CN102399526A - Adhesive composition, circuit connection structure, semiconductor device, and solar cell module - Google Patents
Adhesive composition, circuit connection structure, semiconductor device, and solar cell module Download PDFInfo
- Publication number
- CN102399526A CN102399526A CN2011102080651A CN201110208065A CN102399526A CN 102399526 A CN102399526 A CN 102399526A CN 2011102080651 A CN2011102080651 A CN 2011102080651A CN 201110208065 A CN201110208065 A CN 201110208065A CN 102399526 A CN102399526 A CN 102399526A
- Authority
- CN
- China
- Prior art keywords
- circuit
- adhesive composite
- methyl
- propenoate
- acrylic rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 143
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 143
- 239000004065 semiconductor Substances 0.000 title claims abstract description 80
- 239000000203 mixture Substances 0.000 title abstract description 69
- 229920000800 acrylic rubber Polymers 0.000 claims abstract description 94
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 94
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 42
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000002131 composite material Substances 0.000 claims description 123
- 239000000463 material Substances 0.000 claims description 60
- 239000002245 particle Substances 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 52
- 238000009826 distribution Methods 0.000 claims description 32
- GNBCKKSGQPLTRW-UHFFFAOYSA-N C(C=C)(=O)OC.C(N)(O)=O Chemical compound C(C=C)(=O)OC.C(N)(O)=O GNBCKKSGQPLTRW-UHFFFAOYSA-N 0.000 claims description 27
- 238000010438 heat treatment Methods 0.000 claims description 26
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 8
- 230000005611 electricity Effects 0.000 claims description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 abstract description 9
- 238000010526 radical polymerization reaction Methods 0.000 abstract description 7
- -1 IZO Inorganic materials 0.000 description 91
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- 150000001875 compounds Chemical class 0.000 description 21
- 239000007787 solid Substances 0.000 description 18
- 239000000243 solution Substances 0.000 description 15
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 230000002194 synthesizing effect Effects 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 239000012046 mixed solvent Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 9
- 239000008367 deionised water Substances 0.000 description 9
- 229910021641 deionized water Inorganic materials 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000005060 rubber Substances 0.000 description 9
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 7
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
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- 229910019142 PO4 Inorganic materials 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 5
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- 150000003254 radicals Chemical class 0.000 description 5
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- 229920005992 thermoplastic resin Polymers 0.000 description 5
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 4
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 4
- AFCIMSXHQSIHQW-UHFFFAOYSA-N [O].[P] Chemical compound [O].[P] AFCIMSXHQSIHQW-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
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- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
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- 229920001721 polyimide Polymers 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- LDHQCZJRKDOVOX-UHFFFAOYSA-N 2-butenoic acid Chemical compound CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
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- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 3
- 229960003328 benzoyl peroxide Drugs 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
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- 229930185605 Bisphenol Natural products 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
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- NIHJEJFQQFQLTK-UHFFFAOYSA-N butanedioic acid;hexanedioic acid Chemical compound OC(=O)CCC(O)=O.OC(=O)CCCCC(O)=O NIHJEJFQQFQLTK-UHFFFAOYSA-N 0.000 description 1
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
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- UOCJDOLVGGIYIQ-PBFPGSCMSA-N cefatrizine Chemical group S([C@@H]1[C@@H](C(N1C=1C(O)=O)=O)NC(=O)[C@H](N)C=2C=CC(O)=CC=2)CC=1CSC=1C=NNN=1 UOCJDOLVGGIYIQ-PBFPGSCMSA-N 0.000 description 1
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- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
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- 150000002009 diols Chemical class 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002220 fluorenes Chemical group 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 1
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- 238000005286 illumination Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
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- 150000002632 lipids Chemical class 0.000 description 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- RQAKESSLMFZVMC-UHFFFAOYSA-N n-ethenylacetamide Chemical compound CC(=O)NC=C RQAKESSLMFZVMC-UHFFFAOYSA-N 0.000 description 1
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- 150000002825 nitriles Chemical class 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229940038597 peroxide anti-acne preparations for topical use Drugs 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 125000004193 piperazinyl group Chemical group 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004059 quinone derivatives Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-M terephthalate(1-) Chemical compound OC(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-M 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000007601 warm air drying Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2733—Manufacturing methods by local deposition of the material of the layer connector in solid form
- H01L2224/27334—Manufacturing methods by local deposition of the material of the layer connector in solid form using preformed layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
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Abstract
The invention provides an adhesive composition, a circuit connection structure, a semiconductor device and a solar cell module. The adhesive composition comprises acrylic rubber, urethane acrylate and free radical polymerization initiators from 5-18 weight percentages of structural units of acrylonitrile.
Description
Technical field
The present invention relates to a kind of adhesive composite, circuit connection structure, semiconductor device and solar cell module.
Background technology
In semiconductor element, liquid crystal display device etc., engage in order to make the various parts in the element, use various adhesive composites all the time.For the desired characteristic of adhesive composite, be representative with the cementability, and relate to the many aspects such as safety under thermotolerance, the humid tropical condition.
In addition, being used for bondingly by sticky object, is representative with organic substrates such as PC board, polyimide, can use metals such as copper, aluminium or ITO, IZO, SiN, SiO
2Deng base material with various condition of surface.Therefore, adhesive composite need cooperate by the molecular designing of sticky object sometimes.
All the time, as the adhesive composite of semiconductor element or used for liquid crystal display element, the known material (with reference to patent documentation 1) that the use high adhesion is arranged and demonstrate the epoxy resin of high reliability.As the constituent of this adhesive composite, generally use epoxy resin, have reactive solidifying agent and promote epoxy resin and the hot Latence catalyst of solidifying agent reaction with epoxy resin.Hot Latence catalyst is the important factor of decision solidification value and curing speed, and from the viewpoint consideration of at room temperature the storage stability curing speed during with heating, can use multiple compound.
With regard to the adhesive composite that uses epoxy resin, in actual operation, through under 170～250 ℃ temperature, solidify obtained in 1～3 hour desirable bonding.Yet along with the height highly integrated, liquid crystal cell of recent semiconductor element becomes more meticulous, the spacing of interelement and wiring closet is also in narrow and smallization, and because the heating when solidifying, and may produce detrimentally affect to parts on every side.In addition,, have the necessity that improves turnout, and require be cured in low temperature and the shorter time more, that is to say that to require low temperature quick-setting bonding for cost degradation.
Yet, in order to realize this low temperature fast setting, need to use the low hot Latence catalyst of sensitization energy, but near the storage stability that has concurrently the room temperature is very difficult.
Therefore, recently with acrylate derivative or methacrylate derivative (below, be generically and collectively referred to as " (methyl) acrylate derivative ".) and just receive publicity as the superoxide of radical polymerization initiator and the radical-curable caking agent of usefulness.For the radical-curable caking agent, since rich reactive as the radical of reactive behavior kind, therefore compare with the caking agent that uses epoxy resin, can solidify (with reference to patent documentation 2 and 3) at short notice.
The prior art document
Patent documentation
Patent documentation 1: japanese kokai publication hei 1-113480 communique
Patent documentation 2: No. 98/44067 pph of International Publication
Patent documentation 3: No. 01/015505 pph of International Publication
Summary of the invention
Yet existing radical-curable caking agent has bonding strength problem fully.
In addition, in parts such as semiconductor element or liquid crystal display device bonding,, formally connect through being overlapped and the working fastening operation by the position of sticky object.In recent years, the constantly development of short period of timeization of each operation when being the installation of purpose to improve turnout, and before formal the connection by coincidence of the position of sticky object and working fastening operation, may be thought of as the situation below 1 second.Yet radical-curable caking agent in the past has and can't fully support by sticky object in the working fastening of this short period of time, and produces the problem of position deviation.
For example; In patent documentation 3; Though have following main record: through selecting urethane acrylate as free-radical polymerised compound; Can make excellent in adhesion, but this radical-curable caking agent is in the working fastening of above-mentioned short period of time, is difficult to obtain sufficient holding power (working fastening power).
The present invention accomplishes in view of problem that above-mentioned prior art had, even its purpose is to provide a kind of working fastening time short, also can access sufficient holding power (working fastening power), and the excellent adhesive composite of bonding strength after formal the connection.In addition, the object of the invention also is to provide a kind of and has that to use this adhesive composite to carry out bonding by the circuit connection structure of sticky object, semiconductor device and solar cell module.
That is to say; The present invention provides a kind of adhesive composite, and it contains and has acrylic rubber, urethane acrylate and/or carbamate methacrylic ester and the radical polymerization initiator that 5～18 quality % come from the structural unit of vinyl cyanide.
Adhesive composite of the present invention even the working fastening time is short, also can access sufficient working fastening power through adopting above-mentioned formation, and the bonding strength after formal the connection is excellent.Therefore, according to adhesive composite of the present invention, can carry out at short notice being overlapped and working fastening by the position of sticky object.Therefore, the adhesive composite of the application of the invention in the manufacturing process of semiconductor element or liquid crystal display device etc., can be sought the raising of turnout.
In addition, therefore adhesive composite of the present invention is compared with the caking agent of use epoxy resin owing to be that it(?) can the quick-setting radical-curable caking agent of low temperature when formal the connection, can shorten the activity duration that formal connection operation is spent.
Further, because the bonding strength after the formal connection of adhesive composite of the present invention is excellent, therefore carries out bonding structure and have excellent connection reliability through adhesive composite of the present invention.
In adhesive composite of the present invention, the second-order transition temperature of aforesaid propylene acid rubber is preferably-30～20 ℃ scope.For this adhesive composite, its working fastening power is excellent more, and connection reliability is also excellent more simultaneously.
Adhesive composite of the present invention preferably further contains electroconductive particle.Through further containing electroconductive particle, adhesive composite is endowed electroconductibility or anisotropic conductive.Therefore, this adhesive composite can more be applicable to circuit block connection purposes each other with circuit electrode etc., and can fully reduce the connection resistance between the circuit electrode of connection.
