CN102412346A - Method for manufacturing light-emitting diode - Google Patents
Method for manufacturing light-emitting diode Download PDFInfo
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- CN102412346A CN102412346A CN2010102898124A CN201010289812A CN102412346A CN 102412346 A CN102412346 A CN 102412346A CN 2010102898124 A CN2010102898124 A CN 2010102898124A CN 201010289812 A CN201010289812 A CN 201010289812A CN 102412346 A CN102412346 A CN 102412346A
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Abstract
The invention discloses a method for manufacturing a light-emitting diode. The method comprises the following steps of: 1) providing a base plate with a plurality of accommodation grooves, wherein steps are arranged in each accommodation groove; 2) fixing a plurality of light-emitting chips in the accommodation grooves respectively to ensure that at least one light-emitting chip is arranged in each accommodation groove; 3) providing a plurality of packaging bodies, and fixing each packaging body on the surface of the step in each accommodation groove by using glue; and 4) cutting the base plate into a plurality of independent light-emitting diodes. In the method for manufacturing the light-emitting diode, a jig is not needed to be used, and manufacturing cost can be saved effectively.
Description
Technical field
The present invention relates to a kind of diode fabricating method, be meant a kind of method for manufacturing light-emitting especially.
Background technology
Light-emitting diode relies on its high light efficiency, low energy consumption, advantage such as pollution-free, has been applied among the increasing occasion, has much the trend that replaces conventional light source.
In the process of making light-emitting diode; Based on cost consideration; It is a monoblock substrate that normally first pedestal with a plurality of light-emitting diodes is made into integration, and through cutting it is divided into a plurality of independently pedestals then, luminescence chip is located in the accepting groove of each pedestal afterwards again.Owing to need protect the luminescence chip of light-emitting diode, therefore at last also must on each pedestal, fix transparent encapsulated layer.At present industry adopts two kinds of methods to realize the fixing of encapsulated layer usually, and a kind of is directly a monoblock package board to be covered on the substrate that scribbles viscose glue, together cuts with substrate then and forms a plurality of independently encapsulation individualities with substrate is common; Another kind then is earlier package board to be cut into a plurality of independently encapsulated layers in advance; On substrate, place again one offer a plurality of location holes the smelting tool; Wherein the size of location hole is larger than the size of accepting groove; Coat viscose glue at substrate surface near the position at accepting groove edge then, the encapsulated layer of well cutting passes location hole and is bonded in substrate surface again, and it is individual again substrate cut to be formed a plurality of independent LED encapsulation at last.
Yet; All there is weak point in aforementioned two kinds of methods: preceding a kind of owing to be that package board with monoblock is placed on the substrate and cuts; If deviation appears in the position that package board is placed, will cause the corresponding optical texture of encapsulated layer can't aim at luminescence chip and cause by the bright dipping of all light-emitting diodes of monoblock substrate cut and all squint.Moreover, because package board is different with the hardness of substrate, causes cutting the mortality rising when cutting at the same time easily and influence the product yield.Second method need use tool, because a kind of tool only can be applicable to a kind of substrate of aperture, when being used for the substrate in different apertures, just need change tool simultaneously, causes production cost to rise.
Summary of the invention
So, be necessary the method for manufacturing light-emitting that provides a kind of cost low.
A kind of method for manufacturing light-emitting comprises step:
The substrate of offering a plurality of accepting grooves is provided, has step in each accepting groove;
A plurality of luminescence chips are individually fixed in a plurality of accepting grooves of substrate, make to have a luminescence chip in each accepting groove at least;
Respectively a plurality of encapsulated layers are fixed on the step of these accepting grooves through viscose glue;
With substrate cut is a plurality of independent LED.
This manufacturing approach is owing to be formed with step in accepting groove, encapsulated layer can directly be placed on the step and need not to adopt tool that it is positioned, thereby saves whole production cost so this manufacturing approach can dispense tool.
With reference to the accompanying drawings, in conjunction with specific embodiment the present invention is done further description.
Description of drawings
Fig. 1 shows first step of the light-emitting diode of making first embodiment of the invention.
Fig. 2 shows second step of the light-emitting diode of making first embodiment of the invention.
Fig. 3 shows the 3rd step of the light-emitting diode of making first embodiment of the invention.
Fig. 4 shows the 4th step of the light-emitting diode of making first embodiment of the invention, and wherein one of substrate jiao is cut open with convenient observation.
Fig. 5 shows the 5th step of the light-emitting diode of making first embodiment of the invention.
Fig. 6 shows the light-emitting diode of making first embodiment that accomplishes.
Fig. 7 shows a step of the light-emitting diode of making second embodiment of the invention.
Fig. 8 shows the light-emitting diode of making second embodiment that accomplishes.
