CN102402246B - Board assembly - Google Patents
Board assembly Download PDFInfo
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- CN102402246B CN102402246B CN201010282194.0A CN201010282194A CN102402246B CN 102402246 B CN102402246 B CN 102402246B CN 201010282194 A CN201010282194 A CN 201010282194A CN 102402246 B CN102402246 B CN 102402246B
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- cover plate
- mainboard
- radiator
- board
- expansion board
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Abstract
The invention discloses a kind of board assembly, including the first cover plate, the second cover plate, it is provided with between first cover plate and the second cover plate on mainboard, mainboard and is fitted with expansion board, described first cover plate, mainboard, expansion board, the second cover plate are detachably fixed and link together, and in the board assembly assembled, the outward flange of the first cover plate and the second cover plate all exceeds the outward flange of mainboard, expansion board.The present invention provides a kind of and is resistant to strong vibration, anti-drop, the board assembly that can play a protective role board.
Description
Technical field
The present invention relates to a kind of board, particularly relate to a kind of board assembly.
Background technology
Along with computer in the deep application of every field, people's not only requirement to computing power is more and more higher, also proposes the highest requirement to calculating platform anti-adverse environment.In a lot of industries, such as various fields such as Aeronautics and Astronautics, military affairs, exploration, disaster detections, it is desirable to strong vibration that what computer platform can continue be operated in, fall, when wide temperature change and constant impingement.Now, the board of computer: mainboard, the quality of anti-adverse environment of expansion board will directly influence stability and the safety of computer overall work.
Such as: VPX board assembly, wherein VPX (VersatileProtocolSwitch multi-protocol exchange) is industrial bus standard of new generation based on VITA46 agreement, it is by original VME bus upgrading, the compatibility high speed serial bus protocols such as XMC, FibreChannel, PCI-Express, RapidIO, Hypertransport.Owing to have employed up-to-date connector art and up-to-date High speed serial fabrics technology, be one both can meet tradition VME apply at aspect industrial, medical, can meet again the high-end observing and controlling such as aerospace, military affairs apply new standard.VPX board assembly can extensively be applied, and just the requirement to its anti-adverse environment is higher, and most basic requirement is: antidetonation, anti-drop, thermal diffusivity good.But in VPX specification, define only the basic function component of VPX board, including mainboard, expansion board, cover plate.And how to be connected between these building blocks of functions and realize antidetonation, anti-drop, reinforcing of how about dispelling the heat does not provides a full and accurate scheme.
Summary of the invention
The technical problem to be solved in the present invention is; for the existing applied environment situation that temperature dynamic, anti-drop, wide is run and the requirement of anti-constant impingement is the highest to computer anti-earthquake, it is provided that a kind of be resistant to strong vibration, anti-drop, the board assembly that board can be played a protective role.
The present invention to solve the technical problem that further and be, it is provided that a kind of board assembly dispelling the heat good.
The technical solution adopted for the present invention to solve the technical problems is: a kind of board assembly, including the first cover plate, the second cover plate, it is provided with mainboard between first cover plate and the second cover plate, expansion board it is fitted with on mainboard, described first cover plate, mainboard, expansion board, the second cover plate are detachably fixed and link together, and in the board assembly assembled, the outward flange of the first cover plate and the second cover plate all exceeds the outward flange of mainboard, expansion board.
Described board assembly also includes that the radiator for dispelling the heat mainboard, described radiator include the first radiator and the second radiator, and the two interval is arranged and connected together by connecting plate.
Being respectively equipped with the thermal hole that run-through board face is upper and lower on the plate face, the left and right sides that described mainboard is relative, master chip and side thermal hole on described first radiator alignment mainboard are arranged, and the second radiator alignment mainboard opposite side thermal hole is arranged.
On the mainboard upper and lower biside plate face of described thermal hole surrounding and thermal hole hole inwall is provided with thermal conductive material layer, after assembling, the thermal conductive material layer that mainboard upper and lower biside plate face is arranged is fitted with radiator and the second cover plate respectively.
Described expansion board is between the first radiator and the second radiator, and is plugged on mainboard by adapter.
Described expansion board is installed between the connecting plate of radiator and the first cover plate, and the expansion board end face being inserted on mainboard is less than radiator apical side height, meets: the pin in expansion board, components and parts after assembling do not contact the first cover plate；Expansion board bottom surface, higher than the connecting plate end face of radiator, meets: the pin in expansion board, components and parts after assembling do not contact connecting plate.
Described connecting plate is provided with for strengthening the first radiator and the reinforcement of the second radiator connection.