In the present invention, aforesaid propylene acid rubber can have vinyl cyanide, (methyl) alkyl acrylate and polar functionalities (methyl) propenoate as monomeric unit.
In addition, the weight-average molecular weight of above-mentioned carbamate (methyl) propenoate is preferably 5000～30000.
In addition, be benchmark with the total amount of above-mentioned acrylic rubber, above-mentioned carbamate (methyl) propenoate and above-mentioned radical polymerization initiator, the content of aforesaid propylene acid rubber can be made as 1.5～30 quality %.
In addition, be benchmark with the total amount of above-mentioned acrylic rubber, above-mentioned carbamate (methyl) propenoate and above-mentioned radical polymerization initiator, the content of above-mentioned carbamate (methyl) propenoate can be made as 5～80 quality %.
In addition, be benchmark with the total amount of above-mentioned acrylic rubber, above-mentioned carbamate (methyl) propenoate and above-mentioned radical polymerization initiator, the content of above-mentioned radical polymerization initiator can be made as 0.1～30 quality %.
The present invention also provides a kind of above-mentioned adhesive composite is shaped to the membranaceous membranaceous circuit connection material that forms.
The present invention also provides a kind of circuit connection structure; It has the pair of electrical circuit unit of subtend configuration; And be arranged between the above-mentioned pair of electrical circuit unit, bonding circuit block each other, thereby the interconnecting piece that the circuit electrode that above-mentioned pair of electrical circuit unit is had separately is electrically connected to each other; Above-mentioned interconnecting piece contains the cured article of the adhesive composite of the invention described above.
For circuit connection structure of the present invention; Because bonding pair of electrical circuit unit interconnecting piece each other contains the cured article of the adhesive composite of the invention described above; Even when therefore under hot and humid environment, placing for a long time; Also can obtain excellent connection reliability, and can fully suppress interconnecting piece and on the interface, produced to peel off by sticky object (circuit block).
The present invention also provides a kind of method of manufacture of circuit connection structure; It has makes above-mentioned adhesive composite between first circuit block with first circuit electrode with have between the second circuit parts of second circuit electrode; And with above-mentioned first circuit electrode and above-mentioned second circuit electrode relatively to mode with the working fastening operation of above-mentioned first circuit block and the working fastening of above-mentioned second circuit parts; With above-mentioned first circuit block and above-mentioned second circuit parts heating and pressurizing to working fastening; Above-mentioned adhesive composite is solidified, and the connection operation that above-mentioned first circuit electrode is connected with above-mentioned second circuit electrode electricity.
The present invention also provides a kind of semiconductor device; It has semiconductor element; Carry the substrate of above-mentioned semiconductor element; And be arranged between above-mentioned semiconductor element and the aforesaid substrate bonding above-mentioned semiconductor element and aforesaid substrate, thereby the interconnecting piece that above-mentioned semiconductor element and aforesaid substrate are electrically connected; Above-mentioned interconnecting piece contains the cured article of the adhesive composite of the invention described above.
For semiconductor device of the present invention; Because the interconnecting piece of bonding semi-conductor and substrate contains the cured article of the adhesive composite of the invention described above; Even when therefore under hot and humid environment, placing for a long time; Also can obtain excellent connection reliability, and can fully suppress interconnecting piece and on the interface, produced to peel off by sticky object (semiconductor element, substrate).
The present invention also provides a kind of method of manufacture of semiconductor device; It has makes above-mentioned adhesive composite between semiconductor element and substrate; And make above-mentioned semiconductor element be temporarily fixed at the working fastening operation on the aforesaid substrate; With to above-mentioned semiconductor element and aforesaid substrate heating and pressurizing, make foregoing circuit connect material cured, and make the operation that is connected of above-mentioned semiconductor element and aforesaid substrate electrical connection.
The present invention also provides a kind of solar cell module, and it has the solar battery cell that electrode is arranged, and distribution component and bonding above-mentioned solar battery cell and above-mentioned distribution component are so that the interconnecting piece that above-mentioned electrode and above-mentioned distribution component are electrically connected; Above-mentioned interconnecting piece contains the cured article of the adhesive composite of the invention described above.
For solar cell module of the present invention; Because the adhering part of bonding solar battery cell and distribution component contains the cured article of the adhesive composite of the invention described above; Even when therefore under hot and humid environment, placing for a long time; Also can obtain excellent connection reliability, and can fully suppress interconnecting piece and on the interface, produced to peel off by sticky object (solar battery cell, distribution component).
The present invention also provides a kind of method of manufacture of solar cell module; Its adhesive composite with the invention described above of making is between solar battery cell with electrode and distribution component; And make above-mentioned distribution component be temporarily fixed at the working fastening operation on the above-mentioned solar battery cell; With above-mentioned solar battery cell and above-mentioned distribution component are carried out heating and pressurizing; Above-mentioned adhesive composite is solidified, and make the operation that is connected of above-mentioned solar battery cell and the electrical connection of above-mentioned distribution component.
The invention still further relates to contain and have the compsn of acrylic rubber, carbamate (methyl) propenoate and radical polymerization initiator that 5～18 quality % come from the structural unit of vinyl cyanide as the purposes of caking agent.
The invention still further relates to contain and have the compsn that 5～18 quality % come from acrylic rubber, carbamate (methyl) propenoate and the radical polymerization initiator of the structural unit of vinyl cyanide; As being used for bonding circuit block each other, thus the purposes of the circuit connection material that the circuit electrode that this pair of electrical circuit unit is had separately is electrically connected to each other.
The invention further relates to contain and have the compsn that 5～18 quality % come from acrylic rubber, carbamate (methyl) propenoate and the radical polymerization initiator of the structural unit of vinyl cyanide, as the purposes of the circuit connection material that is used for semiconductor element and substrate are electrically connected.
According to the present invention, even can provide a kind of working fastening time short, also can access sufficient holding power (working fastening power), and the excellent adhesive composite of bonding strength after formal the connection.In addition, according to the present invention, can provide a kind of and have that to use this adhesive composite to carry out bonding by the circuit connection structure of sticky object, semiconductor device and solar cell module.
Description of drawings
[Fig. 1] is the pattern sectional view of expression by an embodiment of the formed film-like adhesive of adhesive composite of the present invention.
[Fig. 2] is the pattern sectional view of an embodiment of expression circuit connection structure of the present invention.
[Fig. 3] is a series of process chart of junction circuit parts.
[Fig. 4] is the pattern sectional view of an embodiment of expression semiconductor device of the present invention.
[Fig. 5] is the pattern sectional view of an embodiment of expression solar cell module of the present invention.
Nomenclature
1... film-like adhesive, 2... circuit connection structure, 3... semiconductor device, 5... caking agent composition, 7... electroconductive particle, 10... circuit connecting section part, 11... insulativity material, 20... first circuit block, 21... circuit substrate (first circuit substrate), 21a... interarea, 22... circuit electrode (first circuit electrode), 30... second circuit parts, 31... circuit substrate (second circuit substrate), 31a... interarea, 32... circuit electrode (second circuit electrode), the membranaceous circuit connection material of 40..., 50... semiconductor element, 60... substrate, 61... schematic circuit, 70... sealing material, 80... semiconductor element interconnecting piece, 92... substrate, 94... distribution component, 95... interconnecting piece, 96... electrode, 97... backplate, 98... sensitive surface, 100A, the 100B... solar battery cell.
Embodiment
Below, according to circumstances, in reference to accompanying drawing, preferred implementation of the present invention is described.In addition, in the accompanying drawings, give prosign, and omit the multiple explanation identical or corresponding part.
In addition, in following explanation, (methyl) vinylformic acid is meant vinylformic acid and/or methylacrylic acid, and (methyl) propenoate is meant propenoate and/or methacrylic ester, and (methyl) acryl is meant acryl and/or methacryloyl.That is to say that carbamate (methyl) propenoate is meant urethane acrylate and/or carbamate methacrylic ester.
In addition, in this manual, weight-average molecular weight is meant according to the condition shown in the below table 1, the value of using the polystyrene standard calibration curve to be measured by gel permeation chromatography (GPC).
Table 1
(adhesive composite)
The adhesive composite of this embodiment contain have 5～18 quality % come from the structural unit of vinyl cyanide acrylic rubber (below, be sometimes referred to as " (a) composition ".), urethane acrylate and/or carbamate methacrylic ester (below, be sometimes referred to as " (b) composition ".) and radical polymerization initiator (below, be sometimes referred to as " (c) composition ".)。
Even the adhesive composite working fastening time of this embodiment is short, also can access sufficient working fastening power, and the bonding strength after formal the connection is excellent.Therefore, according to the adhesive composite of this embodiment, can carry out at short notice being overlapped and working fastening by the position of sticky object.Therefore, through using the adhesive composite of this embodiment, in the manufacturing process of semiconductor element or liquid crystal display device etc., can seek the raising of turnout.
In addition, therefore the adhesive composite of this embodiment is compared with the caking agent of use epoxy resin owing to be that it(?) can the quick-setting radical-curable caking agent of low temperature when formal the connection, can shorten the activity duration that formal connection operation is spent.
Further, because the bonding strength after the formal connection of the adhesive composite of this embodiment is excellent, therefore the adhesive composite through this embodiment carries out the connection reliability that bonding structure has excellence.
Below, each composition of the adhesive composite that constitutes this embodiment is detailed.
((a) composition: acrylic rubber)
The adhesive composite of this embodiment contains acrylic rubber.And, for this acrylic rubber, be benchmark with the total amount of acrylic rubber, have the structural unit that 5 quality % are above, come from vinyl cyanide more than the preferred 8 quality %.Be less than above-mentioned scope if come from the content of the structural unit of vinyl cyanide in the acrylic rubber, the tendency of bonding force step-down is then arranged.
In addition, for acrylic rubber, be benchmark with the total amount of acrylic rubber, the content that comes from the structural unit of vinyl cyanide is below the 18 quality %, and is preferably below the 16 quality %.If the content of structural unit that comes from vinyl cyanide in the acrylic rubber more than above-mentioned scope, then has and (b) the consistency variation of composition, the tendency of productivity difference.
