CN102402067A - System for manufacturing flexible liquid crystal display and method of manufacturing flexible display - Google Patents
System for manufacturing flexible liquid crystal display and method of manufacturing flexible display Download PDFInfo
- Publication number
- CN102402067A CN102402067A CN2011102619741A CN201110261974A CN102402067A CN 102402067 A CN102402067 A CN 102402067A CN 2011102619741 A CN2011102619741 A CN 2011102619741A CN 201110261974 A CN201110261974 A CN 201110261974A CN 102402067 A CN102402067 A CN 102402067A
- Authority
- CN
- China
- Prior art keywords
- board
- flexible base
- flexible
- infrabasal plate
- upper substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
Abstract
The invention relates to a system for manufacturing a flexible liquid crystal display and a method for manufacturing a flexible display. The system comprises a first rolling machine continuously supplying first flexible substrates; a second rolling machine continuously supplying second flexible substrates; an assembling unit equipped on an upper substrate formed on the first flexible substrate and a lower substrate formed on the second flexible substrate; a first aligning film forming unit coating aligning films on one surface of the first flexible substrate when the first flexible substrate is moved from the first rolling machine to the assembling unit; a second aligning film forming unit coating aligning films on the upper surface of the second flexible substrate when the second flexible substrate is moved from the second rolling machine to the vacuum assembling unit; a seal distributor; a spacer forming unit, and a cutter cutting at least one of the first flexible substrate and the second flexible substrate before, after or when the first flexible substrate and the second flexible substrate are transmitted to the assembling unit. The method and the system obviously improve the production efficiency.
Description
Technical field
The present invention relates generally to make the system and the method for making flexible display of flexible liquid crystal display.More particularly, the present invention relates to volume to volume formula or volume are made flexible liquid crystal display to chip method and system.
Background technology
The flat-panel display devices that flexible display is to use flexible substrate to form such as plastic base, and flexible, folding or be deformed into roll forming, keep fabulous indicating characteristic simultaneously.Therefore, flexible display is causing global gazing at as next-generation technology at present.
Flexible display device is processed by thin flexible base, board, but this substrate sensitive paper is equally crooked or be rolled into several centimetres, and does not lose the characteristic of existing display device.Unlike the hard display of being processed by the existing glass substrate, but flexible display is light, thin, high resistance is clashed into and free bend.According to its purposes and function, this flexible display can be divided into reinforces display, curved displays and coiled-type display.Light weight, firm and flexible display can be applicable to the display of high-quality mobile devices such as DMB (DMB), WiMAX (WiBro), PDA(Personal Digital Assistant), and will develop into the coiled-type display.
Fig. 1 is the process flow diagram that is used to make the classic method of LCD.
With reference to Fig. 1, when using glass substrate to make LCD, the operation of operation through being divided into thin film transistor (TFT) (TFT) substrate and colored filter substrate is carried out liquid crystal cell and is processed usually.Particularly, in step S20, on thin film transistor base plate, form thin film transistor (TFT) array, to form thin film transistor (TFT), this thin film transistor (TFT) is the switch or the driving element of LCD.Then, thin film transistor base plate is successively through the cleaning step of the coating of the alignment films of S21 and friction step, S22, and the liquid crystal allocation step of S23.On the other hand; In step S10, colored filter forms on glass substrate, coating of the alignment films of process S11 subsequently and friction step; The cleaning step of S12; The sealing allocation step of S13, the short circuit of S14 distributes (short dispensation) step, and the chock insulator matter of S15 (spacer) allocation step.Then; Assembling two substrates (upper substrate and infrabasal plate) subsequently, carry out sealant cures in step S31 in step S30; In step S32, carry out liquid crystal cell line and fracture obtaining single liquid crystal cell, and in step S33, carry out the final inspection and the installation of polarizer plate.
When using glass substrate, the chip method is made LCD through sheet.On the other hand, replace the great majority of this traditional glass substrate to attempt all concentrating on sheet with flexible base, board to the chip method.That is, sheet to the chip method in, a flexible flake that is formed with thin film transistor (TFT) array is assembled on another flexible flake that is formed with colored filter, thereby has reduced throughput rate significantly, and the utilization of flexible material has been brought difficulty.
Summary of the invention
One or more demands for general introduction above improving this technology and solving; Each side of the present invention is to provide a kind of system and the method for making flexible display that makes flexible liquid crystal display, and it adopts volume to volume formula or volume also can significantly improve throughput rate to the chip method.
According to an aspect of the present invention, the system that makes flexible liquid crystal display comprises: first reeler, supply with first flexible base, board continuously; Second reeler is supplied with second flexible base, board continuously; Assembly unit is assemblied in upper substrate that forms on said first flexible base, board and the infrabasal plate that on said second flexible base, board, forms; First alignment films forms the unit, when said first flexible base, board when said first reeler moves to said assembly unit, in a surface applied alignment films of said first flexible base, board; Second alignment films forms the unit, when said second flexible base, board when said second reeler moves to the vacuum assembly unit, at the upper surface coated with orientation film of said second flexible base, board; The sealing divider; Chock insulator matter forms the unit; And cutter; Just in time before said first flexible base, board and said second flexible base, board are sent to said assembly unit, when said first flexible base, board and said second flexible base, board are in said assembly unit, or just in time after said first flexible base, board and said second flexible base, board are sent out said assembly unit, cut at least one in said first flexible base, board and said second flexible base, board.
