead wire can not directly be connected with the conduction limit with second layer electroplate lead wire two ends;
(2) grow limit (2) and arrange one deck electroplate lead wire (10), with the conduction limit at a distance of 2mm, live width 1mm, and arrange an outwards false copper facing skin (16) of projection every the distance of 1cm on lead-in wire, copper sheet width 1mm, length 1.5mm, the wire (11) that a 1.5mm width is set in the centre position on long limit make long limit electroplate lead wire be connected with the conduction limit;
(3) except the circular optical point that anti-welding exposure aligning is used (13), outer contraposition optical point (14) and section hole (15) can not isolate existence, need to use wire and are connected the limit connection; The first, two layer of electroplate lead wire that one deck electroplate lead wire (10) and minor face are electroplated in long limit can not cover anti-solder ink;
(4) electroplate lead wire is to plating area (17) connected mode: four limits, plating area evenly arrange three wires (20) On current in the plate; False copper facing skin (18) is arranged on the wire of On current in the plate, and width is 3mm; The false copper facing skin (19) of 3 х 3mm crosses is arranged in the electroplate lead wire crosspoint, and the remainder electroplate lead wire of plating area surrounding covers anti-solder ink;
Second step: the processing of electroplate lead wire
(1) will complete the outer pretreatment line microetch of light-emitting diode printed substrate process of electro-coppering through electroplated copper cash by vertical continuous, washing, pickling, washing, oven dry is cleaned; Cleaning pan feeding linear speed: 1.8-2.2m/min; Microetch speed: 30-50 microinch; The microetch spray is pressed: 1.5-2.5kg/cm
2Two circulating water wash pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Descaling bath sulfuric acid volumetric concentration: 2-4%; Three circulating water wash pressure: 0.4-0.8 kg/cm
2, flow of inlet water: 5-7L/min; Bake out temperature: 75-85 ℃;
(2) will press dry film through outer film laminator through pretreated light-emitting diode printed substrate, the outer exposure film exposure of using automatic exposure machine and making, developing line develops, and then making through acid line etching needs outer electroplate lead wire;
Press dry film: preheating divides three sections, and three sections temperature are respectively 100-110 ℃, and 100-110 ℃, 80-100 ℃, speed 1.5-4.0 m/min; Paste the dry film wheel speeds: 1.8-2.2m/min, roller temperature: 110-120 ℃, roller pressure: 0.3-0.5MPa;
Exposure: energy uniformity is the 10-12 level greater than 85%, 25 grade of exposure progression table test progression;
Develop: development Na
2CO
3Mass concentration 0.8-1.2%, 1.5-1.7 kg/cm is pressed in spray
2, speed 3.0-4.0 m/min, temperature 28-32 ℃; Middle setting-out is washed pressure: 1.2-2.5 kg/cm
2, inflow: 5-10L/min; The compound washing pressure of middle pressure: 1.6-2.0 kg/cm
2, inflow: 5-10L/min; Bake out temperature: 50-65 ℃;
Acid etching: operation is acid etching, washing, striping, washing, oven dry; Etching solution proportion 1.26-1.33, HCl concentration 2.0-2.8mol/L, NaClO
3Concentration 15-50g/L, Cu
2+Concentration 95-140g/L, etch temperature 45-55 ℃, upper spray spray is pressed: 2.2 ± 0.8 kg/cm
2, lower spray spray is pressed: 1.8 ± 0.8 kg/cm
2Washing inflow 4-6L/min, washing pressure: 0.5-3.0 kg/cm
2Striping groove NaOH mass concentration 3-6%, speed: 1.0-2.0m/min, temperature 45-55 ℃; Washing flow of inlet water: 4-6L/min, nozzle exit pressure: 0.5-3.0kg/cm
2Bake out temperature: 55-65 ℃;
(3) the light-emitting diode printed wire boards half-finished product of completing through acid etching is processed through anti-welding pretreatment line, two table top printing machines carry out ink printing, the frame-type baking box is pre-baked, the anti-welding exposure film exposure of using exposure machine and making, developing line develops, and obtains final soft gold and electroplates the electroplate lead wire that needs;
Anti-welding preliminary treatment linear speed: 2.5-3.5m/min, microetch speed: 30-50 microinch, circulating water wash inflow: 3-7L/min, bake out temperature: 80-90 ℃;
Anti-solder ink printing: print speed printing speed 3.0 ± 2.5m/min, half tone height＜20mm, squeegee pressure: 0.5 ± 0.3MPa, scraper angle＜20 °;
Pre-baked: 75 ± 3 ℃ of temperature, pre-baked time: 20min;
Exposure: pitch value ± 40um, exposure energy uniformity〉80%;
Develop: speed 3.5-3.8m/min, temperature 28-32 ℃, pressure 1.0-2.0kg/cm
2, K
2CO
3Concentration 8-12g/L, washing inflow: 3-6L/min, bake out temperature 50-70 ℃.
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|---|---|---|---|
| CN 201110226119 CN102421255B (en) | 2011-08-08 | 2011-08-08 | Processing method of electroplated lead applied to LED printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110226119 CN102421255B (en) | 2011-08-08 | 2011-08-08 | Processing method of electroplated lead applied to LED printed circuit board |
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| CN102421255A CN102421255A (en) | 2012-04-18 |
| CN102421255B true CN102421255B (en) | 2013-05-08 |
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| CN 201110226119 Active CN102421255B (en) | 2011-08-08 | 2011-08-08 | Processing method of electroplated lead applied to LED printed circuit board |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104780710B (en) * | 2014-01-15 | 2018-06-15 | 深圳崇达多层线路板有限公司 | Printed wiring board and preparation method thereof |
| CN104066278A (en) * | 2014-06-19 | 2014-09-24 | 四川普瑞森电子有限公司 | Resistance welding pretreatment method of printed circuit board and resistance welding pretreatment roughening micro-etching agent |
| CN108617103B (en) * | 2018-05-10 | 2019-12-24 | 广州兴森快捷电路科技有限公司 | Jigsaw structure |
| CN108811349A (en) * | 2018-06-29 | 2018-11-13 | 奥士康精密电路（惠州）有限公司 | A method of improving pcb board production efficiency |
| CN108875250B (en) * | 2018-07-02 | 2023-03-24 | 广州美维电子有限公司 | Method for improving uniformity of electroplated soft gold, electronic equipment and storage medium |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2109638A (en) * | 1981-11-11 | 1983-06-02 | Greenwoods Electronics Manufac | Printed circuit boards |
| US6383401B1 (en) * | 2000-06-30 | 2002-05-07 | International Flex Technologies, Inc. | Method of producing flex circuit with selectively plated gold |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
-
2011
- 2011-08-08 CN CN 201110226119 patent/CN102421255B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2109638A (en) * | 1981-11-11 | 1983-06-02 | Greenwoods Electronics Manufac | Printed circuit boards |
| US6383401B1 (en) * | 2000-06-30 | 2002-05-07 | International Flex Technologies, Inc. | Method of producing flex circuit with selectively plated gold |
| CN101267713A (en) * | 2008-04-30 | 2008-09-17 | 陈国富 | Making method of electric nickel and golden circuit board for saving nickel and gold dosage |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102421255A (en) | 2012-04-18 |
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