Here; Coming from the content of the structural unit of the vinyl cyanide feeding quantity can be by acrylic acid synthesizing rubber the time easily calculates; But when calculating by the synthetic acrylic rubber; For example, can quantitatively calculate the nitrile equivalent in the acrylic rubber through using IR, NMR, GC-MS, ultimate analysis etc.
For acrylic rubber, for example, can obtain through making vinyl cyanide and vinyl cyanide free radical polymerization monomer in addition carry out polymerization.As the free radical polymerization monomer beyond the vinyl cyanide, can enumerate (methyl) alkyl acrylates such as (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) Bing Xisuandingzhi; (methyl) propenoate of polar functionalities such as (methyl) Hydroxyethyl Acrylate, (methyl) glycidyl acrylate; (methyl) vinylformic acid; 1, dienes such as 4-divinyl etc.These free radical polymerization monomers can use separately, or multiple combination is used.
The not special restriction of the polymerization method of the free radical polymerization monomer beyond vinyl cyanide and the vinyl cyanide can be adopted polymerization methods such as common suspension polymerization, solution polymerization, letex polymerization, mass polymerization, high-pressure free radical polymerization.
In above-mentioned free radical polymerization monomer, acrylic rubber preferably has (methyl) propenoate of (methyl) alkyl acrylate and polar functionalities as monomeric unit.
The content that comes from the structural unit of (methyl) alkyl acrylate in the acrylic rubber is preferably more than the 77 quality %, more preferably more than the 80 quality %.The content that comes from the structural unit of (methyl) alkyl acrylate through making is above-mentioned scope, can play the effect that can access better working fastening power.
In addition, the content that comes from the structural unit of (methyl) alkyl acrylate in the acrylic rubber is preferably below the 94 quality %, more preferably below the 92 quality %.The content that comes from the structural unit of (methyl) alkyl acrylate through making is above-mentioned scope, can play the effect that after formal the connection, can access better bonding force.
The content of structural unit that comes from the propenoate of polar functionalities in the acrylic rubber is preferably more than the 1 quality %, more preferably more than the 2 quality %.Through the content that makes the structural unit that comes from the difunctionality propenoate is above-mentioned scope, can play the effect that after formal the connection, can access better bonding force.
In addition, the content of structural unit that comes from the propenoate of polar functionalities in the acrylic rubber is preferably below the 5 quality %, more preferably below the 4 quality %.Through the content that makes the structural unit that comes from the difunctionality propenoate is above-mentioned scope, can play the effect that can access with the abundant consistency of other adhesive composite.
The second-order transition temperature of acrylic rubber is preferably-30～20 ℃ scope, scope more preferably-25～15 ℃.When the second-order transition temperature of acrylic rubber during, has the tendency of the cured article thermotolerance variation of adhesive composite less than-30 ℃.In addition,, have and in shorter time, to carry out being overlapped, when working fastening, can access the tendency of higher working fastening power simultaneously by the position of sticky object when the second-order transition temperature of acrylic rubber is below 20 ℃ the time.
The weight-average molecular weight of acrylic rubber is preferably 100000～1500000 scope, more preferably 250000～1000000 scope.When the weight-average molecular weight of acrylic rubber less than 100000 the time, have the tendency of the cured article thermotolerance variation of adhesive composite.In addition, when the weight-average molecular weight of acrylic rubber greater than 1500000 the time, have the consistency variation with other resin (particularly (b) composition), and a mobile tendency that reduces.
The content of the acrylic rubber in the adhesive composite of this embodiment ((a) composition) is benchmark with (a) composition, (b) composition with (c) total amount of composition, is preferably 1.5～30 quality %, more preferably 2.5～20 quality %.When the content of acrylic rubber is 1.5 quality % when above, have and can in shorter time, carry out being overlapped by the position of sticky object, when working fastening, can access the tendency of higher working fastening power simultaneously.In addition, if the content of acrylic rubber, then has the tendency with the consistency variation of other resin (particularly (b) composition) more than 30 quality %.
((b) composition: carbamate (methyl) propenoate)
The adhesive composite of this embodiment contains carbamate (methyl) propenoate.Here, carbamate (methyl) propenoate is meant that intramolecularly has the compound of at least one carbamate groups and at least one (methyl) acryl.
As carbamate (methyl) propenoate, can enumerate the resultant of reaction of (methyl) acryliccompound of diatomic alcohol compounds, diisocyanate cpd and hydroxyl.
As above-mentioned diatomic alcohol compounds; Can enumerate polyethylene glycol adipate, polydiethylene glycol adipate, polypropylene adipate(PPA), poly adipate succinic acid ester, gather hexanodioic acid-1; 6-pinakon ester, polyneopentyl glycol adipate, polycaprolactone polyol, gather carbonic acid-1,6-pinakon ester, siloxane polyol, acryl polyvalent alcohol, polyoxyethylene glycol, W 166, gather tetramethylene glycol etc.They can use separately, or combination more than 2 kinds is used.
As above-mentioned diisocyanate cpd, can enumerate 2,4-toluene support vulcabond, 3; 3 '-dimethyl--4,4 '-biphenylene vulcabond, 1,6-hexamethylene diisocyanate, 1; 3-phenylene vulcabond, 1,4-phenylene vulcabond, naphthalene-1,5-vulcabond, 3; 3 '-dimethyl diphenylmethane-4,4 '-vulcabond, 4,4 '-methylene radical two (cyclohexyl isocyanate), isophorone diisocyanate, 4; 4 '-diphenylmethanediisocyanate, dicyclohexyl methyl hydride-4; 4 '-vulcabond, Toluene-2,4-diisocyanate, 6-vulcabond, Toluene-2,4-diisocyanate, 4-vulcabond, triethyl hexamethylene diisocyanate, m xylene diisocyanate etc.They can use separately, or combination more than 2 kinds is used.
As (methyl) acryliccompound of hydroxyl, can enumerate (methyl) 2-Hydroxy ethyl acrylate, (methyl) vinylformic acid-2-hydroxy propyl ester etc.
The weight-average molecular weight of carbamate (methyl) propenoate is preferably 5000～30000 scope, more preferably 8000～20000 scope.If the weight-average molecular weight of carbamate (methyl) propenoate is more than 5000, the excellent more tendency of bonding force after the formal connection is then arranged, if be below 30000, the mobile tendency that further improves is arranged then.
The content of the carbamate in the adhesive composite of this embodiment (methyl) propenoate ((b) composition) is benchmark with (a) composition, (b) composition with (c) total amount of composition, is preferably 5～80 quality %, more preferably 10～70 quality %.When the content of carbamate (methyl) propenoate is 5 quality % when above, has the tendency that can access higher bonding force.In addition, if the content of carbamate (methyl) propenoate more than 80 quality %, then during with membranaceous use, has the tendency of film-forming properties variation at adhesive composite.
((c) composition: radical polymerization initiator)
The adhesive composite of this embodiment contains radical polymerization initiator.Here, radical polymerization initiator is meant and can decomposes through heating and/or rayed, and produces the compound of free radical.
As radical polymerization initiator, for example, the superoxide or the azo cpd that can use in the past to be known.These radical polymerization initiators are to decompose through heating, and produce the compound of free radical.
1 minute half life temperature of radical polymerization initiator is preferably 80～200 ℃ scope, is preferably 90～175 ℃ scope.When radical polymerization initiator half life temperature was in above-mentioned scope in 1 minute the time, the storage stability of adhesive composite is good, and has sufficient reactivity (solidified nature).In addition, so-called here " 1 minute half life temperature " is meant that the transformation period is 1 minute a temperature.In addition, " transformation period " be meant until compound concentrations and be reduced to the half the time of initial value.
In addition, as radical polymerization initiator, preferred molecular weight is the superoxide of 180～1000 scopes, and more preferably molecular weight is the superoxide of 200～500 scopes.This radical polymerization initiator is except owing to (a) composition and (b) the consistency excellence of composition, and is therefore outside stability and the reactive excellence, also low owing to its volatility, so operability is easy.
As radical polymerization initiator; Can enumerate 1; 1,3,3-tetramethyl butyl new decanoate ester peroxide, cumyl new decanoate ester peroxide, uncle's hexyl new decanoate ester peroxide, 1-cyclohexyl-1-methylethyl new decanoate ester peroxide, tert-butyl hydroperoxide neodecanoic acid ester, t-butylperoxy pivarate, 1; 1; 3,3-tetramethyl butyl peroxo--2-ethylhexanoate, 2,5-dimethyl--2; 5-two (peroxo-of 2-ethyl hexanoyl base) hexane, uncle's hexyl peroxo--2-ethylhexanoate, tert-butyl hydroperoxide-2-ethylhexanoate, the new heptanoate of tert-butyl hydroperoxide, t-amyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide six hydrogen terephthalate, t-amyl peroxy-3; 5,5-tri-methyl hexanoic acid ester, 3-hydroxyl-1,1-dimethylbutyl new decanoate ester peroxide, t-amyl peroxy neodecanoic acid ester, uncle's hexyl peroxo-sec.-propyl monocarbonate, tert-butyl hydroperoxide toxilic acid, tert-butyl hydroperoxide-3; 5; 5-tri-methyl hexanoic acid ester, tert-butyl hydroperoxide laurate, 2,5-dimethyl--2,5-two (peroxo-of 3-methyl benzoyl) hexane, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, uncle's hexyl peroxide benzoate, 2; 5-dimethyl--2, peroxyesters such as 5-two (benzoyl-peroxo-) hexane, tert butyl peroxy benzoate, dibutyl peroxo-trimethyladipic acid ester, t-amyl peroxy n-caprylic acid ester, the different pelargonic esternonate of t-amyl peroxy, t-amyl peroxy benzoic ether; Peroxy dicarbonates such as two (4-tert-butylcyclohexyl) peroxy dicarbonate, two (2-ethylhexyl) peroxy dicarbonate; Diacyl peroxide classes such as two bay acyl peroxides, dibenzoyl superoxide, 3-methyl benzoyl superoxide, 4-methyl benzoyl superoxide, two (3-methyl benzoyl) superoxide, two (4-methyl benzoyl) superoxide; 2,2 '-azo two-2,4-methyl pentane nitrile, 1; 1 '-azo two (1-acetoxyl group-1-diphenylphosphino ethane), 2; 2 '-Diisopropyl azodicarboxylate, 2,2 '-azo two (2-methylbutyronitrile), dimethyl--2,2 '-Diisopropyl azodicarboxylate, 4; 4 '-azo two (4-cyanopentanoic acid), 1,1 '-azo two azos such as (1-cyclohexane nitriles) is a polymerization starter etc.These compounds can use a kind separately, can the compound more than 2 kinds be used in addition.