In one embodiment, said assembly unit can be the vacuum assembly unit.
In one embodiment, said assembly unit can comprise electrostatic chuck (ESC), and said electrostatic chuck supports and transmit said first flexible base, board or said second flexible base, board by said cutter cuts.
In one embodiment; Said system also can comprise at least one force cell; Said force cell is kept the tension force of said first flexible base, board and said second flexible base, board when said first flexible base, board and said second flexible base, board are sent to said assembly unit.
In one embodiment; Said system also can comprise at least one netted guides; Said netted guides is located said first flexible base, board and said second flexible base, board when said first flexible base, board and said second flexible base, board are sent to said assembly unit.
In one embodiment, the roller that is used to support and transmit said first flexible base, board and said second flexible base, board can touch with the side edge of said first flexible base, board and said second flexible base, board.
In one embodiment, be used for the distance B 1 between the alignment mark of said upper substrate and the distance B 2 that is used between the alignment mark of said infrabasal plate inequality.
In one embodiment, the distance B between the said alignment mark 1 can be greater than the distance B between the said alignment mark 2.
According to another aspect of the present invention, the method for making flexible display comprises: on a surface of first flexible base, board that first reeler is supplied with continuously, form first alignment films, to form upper substrate; On the upper surface of second flexible base, board that second reeler is supplied with continuously, form second alignment films; Upper surface at second flexible base, board seals distribution or short circuit distribution (short dispensation); On the upper surface of second flexible base, board, form the space, to form infrabasal plate; Just in time before first flexible base, board and second flexible base, board are sent to assembly unit; When first flexible base, board and second flexible base, board are in assembly unit; Perhaps just in time after first flexible base, board and second flexible base, board are sent out assembly unit, cut at least one in first flexible base, board and second flexible base, board; And first alignment mark that will be used for upper substrate and second alignment mark that is used for infrabasal plate are with fit on substrate and infrabasal plate.
The further aspect according to the present invention; The method of making flexible display comprises: transmit the first netted flexible base, board; The said first netted flexible base, board has the alignment mark on a plurality of upper substrates and each upper substrate, and the distance between the alignment mark of adjacent upper substrate is D1; Transmit the second netted flexible base, board, the said second netted flexible base, board has the alignment mark on a plurality of infrabasal plates and each infrabasal plate, and the distance between the alignment mark of adjacent infrabasal plate is D2 (D1 ≠ D2); And, with the alignment mark of the alignment mark and the infrabasal plate of upper substrate, so that upper substrate and infrabasal plate are assembled up each other.
In one embodiment, the distance B between the alignment mark of adjacent upper substrate 1 can equal the distance B 2 between the alignment mark of adjacent infrabasal plate.
In one embodiment, said method can further comprise: before forming said alignment films on the surface of said first flexible base, board, on a surface of said first flexible base, board, form colored filter.
In one embodiment, said method can further comprise: before forming said second alignment films on the upper surface of said second flexible base, board, on the upper surface of said second flexible base, board, form thin film transistor (TFT) array.
In one embodiment, said method can further comprise: before forming said thin film transistor (TFT) array on the upper surface of said second flexible base, board, on the upper surface of said second flexible base, board, form colored filter.
In one embodiment; The roller that is used to transmit said first flexible base, board and said second flexible base, board can touch with the side edge of said first flexible base, board and said second flexible base, board, and the edge of said first flexible base, board and said second flexible base, board lays respectively at outside the infrabasal plate machining area of upper substrate machining area and said second flexible base, board of said first flexible base, board.
In one embodiment, said first flexible base, board and said second flexible base, board can be formed with through hole in its edge, and said through hole is used for locating respectively said first flexible base, board and said second flexible base, board.
In one embodiment, the assembling of said upper substrate and said infrabasal plate can be carried out under vacuum.
In one embodiment, said distance B 1 can be greater than said distance B 2.
In one embodiment, said method is cut said first flexible base, board before or after can further being included in said upper substrate of assembling and said infrabasal plate.
In one embodiment, said method can further comprise: before said upper substrate of assembling and said infrabasal plate, when transmitting second flexible base, board, on the upper surface of second flexible base, board, form second alignment films; On the upper surface of second flexible base, board that is formed with second alignment films, seal and distribute and the liquid crystal distribution; And, on the upper surface of said second flexible base, board, form chock insulator matter.
Description of drawings
In the description that combines accompanying drawing and the following embodiment that provides, above-mentioned other aspects of the present invention, feature and advantage will be clearly.
Fig. 1 is the process flow diagram of the classic method of manufacturing LCD;
Fig. 2 is the block diagram of the system of manufacturing flexible liquid crystal display according to an embodiment of the invention;
Fig. 3 is the process flow diagram of the method for manufacturing flexible liquid crystal display according to an embodiment of the invention;
Fig. 4 is the conceptual view of transmission flexible base, board step according to an embodiment of the invention;
Fig. 5 is the conceptual view of illustration flexible base, board position control when with volume to volume formula or volume chip being made flexible base, board;
Fig. 6 is the conceptual view of illustration alignment mark position when making flexible base, board with the volume to volume formula;
Fig. 7 is the conceptual view of flexible display installation step in the illustration volume to volume formula method according to one embodiment of present invention;
Fig. 8 is the conceptual view of flexible display installation step in the illustration volume to volume formula method according to another embodiment of the invention;
Fig. 9 is the conceptual view of flexible display installation step in the illustration volume to volume formula method according to one embodiment of present invention.