Described first cover plate has air vent.
Described first cover plate is fixed together by screw locking the most respectively with radiator, mainboard, the second cover plate edge, and described mainboard passes through together with screw locking with expansion board.
Described second edge, the cover plate left and right sides is provided with boss, and boss is detachably fixed with mainboard and is connected, and the height of boss meets: after assembling, main board elements does not contact the second cover plate.
First cover plate, radiator, mainboard, the second cover plate are detachably fixed and link together by the present invention, form an entirety, and after board assembly becomes an entirety, intensity is greatly improved, and its opposing impact capacity, anti-dropping damage characteristic promote accordingly.And in the board assembly assembled; the outward flange of the first cover plate and the second cover plate all exceeds the outward flange of mainboard, expansion board and radiator; when board assembly is by situations such as clashing into, fall; first cover plate and the second cover plate are first touched; it is effectively protected mainboard, expansion board and adapter, the when of preventing from falling by mistake or hitting by mistake, damages adapter and mainboard and expansion board.The present invention can use in the adverse circumstances such as strong vibration, high temperature, low temperature.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the explosive view of the embodiment of the present invention；
Fig. 2 is the top view after embodiment of the present invention assembling；
Fig. 3 is the axonometric chart after embodiment of the present invention assembling；
Fig. 4 is the structural representation of embodiment of the present invention radiator；
Fig. 5 is the structural representation of embodiment of the present invention mainboard；
Fig. 6 is the structural representation of the embodiment of the present invention the second cover plate.
Detailed description of the invention
The present invention up and down and the definition in orientation, left and right is: board assembly is kept flat, the first cover plate upper, the second cover plate under, in the face of board assembly spanner side, left hand direction be a left side, and right-hand lay is the right side.
As shown in Figure 1, 2, 3, a kind of board assembly, including first cover plate the 1, second cover plate 5, wherein the first cover plate 1 uses stainless steel material to make, and the aluminum alloy materials that the second cover plate 5 uses radiating effect good is made.It is provided with mainboard 4 between first cover plate 1 and the second cover plate 5, expansion board 2 it is fitted with on mainboard 4, described first cover plate 1, mainboard 4, expansion board 2, second cover plate 5 is detachably fixed and links together, and the shape of the first cover plate 1 and the second cover plate 5 and mainboard 4 form fit, the two size is more than all boards arranged between and device size, in the board assembly assembled, the outward flange of the first cover plate 1 and the second cover plate 5 all exceeds mainboard 4, the outward flange of expansion board 2, wherein described mainboard 4 outward flange refers to mainboard 4 and the outermost edges of upper all components and parts thereof, the outward flange of same expansion board 2 also refers to the outermost edges of they and all of which components and parts.Therefore, the outward flange of the first cover plate 1 and the second cover plate 5, beyond the connector position on board, protects board and adapter effectively, damages adapter and board when of preventing board from falling by mistake.And owing to they are all to be fixed together, forming an entirety, bulk strength to be significantly larger than single strength of parts, and therefore, the impact resistant of board assembly, anti-vibration, anti-drop ability all improve a lot.
As shown in Figure 1, 2, 3, the first cover plate 1 of stainless steel is die-cut a lot of air vent 11, and these air vents 11 are possible not only to strengthen the air flowing of board assembly, are beneficial to heat radiation, and can also the gross weight of lightened plate floor card assembly.The present embodiment expansion board 2 is two pieces, is inserted into side by side on mainboard 4.First cover plate 1 is to be made up of one block of overall plate, and the position between two pieces of corresponding expansion board 2 is not divided into two boards, integral slab to contribute to strengthening the intensity of the first cover plate 1, plays a protective role expansion board 2.First cover plate 1 uses the corrosion resistant plate SUS301 of 1.5mm thickness, and its intensity is higher, can bear the impact of high intensity, falls for board and has good protective effect.And rustless steel also has excellent corrosion resistance, good die-cut Bending Processing performance.
Such as Fig. 1, shown in 4, so that the bigger chip of mainboard 4 caloric value can dispel the heat in time, ensure that board assembly normally can work in a wide temperature range, the radiator 3 to mainboard 4 heat radiation it is additionally provided with between the first cover plate 1 and the second cover plate 5, owing to radiator 3 and expansion board 2 need to arrange on the plate face of mainboard 4 side simultaneously, therefore radiator 3 is divided into first radiator 31 and second radiator 32 two parts, the first radiator 31 and the second radiator 32 interval arrange and are connected together by connecting plate 33.The first radiator 31 and the second radiator 32 in radiator 3 are all fin structure, first radiator 31 and the second radiator 32 are connected one entirety of formation by connecting plate 33, be conducive to increasing the intensity of radiator 3, and in order to strengthen the intensity of connecting plate 33, connecting plate 33 is provided with reinforcement 35, further strengthens the first radiator 31 and connection of the second radiator 32.Radiator 3 uses aluminium alloy 6063 material, has excellent heat conductivility, and density is smaller simultaneously, can alleviate the weight of whole board assembly.