In addition, as radical polymerization initiator, can also use to be the compound that the light of 150～750nm produces radical through illumination wavelength.As this compound, for example, Photoinitiation; Photopolymerization; And Photocuring, J.-P.Fouassier, Hanser Publishers (nineteen ninety-five); The α that is put down in writing among p17～p35-acetamido benzophenone derivatives or phosphine oxide verivate are because high to light-struck susceptibility, therefore preferred.These compounds can use a kind separately, can the compound more than 2 kinds be used in addition.In addition, can also mix use with above-mentioned superoxide or azo cpd.
Below the preferred 5000ppm of the content of the cl ions in the radical polymerization initiator.Contain the adhesive composite of this radical polymerization initiator owing to can further suppress the corrosion of the splicing ear of circuit block, therefore be suitable as the adhesive composite that circuit block connects usefulness.
In addition, the organic acid content in the radical polymerization initiator is preferably below the 5000ppm.Contain the adhesive composite of this radical polymerization initiator owing to can further suppress the corrosion of the splicing ear of circuit block, therefore be suitable as the adhesive composite that circuit block connects usefulness.
In addition, as radical polymerization initiator, the radical polymerization initiator that preferably has the quantity retention more than the 20 quality % after 24 hours in open placement under room temperature (25 ℃), the normal pressure.The stability in storage of adhesive composite that contains this radical polymerization initiator is excellent more.
The content of the radical polymerization initiator in the adhesive composite of this embodiment ((c) composition) is benchmark with (a) composition, (b) composition with (c) total amount of composition, is preferably 0.1～30 quality %, more preferably 1～20 quality %.When the content of radical polymerization initiator is 0.1 quality % when above, has the tendency that can access higher reactivity and Geng Gao bonding force.In addition, if the content of radical polymerization initiator then has the tendency that shortens working life more than 30 quality %.That is to say, be above-mentioned scope through making radical polymerization initiator, can take into account high reactivity and bonding force and long pot life.
((d) composition: electroconductive particle)
The adhesive composite of this embodiment can further contain electroconductive particle (below, be sometimes referred to as " (d) composition ".)。The adhesive composite that contains electroconductive particle can be suitable for and make the anisotropic conductive adhesive composite.
As electroconductive particle, can enumerate the metallics that contains Au, Ag, Pd, Ni, Cu, scolding tin etc.; Carbon particles; On by formed nucleomes of non-conductive material such as glass, pottery, plastics, the composite particles of conductive materials such as coated metal, metallics, carbon etc.Electroconductive particle for example can be the particle of lining silver on the metallics that is formed by copper.In addition, as electroconductive particle, also can use like what TOHKEMY 2005-116291 communique was put down in writing the sort ofly to have a metal-powder that a plurality of fine metal particles connect into the catenate shape.
As electroconductive particle, be preferably the formed composite particles of lining conductive material on formed nucleome by plastics, or the metal (metallics that for example, contains nickel, copper, silver etc.)。These electroconductive particles are owing to have a deformability of being out of shape through heating and pressurizing, therefore when circuit block is bonded to each other, can increase the circuit electrode that this circuit block has and the contact area of electroconductive particle.Therefore, according to the adhesive composite that contains these electroconductive particles, can obtain the excellent more circuit connection structure of connection reliability.In addition, as electroconductive particle, can also use the surface of above-mentioned electroconductive particle that the particle of the insulation layer that is formed by the insulativity material is set on the surface of above-mentioned electroconductive particle with the particle of insulativity particle lining, through methods such as hydridization.Through using this electroconductive particle, be difficult to take place because the short circuit that the electroconductive particle contact each other of adjacency causes.
The content of the electroconductive particle in the adhesive composite of this embodiment ((d) composition) is benchmark with the TV of the solids component in the adhesive composite, preferably is made as 0.1～30 volume %, more preferably is made as 0.1～10 volume %.If the content of electroconductive particle less than 0.1 volume %, then has the tendency of electroconductibility variation,, the tendency that is easy to generate short circuit between circuit electrode is arranged then if surpass 30 volume %.The TV of above-mentioned solids component is for example confirmed by the volume sum of each composition of adhesive composite before the curing under 23 ℃.The volume of each composition for example, can utilize proportion that mass conversion is obtained for volume.In addition; Can with can not dissolve or swelling want volumetric composition and just fully the appropriate solvent of wetting this composition (water, alcohol etc.) join in the container such as graduated cylinder; In this container, drop into the determination object composition then, and the volume that increases is obtained as the volume of this composition.
(other composition)
The adhesive composite of this embodiment can also contain above-mentioned composition in addition.
For example, the adhesive composite of this embodiment can also further contain the thermoplastic resin beyond the aforesaid propylene acid rubber.
As thermoplastic resin, can enumerate polyimide resin class, polyamide resin lipid, phenoxy resin class, gather (methyl) acrylate resin class, polyurethane type resin, polyester resin, polyvinyl butyral resin class etc.Further, in these thermoplastic resins, can also contain siloxane bond or fluoro substituents.For these resins,, just can use suitably as long as the blended resin mixes fully each other or microphase-separated takes place and becomes the gonorrhoea state.
The molecular weight of thermoplastic resin is big more, then obtains film-forming properties more easily, can the melt viscosity of influence as the flowability of caking agent be set in the wide scope in addition.The molecular weight of thermoplastic resin does not receive special restriction, but as general weight-average molecular weight, is preferably 5000～200000, is preferably 10000～150000 especially.When this value less than 5000 the time, have the tendency of film-forming properties variation, in addition,, the tendency with the consistency variation of other composition is arranged then if surpass 200000.
In addition, the adhesive composite of this embodiment can also further contain the free-radical polymerised composition beyond above-mentioned carbamate (methyl) propenoate.
Free-radical polymerised composition can use with states such as monomer, oligopolymer, and can monomer and oligopolymer be mixed use.In addition, free-radical polymerised composition can use a kind separately, perhaps uses mixing more than 2 kinds.
As free-radical polymerised composition, can enumerate material with (methyl) acryl.As free-radical polymerised composition, can enumerate oligopolymer such as epoxy group(ing) (methyl) origoester acrylate, polyethers (methyl) origoester acrylate, polyester (methyl) origoester acrylate with (methyl) acryl; Trimethylolpropane tris (methyl) propenoate; Polyoxyethylene glycol two (methyl) propenoate; Polyalkylene glycol two (methyl) propenoate; Dicyclopentenyl (methyl) propenoate; Two cyclopentenes oxygen base ethyl (methyl) propenoate; NSC 6366 two (methyl) propenoate; Dipentaerythritol six (methyl) propenoate; Isocyanuric acid modification 2 officials ability (methyl) propenoate; Isocyanuric acid modification 3 officials ability (methyl) propenoate; Epoxy group(ing) (methyl) propenoate that makes the glycidyl of (methyl) vinylformic acid and bisphenol fluorene diglycidylether carry out addition; Carry out importing in the compound of addition multifunctional (methyl) propenoate such as compound etc. of (methyl) acryloxy at the glycidyl that makes terepthaloyl moietie or Ucar 35 and bisphenol fluorene diglycidylether.In addition; Can also use tetramethylolmethane (methyl) propenoate, 2-cyano ethyl (methyl) propenoate, cyclohexyl (methyl) propenoate, dicyclopentenyl (methyl) propenoate, two cyclopentenes oxygen base ethyl (methyl) propenoate, 2-(2-ethoxy ethoxy) ethyl (methyl) propenoate, 2-ethoxyethyl group (methyl) propenoate, 2-ethylhexyl (methyl) propenoate, n-hexyl (methyl) propenoate, 2-hydroxyethyl (methyl) propenoate, hydroxypropyl (methyl) propenoate, isobornyl (methyl) propenoate, isodecyl (methyl) propenoate, iso-octyl (methyl) propenoate, positive lauryl (methyl) propenoate, 2-methoxy ethyl (methyl) propenoate, 2-phenoxy ethyl (methyl) propenoate, tetrahydrofurfuryl (methyl) propenoate, 2-(methyl) acryloxy ethyl phosphonic acid ester, N; N-dimethyl aminoethyl (methyl) propenoate, N, N-dimethylaminopropyl (methyl) propenoate, (methyl) acryloyl morpholine etc.
Among these,, preferably has the compound of (methyl) acryl more than 2 at intramolecularly as free-radical polymerised composition with (methyl) acryl.
In addition, as free-radical polymerised composition, except material with (methyl) acryl, can also enumerate have allyl group, dimaleoyl imino, vinyl etc. can be through living radical and the compound of polymeric functional group.As this compound, for example, can enumerate N-vinyl imidazole, N-vinyl pyridine, N-vinyl pyrrolidone, N-vinyl formamide, N-caprolactam, 4; 4 '-vinylidene two (N, accelerine), N-vinyl acetamide, N, N-DMAA, N-NSC 11448, N; N-diethylammonium acrylic amide, NMA, 4,4 '-ditan dimaleimide, 3,3 '-dimethyl--5; 5 '-4,4 '-ditan dimaleimide, 1,6-dimaleimide-(2; 2, the 4-trimethylammonium) hexane etc.
Further, as free-radical polymerised composition, can also enumerate free-radical polymerised composition with phosphate ester structure.Adhesive composite with this free-radical polymerised composition because the bonding strength on inorganicss such as metal surfaces is improved, therefore goes for each other bonding of circuit block.