Embodiment
Describe embodiments of the invention in detail referring now to accompanying drawing.
Fig. 2 is the block diagram of the system of manufacturing flexible liquid crystal display according to an embodiment of the invention; Fig. 3 is the process flow diagram of the method for manufacturing flexible liquid crystal display according to an embodiment of the invention.
Referring to figs. 2 and 3, first reeler 102 is supplied with first flexible base, board 100 that is rolled into roll forming continuously.First flexible base, board 100 can be formed by polyethylene terephthalate (PET), PEN (PEN), polyethersulfone (PES), polyacrylate (PAR), polycarbonate (PC), cyclic olefine copolymer (COC) or polyimide, but is not limited to above-mentioned material.The tension force that is necessary to keep first flexible base, board 100 within constant scope to transmit effectively and subsequently step.At least one force cell 104 can be arranged on the direction of transfer of first flexible base, board 100, to measure and to adjust the tension force of first flexible base, board 100.Because the deformable in the process that moves (transmission) of first flexible base, board 100 is snakelike shape of curling, at least one netted guides 106 can be arranged on the direction of transfer of first flexible base, board 100, is positioned at constant position to adjust first flexible base, board 100.
At first, in step S100, on first flexible base, board 100, form colored filter 108.Yet, when being pre-formed first flexible base, board 100 that has colored filter 108, can omit the step that forms colored filter 108.Can form colored filter 108 through the typical method that forms colored filter.In addition, on first flexible base, board 100, also can further form common electrode (not shown) and black matrix".
Next, in step S102, form the unit (not shown) and on first flexible base, board 100, form first alignment films 110 through first alignment films.First alignment films 110 can be organic alignment films, inorganic alignment film or metal alignment films.Form organic polymer layers through rotary coating, printing coating etc., solidify this organic polymer layers then, can form organic alignment films.This organic polymer layers can be further through friction.An instance of this organic alignment films comprises alignment film of polyimide.Through oblique evaporation, can form inorganic alignment film such as oxides such as silicon monoxide, silicon dioxide.The metal alignment films can be by forming such as gold (Au), platinum metal materials such as (Pt).
Can on one of the upper surface of first flexible base, board 100 and lower surface, form the colored filter 108 and first alignment films 110.
At first, in step S200,, can on the upper surface of second flexible base, board 200, form thin film transistor (TFT) (TFT) array 208 through forming the typical method of thin film transistor (TFT) array.Yet, when being pre-formed second flexible base, board 200 that has thin film transistor (TFT) array, can omit the step that forms thin film transistor (TFT) array.Further, for passive matrix liquid crystal display, but not AMLCD can form the transparency electrode figure, but not thin film transistor (TFT) array.
Next, in step S202, form the unit (not shown) through second alignment films and form second alignment films 210.The kind of second alignment films 210 is identical with the formation method with the kind of the formation method and first alignment films 110, and second alignment films formation unit can be used as first alignment films formation unit.
Then; Respectively through sealing divider (not shown), short circuit divider (short dispenser); Not shown) and the liquid crystal dispensing apparatus (not shown), allocation step S204, short circuit allocation step S206 and liquid crystal allocation step S208 can be sealed at the upper surface of second flexible base, board with second alignment films 210.In this literary composition, the short circuit allocation step can be omitted.In addition, the order of sealing allocation step S204, short circuit allocation step S206 and liquid crystal allocation step S208 can change.Further, before fit on substrate and infrabasal plate, carry out liquid crystal allocation step S208, after the vacuum assembling, can inject the step of liquid crystal, and need not carry out liquid crystal allocation step S208 though present embodiment has been explained.
When assembling first flexible base, board 100 and second flexible base, board 200, sealing allocation step S204 is the step that forms sealant 212, and sealing agent 212 is provided for receiving the framework of liquid crystal.Sealant can be inorganic sealant or organic encapsulant.Organic encapsulant can be formed by epoxy resin, phenolics, acryl resin or isocyanate resin, and can be one-pack type or two-component-type.Further, organic encapsulant can be the combination of thermal cure sealants, ultraviolet curing sealant or heat curing and ultraviolet curing sealant.Use typical divider can seal allocation step S204.In this literary composition, it should be understood that through methods such as serigraphys to form sealant 212, be not limited to sealing and distribute.
Short circuit allocation step S206 forms between the public electrode of the public electrode voltages application end of TFT substrate (infrabasal plate) and colored filter substrate (upper substrate) and electrically contacts, and is applied on the public electrode of colored filter substrate through the TFT substrate to allow voltage.Through the short circuit divider, can form the short circuit (shorts) 214 of point-like at the outside surface of sealed mould.Short circuit 214 can be formed by the conductive paste that comprises silver (Ag), aluminium (Al) etc., and short circuit 214 can comprise hardening agent identical or different except sealant.Use typical divider can carry out short circuit allocation step S206.
(ODF, One-Drop-Filling) method can be carried out liquid crystal allocation step S208 to splash into processing procedure through liquid crystal.Splash into manufacturing method thereof for liquid crystal, in the sealing figure, form sealant 212.In this literary composition,, in comprising the figure of inlet, but not form sealant 212 in the sealing figure when through liquid crystal injecting method but not liquid crystal splashes into manufacturing method thereof when carrying out the liquid crystal allocation step.When splashing into manufacturing method thereof through liquid crystal when carrying out the liquid crystal allocation step, sealant 212 can be ultraviolet hardening or thermosetting and ultraviolet curing mating type.
