CN102419276A - Preparation method of metallographic microsection sample - Google Patents
Preparation method of metallographic microsection sample Download PDFInfo
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- CN102419276A CN102419276A CN2011102336174A CN201110233617A CN102419276A CN 102419276 A CN102419276 A CN 102419276A CN 2011102336174 A CN2011102336174 A CN 2011102336174A CN 201110233617 A CN201110233617 A CN 201110233617A CN 102419276 A CN102419276 A CN 102419276A
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Abstract
The invention provides a preparation method of a metallographic microsection sample, comprising the following steps: A, applying proper amount of degumming agent on the bottom and lateral side of a glue pouring agent model; B, mixing proper amount of resin and hardening agent to form a resin adhesive; C, putting a test piece horizontally in the glue pouring agent model; D, slowly injecting the resin adhesive to the center of the test piece until the resin completely covers the test piece; E, putting the glue pouring agent model in a vacuum-pumping machine for vacuumizing; and F, taking the glue pouring agent model out from the vacuum-pumping machine, and completely hardening the resin to finish the preparation of a metallographic microsection sample. According to the invention, a large amount of cold-buried consumables are saved, and the grinding speed of subsequent grinding process in increased; when subsequent scanning electron microscope observation is carried out, the use of the prepared metallographic microsection sample saves the gold-plating consumption; a plurality of samples can be placed in a sample warehouse at a time, thus the speed of observation and analysis of the sample is increased, the production cost is reduced, and the invention brings certain economic benefits for enterprises.
Description
Technical field
The present invention relates to a kind of preparation method of microsection sample.
Background technology
Microsection has another name called section, be with special liquid resin with the solid envelope of sample parcel, carry out a kind of method for making sample of grinding and polishing then, data such as testing process comprises sampling, seals, polishes, provides the pattern photo admittedly, cracking layering size judgement or size.Microsection is the most common means of present observation sample section structure structure situation.Preparation about the microsection sample; Method commonly used in the industry be sample vertically Feng Jinleng bury material, this method is relatively wasted consumptive material, and during follow-up use scanning electron microscope; The gold-plated consumption of sample is also bigger, and the disposable sample size of putting into sample bin is less.Therefore need a kind of new method to reduce the loss of consumptive material in the microsection sample making course and improve follow-up sample observation analysis speed.
Summary of the invention
For the big and slow-footed problem of microsection sample scanning analysis of waste that solves existing microsection sample preparation methods consumptive material, the present invention proposes following technical scheme:
A kind of preparation method of microsection sample may further comprise the steps:
A, be coated with degumming agent: get bottom and sidepiece that an amount of degumming agent evenly is applied in encapsulating agent model, smear and encapsulating agent model is put in air drying after accomplishing;
B, preparation resin glue:, and resin and rigidizer concocted according to sample preparation quantity and resin and rigidizer proportionate relationship weighing resin and rigidizer;
The preparation of C, test piece: get quantity of resin glue and pour the dry encapsulating agent model the inside of degumming agent into, put into test piece, and horizontality is adjusted in test piece;
D, adjust the test piece position after, resin glue is slowly injected from the central authorities of test piece, till resin covers test piece fully, and remove the bubble that the resin injection process produces;
E, encapsulating agent model is positioned in the vacuum pumping pump vacuumizes, vacuumize and finish the back and kept 2 minutes;
F, encapsulating agent model is taken out in evacuator, treat that resin glue hardens fully after, accomplish sample preparation.
As a kind of preferred version of the present invention, put into test piece among the said step C before, earlier in encapsulating agent model, put into microslide.
As another kind of preferred version of the present invention, in the said step F, encapsulating agent model will slowly take out from evacuator, enters into resin glue to avoid bubble.