As free-radical polymerised composition, for example, can enumerate following formula (1)～(3) represented phosphoric acid ester with phosphate ester structure.
In the formula, R
1Expression acryl or methacryloyl, R
2Expression Wasserstoffatoms or methyl, x and w represent 1～8 integer independently of one another.In addition, in the formula, R
1R each other,
2Each other, w each other and x each other, separately each other can be identical or different.
In the formula, R
3Expression acryl or methacryloyl, y and z represent 1～8 integer independently of one another.In addition, in the formula, R
3Each other, y each other and z each other, separately each other can be identical or different.
[changing 3]
In the formula, R
4Expression acryl or methacryloyl, R
5Expression Wasserstoffatoms or methyl, a and b represent 1～8 integer independently of one another.In the formula, R
5Each other and a each other, separately each other can be identical or different.
In addition; As free-radical polymerised composition with phosphate ester structure; Can enumerate acid phosphorus oxygen base ethyl (methyl) propenoate, acid phosphorus oxygen base propyl group (methyl) propenoate, acid phosphorus oxygen base polyoxyethylene glycol list (methyl) propenoate, acid phosphorus oxygen base polyoxy Ucar 35 list (methyl) propenoate, 2,2 '-two (methyl) acryloxy diethylammonium SULPHOSUCCINIC ACID ESTER, EO modified phosphate two (methyl) propenoate, phosphoric acid modification epoxy group(ing) (methyl) propenoate, phosphoric acid vinyl acetate etc.
In addition, the free-radical polymerised composition that has a phosphate ester structure can also obtain through making the reaction of phosphoric anhydride and (methyl) 2-Hydroxy ethyl acrylate.Particularly, list (2-(methyl) acryloxy ethyl) phosphate ester acid, two (2-(methyl) acryloxy ethyl) phosphate ester acid etc. is arranged.
The content of the free-radical polymerised composition in the adhesive composite of this embodiment with phosphate ester structure, with (a) composition, (b) composition when (c) total amount of composition is 100 mass parts, be preferably 0.01～50 mass parts, more preferably 0.5～5 mass parts.
In addition, the adhesive composite of this embodiment also can further contain stablizer.
Stablizer is in order to control curing speed, to give stability in storage and add.As this stablizer, can suitably use quinone derivatives such as benzoquinones, quinhydrones; Amphyls such as 4-methoxyphenol, 4-tert-butyl catechol; 2,2,6,6-tetramethyl piperidine-1-oxygen base, 4-hydroxyl-2,2,6,6-tetramethyl piperidine-aminooxy verivates such as 1-oxygen base; Hindered amine verivates such as tetramethyl-piperidyl methacrylic ester etc.
For the addition of stablizer,, be preferably 0.01～15 quality %, more preferably 0.05～10 quality % in (a) composition, (b) composition and (c) the total amount benchmark of composition.When this addition during less than 0.01 quality %, have the tendency that can't fully obtain additive effect, if surpass 15 quality %, then hinder polyreaction sometimes.
In addition, the adhesive composite of this embodiment can also further contain bonding auxiliary agents such as coupling agent, driving fit rising agent, flow agent.As this bonding auxiliary agent, can use the represented compound of following formula (4) suitably.These bonding auxiliary agents can use a kind separately, also can use mixing more than 2 kinds.
In the formula, R
6, R
7And R
8Represent that independently of one another Wasserstoffatoms, carbonatoms are that 1～5 alkyl, carbonatoms are that 1～5 alkoxyl group, carbonatoms are that 1～5 alkoxy carbonyl or carbonatoms are 1～5 aryl, R
9Expression acryl, methacryloyl, vinyl, NCO, imidazolyl, sulfydryl, amino, methylamino, dimethylamino, benzylamino, phenyl amino, cyclohexyl amino, morpholinyl, piperazinyl, urea groups or glycidyl, c representes 1～10 integer.
Further, for stress relaxes and the raising cementability, the adhesive composite of this embodiment can also add the known rubber constituent beyond the acrylic rubber.As rubber constituent; Specifically; Can enumerate TR 301, polyhutadiene, C-terminal polyhutadiene, C-terminal polyhutadiene, 1; 2-polyhutadiene, C-terminal 1; 2-polyhutadiene, C-terminal 1,2-polyhutadiene, SBR styrene butadiene rubbers, C-terminal SBR styrene butadiene rubbers, carboxyl, hydroxyl, carboxylated nitrile rubber, C-terminal gather (oxypropylene), alkoxysilyl end and gather (oxypropylene), gather (oxygen tetramethylene) glycol, polyolefin diols, gather-6-caprolactone etc.
Abundant as above-mentioned rubber, consider from the viewpoint that improves cementability, preferably in side chain or the terminal cyanic acid as high polar group, the rubber constituent of carboxyl of containing.These compounds can use a kind separately, also can use mixing more than 2 kinds.
The adhesive composite of this embodiment can be through with the composition except that electroconductive particle in above-mentioned each composition, mixing in the solvent that can dissolve and/or disperse this composition and obtaining.In addition, can not use solvent yet and mix above-mentioned each composition and make.In addition, electroconductive particle is as long as suitably add in above-mentioned mixing process.
The adhesive composite of this embodiment can form membranaceous the use.Specifically, for example, can be coated on the separability base materials such as fluororesin film, polyethylene terephthalate film, release paper, remove and desolvate and form membranaceous in adhesive composite, having added formed solution such as solvent as required.In addition, can also base materials such as above-mentioned solution impregnation non-woven fabrics be loaded on it on separability base material, and remove and to desolvate etc. and form membranaceous.If with membranaceous use, then consider from viewpoints such as operability, convenient more.
Fig. 1 is the pattern sectional view of expression by an embodiment of the formed film-like adhesive of adhesive composite of this embodiment.Film-like adhesive 1 shown in Figure 1 is that the adhesive composite with above-mentioned embodiment forms membranaceous and forms.According to this film-like adhesive, owing to handle easily, and can be easily positioned on by on the sticky object, therefore can easily connect operation.In addition, film-like adhesive 1 also can have by the layer formed multilayered structure (not shown) more than 2 kinds.In addition, when film-like adhesive 1 contained electroconductive particle (not shown), it can be suitable for made the anisotropic conductive film.
Adhesive composite of this embodiment and film-like adhesive usually can be through heating and pressurize and being bonded to each other with making by sticky object.Heating temperature is preferably 100～250 ℃ temperature.Pressure is not so long as can just limit, but generally be preferably 0.1～10MPa do not caused the scope of damage by sticky object especially.These heating and pressurization are preferably carried out in the scope in 0.5 second～120 second.According to the adhesive composite and the film-like adhesive of this embodiment, for example,, also can make by sticky object fully bonding each other even under 150～200 ℃, the condition of 3MPa, carry out the short period of time heating and the pressurization in 15 seconds.
In addition, adhesive composite of this embodiment and film-like adhesive can be as different not of the same race by the caking agent of sticky object of thermal expansivity.Specifically, can as with anisotropically conducting adhesive, silver pastes, silverskin etc. be representative circuit connection material, use that elastomerics, CSP use that underfill, LOC are with etc. with CSP and be the semiconductor element adhesives of representative.
(circuit connection structure)
Below; Adhesive composite and film-like adhesive for this embodiment are used separately as anisotropic conductive adhesive composite and anisotropic conductive film, and an example when on the interarea of circuit substrate, forming 2 circuit blocks that circuit electrode forms and connect describes.
That is to say; Can with anisotropic conductive adhesive composite or anisotropic conductive film be configured on the circuit substrate relatively to circuit electrode between; And pass through heating and pressurizing; Carry out bonding between electrical connection and the circuit substrate between the circuit electrode of subtend, thereby circuit block is connected to each other.Here; As the circuit substrate that forms circuit electrode, can use by the formed substrate of inorganicss such as semi-conductor, glass, pottery, by inorganics such as the formed substrate of organism such as polyimide, polycarbonate, combination glass/epoxy and organic substrate etc.In addition, when the adhesive composite of this embodiment and film-like adhesive were connected the purposes of material as sort circuit, they preferably contained electroconductive particle.
Fig. 2 is the general profile chart of an embodiment of expression circuit connection structure of the present invention (syndeton of circuit block).As shown in Figure 2, the circuit connection structure 2 of this embodiment has first circuit block 20 and second circuit parts 30 of mutual subtend, and between first circuit block 20 and second circuit parts 30, is provided with the circuit connecting section part 10 that connects them.
On the other hand, second circuit parts 30 have circuit substrate (second circuit substrate) 31 and formed circuit electrode (second circuit electrode) 32 on the interarea 31a of circuit substrate 31.In addition, on the interarea 31a of circuit substrate 31, can also according to circumstances form insulation layer (not shown).
As first and second circuit blocks 20,30, so long as formed the circuit block of the electrode that need be electrically connected, just not special restriction.Specifically, can enumerate can be used for liquid-crystal display formed glass or plastic base, the PC board of electrode, ceramic wiring board, FPC, semiconductor silicon chips etc. with ITO, IZO etc., they also can make up use as required.As stated, in this embodiment, be representative with PC board or by the formed material of organism such as polyimide, can also use like metals such as copper, aluminium or ITO (tin indium oxide), silicon nitride (SiN
x), silicon-dioxide (SiO
2) wait the such circuit block of inorganic with various condition of surface.
Circuit connecting section part 10 is formed by the cured article of adhesive composite of this embodiment or film-like adhesive.This circuit connecting section part 10 contains insulativity material 11 and electroconductive particle 7.Electroconductive particle 7 not only can be configured between the circuit electrode 22 and circuit electrode 32 of subtend, also can be configured in interarea 21a, 31a each other.In circuit connection structure 2, circuit electrode 22,32 is electrically connected through electroconductive particle 7.That is, electroconductive particle 7 directly contacts with circuit electrode 22,32 both sides.