Next, in step S210, chock insulator matter forms the unit (not shown) and is used to form chock insulator matter 216.Because the thickness of liquid crystal layer and the indicating characteristic of LCD are closely related such as reaction rate, contrast, visual angle, color etc., so be necessary accurately unified control to be provided to the thickness of liquid crystal layer.Chock insulator matter 216 is used for keeping the constant distance between upper substrate and the infrabasal plate, the i.e. thickness of liquid crystal layer.Chock insulator matter 216 not only can be through the chock insulator matter that disperses glass chock insulator matter or plastics chock insulator matter to form, and also can be through coating photosensitive resin compound, makes public then, develops and dry the light sensation formula chock insulator matter of formation.
Next; In step S300; Upper substrate and infrabasal plate through assembly unit 300 will form on first flexible base, board 100 and second flexible base, board 200 are respectively aimed at and are assembled; Curing sealant in step 302 is divided into single liquid crystal cell with the substrate that assembles in step 304 subsequently, and polarizer plate is installed then.Significantly, the step that the substrate that assembles is divided into single liquid crystal cell can be carried out after polarizer plate is installed.When injecting the step of liquid crystal, liquid crystal is injected into after upper substrate and infrabasal plate assembling, and the inlet of sealant seals at that time.On the other hand, carry out liquid crystal when splashing into manufacturing method thereof, assembly unit 300 is vacuum assembly units, and it is assembled with each other with upper substrate and infrabasal plate in a vacuum.
This system can be provided with the cutter (not shown); This cutter just in time before first flexible base, board 100 and second flexible base, board 200 are sent to assembly unit 300, when first flexible base, board 100 and second flexible base, board 200 are within assembly unit 300, or just in time after first flexible base, board 100 and second flexible base, board 200 are sent out assembly unit 300, cut at least one in first flexible base, board 100 and second flexible base, board 200.Further; This system can have a plurality of roller R100, R102, R104, R106, R108, R110, R112, R200, R202, R204, R206, R208, R210, R212 at first flexible base, board 100 and second flexible base, board, 200 direction of transfers, and in these rollers some can be the drive roller by motor driven.
As described above, in volume to volume formula method, the upper substrate or first flexible base, board 100 can only pass through the step that forms first alignment films 110, and infrabasal plate can pass through formation residue liquid crystal cell step.Owing to carry out allocation step (just as the allocation step of glass substrate) at gravity direction; Therefore substrate overturn plane after must carrying out allocation step at the upper surface of upper substrate, before the fit on substrate makes manufacturing system complicated and be difficult in liquid crystal cell and make the line installation system thus.In other words, the ground floor that liquid crystal cell is made line must be provided for the equipment that infrabasal plate is processed, and the second layer must be provided for the equipment of upper substrate processing.Further, owing to system must be made up of two-layer equipment, thus the increase of the interior net storey height of manufacturing facility, and the system maintenance difficulty.Yet; In rolling up to the chip method; Upper surface at first flexible base, board carries out allocation step to form upper substrate, before fit on substrate and infrabasal plate, cuts one of first flexible base, board and second flexible base, board, and the upper surface of first flexible base, board is assembled to infrabasal plate then.Therefore, can carry out at the upper surface of first flexible base, board such as steps such as sealing distribution, short circuit distribution, liquid crystal distribution.
Fig. 4 is for transmit the conceptual view of the step of flexible base, board according to an embodiment of the invention.For the ease of describing, describe this step with reference to second flexible base, board, and it should be understood that this step also can be applicable to first flexible base, board.On the other hand, transfer step that is used for flexible base, board that describes below and installation step not only can be applicable to flexible liquid crystal display, dual panel-type organic electroluminescent display etc., also can be applicable to method, equipment or the device of any this flexible base, board of use.In this literary composition, for the ease of describing, main tested liquid crystal display is described these steps.
With reference to Fig. 4, the upper surface of second flexible base, board 200 that second reeler 200 is supplied with has infrabasal plate machining area 2002, and the thin film transistor (TFT) array electrode pattern of passive matrix (or be used for) will form on this zone.In this literary composition, the meaning of term " infrabasal plate machining area " is the zone that thin film transistor (TFT) array, alignment films, sealant, liquid crystal, chock insulator matter etc. exist.Because the various steps that infrabasal plate machining area experience is above-mentioned; Among roller R1, R2, R3, R4, R5, the R6 each all can be dumbbell shape; Core and the diameter bigger marginal portion less by diameter constitute; To prevent pollution and previous figure or the processing layer that forms of protection in these steps, like sealant, alignment films etc.That is, at the core A place of infrabasal plate machining area 2002 existing second flexible base, boards 200, roller R1 etc. only touches the edge B of second flexible base, board 200, and whole second flexible base, board 200 of noncontact.More preferably, said roller contacts with the part of second flexible base, board 200, and said this part places the outside of second flexible base, board, 200 alignment marks 2004.Be the tension force and location second flexible base, board 200 of behind cutting second flexible base, board 200, keeping second flexible base, board 200, can form the edge B of second flexible base, board 200 through through hole 2006.
On the other hand, the lower surface of second flexible base, board 200 does not have the infrabasal plate machining area 2002 that on this zone, forms thin film transistor (TFT) array electrode pattern of passive matrix (or be used for) etc.Replace having the roller of dumbbell shape, the cylindrical shape roller with constant diameter can help supporting and transmitting second flexible base, board 200.In other words, roller R3, R4 and R6 can be the dumbbell shape roller, and roller R1, R2, R5 and R7 can be the cylindrical shape roller.
