CN102402196A - PLC (programmable logic controller) temperature measurement expanding module - Google Patents
PLC (programmable logic controller) temperature measurement expanding module Download PDFInfo
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- CN102402196A CN102402196A CN2010102839624A CN201010283962A CN102402196A CN 102402196 A CN102402196 A CN 102402196A CN 2010102839624 A CN2010102839624 A CN 2010102839624A CN 201010283962 A CN201010283962 A CN 201010283962A CN 102402196 A CN102402196 A CN 102402196A
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Abstract
The invention discloses a PLC (programmable logic controller) temperature measurement expanding module, which comprises a PCB (printed circuit board). A terminal strip and a temperature sensor for realizing local temperature compensation are disposed on the PCB. The PLC temperature measurement expanding module is characterized in that the terminal strip is arranged on the PCB via a supporting arm in an aerial manner, and the temperature sensor is disposed below the aerial terminal strip. The PLC temperature measurement expanding module has the following technical advantages that on the one hand, the temperature sensor is far away from electronic devices on the PCB, particularly heating and radiating devices, influence of the heating and radiating devices to the temperature sensor, namely to local temperature measurement, is reduced, on the other hand, the temperature sensor is closers to a wiring port of the terminal strip, measured temperature is closer to the temperature of the wiring port, and accordingly, the local temperature measurement can be more accurate.
Description
Technical field
(Programmable Logic Controller, PLC) field relate in particular to a kind of PLC temperature survey expansion module to the present invention relates to FPGA control.
Background technology
PLC temperature survey expansion module has been widely used in temperature survey and the processing in various industrial occasions or the life.When adopting thermopair, PLC temperature survey expansion module carries out far-end thermometric the time; Need know near the temperature value that near-end (input port just) is; Promptly need near input port, do local temperature compensation, just can calculate the dut temperature of far-end in view of the above.At present, PLC temperature survey expansion module generally adopts thermal resistance temperature sensor that local temperature is measured, and its structure is as shown in Figure 1.PLC temperature survey expansion module comprises a pcb board 11, is positioned at the radiating electronic device 13 on the said pcb board 11, the temperature sensor 14 that carries out local temperature compensation, terminal row 15.Row's pin 12 on the said terminal row 15 is realized being electrically connected with the mode of welding with the welding hole 16 on the said pcb board 11, and the bottom of terminal row 15 contacts with the surface of pcb board 11.On 14 pcb boards that are arranged near terminal row 15 of said temperature sensor.When said PLC temperature survey expansion module continuous firing after a period of time, the temperature at radiating electronic device place will be higher than other local temperature, and its heat can be to other local diffusions.Said temperature sensor 14 is on the one hand owing to receive the influence of radiating electronic device heat diffusion; On the other hand because far away from said terminal row 15 distances; There is certain difference in the temperature at the temperature of its measurement and Wiring port place, causes temperature survey inaccurate, and local effect temperature compensation is undesirable.
Summary of the invention
The purpose of the embodiment of the invention is, a kind of PLC temperature survey expansion module that improves temperature compensation is provided, and improves the accuracy of the local temperature compensation of PLC temperature survey expansion module.
The embodiment of the invention provides a kind of PLC temperature survey expansion module; Comprise a pcb board; The temperature sensor that on said pcb board, is provided with terminal row and carries out local temperature compensation; It is characterized in that: said terminal row utilizes sway brace to make somebody a mere figurehead and is arranged on the said pcb board, and said temperature sensor is located at the below of built on stilts terminal row.
Preferable, said sway brace is located at the bottom of said terminal row, fuses with said terminal row or one-body molded during fabrication with said terminal row.
Preferable; Also dispose the terminal base be located on the said pcb board; Said terminal row is installed on the said terminal base; Connect said pcb board through said terminal base, said sway brace is located at the bottom of said terminal base, fuses with said terminal base or one-body molded during fabrication with said terminal base.
Preferable, the bottom of said terminal base is provided with the row's pin that penetrates the bottom, and said row's pin one end inserts the patchhole that said terminal row bottom is provided with, and the other end inserts the welding hole that is provided with on the said pcb board and fixes through welding.
Preferable, said terminal base is provided with two sidewalls, cooperates with row's pin, and said terminal row is fixed on the said terminal base.