Here, electroconductive particle 7 is the illustrated electroconductive particles of preamble, and insulativity material 11 is the cured articles of each composition of insulativity that constitute adhesive composite or the film-like adhesive of this embodiment.
In this circuit connection structure 2, as stated, the circuit electrode 22 and the circuit electrode 32 of subtend are electrically connected through electroconductive particle 7.Therefore, the connection resistance of 22,32 of circuit electrodes fully reduces.Therefore, the electric current that circuit electrode is 22,32 can flow through smoothly, and can give full play to the function that circuit has.In addition, when circuit connecting section part 10 does not contain electroconductive particle 7,, circuit electrode 22 is electrically connected through directly being contacted with circuit electrode 32.
Circuit connecting section part 10 is made up of the adhesive composite of this embodiment or the cured article of film-like adhesive; Therefore; Can fully improve the bonding strength of 10 pairs of circuit blocks 20 of circuit connecting section part or 30; Even and after reliability test (high temperature and humidity test), also can keep stable performance (good bonding strength be connected resistance).
Then, on one side with reference to Fig. 3, one side describes an example of the method for manufacture of foregoing circuit syndeton body.At first, prepare above-mentioned first circuit block 20 and membranaceous circuit connection material 40 (with reference to Fig. 3 (a)).Membranaceous circuit connection material 40 is that the adhesive composite (circuit connection material) with this embodiment is shaped to membranaceous forming, and it contains electroconductive particle 7 and caking agent composition 5.In addition, even when circuit connection material does not contain electroconductive particle 7, this circuit connection material also can be used as the insulativity caking agent, and to be used for anisotropic conductive bonding, also is called NCP (non-conductive paste) sometimes especially.In addition, when circuit connection material contained electroconductive particle 7, this circuit connection material was also referred to as ACP (anisotropic conductive paste).
The thickness of membranaceous circuit connection material 40 is preferably 6～50 μ m.When the thickness of membranaceous circuit connection material 40 during, have the tendency of circuit connection material at 22,32 lack of fills of circuit electrode less than 6 μ m.On the other hand,, the adhesive composite that can't fully get rid of 22,32 of circuit electrodes is arranged then, be difficult to guarantee the tendency of circuit electrode 22,32 conductings if surpass 50 μ m.
Then, membranaceous circuit connection material 40 is placed on the face that is formed with circuit electrode 22 of first circuit block 20.In addition, when membranaceous circuit connection material 40 attached to support (not shown) last time, so that membranaceous circuit connection material 40 sides are placed on first circuit block 20 towards the mode of first circuit block 20.At this moment, membranaceous circuit connection material 40 is membranaceous, and handles easily.Therefore, can easily make membranaceous circuit connection material 40 between first circuit block 20 and second circuit parts 30, and can easily carry out the operation that is connected of first circuit block 20 and second circuit parts 30.
Then, on the arrow A of Fig. 3 (a) and B direction, membranaceous circuit connection material 40 is pressurizeed, make membranaceous circuit connection material 40 be connected (with reference to Fig. 3 (b)) with first circuit block 20 temporarily.At this moment, while also can heat and pressurize.But Heating temperature is made as the low temperature of solidification value than adhesive composite in the membranaceous circuit connection material 40.The interim Heating temperature that connects is preferably 50～120 ℃, more preferably 60～110 ℃.Pressure when temporarily connecting in addition, is preferably 0.1～3MP.
Then, shown in Fig. 3 (c), so that the second circuit electrode towards the mode of first circuit block 20, is placed on second circuit parts 30 on the membranaceous circuit connection material 40.In addition, when membranaceous circuit connection material 40 attached to support (not shown) last time, after peeling off support, second circuit parts 30 are placed on the membranaceous circuit connection material 40.At this moment, carry out the position and overlap so that first and second circuit electrodes relatively to, heat, pressurize from the top of second circuit parts then, thus can be with the working fastening of second circuit parts.So carry out the position deviation of electrode in the time of to suppress next formally to connect.Heating temperature during working fastening is made as the low temperature of solidification value than the adhesive composite in the membranaceous circuit connection material 40, and in order to shorten the PT, the time that overlaps the working fastening end from the position was preferably below 5 seconds.In addition, the Heating temperature during working fastening is preferably 50～120 ℃, more preferably 60～110 ℃.In addition, the pressure during working fastening is preferably 0.1～3MP.
Then, Yi Bian heat membranaceous circuit connection material 40, Yi Bian, on the arrow A of Fig. 3 (c) and B direction, pressurize across first and second circuit blocks 20,30.At this moment Heating temperature be made as can initiated polymerization temperature.So carry out, membranaceous circuit connection material 40 experience solidification treatment formally connect, and can obtain circuit connection structure as shown in Figure 2.
Here, condition of contact as previously mentioned, preferred Heating temperature is 100～250 ℃ (more preferably 150～240 ℃), pressure is 0.1～10MPa, the tie-time was 0.5 second～120 second.These conditions can suitably be selected according to use, adhesive composite, circuit block, and can carry out after fixing as required.
Through making circuit connection structure as described above, in the circuit connection structure of gained, electroconductive particle 7 is contacted with circuit electrode 22,32 both sides of subtend, thereby can fully reduce the connection resistance of 22,32 of circuit electrodes.
In addition; Through heating membranaceous circuit connection material 40; Caking agent composition 5 solidifies under the state that the distance of 32 of circuit electrode 22 and circuit electrodes fully reduces, and form insulativity material 11, and first circuit block 20 is connected securely through circuit connecting section part 10 with second circuit parts 30.That is to say; In the circuit connection structure of gained; Circuit connecting section part 10 is made up of the cured article of the formed circuit connection material of adhesive composite of this embodiment; Therefore the bonding strength of 10 pairs of circuit blocks 20 of circuit connecting section part or 30 can be fully improved, the connection resistance between the circuit electrode of electrical connection can be fully reduced simultaneously.In addition, even under hot and humid environment, during long-time the placement, also can fully suppress the decline and the increase that is connected resistance of bonding strength.
In addition, Fig. 4 is the pattern sectional view of an embodiment of expression semiconductor device of the present invention.As shown in Figure 4, semiconductor device 3 has semiconductor element 50 and the substrate 60 that forms the semi-conductor holding components, and between semiconductor element 50 and substrate 60, is provided with the semiconductor element interconnecting piece 80 that they are electrically connected.In addition, semiconductor element interconnecting piece 80 is stacked on the interarea 60a of substrate 60, and semiconductor element 50 further is stacked on this semiconductor element interconnecting piece 80.
Substrate 60 has circuit Figure 61, and circuit Figure 61 passes through semi-conductor interconnecting piece 80 or directly is electrically connected with semiconductor element 50 on the interarea 60a of substrate 60.And they form semiconductor device 3 through sealing material 70 sealings.
Material as semiconductor element 50; Can use the II-VI compound semiconductor elements such as III-V compound semiconductor element, HgTe, HgCdTe, CdMnTe, CdS, CdSe, MgSe, MgS, ZnSe, ZeTe such as 4 family's semiconductor elements, GaAs, InP, GaP, InGaAs, InGaAsP, AlGaAs, InAs, GaInP, AlInP, AlGaInP, GaNAs, GaNP, GaInNAs, GaInNP, GaSb, InSb, GaN, AlN, InGaN, InNAsP of silicon, germanium, and CuInSe various materials such as (ClS).
Semiconductor element interconnecting piece 80 contains insulativity material 11 and electroconductive particle 7.Electroconductive particle 7 not only is configured between semiconductor element 50 and circuit Figure 61, also is configured between semiconductor element 50 and the interarea 60a.In semiconductor device 3, semiconductor element 50 is electrically connected through electroconductive particle 7 with circuit Figure 61.Therefore, semiconductor element 50 fully reduces with the resistance that is connected between circuit Figure 61.Therefore, the electric current between semiconductor element 50 and circuit Figure 61 can flow through smoothly, and can give full play to the function that semi-conductor has.
In addition, when semiconductor element interconnecting piece 80 did not contain electroconductive particle 7, the electric current of desired amount in order to flow through directly contacted perhaps fully near being electrically connected through making semiconductor element 50 and circuit Figure 61.
Semiconductor element interconnecting piece 80 is made up of the cured article of the adhesive composite of the invention described above.Therefore, the bonding strength of 80 pairs of semiconductor elements of semiconductor element interconnecting piece 50 and substrate 60 fully improves, and semiconductor element 50 fully reduces with the resistance that is connected between circuit Figure 61.In addition, even under hot and humid environment, during long-time the placement, also can fully suppress the decline and the increase that is connected resistance of bonding strength.In addition, semiconductor element interconnecting piece 80 can form through the heat treated of low temperature short period of time.Therefore, semiconductor device 3 can have than high in the past safety.
In addition; For semiconductor device 3; Can use substrate 60 and semiconductor element 50 as first and second circuit blocks 20,30 in the method for manufacture of foregoing circuit syndeton body, and through with the same method manufacturing of method of manufacture of foregoing circuit syndeton body.
Then, the solar cell module to this embodiment describes.
The solar cell module of this embodiment has the solar battery cell that electrode is arranged, and distribution component and bonding above-mentioned solar battery cell and above-mentioned distribution component are so that the interconnecting piece that above-mentioned electrode and above-mentioned distribution component are electrically connected.And above-mentioned interconnecting piece contains the cured article of above-mentioned adhesive composite.
Fig. 5 is the pattern sectional view of an embodiment of expression solar cell module of the present invention.As shown in Figure 5, solar cell module has solar battery cell 100A and distribution component 94, is provided with the interconnecting piece 95 that is electrically connected them between solar battery cell 100A and the distribution component 94.
In solar cell module as shown in Figure 5; The interconnecting piece 95 of the cured article through containing above-mentioned adhesive composite; Bonding distribution component 94 and solar battery cell 100B are so that the backplate 97 of distribution component 94 and solar cell 100B is electrically connected.