Fig. 5 is the conceptual view of illustration flexible base, board position control when with volume to volume formula or volume chip being made flexible base, board.Because the position control of first flexible base, board and the position control of second flexible base, board are carried out in an identical manner, for convenience's sake, describe with reference to second flexible base, board.
Second flexible base, board 200 need not be provided for the tracker 270 of marginal position control.When second flexible base, board 200 was provided with tracker 270, position-detection sensor 280 can detect the position of second flexible base, board 200 with reference to circuit tracker 270.On the other hand, when second flexible base, board 200 is not provided with circuit tracker 270, can carry out position measurement and adjustment with reference to the edge plane 200a of second flexible base, board.Position-detection sensor 280 can be ultrasonic sensor or UV sensor.Above-mentioned through hole 2006 (Fig. 4) can be used as the circuit tracker or can on second flexible base, board, form independent circuit tracker.Further, the position control of second flexible base, board 200 is carried out in the position of second flexible base, board 200 based on testing result through position-detection sensor 280 detections and netted guides 206 (see figure 2)s.
Fig. 6 is the conceptual view of illustration alignment mark position when making flexible base, board with the volume to volume formula.
With reference to Fig. 6; Through above-mentioned manufacture process; On a surface (lower surface) of first flexible base, board 100, form upper substrate 150,152 successively, and on the upper surface of second flexible base, board 200, form infrabasal plate 250,252 successively with colored filter etc.Then, two or more alignment marks 160,162,260,262 that are used to aim at upper substrate 150,152 and infrabasal plate 250,252 form on the edge of each upper substrate (at the upper substrate machining area) and infrabasal plate (at the infrabasal plate machining area).Preferably, on the edge of each upper substrate and infrabasal plate, form four alignment marks.In this literary composition, the meaning of term " upper substrate " is to comprise the upper substrate machining area and in assembling, be installed to the thin slice on the infrabasal plate, and the meaning of term " infrabasal plate " is to comprise the infrabasal plate machining area and in assembling, be installed to the thin slice on the upper substrate.
According to this embodiment; Supplying with continuously in the volume to volume formula method of first flexible base, board 100 and second flexible base, board 200; When the distance B between the alignment mark of adjacent upper substrate 1 equals the distance B 2 between the alignment mark of adjacent infrabasal plate; The alignment error that occurs in the assembly process is the upper substrate and the infrabasal plate of back to all panels in back, and adverse effect is arranged, and causes processing cost obviously to increase.Further; Under the situation of proper alignment; Behind assembling first upper substrate 150 and first infrabasal plate 250 aligned with each other, owing to aim at the infrabasal plate 252 of back for the upper substrate 152 of back, distance B 1 equals distance B 2; The alignment mark 162 that is used for second upper substrate is because 100 distortion of first flexible base, board are tended to right avertence in the drawings, and being created in needs in the vision alignment mode tiltedly to aim at but not vertically aligned problem.
Fig. 7 is the conceptual view of flexible display installation step in the illustration volume to volume formula method according to one embodiment of present invention.
With reference to Fig. 7; Through above-mentioned manufacture process; On a surface (lower surface) of first flexible base, board 100, form upper substrate 150,152 successively, and on the upper surface of second flexible base, board 200, form infrabasal plate 250,252 successively with colored filter etc.Then, on the edge of each upper substrate and infrabasal plate, form two or more alignment marks 160,162,260,262 that are used to aim at upper substrate 150,152 and infrabasal plate 250,252.Preferably, on the edge of each upper substrate and infrabasal plate, form four alignment marks.
In making the volume to volume formula method of flexible liquid crystal display according to an embodiment of the invention, the distance B 2 between the alignment mark of the distance B 1 between the alignment mark of adjacent upper substrate 150,152 and adjacent infrabasal plate 250,252 is different.Preferably, D1 is greater than D2.Perhaps, D2 can be greater than D1.
When D1 greater than D2, the boundary of first flexible base, board 100 between panel that has assembled and knocked-down panel is formed with the staged portion C, when aiming at second upper substrate 152 with second infrabasal plate 252, the advantage of elimination tilt alignment is provided thus.Further, when in first upper substrate 150 and first infrabasal plate, 250 alignings, alignment error occurring, the panel that the back is all, promptly second upper substrate and second infrabasal plate all will receive the influence of this alignment error.Because D1 is greater than D2, through adjusting the position of second upper substrate 152,, also might aim at second upper substrate 152 and second infrabasal plate 252 even when in first upper substrate 150 and first infrabasal plate, 250 alignings, alignment error occurring.
Fig. 8 is for illustrate the conceptual view of flexible display installation step in the illustration volume to volume formula method according to another embodiment of the invention.
Fig. 8 has shown a kind of situation, in this situation, and adjacent upper substrate 150,152; 152, the distance between 154 the alignment mark is greater than adjacent infrabasal plate 250,252; 252, the distance between 254 the alignment mark.In this literary composition; Be formed with upper substrate 150,152,154,156 successively on the surface (lower surface) of first flexible base, board 100; Be formed with colored filter, alignment films etc. on this upper substrate 150,152,154,156; And this first flexible base, board 100 is sent to assembly unit 300, and is formed with infrabasal plate 250,252,254,256 on the upper surface of second flexible base, board 200 successively, and this second flexible base, board 200 is sent to assembly unit 300.Assembly unit 300 can be the vacuum assembly unit.