The beneficial effect that the present invention brings is:
1, the inventive method has been saved a large amount of cold consumptive materials that buries, and has improved the grinding rate of follow-up grinding step;
2, the microsection sample of the inventive method preparation makes when carrying out the follow up scan electron microscope observation, has saved gold-plated consumption, has reduced production cost, has brought certain economic benefits to enterprise;
3, to take volume little for the microsection sample of the inventive method preparation, once can place a plurality of these samples in sample bin, improved the speed of the observation analysis of sample, improved throughput rate.
Embodiment
Set forth in detail in the face of preferred embodiment of the present invention down, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
A kind of preparation method of microsection sample may further comprise the steps:
A, be coated with degumming agent: get bottom and sidepiece that an amount of degumming agent evenly is applied in encapsulating agent model, smear and encapsulating agent model is put in air drying after accomplishing;
B, preparation resin glue: microsection sample of present embodiment preparation, weighing 10g resin and 2g rigidizer carry out the mixed preparing resin glue;
The preparation of C, test piece: the resin glue that takes a morsel is poured the dry encapsulating agent model the inside of degumming agent into, puts into a slice microslide earlier, puts into test piece then, and horizontality is adjusted in test piece;
D, adjust the test piece position after, resin glue is slowly injected from the central authorities of test piece, till resin covers test piece fully, and remove the bubble that the resin injection process produces;
E, encapsulating agent model is positioned in the vacuum pumping pump vacuumizes, vacuumize and finish the back and kept 2 minutes;
F, encapsulating agent model slowly taken out in evacuator avoids bubble to enter into resin glue, treat that resin hardens fully after, accomplish sample preparation.
The above; Be merely embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any those of ordinary skill in the art are in the technical scope that the present invention disclosed, and variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (3)
1. the preparation method of a microsection sample, it is characterized in that: this preparation method may further comprise the steps:
A, be coated with degumming agent: get bottom and sidepiece that an amount of degumming agent evenly is applied in encapsulating agent model, smear and encapsulating agent model is put in air drying after accomplishing;
B, preparation resin glue:, and resin and rigidizer concocted according to sample preparation quantity and resin and rigidizer proportionate relationship weighing resin and rigidizer;
The preparation of C, test piece: get quantity of resin glue and pour the dry encapsulating agent model the inside of degumming agent into, put into test piece, and horizontality is adjusted in test piece;
D, adjust the test piece position after, resin glue is slowly injected from the central authorities of test piece, till resin covers test piece fully, and remove the bubble that the resin injection process produces;
E, encapsulating agent model is positioned in the vacuum pumping pump vacuumizes, vacuumize and finish the back and kept 2 minutes;
F, encapsulating agent model is taken out in evacuator, treat that resin glue hardens fully after, accomplish sample preparation.
2. the preparation method of a kind of microsection sample according to claim 1 is characterized in that: before putting into test piece among the said step C, in encapsulating agent model, put into microslide earlier.