As shown in Figure 1,5, it is respectively equipped with the upper and lower thermal hole in run-through board face 42 on the plate face, the left and right sides that described mainboard 4 is relative, described first radiator 31 is directed at the master chip on mainboard 4 and side thermal hole 42 is arranged, it is bigger, being easy to the heat radiation of master chip, the second radiator 32 is directed at mainboard 4 opposite side thermal hole 42 and arranges.On mainboard about the 4 biside plate face of described thermal hole 42 surrounding and thermal hole 42 hole inwall is provided with thermal conductive material layer 45, after assembling, the thermal conductive material layer 45 that mainboard about 4 biside plate face is arranged is fitted with radiator 3 and the second cover plate 5 respectively.Thermal conductive material layer 45 is that the material using some good heat conduction effect is made, such as: copper, silver, alloy etc., the present embodiment uses copper, copper covers on the mainboard 4 around thermal hole 42 and on thermal hole 42 inwall, thermal hole 42 is made to become the optimal path of heat conduction, so heat part on radiator 3 will be transmitted to, above the second cover plate 5, radiate heat in air by the surface area of the second cover plate 5 by thermal hole 42, is then taken away by the cold wind of the fan system arranged inside cabinet.
As shown in Figure 1,5, described expansion board 2 is between the first radiator 31 and the second radiator 32, and is plugged on mainboard 4 by adapter, and adapter includes connector for extender and motherboard connector, and expansion board 2 is just electrically connected by the two grafting with mainboard 4.The present embodiment uses two pieces of expansion board 2, is plugged on side by side on mainboard 4.As a example by VPX mainboard, two pieces of PMC card (PCIMezzanineCard of plug-in mounting can be distinguished on VPX mainboard, i.e. PCI interlayer card) or one piece of PMC card, two pieces of XMC (XMC:SwitchedMezzanineCard, i.e. switched mezzanine card) or one piece of XMC card.Four motherboard connector 43 grafting that wherein PMC card is outer with on mainboard, XMC card and two motherboard connector 44 grafting near main plate center, same position once can only insert a kind of expansion board 2.
Owing to expansion board 2 is installed between connecting plate 33 and first cover plate 1 of radiator 3, expansion board 2 end face being inserted on mainboard 4 is less than radiator 3 apical side height, meet: the pin in expansion board 2 after assembling, components and parts do not contact the first cover plate 1, avoid pin and the first cover plate 1 contact short circuit, damage, thus cause the infringement of expansion board 2.Expansion board 2 bottom surface, higher than connecting plate 33 end face of radiator 3, meets: the components and parts in expansion board 2 after assembling do not contact connecting plate 33, it is to avoid the above pin of expansion board 2, components and parts are mutually damaged with connecting plate 33.
As shown in Fig. 1,2,3,4,5,6, described first cover plate 1 is fixed together by screw locking the most respectively with radiator 3, mainboard the 4, second cover plate 5 edge.The present embodiment is provided with on connecting hole 12, radiator 3 the first cover plate 1 four jiaos and is provided with connecting hole 36, and mainboard 4 is provided with the corner of connecting hole the 41, second cover plate 5 has connecting hole 52, screw 13 they to be locked together in being installed on connecting hole 12,36,41,52.
As shown in Figure 6, described second edge, cover plate 5 left and right sides is provided with boss 51, and boss 51 is detachably fixed with mainboard 4 and is connected, and in the present embodiment, connecting hole 52 is arranged on boss 51, and boss 51 and mainboard 4 is detachably fixed by screw 13 and is connected.The height of boss 51 meets: after assembling, mainboard 4 components and parts do not contact the second cover plate 5.The thickness of the second cover plate 5 mid portion is 2mm, thinner than its dual-side boss 51, is conducive to the high device of amplification quantity on mainboard 4.The thickness 5.7mm of dual-side boss 51.So it is arranged in intensity and can effectively meet the protection to board, resist high-strength impact.