After assembling first upper substrate 150 and first infrabasal plate 250, when assembling second upper substrate 152 each other, because the distance difference between the alignment mark, first upper substrate of first flexible base, board 100 and the distortion of the boundary plane between second upper substrate with infrabasal plate 252.Though the crushed element of first flexible base, board 100 allows to remain; But be to use cutter 350; First flexible base, board 100 can be by independent cutting (seeing Fig. 8 (A)) or be cut (seeing Fig. 8 (B)) with second flexible base, board 200, goes wrong in the later step preventing.Cutter 350 can be placed on assembly unit 300 the insides or assembly unit 300 outsides.
Fig. 9 is the conceptual view of flexible display installation step in the further embodiment illustration volume to volume formula method according to the present invention.
Though be formed with upper substrate successively on the surface (lower surface) of first flexible base, board 100, be formed with colored filter, alignment films etc. on this upper substrate, for the ease of describing, the single upper substrate 150 of illustration only in Fig. 9.As stated, upper substrate 150 is thin slices that comprise upper substrate machining area 1002 and be installed to infrabasal plate.Second flexible base, board 200 that is formed with first flexible base, board 100 of a plurality of upper substrates that comprise upper substrate 150 successively and is formed with a plurality of infrabasal plates successively is sent to assembly unit 300, and with cutter 350 cuttings first flexible base, board 100.Cut before or after first flexible base, board 100; Side at first flexible base, board 100 at upper substrate machining area 1002 place; Available mechanical chuck or vacuum chuck 360 support or fixing upper substrate 150; And in fixing upper substrate 150, use electrostatic chuck 370 to move the adsorbed state of keeping upper substrate under the vacuum with the upper substrate 150 of infrabasal plate assembling.In other words; Through 1002 of upper substrate machining areas not the plane; Electrostatic chuck 370 relies on fixedly upper substrate 150 of electrostatic attraction, moves upper substrate 150 and makes the upper surface of upper substrate machining area 1002 in the face of infrabasal plate 250, the aligned with each other and assembling of upper substrate and infrabasal plate subsequently.In this literary composition, infrabasal plate 250 also can be supported and fixed by mechanical chuck or vacuum chuck 380.
Cut before getting into assembly units 300 at first flexible base, board 100 outside (in the left side) that cutter 350 can be placed in the inside of assembly unit 300 or be placed in assembly unit 300.In rolling up to the chip method; Because cutting comprises first flexible base, board (perhaps second flexible base, board) of upper substrate (perhaps infrabasal plate) before assembling; Therefore; Equaling in the distance between the alignment mark of adjacent upper substrate does not have big problem under the situation of the distance between the alignment mark of adjacent infrabasal plate 250,252.So the distance between the alignment mark of upper substrate can equal or be different from the distance between the alignment mark of infrabasal plate.
Likewise, the chip method is made flexible liquid crystal display, significantly improve the manufacturing rate thus according to the system and method employing volume to volume formula or the volume of the embodiment of the invention.
Further, according to the system and method for the embodiment of the invention,, can significantly improve efficiency of assembling through introducing the adjustment and the cutter of distance between the alignment mark.
Though described some embodiment in the present invention, only it will be understood by those skilled in the art that to provide these embodiment through illustrative mode, and under the prerequisite of the spirit and scope of the present invention, can carry out various modifications, variation and change.Protection scope of the present invention only is limited to accompanying claims and its equivalent.
Claims (20)
1. a system that makes flexible liquid crystal display is characterized in that, comprising:
First reeler is supplied with first flexible base, board continuously;
Second reeler is supplied with second flexible base, board continuously;
Assembly unit is assemblied in upper substrate that forms on said first flexible base, board and the infrabasal plate that on said second flexible base, board, forms;
First alignment films forms the unit, when said first flexible base, board when said first reeler moves to said assembly unit, in a surface applied alignment films of said first flexible base, board;
Second alignment films forms the unit, when said second flexible base, board when said second reeler moves to said assembly unit, at the upper surface coated with orientation film of said second flexible base, board;
The sealing divider;
Chock insulator matter forms the unit; And
Cutter; Just in time first flexible base, board and second flexible base, board be sent to assembly unit it, when first flexible base, board and second flexible base, board are within assembly unit, or just in time after first flexible base, board and second flexible base, board are sent out assembly unit, cut at least one in first flexible base, board and second flexible base, board.
2. system according to claim 1 is characterized in that, said assembly unit is the vacuum assembly unit.
3. system according to claim 1 is characterized in that said assembly unit comprises electrostatic chuck, and said electrostatic chuck supports and transmit said first flexible base, board or said second flexible base, board by said cutter cuts.
4. system according to claim 1 is characterized in that, also comprises:
At least one force cell; Said force cell is kept the tension force of said first flexible base, board and said second flexible base, board when said first flexible base, board and said second flexible base, board are sent to said assembly unit.
5. system according to claim 1 is characterized in that, also comprises:
At least one netted guides; Said netted guides is located said first flexible base, board and said second flexible base, board when said first flexible base, board and said second flexible base, board are sent to said assembly unit.
6. system according to claim 1 is characterized in that, is used to support and transmit the roller of said first flexible base, board and said second flexible base, board and the side edge of said first flexible base, board and said second flexible base, board is touched.