Embodiment of the present invention embodiment has following beneficial effect: be to make temperature sensor on the one hand away from the electron device on the pcb board, especially heating, radiating element, will generate heat, radiating element to temperature sensor also promptly to the thermometric influence reduction in this locality; Be to make temperature sensor more near the Wiring port of terminal row on the other hand, the temperature of measurement is also more near the temperature of Wiring port, thereby can be so that local temperature survey is more accurate.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention; The accompanying drawing of required use is done to introduce simply in will describing embodiment below; Obviously, the accompanying drawing in describing below only is one embodiment of the present of invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the blast structural representation of prior art PLC temperature survey expansion module;
Fig. 2 is an embodiment of the PLC temperature survey expansion module of the present invention structural representation that explodes;
Fig. 3 is an embodiment package assembly synoptic diagram of PLC temperature survey expansion module of the present invention;
Fig. 4 is another embodiment of PLC temperature survey expansion module of the present invention structural representation that explodes;
Fig. 5 is another embodiment package assembly synoptic diagram of PLC temperature survey expansion module of the present invention;
Fig. 6 is another embodiment side blast structural representation of PLC temperature survey expansion module of the present invention;
Fig. 7 is another embodiment side package assembly synoptic diagram of PLC temperature survey expansion module of the present invention;
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention provides a kind of PLC temperature survey expansion module, below in conjunction with Fig. 2-Fig. 7 the embodiment of PLC temperature survey expansion module of the present invention is described.
Fig. 2 and Fig. 3 are an embodiment of PLC temperature survey expansion module of the present invention, and as shown in Figures 2 and 3, the PLC temperature survey expansion module of present embodiment comprises: pcb board 21, be located at terminal row 22 and temperature sensor 23 on the said pcb board 21, wherein:
At least one edge of said pcb board 21 is provided with welding hole 211.
Said terminal row 22 sides are provided with a plurality of Wiring ports 223, as the input port of temperature signal; The bottom of said terminal row 22 is provided with row's pin 222 and sway brace 221.During assembling; Said row's pin 222 is realized being electrically connected through the mode of welding with the welding hole 211 of said pcb board 21; Said sway brace 221 is used for said terminal row 22 is maked somebody a mere figurehead at said pcb board 21; Said sway brace 221 can independently be made in manufacture process, also can be one-body molded with said terminal row 22.
Below built on stilts terminal row 22; Between two welding holes of pcb board 21 temperature sensor 23 is set; Make said temperature sensor 23 both near said terminal row 22, simultaneously again away from the various heatings on the said pcb board 21, radiating electronic device 24, generated heat when reducing to measure local temperature, the influence of radiating electronic device 24; Can measure local temperature more accurately, also be the temperature of port.Said temperature sensor 23 can be the temperature sensor of thermal resistance temperature sensor or other types.
Embodiment of the present invention embodiment has following beneficial effect: be to make temperature sensor on the one hand away from the electron device on the pcb board, especially heating, radiating element, will generate heat, radiating element to temperature sensor also promptly to the thermometric influence reduction in this locality; Be to make temperature sensor more near the Wiring port of terminal row on the other hand, the temperature of measurement is also more near the temperature of Wiring port, thereby can be so that local temperature survey is more accurate.
Fig. 4 to Fig. 7 is another embodiment of PLC temperature survey expansion module of the present invention; Extremely shown in Figure 7 like Fig. 4; The PLC temperature survey expansion module of present embodiment comprises: pcb board 41, be located at terminal row 42, terminal base 45 and temperature sensor 43 on the said pcb board 41, wherein:
At least one edge of said pcb board 41 is provided with welding hole 411.
Said terminal row 42 sides are provided with a plurality of Wiring ports 421, as the input port of temperature signal; The bottom of said terminal row 42 is provided with the patchhole 422 (patchhole 422 as shown in Figure 6) suitable with Wiring port 421 quantity, is used to assemble said terminal row 42 and said terminal base 45.
Said terminal base 45 bottoms are provided with row's pin 452 and sway brace 451.Row's pin 452 penetrates the bottom of said terminal base 45.Be provided with two row's pins 452 between per two sway braces 451.During assembling; Insert respectively in the patchhole 422 and the welding hole 411 on the pcb board 41 of terminal row 42 bottoms at the two ends of row's pin 452 of said terminal base 45; Said terminal base 45 is fixed on the said pcb board 41 through the mode of row's pin 452 with patchhole 422 welding, and realizes the electrical connection of the Wiring port 421 and the pcb board 41 of terminal row 42 through row's pin; Said sway brace 451 contacts with said pcb board 41, in order to support end stroma 45 and on terminal row 42.During fabrication, said sway brace 451 can independently be made, also can be one-body molded with said terminal base 45.