Interconnecting piece 95 for example also can be the parts that contain insulativity material and electroconductive particle.When interconnecting piece 95 contained the insulativity particle, electrode 96 and the distribution component 94 of solar battery cell 100A can be electrically connected through electroconductive particle.In addition, the backplate 97 of solar battery cell 100B is electrically connected through electroconductive particle with distribution component 94 too.
For solar cell module shown in Figure 5, interconnecting piece 95 is made up of the cured article of the adhesive composite of the invention described above.Therefore, the bonding strength that 95 couples of solar battery cell 100A of interconnecting piece and distribution component are 94 is high fully, and the connection resistance of 94 of solar battery cell 100A and distribution components is fully little.In addition, even under hot and humid environment, during long-time the placement, also can fully suppress the reduction and the increase that is connected resistance of bonding strength.And interconnecting piece 95 can form through the heat treated of low temperature short period of time.Therefore, solar cell module as shown in Figure 5 can not make solar battery cell 100A deterioration ground make when connecting, and can have than higher in the past safety.
In addition; For solar cell module shown in Figure 5; Can use solar battery cell 100A and distribution component 4 as first and second circuit block 20,30 in the method for manufacture of foregoing circuit syndeton body, and through the method manufacturing same with the method for manufacture of foregoing circuit syndeton body.
More than, preferred implementation of the present invention is illustrated, but the present invention is not limited to above-mentioned embodiment.
Embodiment
Below, through embodiment and comparative example the present invention is described more specifically, but the present invention is not limited to embodiment.
At first, the manufacturing for the acrylic rubber that uses in embodiment and the comparative example, urethane acrylate, conducting particles and phenoxy resin describes.In addition, the second-order transition temperature of acrylic rubber is measured through following method.
(mensuration of second-order transition temperature)
40g phenoxy resin (molecular-weight average is 45000 for PKHC, Union Carbide Corporation's goods name) is dissolved in the 60g methylethylketone, and forming solids component is the solution of 40 weight %.Then, 15g synthetic acrylic rubber is dissolved in the mixed solvent of 42.5g toluene, 42.5g ETHYLE ACETATE, forming solids component is the solution of 15 weight %.With with solids component than the note phenoxy resin: the ratio of acrylic rubber=3: 1 mixes them, and uses the coating machine coating, drying 10 minutes under 70 ℃ hot blast then, thereby obtain the film that thickness is 20 μ m.For the film of gained, use the RSAII of Rheometric Scientific manufactured, under following condition, measure.In the result of gained, the temperature of low temperature side is the Tg of acrylic rubber in the peak temperature of tan δ.
< condition determination >
Heat-up rate: 5 ℃/minute
Vibration number: 1Hz
Measure TR :-40 ℃～100 ℃
(synthesizing of acrylic rubber 1)
In device with stirrer, TM, reflux exchanger and nitrogen ingress pipe; Add 500g deionized water, 61g Bing Xisuandingzhi, 23g ethyl propenoate, 3g Hydroxyethyl Acrylate and 13g vinyl cyanide, and under nitrogen gas stream, at room temperature stirred 1 hour; Be heated to 70 ℃ then; Under this state, stirred 3 hours, further be heated to 90 ℃, stirred 3 hours.After the solid of gained reclaimed, washing, drying, thus obtain that weight-average molecular weight is 500000, Tg is-10 ℃ acrylic rubber 1.This acrylic rubber 1 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 2)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 66g Bing Xisuandingzhi, 26g ethyl propenoate, 3g Hydroxyethyl Acrylate and 5g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 600000, Tg is-17 ℃ acrylic rubber 2.This acrylic rubber 2 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 3)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 60g Bing Xisuandingzhi, 20g ethyl propenoate, 3g Hydroxyethyl Acrylate and 17g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 450000, Tg is 2 ℃ acrylic rubber 3.This acrylic rubber 3 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 4)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 74g Bing Xisuandingzhi, 10g ethyl propenoate, 3g Hydroxyethyl Acrylate and 13g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 550000, Tg is-22 ℃ acrylic rubber 4.This acrylic rubber 4 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 5)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 54g Bing Xisuandingzhi, 30g ethyl propenoate, 3g Hydroxyethyl Acrylate and 13g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 650000, Tg is 12 ℃ acrylic rubber 5.This acrylic rubber 5 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 6)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 84g Bing Xisuandingzhi, 3g Hydroxyethyl Acrylate and 13g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 420000, Tg is-32 ℃ acrylic rubber 6.This acrylic rubber 6 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 7)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 24g Bing Xisuandingzhi, 60g ethyl propenoate, 3g Hydroxyethyl Acrylate and 13g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 710000, Tg is 26 ℃ acrylic rubber 7.This acrylic rubber 7 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 8)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 64g Bing Xisuandingzhi, 31g ethyl propenoate, 3g Hydroxyethyl Acrylate and 2g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 480000, Tg is-18 ℃ acrylic rubber 8.This acrylic rubber 8 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of acrylic rubber 9)
With the same device of acrylic rubber 1 in; Add 500g deionized water, 57g Bing Xisuandingzhi, 17g ethyl propenoate, 3g Hydroxyethyl Acrylate and 23g vinyl cyanide; And through with the same condition of acrylic rubber 1 under heated and stirred, obtain weight-average molecular weight and be 500000, Tg is 13 ℃ acrylic rubber 9.This acrylic rubber 9 is dissolved in the mixed solvent of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 15 quality %.
(synthesizing of urethane acrylate)
While stirring 400 parts of weight-average molecular weight is that 800 polycaprolactone divalent alcohol, 131 parts of vinylformic acid-2-hydroxy propyl esters, 0.5 part of dibutyltin dilaurate as catalyzer, 1.0 parts of hydroquinone monomethyl ethers as stopper are heated to 50 ℃, mixes.Then, drip 222 parts of isophorone diisocyanates, further stir on one side,, carry out the urethane reaction Yi Bian be warming up to 80 ℃.After the reactivity of confirming NCO reached 99% or more, the reduction temperature of reaction obtained weight-average molecular weight and is 8500 urethane acrylate.
(making of electroconductive particle)
On the surface of polystyrene particle, be that the mode of 0.2 μ m is provided with by the formed layer of nickel with thickness, further on the surface of this formed layer, be that the mode of 0.04 μ m is provided with by the formed layer of gold with thickness by nickel.So carry out, making median size is the electroconductive particle of 5 μ m.
(synthesizing of phenoxy resin)
The phenolic compound (4 that has the fluorenes ring structure by bisphenol A type epoxy resin and intramolecularly; 4 '-(9-fluorylidene)-phenylbenzene (Off エ 21 Le)); Synthetic weight-average molecular weight is 45000 phenoxy resin; And with this resin dissolves in the mixing solutions of toluene/ethyl acetate=50/50 by quality ratio, forming solids component is the solution of 40 quality %.
Then, embodiment and comparative example are described.
(embodiment 1～9, comparative example 1～2)
With solids component mass ratio separately; According to the ratio shown in the table 2; Cooperate the acrylic rubber shown in the table 2, above-mentioned urethane acrylate, above-mentioned phenoxy resin, (common prosperity society chemistry is made as two (2-methacryloxyethyl) acid phosphoric acid ester of SULPHOSUCCINIC ACID ESTER; Trade(brand)name P-2M), (NOF Corp makes as uncle's hexyl peroxo--2-ethylhexanoate of radical polymerization initiator; Trade(brand)name Percure HO (パ one キ ユ ア HO)), make adhesive composite and contain liquid.Then, be benchmark with the TV of solids component in the adhesive composite, 3 volume % electroconductive particles are dispersed in this adhesive composite contain in the liquid, modulation circuit connects material and contains liquid.
This circuit connection material is contained liquid at 25 ℃, 60%RH environment held after 1 hour; Using apparatus for coating that it is coated on the thickness that has simultaneously carried out surface treatment (demoulding processing) is on polyethylene terephthalate (PET) film of 50 μ m; And, obtain that thickness is the membranaceous circuit connection material of 16 μ m on the PET film 70 ℃ of following warm air dryings 3 minutes.At this moment, confirm on film, to have or not the generation foreign matter through resin isolation.Here; With the situation of not observing foreign matter on the film fully as " A "; With observing a part of foreign matter on the film surface, but for the situation that can not connect the degree that cause obstruction to circuit as " B ", film surface integral body has all been produced foreign matter; And can not be used for the situation conduct " C " that circuit connects, carry out the evaluation of consistency.The evaluation result of consistency, as shown in table 3.
Table 2
Then; In above-mentioned membranaceous circuit connection material; The consistency evaluation result is the material of A or B; (thickness is 1.1mm, and surface resistivity is 20 Ω/), is 2 samples of each transfer printing under 70 ℃, 1MPa, the condition in 2 seconds in temperature with respect to having formed the glass that thickness is Indium sesquioxide (ITO) thin layer of 0.2 μ m.
Then; Use thermo-compression bonding device (type of heating: permanent pattern of fever; Toray Engineering Co., Ltd. makes); Under 70 ℃ temperature, with 1Mpa, the heating and pressurizing in 1 second, the flexible PCB (FPC) that will have 500 live widths and be 25 μ m, spacing and be 50 μ m, thickness and be the copper circuit of 18 μ m carries out working fastening with respect to each sample.Then; For 1 sample in 2 samples; Under 190 ℃ temperature, carry out 3Mpa, the heating and pressurizing in 15 seconds (the formal connection), making width is the cured article connection FPC substrate that passes through membranaceous circuit connection material of 2mm and the circuit connection structure of ito substrate.
(mensuration that connects resistance)
To the circuit connection structure of gained, with multitester measuring in abutting connection with the resistance value between circuit (connection resistance).Resistance value by in abutting connection with between circuit 37 resistance average and obtain.The resistance value of gained is connected resistance as the initial stage, and be shown in table 3.
In addition, with the circuit connection structure of gained, after 250 hours, measure in abutting connection with the resistance value between circuit (connection resistance) equally at 85 ℃, 85%RH environment held.Resistance value by in abutting connection with between circuit 37 resistance average and obtain.The resistance value of gained is connected resistance as hot and humid maintenance, and be shown in table 3.