7. system according to claim 1 is characterized in that, the distance B 2 between the distance B 1 between the alignment mark of said upper substrate and the alignment mark of said infrabasal plate is inequality.
8. system according to claim 7 is characterized in that, said distance B 1 is greater than said distance B 2.
9. a method of making flexible display is characterized in that, comprising:
On a surface of first flexible base, board that first reeler is supplied with continuously, form first alignment films, to form upper substrate;
On the upper surface of second flexible base, board that second reeler is supplied with continuously, form second alignment films;
Upper surface at second flexible base, board seals distribution or short circuit distribution;
Upper surface at second flexible base, board forms the space, to form infrabasal plate;
Just in time before first flexible base, board and second flexible base, board are sent to assembly unit, when first flexible base, board and second flexible base, board are within assembly unit, or just in time after first flexible base, board and second flexible base, board are sent out assembly unit, cut at least one in first flexible base, board and second flexible base, board; And
With second alignment mark of first alignment mark and the said infrabasal plate of said upper substrate, with fit on substrate and infrabasal plate.
10. a method of making flexible display is characterized in that, comprising:
Transmit the first netted flexible base, board, the said first netted flexible base, board has the alignment mark on a plurality of upper substrates and each upper substrate, and the distance between the alignment mark of adjacent upper substrate is D1;
Transmit the second netted flexible base, board, the said second netted flexible base, board has the alignment mark of a plurality of infrabasal plates and each infrabasal plate, and the distance between the alignment mark of adjacent infrabasal plate is D2, and D1 ≠ D2; And
With the alignment mark of the alignment mark and the infrabasal plate of upper substrate, so that upper substrate and infrabasal plate are assembled up each other.
11. method according to claim 9 is characterized in that, said distance B 1 equals said distance B 2.
12. method according to claim 9 is characterized in that, also comprises:
Before forming said alignment films on the surface of said first flexible base, board, on a surface of said first flexible base, board, form colored filter.
13. method according to claim 9 is characterized in that, also comprises:
Before forming said second alignment films on the upper surface of said second flexible base, board, on the upper surface of said second flexible base, board, form thin film transistor (TFT) array.
14. method according to claim 13 is characterized in that, also comprises:
Before forming said thin film transistor (TFT) array on the upper surface of said second flexible base, board, on the upper surface of said second flexible base, board, form colored filter.
15. according to claim 9 or 10 described methods; It is characterized in that; Be used to transmit the roller of said first flexible base, board and said second flexible base, board and the side edge of said first flexible base, board and said second flexible base, board is touched, the edge of said first flexible base plate and said second flexible base plate lays respectively at outside the infrabasal plate machining area of upper substrate machining area and said second flexible base, board of said first flexible base, board.
16., it is characterized in that said first flexible base, board and said second flexible base, board are formed with through hole in its edge according to claim 9 or 10 described methods, said through hole is used for locating respectively said first flexible base, board and said second flexible base, board.
17., it is characterized in that being assemblied under the vacuum of said upper substrate and said infrabasal plate carried out according to claim 9 or 10 described methods.
18. method according to claim 10 is characterized in that, said distance B 1 is greater than said distance B 2.
19. method according to claim 10 is characterized in that, also comprises:
Before or after said upper substrate of assembling and said infrabasal plate, cut said first flexible base, board.
20. method according to claim 10 is characterized in that, also comprises:
Before said upper substrate of assembling and said infrabasal plate, when transmitting second flexible base, board, on the upper surface of second flexible base, board, form second alignment films;
On the upper surface of second flexible base, board that is formed with second alignment films, seal and distribute and the liquid crystal distribution; And
On the upper surface of said second flexible base, board, form chock insulator matter.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100090279A KR101164525B1 (en) | 2010-09-15 | 2010-09-15 | Flexible liquid crystal display manufacturing system and method for fabricating flexible display |
| KR10-2010-0090279 | 2010-09-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102402067A true CN102402067A (en) | 2012-04-04 |
| CN102402067B CN102402067B (en) | 2014-10-22 |
Family
ID=45884431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110261974.1A Expired - Fee Related CN102402067B (en) | 2010-09-15 | 2011-09-06 | System for manufacturing flexible liquid crystal display and method of manufacturing flexible display |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101164525B1 (en) |
| CN (1) | CN102402067B (en) |
| TW (1) | TWI451153B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809852A (en) * | 2012-08-17 | 2012-12-05 | 飞优特科技（深圳）有限公司 | Flexible LCD and manufacturing method thereof |