The main element symbol description
Accepting groove 12
Viscose glue 30
Encapsulated layer 40
Embodiment
See also Fig. 1-6, show the method for the light-emitting diode of a kind of manufacturing first embodiment.At first, the substrate 10 that provides an end face to offer a plurality of accepting grooves 12.The material that this substrate 10 can adopt plastics or other to be fit to is made, and it has one and is flat rectangular configuration.These accepting grooves 12 are arranged as matrix along the direction of the four side of parallel substrate 10, are separated out a segment distance between adjacent two accepting grooves 12 and communicate with each other avoiding.The aperture of the bottom of each accepting groove 12 is less than the aperture on top and forms a step 14 in the position near the center.This step 14 is parallel to substrate 10 end faces and accepting groove 12 bottom surfaces.Then, in each accepting groove 12, luminescence chip 20 is set respectively.The material of these luminescence chips 20 can be selected according to the luminous demand of reality, such as the GaAsP that glows, and the InGaAlP of jaundice light, the GaN of blue light-emitting, GaP of green light or the like.And luminescence chip 20 quantity in each accepting groove 12 also can change according to the actual requirements, more than reaching such as two, three, and are not limited to shown in the figure.Subsequently, at surface-coated one deck viscose glue 30 of each step 14, the encapsulated layer 40 with a plurality of well cuttings places in each accepting groove 12 again.Encapsulated layer 40 can be made by various transparent materials, is preferably glass in the present embodiment.Each encapsulated layer 40 is roughly rectangular, and its area is slightly less than the area on accepting groove 12 tops and greater than the area of accepting groove 12 bottoms.Encapsulated layer 40 is fixed in step 14 surfaces through viscose glue 30, thus the encapsulation of realization and substrate 10.At last, through cutter sweep substrate 10 is cut into a plurality of independent LED along its secant.Each secant is parallel to the respective side edge of substrate 10 and between adjacent two accepting grooves 12, so that substrate 10 is evenly cut apart.
Should be pointed out that for the luminescence chip 20 of formal dress type, also include the step of it being carried out routing in the above-mentioned manufacture process, but this step to belong to known technology, so and exclude in the above-mentioned manufacture process.For the luminescence chip 20 of flip chip type, its with substrate 10 fixation process in accomplished the step that is electrically connected, therefore need not to carry out again routing.
Be appreciated that ground, for difform light-emitting diode, its manufacturing approach also can be done corresponding the variation so that make more flexible.Such as when encapsulated layer 40 is changed to dome-shaped shown in Fig. 7-8 by above-mentioned tabular, its fixation procedure with substrate 10 just can be different with aforementioned process.Particularly; Arc and the middle part, its bottom surface that is evagination owing to the outer surface of this encapsulated layer 40 offer a cavity form one with the arc-shaped inner surface of outer surface almost parallel, therefore can be earlier at encapsulated layer 40 viscose glue 30 on the bottom surface point between inner surface and the outer surface.This viscose glue 30 can adopt PUR associated materials such as (like EVA copolymer, polyester, Polyurethane etc.) made, and it possesses the characteristics of at high temperature softening viscous and at room temperature hardening.Then, substrate 10 is heated, make on its softening temperature that remains on viscose glue 30.Again encapsulated layer 40 is placed in the accepting groove 12, the viscose glue 30 of its bottom surface is contacted with the step 14 of substrate 10.Receive substrate 10 Influence of Temperature, viscose glue 30 takes place softening and encapsulated layer 40 and step 14 is bonding.Make substrate 10 drop to room temperature subsequently, encapsulated layer 40 and substrate 10 are fixed.Again to substrate 10 cuttings, make it be divided into a plurality of independent LED at last.
Because be formed with step 14 on the substrate 10, encapsulated layer 40 can directly place on the step 14, need not to accomplish the position fixing process with substrate 10 by tool.Therefore, the method can effectively reduce the manufacturing cost of light-emitting diode, is convenient to industry and applies.And, because can playing one to viscose glue 30, the step 14 that forms accommodates effect, make it unlikelyly diffuse out substrate 10 surfaces and cause substrate 10 is polluted, and can guarantee that therefore substrate 10 surfaces are clean and tidy, and can prevent that the situation that viscose glue 30 that secant is overflowed covers from taking place.
Claims (10)
1. a method for manufacturing light-emitting comprises step: 1) substrate of offering a plurality of accepting grooves is provided, has step in each accepting groove; 2) some luminescence chips are individually fixed in these accepting grooves, make to have a luminescence chip in each accepting groove at least; 3) a plurality of packaging bodies are provided, each packaging body are fixed in the ledge surface of each accepting groove through viscose glue; 4) be a plurality of independent LED with substrate cut.
2. method for manufacturing light-emitting as claimed in claim 1 is characterized in that: accepting groove in the aperture on step top greater than aperture in the step bottom.
3. method for manufacturing light-emitting as claimed in claim 1 is characterized in that: step is parallel to substrate top surface and accepting groove bottom surface.
4. method for manufacturing light-emitting as claimed in claim 1, it is characterized in that: packaging body is processed by glass.