(mensuration of working fastening power and bonding force)
For the sample of FPC working fastening,, use 90 degree to peel off method and estimate bonding strength (working fastening power) according to JIS-Z0237.In addition, for the formal sample that connects of FPC,, use 90 degree to peel off method and estimate bonding strength (bonding force) equally according to JIS-Z0237.Here, the determinator of working fastening power and bonding force, the Tensilon UTM-4 (peeling rate is 50mm/min, 25 ℃) that uses Japan Baldwin Co., Ltd. to make.The working fastening power and the bonding force of gained are shown in table 3.
Table 3
Can know by the result shown in the table 3; Even the membranaceous circuit connection material of gained is under 70 ℃, 1MPa, the working fastening condition in 1 second among the embodiment 1～9; Also can obtain the above sufficient working fastening power of 290mN/cm; And after formal the connection, also can obtain the above high bonding force of 7N/cm.On the other hand, in the poor comparative example 1 of the structural unit that comes from vinyl cyanide, the bonding force after fully formally not connected.In addition, in the many comparative examples 2 of the content of the structural unit that comes from vinyl cyanide, consistency is poor, when coated film, produces foreign matter, is difficult to use in circuit and connects.Further, second-order transition temperature is that the working fastening power of embodiment 1～7 of-30～20 ℃ of scopes is excellent more in an embodiment, and connection reliability is also excellent more.
Claims (18)
1. adhesive composite, it contains and has acrylic rubber, carbamate (methyl) propenoate and the radical polymerization initiator that 5～18 quality % come from the structural unit of vinyl cyanide.
2. adhesive composite as claimed in claim 1, the second-order transition temperature of wherein said acrylic rubber are-30～20 ℃ scope.
3. adhesive composite as claimed in claim 1, it further contains electroconductive particle.
4. adhesive composite as claimed in claim 1, wherein said acrylic rubber have (methyl) propenoate of vinyl cyanide, (methyl) alkyl acrylate and polar functionalities as monomeric unit.
5. adhesive composite as claimed in claim 1, the weight-average molecular weight of wherein said carbamate (methyl) propenoate is 5000～30000.
6. adhesive composite as claimed in claim 1, wherein the total amount with said acrylic rubber, said carbamate (methyl) propenoate and said radical polymerization initiator is a benchmark, the content of said acrylic rubber is 1.5～30 quality %.
7. adhesive composite as claimed in claim 1; Wherein the total amount with said acrylic rubber, said carbamate (methyl) propenoate and said radical polymerization initiator is a benchmark, and the content of said carbamate (methyl) propenoate is 5～80 quality %.
8. adhesive composite as claimed in claim 1; Wherein the total amount with said acrylic rubber, said carbamate (methyl) propenoate and said radical polymerization initiator is a benchmark, and the content of said radical polymerization initiator is 0.1～30 quality %.
9. one kind is shaped to the membranaceous membranaceous circuit connection material that forms with each described adhesive composite of claim 1～8.
10. circuit connection structure, it has
The pair of electrical circuit unit of subtend configuration and
Be arranged between the said pair of electrical circuit unit, bonding circuit block each other, thereby the interconnecting piece that the circuit electrode that said pair of electrical circuit unit is had separately is electrically connected to each other;
Said interconnecting piece contains the cured article of each described adhesive composite of claim 1～8.
11. the method for manufacture of a circuit connection structure, it has
Make each described adhesive composite of claim 1～8 between first circuit block with have between the second circuit parts of second circuit electrode with first circuit electrode; And with said first circuit electrode and said second circuit electrode relatively to mode with the working fastening operation of said first circuit block and the working fastening of said second circuit parts and
To said first circuit block and the said second circuit parts heating and pressurizing of working fastening, said adhesive composite is solidified, and the connection operation that said first circuit electrode is connected with said second circuit electrode electricity.
12. a semiconductor device, it has
Semiconductor element,
Carry said semiconductor element substrate and
Be arranged between said semiconductor element and the said substrate bonding said semiconductor element and said substrate, thereby the interconnecting piece that said semiconductor element and said substrate are electrically connected;
Said interconnecting piece contains the cured article of each described adhesive composite of claim 1～8.
13. the method for manufacture of a semiconductor device, it has
Make each described adhesive composite of claim 1～8 between semiconductor element and substrate, and make said semiconductor element be temporarily fixed on the said substrate the working fastening operation and
To said semiconductor element and said substrate heating and pressurizing, said adhesive composite is solidified, and make the operation that is connected of said semiconductor element and the electrical connection of said substrate.
14. a solar cell module, it has
The solar battery cell that electrode is arranged,
Distribution component and
Bonding said solar battery cell and said distribution component are so that the interconnecting piece that said electrode and said distribution component are electrically connected;
Said interconnecting piece contains the cured article of each described adhesive composite of claim 1～8.
15. the method for manufacture of a solar cell module, it has
Make each described adhesive composite of claim 1～8 between solar battery cell with electrode and distribution component, and make said distribution component be temporarily fixed at the working fastening operation on the said solar battery cell,
With said solar battery cell and said distribution component are carried out heating and pressurizing, said adhesive composite is solidified, and makes the operation that is connected that said solar battery cell and said distribution component be electrically connected.
Has the compsn of acrylic rubber, carbamate (methyl) propenoate and radical polymerization initiator that 5～18 quality % come from the structural unit of vinyl cyanide as the purposes of caking agent 16. contain.
17. contain and have the compsn that 5～18 quality % come from acrylic rubber, carbamate (methyl) propenoate and the radical polymerization initiator of the structural unit of vinyl cyanide; As being used for bonding circuit block each other, thus the purposes of the circuit connection material that the circuit electrode that this pair of electrical circuit unit is had separately is electrically connected to each other.
Has the compsn that 5～18 quality % come from acrylic rubber, carbamate (methyl) propenoate and the radical polymerization initiator of the structural unit of vinyl cyanide 18. contain, as the purposes that is used for the circuit connection material of semiconductor element and substrate electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510144456.XA CN104867896B (en) | 2010-07-20 | 2011-07-20 | Circuit connection structure, semiconductor device, solar cell module and their manufacturing method and application |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-163195 | 2010-07-20 | ||
| JP2010163195 | 2010-07-20 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510144456.XA Division CN104867896B (en) | 2010-07-20 | 2011-07-20 | Circuit connection structure, semiconductor device, solar cell module and their manufacturing method and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102399526A true CN102399526A (en) | 2012-04-04 |
Family
ID=45834779
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510144456.XA Active CN104867896B (en) | 2010-07-20 | 2011-07-20 | Circuit connection structure, semiconductor device, solar cell module and their manufacturing method and application |
| CN2011102080651A Pending CN102399526A (en) | 2010-07-20 | 2011-07-20 | Adhesive composition, circuit connection structure, semiconductor device, and solar cell module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510144456.XA Active CN104867896B (en) | 2010-07-20 | 2011-07-20 | Circuit connection structure, semiconductor device, solar cell module and their manufacturing method and application |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5293779B2 (en) |
| KR (1) | KR101379152B1 (en) |
| CN (2) | CN104867896B (en) |
| TW (1) | TWI456016B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112126004A (en) * | 2019-06-25 | 2020-12-25 | 玮锋科技股份有限公司 | Low glass transition temperature composites |
| CN113613892A (en) * | 2019-03-13 | 2021-11-05 | 昭和电工材料株式会社 | Adhesive film for circuit connection and method for manufacturing same, method for manufacturing circuit connection structure, and adhesive film housing set |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150005516A (en) * | 2012-04-25 | 2015-01-14 | 히타치가세이가부시끼가이샤 | Circuit connection material, circuit connection structure, adhesive film, and wound body |
| JP6180159B2 (en) * | 2013-04-04 | 2017-08-16 | デクセリアルズ株式会社 | Anisotropic conductive film, connection method, and joined body |
| JP6231394B2 (en) * | 2014-02-03 | 2017-11-15 | デクセリアルズ株式会社 | Method for measuring reaction rate of acrylic adhesive and acrylic adhesive |
| KR102315050B1 (en) * | 2020-04-07 | 2021-10-21 | 대주전자재료 주식회사 | Reworkable conductive adhesive and solar cell module |
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| CN101689410A (en) * | 2007-08-02 | 2010-03-31 | 日立化成工业株式会社 | Circuit connection material, the syndeton of circuit member of using it and the method for attachment of circuit member |
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| JP2005320455A (en) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device |
| JP5236144B2 (en) * | 2004-08-09 | 2013-07-17 | 日立化成株式会社 | Adhesive composition, circuit connection structure, and semiconductor device |
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| JP5067927B2 (en) * | 2007-03-27 | 2012-11-07 | 日東電工株式会社 | Adhesive film for semiconductor device manufacturing |
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- 2011-07-15 JP JP2011156667A patent/JP5293779B2/en not_active Expired - Fee Related
- 2011-07-19 TW TW100125451A patent/TWI456016B/en not_active IP Right Cessation
- 2011-07-20 KR KR1020110071879A patent/KR101379152B1/en active IP Right Grant
- 2011-07-20 CN CN201510144456.XA patent/CN104867896B/en active Active
- 2011-07-20 CN CN2011102080651A patent/CN102399526A/en active Pending
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| CN113613892A (en) * | 2019-03-13 | 2021-11-05 | 昭和电工材料株式会社 | Adhesive film for circuit connection and method for manufacturing same, method for manufacturing circuit connection structure, and adhesive film housing set |
| CN112126004A (en) * | 2019-06-25 | 2020-12-25 | 玮锋科技股份有限公司 | Low glass transition temperature composites |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104867896A (en) | 2015-08-26 |
| KR101379152B1 (en) | 2014-03-31 |
| TWI456016B (en) | 2014-10-11 |
| KR20120010169A (en) | 2012-02-02 |
| TW201209119A (en) | 2012-03-01 |
| JP2012041525A (en) | 2012-03-01 |
| CN104867896B (en) | 2018-07-03 |
| JP5293779B2 (en) | 2013-09-18 |
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Application publication date: 20120404 |