3. the preparation method of a kind of microsection sample according to claim 1 is characterized in that: in the said step F, encapsulating agent model will slowly take out from evacuator, enters into resin glue to avoid bubble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102336174A CN102419276A (en) | 2011-08-16 | 2011-08-16 | Preparation method of metallographic microsection sample |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102336174A CN102419276A (en) | 2011-08-16 | 2011-08-16 | Preparation method of metallographic microsection sample |
Publications (1)
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| CN102419276A true CN102419276A (en) | 2012-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102336174A Pending CN102419276A (en) | 2011-08-16 | 2011-08-16 | Preparation method of metallographic microsection sample |
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| CN (1) | CN102419276A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721584A (en) * | 2012-06-21 | 2012-10-10 | 三星高新电机（天津）有限公司 | Quick preparation method and device for embedded sample |
| CN102879246A (en) * | 2012-09-28 | 2013-01-16 | 无锡江南计算技术研究所 | Metallographic sample preparation method and metallographic sample mould for packaged chips |
| CN103076216A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Preparation method, grinding method and device for microsection sample |
| CN104535393A (en) * | 2015-01-16 | 2015-04-22 | 山东泰山钢铁集团有限公司 | Method for manufacturing metallographic specimen by using denture base resin |
| CN105527289A (en) * | 2014-09-29 | 2016-04-27 | 芬欧汇川(中国)有限公司 | System used for observing cross section of paper product and observation method thereof |
| CN106546459A (en) * | 2016-11-02 | 2017-03-29 | 江苏弘信华印电路科技有限公司 | A kind of method that microsection makes |
| CN108871902A (en) * | 2018-07-23 | 2018-11-23 | 超威电源有限公司 | A kind of metallographic sample preparation method and device |
| CN110608939A (en) * | 2019-08-28 | 2019-12-24 | 广东风华高新科技股份有限公司 | Ceramic electronic component metallographic section and preparation method thereof |
| CN114102695A (en) * | 2021-11-19 | 2022-03-01 | 阔智科技（广州）有限公司 | Slicing method of sealing adhesive BGA |
Citations (2)
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| JPH09266360A (en) * | 1996-03-29 | 1997-10-07 | Oki Electric Ind Co Ltd | Test coupon for printed interconnection board |
| CN201274604Y (en) * | 2008-07-16 | 2009-07-15 | 英业达科技有限公司 | Printed circuit board |
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Patent Citations (2)
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| JPH09266360A (en) * | 1996-03-29 | 1997-10-07 | Oki Electric Ind Co Ltd | Test coupon for printed interconnection board |
| CN201274604Y (en) * | 2008-07-16 | 2009-07-15 | 英业达科技有限公司 | Printed circuit board |
Non-Patent Citations (2)
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| 孙静静: "印制板（PCB）金相切片样品的制备及其对判读的影响", 《第四届全国青年印制电路学术年会》 * |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102721584A (en) * | 2012-06-21 | 2012-10-10 | 三星高新电机（天津）有限公司 | Quick preparation method and device for embedded sample |
| CN102879246A (en) * | 2012-09-28 | 2013-01-16 | 无锡江南计算技术研究所 | Metallographic sample preparation method and metallographic sample mould for packaged chips |
| CN103076216A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Preparation method, grinding method and device for microsection sample |
| CN103076216B (en) * | 2012-12-28 | 2015-01-21 | 广州杰赛科技股份有限公司 | Preparation method, grinding method and device for microsection sample |
| CN105527289A (en) * | 2014-09-29 | 2016-04-27 | 芬欧汇川(中国)有限公司 | System used for observing cross section of paper product and observation method thereof |
| CN104535393A (en) * | 2015-01-16 | 2015-04-22 | 山东泰山钢铁集团有限公司 | Method for manufacturing metallographic specimen by using denture base resin |
| CN106546459A (en) * | 2016-11-02 | 2017-03-29 | 江苏弘信华印电路科技有限公司 | A kind of method that microsection makes |
| CN108871902A (en) * | 2018-07-23 | 2018-11-23 | 超威电源有限公司 | A kind of metallographic sample preparation method and device |
| CN108871902B (en) * | 2018-07-23 | 2023-08-29 | 超威电源集团有限公司 | Metallographic sample preparation method and device |
| CN110608939A (en) * | 2019-08-28 | 2019-12-24 | 广东风华高新科技股份有限公司 | Ceramic electronic component metallographic section and preparation method thereof |
| CN110608939B (en) * | 2019-08-28 | 2022-03-29 | 广东风华高新科技股份有限公司 | Ceramic electronic component metallographic section and preparation method thereof |
| CN114102695A (en) * | 2021-11-19 | 2022-03-01 | 阔智科技（广州）有限公司 | Slicing method of sealing adhesive BGA |
| CN114102695B (en) * | 2021-11-19 | 2024-04-26 | 阔智科技（广州）有限公司 | Slicing method of sealing glue BGA |
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Application publication date: 20120418 |