Claims (8)
1. a board assembly, including the first cover plate, the second cover plate, it is provided with mainboard between first cover plate and the second cover plate, expansion board it is fitted with on mainboard, it is characterized in that, described first cover plate, mainboard, expansion board, the second cover plate are detachably fixed and link together, and in the board assembly assembled, the outward flange of the first cover plate and the second cover plate all exceeds the outward flange of mainboard, expansion board；
Described board assembly also includes that the radiator for dispelling the heat mainboard, described radiator include the first radiator and the second radiator, and the two interval is arranged and connected together by connecting plate；
Being respectively equipped with the thermal hole that run-through board face is upper and lower on the plate face, the left and right sides that described mainboard is relative, master chip and side thermal hole on described first radiator alignment mainboard are arranged, and the second radiator alignment mainboard opposite side thermal hole is arranged.
Board assembly the most according to claim 1, it is characterized in that, on the mainboard upper and lower biside plate face of described thermal hole surrounding and thermal hole hole inwall is provided with thermal conductive material layer, after assembling, the thermal conductive material layer that mainboard upper and lower biside plate face is arranged is fitted with radiator and the second cover plate respectively.
Board assembly the most according to claim 1, it is characterised in that described expansion board is between the first radiator and the second radiator, and is plugged on mainboard by adapter.
Board assembly the most according to claim 3, it is characterized in that, described expansion board is installed between the connecting plate of radiator and the first cover plate, and the expansion board end face being inserted on mainboard is less than radiator apical side height, meets: the pin in expansion board, components and parts after assembling do not contact the first cover plate；Expansion board bottom surface, higher than the connecting plate end face of radiator, meets: the pin in expansion board, components and parts after assembling do not contact connecting plate.
Board assembly the most according to claim 3, it is characterised in that described connecting plate is provided with for strengthening the first radiator and the reinforcement of the second radiator connection.
6. according to the board assembly described in Claims 1 to 5 any one, it is characterised in that described first cover plate has air vent.
7. according to the board assembly described in Claims 1 to 5 any one, it is characterized in that, described first cover plate is fixed together by screw locking the most respectively with radiator, mainboard, the second cover plate edge, and described mainboard passes through together with screw locking with expansion board.
8., according to the board assembly described in Claims 1 to 5 any one, it is characterised in that described second edge, the cover plate left and right sides is provided with boss, and boss is detachably fixed with mainboard and is connected, the height of boss meets: after assembling, main board elements does not contact the second cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010282194.0A CN102402246B (en) | 2010-09-15 | 2010-09-15 | Board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010282194.0A CN102402246B (en) | 2010-09-15 | 2010-09-15 | Board assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102402246A CN102402246A (en) | 2012-04-04 |
| CN102402246B true CN102402246B (en) | 2016-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010282194.0A Active CN102402246B (en) | 2010-09-15 | 2010-09-15 | Board assembly |
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| Country | Link |
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| CN (1) | CN102402246B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103746818B (en) * | 2013-12-27 | 2018-03-02 | 上海斐讯数据通信技术有限公司 | A kind of signal connection system between network switch support plate and sandwich plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201194095Y (en) * | 2008-03-21 | 2009-02-11 | 研祥智能科技股份有限公司 | Fin cooling type non-fan special computer |
| CN201340566Y (en) * | 2008-12-19 | 2009-11-04 | 上海研祥智能科技有限公司 | 1U totally-enclosed fan-less top carriage type industrial control computer |
-
2010
- 2010-09-15 CN CN201010282194.0A patent/CN102402246B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201194095Y (en) * | 2008-03-21 | 2009-02-11 | 研祥智能科技股份有限公司 | Fin cooling type non-fan special computer |
| CN201340566Y (en) * | 2008-12-19 | 2009-11-04 | 上海研祥智能科技有限公司 | 1U totally-enclosed fan-less top carriage type industrial control computer |
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| Publication number | Publication date |
|---|---|
| CN102402246A (en) | 2012-04-04 |
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| C06 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Chao Inventor after: Sun Yu Inventor after: Chen Zhilie Inventor after: Shen Hang Inventor after: Luo Shouquan Inventor before: Chen Zhilie Inventor before: Luo Shouquan |
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| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230712 Address after: 518000 1701, Yanxiang Science and Technology Building, No. 31, High-tech Middle 4th Road, Maling Community, Yuehai Street, Nanshan District, Shenzhen, Guangdong Province Patentee after: Yanxiang smart IOT Technology Co.,Ltd. Address before: 518057 Guangdong city of Shenzhen province Nanshan District high in the four EVOC Technology Building No. 31 Patentee before: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |