CN102403368A - Tinned and silvered high-conduction soldering strip - Google Patents

Tinned and silvered high-conduction soldering strip Download PDF

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Publication number
CN102403368A
CN102403368A CN2010102776042A CN201010277604A CN102403368A CN 102403368 A CN102403368 A CN 102403368A CN 2010102776042 A CN2010102776042 A CN 2010102776042A CN 201010277604 A CN201010277604 A CN 201010277604A CN 102403368 A CN102403368 A CN 102403368A
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CN
China
Prior art keywords
silver
silvered
soldering
copper
strip
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010102776042A
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Chinese (zh)
Inventor
吴平
陶俊兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI ZHONGYUAN NEW MATERIAL Co Ltd
Original Assignee
ANHUI ZHONGYUAN NEW MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI ZHONGYUAN NEW MATERIAL Co Ltd filed Critical ANHUI ZHONGYUAN NEW MATERIAL Co Ltd
Priority to CN2010102776042A priority Critical patent/CN102403368A/en
Publication of CN102403368A publication Critical patent/CN102403368A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a tinned and silvered high-conduction soldering strip, which comprises a copper substrate made of pure copper and a soldering tin layer arranged on the copper substrate surface. The tinned and silvered high-conduction soldering strip is characterized by comprising a slivered layer arranged between the copper substrate and the soldering tin layer. Silvered trenches are arranged in the centers of two faces of the copper substrate, and a silver strip is arranged in each silvered trench, so that the slivered layer is formed. The width of the copper substrate ranges from 0.50mm to 6.00mm, the thickness of the copper substrate ranges from 0.05mm to 0.30mm, the width of the silvered layer ranges from 0.15mm to 3.00mm, and the thickness of the silvered layer ranges from 0.02mm to 0.10mm. By the aid of the silver strips inlaid into the centers of the two faces of the copper substrate, during practical use of the tinned and silvered high-conduction soldering strip, the inlaid silver strips can contact with a conductive strip of a cell plate directly, so that the conductive performance of products is greatly enhanced on the premise that the cell plate and the soldering strip are not affected. The tinned and silvered high-conduction soldering strip has the advantages of stable structure, high solderability, low cost and high elongation, and is capable of meeting the requirements of photovoltaic cell plates on high conduction of soldering strips.

Description

Being coated with tin inlays silver-colored height and leads welding
Technical field
What the present invention relates to is a kind of welding, and what be specifically related to is that photovoltaic that a kind of photovoltaic module (monocrystalline silicon, polysilicon and hull cell) that is applied to solar power generation connects usefulness is coated with tin and inlays silver-colored height and lead welding.
Background technology
Welding is one of main auxiliary material of photovoltaic module, on solar panel, plays a part to connect silicon chip and changes a conduction, and its inherent conductivity, solderability and percentage elongation play crucial effects to the quality of photovoltaic module.
Since the solar power generation mass production; The connecting band of battery sheet (PV) is taked the mode of copper base band surfaces coated tin always; But along with the continuous development of photovoltaic technology, the parameters of silicon chip is improved before, especially improves the silicon chip power of unit are; The thickness of silicon chip is more and more thinner at present; To the requirement of welding with select also increasingly highly, and, limitation on the material of copper material own and photovoltaic cell can not satisfy the requirement of photovoltaic module because to the requirement of high conduction performance, being the conductivity of the photovoltaic tin-coated welding strip of base material fully with copper.
Summary of the invention
To the deficiency that exists on the prior art, the present invention seeks to be to provide a kind of solderability strong and electric conductivity is high is coated with tin and inlays silver-colored height and lead welding, satisfy of the requirement of photovoltaic cell sheet to the welding high conduction performance.
To achieve these goals, the present invention realizes through following technical scheme:
Be coated with tin and inlay silver-colored height and lead welding, comprise base copper of processing with fine copper and the soldering-tin layer that is arranged on the base copper surface it is characterized in that it also comprises the edge silver layer that is arranged between base copper and the soldering-tin layer; The center, two sides of said base copper is equipped with the silver-colored groove of edge, and the silver band is set in the silver-colored groove of said edge, constitutes described edge silver layer; Said base copper width 0.50~6.00mm, thickness 0.05~0.30mm, said edge silver layer width 0.15~3.00mm, thickness is 0.02~0.10mm.
The aforesaid tin that is coated with is inlayed silver-colored height and is led welding, wherein, said tin coating thickness 0.025mm, the base copper that is provided with the silver band is through making it be solidified as one at its electroplating surfaces with tin liquid.
The aforesaid tin that is coated with is inlayed silver-colored height and is led welding, and wherein, the outer surface of said silver band is higher than copper strip surface 0.005mm.
The present invention has been bumped into the silver band through the center, two sides at base copper, makes it in actual use, and the silver band that is bumped into can directly contact the conductive strips of battery sheet after welding, utilize silver (1.65 * 10 -8Ω m) conductivity is than copper (1.75 * 10 -8Ω m) good characteristics; Under the prerequisite that does not influence battery sheet and other technical parameter of welding; Increased substantially the electric conductivity of product, it has Stability Analysis of Structures, solderability is strong, cost is low and percentage elongation is high advantage, satisfies the requirement of photovoltaic cell sheet to the welding high conduction performance.
Description of drawings
Specify the present invention below in conjunction with accompanying drawing and embodiment;
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a cutaway view of the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with embodiment, further set forth the present invention.
Embodiment:
Referring to Fig. 1 and Fig. 2, present embodiment provides photovoltaic that the photovoltaic module (monocrystalline silicon, polysilicon and hull cell) that is applied to solar power generation connects usefulness and is coated with tin and inlays silver-colored height and lead welding, and it comprises base copper 1, tin coating 3 and edge silver layer 2 between the two is set.
In the present embodiment, the fine copper base band that the fine copper that base copper 1 adopts is made, its width is 0.50~6.00mm; The copper strips of thickness 0.05~0.30mm processes the silver-colored groove of edge in the center, two sides of base copper 1, in the silver-colored groove of edge, be rolled into the silver band formation edge silver layer 2 that fine silver is made; This edge silver layer 2 is arranged on the two sides of base copper 1, and wherein, the width of edge silver layer 2 is 0.15~3.00mm; Thickness is 0.02~0.10mm; The outer surface of the silver band that this is rolled into is higher than fine copper base band surface 0.005mm, promptly inlays silver layer and is higher than base copper 1 surperficial 0.005mm, and the silver band that is bumped into when easy to use can directly contact the conductive strips of battery sheet after welding.
When the present invention makes; Making the fine copper base band through fine copper earlier is base copper 1, respectively makes the silver-colored groove of edge in centre, fine copper base band two sides, in the silver-colored groove of edge, is rolled into a slice silver band; Overall thermal immersion tin then; Its two electroplating surfaces with tin thickness 0.025mm, make after tin liquor is solidified fine copper base band, silver band with and tin coating 3 firm being connected as a single entity that form of surface, be made into then and be coated with tin and inlay silver-colored height and lead welding.
The present invention in actual use; The silver band that is bumped into can directly contact the conductive strips of battery sheet after welding; Reach under the prerequisite that does not influence battery sheet and other technical parameter of welding, increased substantially the electric conductivity of product, it has Stability Analysis of Structures, advantage that the strong percentage elongation of solderability is high; Satisfy of the requirement of photovoltaic cell sheet, can be widely used in the electric power conduction of photovoltaic module and be connected the welding high conduction performance.
More than show and described basic principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the specification just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection range to be defined by appending claims and equivalent thereof.

Claims (3)

1. be coated with tin and inlay silver-colored height and lead welding, comprise base copper of processing with fine copper and the soldering-tin layer that is arranged on the base copper surface it is characterized in that it also comprises the edge silver layer that is arranged between base copper and the soldering-tin layer; The center, two sides of said base copper is equipped with the silver-colored groove of edge, and the silver band is set in the silver-colored groove of said edge, constitutes described edge silver layer; Said base copper width 0.50~6.00mm, thickness 0.05~0.30mm, said edge silver layer width 0.15~3.00mm, thickness is 0.02~0.10mm.
2. the tin that is coated with according to claim 1 is inlayed silver-colored height and is led welding, it is characterized in that said tin coating thickness 0.025mm.
3. the tin that is coated with according to claim 1 and 2 is inlayed silver-colored height and is led welding, it is characterized in that, the outer surface of said silver band is higher than copper strip surface 0.005mm.
CN2010102776042A 2010-09-09 2010-09-09 Tinned and silvered high-conduction soldering strip Pending CN102403368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010102776042A CN102403368A (en) 2010-09-09 2010-09-09 Tinned and silvered high-conduction soldering strip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010102776042A CN102403368A (en) 2010-09-09 2010-09-09 Tinned and silvered high-conduction soldering strip

Publications (1)

Publication Number Publication Date
CN102403368A true CN102403368A (en) 2012-04-04

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Family Applications (1)

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CN2010102776042A Pending CN102403368A (en) 2010-09-09 2010-09-09 Tinned and silvered high-conduction soldering strip

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CN (1) CN102403368A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108145336A (en) * 2016-12-06 2018-06-12 江苏九天光电科技有限公司 A kind of detection method of nickel plated steel strip scolding tin performance

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1971789A (en) * 2006-11-24 2007-05-30 林羽锦 Machining technique of silver/copper double composite strip material
CN101630694A (en) * 2008-07-18 2010-01-20 日立电线株式会社 Solar cell lead wire and method of manufacturing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1971789A (en) * 2006-11-24 2007-05-30 林羽锦 Machining technique of silver/copper double composite strip material
CN101630694A (en) * 2008-07-18 2010-01-20 日立电线株式会社 Solar cell lead wire and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108145336A (en) * 2016-12-06 2018-06-12 江苏九天光电科技有限公司 A kind of detection method of nickel plated steel strip scolding tin performance

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Application publication date: 20120404