5. method for manufacturing light-emitting as claimed in claim 2 is characterized in that: the area of packaging body is less than the area on accepting groove top and greater than the area of accepting groove bottom.
6. like each described method for manufacturing light-emitting of claim 1 to 5, it is characterized in that: the viscose glue in the step 3) is coated on the ledge surface in the accepting groove earlier, and is bonding with encapsulated layer again.
7. like each described method for manufacturing light-emitting of claim 1 to 5, it is characterized in that: the viscose glue in the step 3) is coated on the encapsulated layer bottom surface earlier, and is bonding with the step of accepting groove again.
8. method for manufacturing light-emitting as claimed in claim 7 is characterized in that: before the bonding step of viscose glue, also comprise the step that substrate is heated.
9. method for manufacturing light-emitting as claimed in claim 8 is characterized in that: viscose glue is a PUR.
10. method for manufacturing light-emitting as claimed in claim 7 is characterized in that: encapsulated layer comprises the outer surface of an evagination and the inner surface of an indent, and viscose glue is coated between the outer surface and inner surface of encapsulated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102898124A CN102412346A (en) | 2010-09-23 | 2010-09-23 | Method for manufacturing light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102898124A CN102412346A (en) | 2010-09-23 | 2010-09-23 | Method for manufacturing light-emitting diode |
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| Publication Number | Publication Date |
|---|---|
| CN102412346A true CN102412346A (en) | 2012-04-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102898124A Pending CN102412346A (en) | 2010-09-23 | 2010-09-23 | Method for manufacturing light-emitting diode |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325919A (en) * | 2013-06-27 | 2013-09-25 | 深圳市东昊光电子有限公司 | LED manufacturing technology of L-shaped metal base plate and base plate |
| CN111145667A (en) * | 2020-01-22 | 2020-05-12 | 常州机电职业技术学院 | Character die and pattern LED lamp bead glue injection clamping tool and LED lamp bead fixing method |
Citations (7)
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| CN1306476A (en) * | 1998-06-23 | 2001-08-01 | 阿梅拉西亚国际技术公司 | Method of making adhesive preform lid for electronic devices |
| CN1870306A (en) * | 2005-05-26 | 2006-11-29 | 深圳市龙岗区横岗光台电子厂 | LED grain binding fixing method and grain binding structure using the method |
| US20070194333A1 (en) * | 2006-02-23 | 2007-08-23 | Lg Innotek Co., Ltd | Light emitting diode package and method of manufacturing the same |
| JP2007317815A (en) * | 2006-05-25 | 2007-12-06 | Matsushita Electric Works Ltd | Light-emitting device |
| JP4389840B2 (en) * | 2005-05-26 | 2009-12-24 | パナソニック電工株式会社 | Manufacturing method of circuit board for mounting semiconductor element |
| CN101681960A (en) * | 2007-05-09 | 2010-03-24 | 希爱化成株式会社 | Light emitting device and package assembly for light emitting device |
| CN101820044A (en) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Metal substrate and light-emitting diode encapsulation method of metal substrate |
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2010
- 2010-09-23 CN CN2010102898124A patent/CN102412346A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306476A (en) * | 1998-06-23 | 2001-08-01 | 阿梅拉西亚国际技术公司 | Method of making adhesive preform lid for electronic devices |
| CN1870306A (en) * | 2005-05-26 | 2006-11-29 | 深圳市龙岗区横岗光台电子厂 | LED grain binding fixing method and grain binding structure using the method |
| JP4389840B2 (en) * | 2005-05-26 | 2009-12-24 | パナソニック電工株式会社 | Manufacturing method of circuit board for mounting semiconductor element |
| US20070194333A1 (en) * | 2006-02-23 | 2007-08-23 | Lg Innotek Co., Ltd | Light emitting diode package and method of manufacturing the same |
| JP2007317815A (en) * | 2006-05-25 | 2007-12-06 | Matsushita Electric Works Ltd | Light-emitting device |
| CN101681960A (en) * | 2007-05-09 | 2010-03-24 | 希爱化成株式会社 | Light emitting device and package assembly for light emitting device |
| CN101820044A (en) * | 2010-04-09 | 2010-09-01 | 江苏伯乐达光电科技有限公司 | Metal substrate and light-emitting diode encapsulation method of metal substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325919A (en) * | 2013-06-27 | 2013-09-25 | 深圳市东昊光电子有限公司 | LED manufacturing technology of L-shaped metal base plate and base plate |
| CN103325919B (en) * | 2013-06-27 | 2016-01-06 | 深圳市东昊光电子有限公司 | A kind of LED production technology of L-type metal substrate and substrate |
| CN111145667A (en) * | 2020-01-22 | 2020-05-12 | 常州机电职业技术学院 | Character die and pattern LED lamp bead glue injection clamping tool and LED lamp bead fixing method |
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Application publication date: 20120411 |