The both sides of said terminal base 45 also are provided with the first side wall 453 and second sidewall 454.During assembling, said the first side wall 453 is positioned at the outside of the side that is provided with Wiring port 421 of said terminal row 42, and height is as the criterion not block Wiring port 421; Second sidewall 454 is positioned at the outside of the side relative with said Wiring port of said terminal row 42.The first side wall 453 and second sidewall 454 cooperatively interact and clamp said terminal row 42, and said terminal row 42 is fixed on the said terminal base 45.The terminal setting of this structure can directly be extracted from said terminal base 45 after making said terminal row 42 break down, and is convenient for changing, and need not as using the soldering equipment that disappears just can separate terminal row and pcb board among the last embodiment.
Below the terminal row 42 of making somebody a mere figurehead through terminal base 45; Between two welding holes of pcb board 41 temperature sensor 43 is set; Make said temperature sensor 43 both near said terminal row 42; Simultaneously again away from the various heatings on the said pcb board 41, radiating electronic device 44, be difficult for heating when measuring local temperature, receive the influence of radiating electronic device, can measure local temperature (port temperature) more accurately.
Embodiment of the present invention embodiment has following beneficial effect: be to make temperature sensor on the one hand away from the electron device on the pcb board, especially heating, radiating element, will generate heat, radiating element to temperature sensor also promptly to the thermometric influence reduction in this locality; Be to make temperature sensor more near the Wiring port of terminal row on the other hand, the temperature of measurement is also more near the temperature of Wiring port, thereby can be so that local temperature survey is more accurate.In addition, the mode that adopts terminal base to realize that pcb board and terminal row are electrically connected can be convenient for changing terminal row.
Above disclosedly be merely preferred embodiment of the present invention, can not limit the present invention's interest field certainly with this, the equivalent variations of therefore doing according to claim of the present invention still belongs to the scope that the present invention is contained.
Claims (5)
1. PLC temperature survey expansion module; Comprise a pcb board; The temperature sensor that on said pcb board, is provided with terminal row and carries out local temperature compensation; It is characterized in that: said terminal row utilizes sway brace to make somebody a mere figurehead and is arranged on the said pcb board, and said temperature sensor is located at the below of built on stilts terminal row.
2. PLC temperature survey expansion module as claimed in claim 1, it is characterized in that: said sway brace is located at the bottom of said terminal row, fuses with said terminal row or one-body molded during fabrication with said terminal row.
3. PLC temperature survey expansion module as claimed in claim 1; It is characterized in that: also dispose the terminal base be located on the said pcb board; Said terminal row is installed on the said terminal base; Connect said pcb board through said terminal base, said sway brace is located at the bottom of said terminal base, fuses with said terminal base or one-body molded during fabrication with said terminal base.
4. PLC temperature survey expansion module as claimed in claim 3; It is characterized in that: the bottom at said terminal base is provided with the row's pin that penetrates said bottom; Said row's pin one end inserts the patchhole that said terminal row bottom is provided with, and the other end inserts the welding hole that is provided with on the said pcb board and fixes through welding.
5. PLC temperature survey expansion module as claimed in claim 3 is characterized in that: said terminal base is provided with two sidewalls, cooperates with row's pin, and said terminal row is fixed on the said terminal base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102839624A CN102402196A (en) | 2010-09-10 | 2010-09-10 | PLC (programmable logic controller) temperature measurement expanding module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102839624A CN102402196A (en) | 2010-09-10 | 2010-09-10 | PLC (programmable logic controller) temperature measurement expanding module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102402196A true CN102402196A (en) | 2012-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102839624A Pending CN102402196A (en) | 2010-09-10 | 2010-09-10 | PLC (programmable logic controller) temperature measurement expanding module |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001042906A (en) * | 1999-07-29 | 2001-02-16 | Toshiba Mach Co Ltd | Programmable logic controller |
| CN1773228A (en) * | 2004-11-10 | 2006-05-17 | 松下电器产业株式会社 | Electronic circuit device |
| US20090125124A1 (en) * | 2007-11-14 | 2009-05-14 | General Electric Company | Programmable logic controller having micro-electromechanical system based switching |
-
2010
- 2010-09-10 CN CN2010102839624A patent/CN102402196A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001042906A (en) * | 1999-07-29 | 2001-02-16 | Toshiba Mach Co Ltd | Programmable logic controller |
| CN1773228A (en) * | 2004-11-10 | 2006-05-17 | 松下电器产业株式会社 | Electronic circuit device |
| US20090125124A1 (en) * | 2007-11-14 | 2009-05-14 | General Electric Company | Programmable logic controller having micro-electromechanical system based switching |
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Application publication date: 20120404 |