| CN105894980A (en) * | 2016-06-15 | 2016-08-24 | 成都捷翼电子科技有限公司 | Method for manufacturing roll-to-roll colored electronic paper |
| CN106157818A (en) * | 2016-09-05 | 2016-11-23 | 京东方科技集团股份有限公司 | A kind of flexible display panels, its manufacture method and display device |
| CN108646449A (en) * | 2018-07-25 | 2018-10-12 | 浙江富申科技有限公司 | The display device and its driving method of passive mixed type |
| CN112684640A (en) * | 2019-10-18 | 2021-04-20 | 江苏集萃智能液晶科技有限公司 | Process for preparing liquid crystal dimming device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101970645B1 (en) | 2012-08-14 | 2019-04-22 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
| KR101410840B1 (en) * | 2012-10-30 | 2014-07-01 | 한국전기연구원 | Manufacturing method of composite wire type material for magnetic freezer |
| KR20140063303A (en) | 2012-11-16 | 2014-05-27 | 삼성디스플레이 주식회사 | Method of manufacturing a flexible display apparatus |
| CN103151306B (en) * | 2013-03-08 | 2015-06-17 | 上海和辉光电有限公司 | Method for manufacturing flexible electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1392439A (en) * | 1995-01-11 | 2003-01-22 | 株式会社半导体能源研究所 | Method and device for producing liquid crystal element |
| KR100465674B1 (en) * | 2004-09-01 | 2005-01-13 | 디엔씨엔지니어링 주식회사 | Apparatus for providing a back lighting film to mold frame |
| KR20070013134A (en) * | 2005-07-25 | 2007-01-30 | 삼성전자주식회사 | Apparatus and method for manufacturing display device substrate |
| KR20100044299A (en) * | 2008-10-22 | 2010-04-30 | 웅진케미칼 주식회사 | Flexible lcd, method for fabricating flexible lcd and apparatus for fabricating thereof |
-
2010
- 2010-09-15 KR KR1020100090279A patent/KR101164525B1/en active IP Right Grant
-
2011
- 2011-08-16 TW TW100129165A patent/TWI451153B/en not_active IP Right Cessation
- 2011-09-06 CN CN201110261974.1A patent/CN102402067B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1392439A (en) * | 1995-01-11 | 2003-01-22 | 株式会社半导体能源研究所 | Method and device for producing liquid crystal element |
| KR100465674B1 (en) * | 2004-09-01 | 2005-01-13 | 디엔씨엔지니어링 주식회사 | Apparatus for providing a back lighting film to mold frame |
| KR20070013134A (en) * | 2005-07-25 | 2007-01-30 | 삼성전자주식회사 | Apparatus and method for manufacturing display device substrate |
| KR20100044299A (en) * | 2008-10-22 | 2010-04-30 | 웅진케미칼 주식회사 | Flexible lcd, method for fabricating flexible lcd and apparatus for fabricating thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102809852A (en) * | 2012-08-17 | 2012-12-05 | 飞优特科技（深圳）有限公司 | Flexible LCD and manufacturing method thereof |
| CN105894980A (en) * | 2016-06-15 | 2016-08-24 | 成都捷翼电子科技有限公司 | Method for manufacturing roll-to-roll colored electronic paper |
| CN105894980B (en) * | 2016-06-15 | 2018-08-31 | 成都捷翼电子科技有限公司 | A kind of roll-to-roll color electric paper manufacturing method |
| CN106157818A (en) * | 2016-09-05 | 2016-11-23 | 京东方科技集团股份有限公司 | A kind of flexible display panels, its manufacture method and display device |
| CN106157818B (en) * | 2016-09-05 | 2022-06-24 | 京东方科技集团股份有限公司 | Flexible display panel, manufacturing method thereof and display device |
| CN108646449A (en) * | 2018-07-25 | 2018-10-12 | 浙江富申科技有限公司 | The display device and its driving method of passive mixed type |
| CN112684640A (en) * | 2019-10-18 | 2021-04-20 | 江苏集萃智能液晶科技有限公司 | Process for preparing liquid crystal dimming device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI451153B (en) | 2014-09-01 |
| TW201219890A (en) | 2012-05-16 |
| CN102402067B (en) | 2014-10-22 |
| KR20120028443A (en) | 2012-03-23 |
| KR101164525B1 (en) | 2012-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102402067B (en) | System for manufacturing flexible liquid crystal display and method of manufacturing flexible display | |
| CN100432770C (en) | A liquid crystal display apparatus | |
| KR100947082B1 (en) | Panel adhesive apparatus | |
| CN1854867B (en) | Liquid crystal display device and method for fabricating the same | |
| CN1716053B (en) | Method of forming thin film | |
| US20060150788A1 (en) | Apparatus for cutting substrate and method thereof | |
| CN102103291B (en) | Repair equipment of alignment film and repair method thereof | |
| WO2010095762A1 (en) | Method for sealing edge portion of double-layer product and device for sealing edge portion of double-layer product | |
| KR20080070318A (en) | Liquid crystal display panel cutting apparatus and cutting method using the same | |
| CN102460280A (en) | Method for manufacturing liquid crystal panel, liquid crystal panel, and repairing device | |
| JP2008052168A (en) | Method of manufacturing liquid crystal display | |
| KR102032721B1 (en) | Automatic bonding system for LCD and automatic bonding method using the same | |
| CN111744722B (en) | Manufacturing device and manufacturing method for joint member | |
| CN102473667B (en) | Panel equilibrium adjusting device and a panel attaching device comprising the same | |
| CN202306070U (en) | Transfer printing plate | |
| CN100416360C (en) | Method for manufacturing liquid crystal display device | |
| TW200827878A (en) | Method of manufacturing thick cell gap LC cell | |
| US9144134B2 (en) | Method for coating polyimide on liquid crystal display panel | |
| KR20050095925A (en) | Polarizing plate send equipment | |
| CN100421011C (en) | Apparats for forming directional layer in liquid crystal display device | |
| KR102210656B1 (en) | A display device hardening apparatus and methode of hardening adhesive material using the same | |
| CN103499895A (en) | Display panel, display device and manufacturing method of display panel | |
| CN103645586B (en) | A kind of display panels and manufacture method, display device | |
| US7595928B1 (en) | Method and apparatus for manufacturing electrophoretic display | |
| KR20060116888A (en) | Liquid crystal drop equipment and method for dropping using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20200906 |