CN102385461A - Projecting capacitor type touch panel and manufacture method thereof - Google Patents
Projecting capacitor type touch panel and manufacture method thereof Download PDFInfo
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- CN102385461A CN102385461A CN2010102683404A CN201010268340A CN102385461A CN 102385461 A CN102385461 A CN 102385461A CN 2010102683404 A CN2010102683404 A CN 2010102683404A CN 201010268340 A CN201010268340 A CN 201010268340A CN 102385461 A CN102385461 A CN 102385461A
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Abstract
The invention provides a projecting capacitor type touch panel and a manufacture method thereof. The method comprises the following steps: A providing a substrate; B forming a conductive layer on a first surface of the substrate, the conductive layer is provided with a first image, a second image and the third image; and C a conductive bridge connecting piece is formed on the third image conductive layer, and the first image and the second image are electrically connected through the conductive bridge connecting piece.
Description
Technical field
The invention relates to a kind of contact panel and manufacturing approach thereof, particularly about a kind of projected capacitive touch panel and manufacturing approach thereof.
Background technology
Projected capacitive touch panel (Projected Capacitive Touch Panel) is to be the basis with traditional capacitance type touch-control panel, increases by two groups of transparent leads that are present in Different Plane and are perpendicular to one another (X, Y) and drive wire again and constitutes.Related art is removed and can be consulted following record and also can consult the TaiWan, China application for a patent for invention case of being applied for before the applicant No. 098122986.
See also Fig. 1, it is the manufacturing flow chart of the present projected capacitive touch panel that uses.Should comprise the following steps: by existing manufacturing process 100
(step 101): the substrate with single face indium tin oxide (ITO) is provided.
(step 102): utilize that photoresist (A) is coated with, makes public on this ITO layer, processing such as development, etching and stripping, use the Y axle patterned layer (containing the Y axis channel) that on glass baseplate, forms as first conductive layer.It should be noted that and in this step, used the first road light shield.
(step 103): utilize processing such as photoresist (B) is coated with, makes public, develops, bakes admittedly on first conductive layer, use formation as X axle channel and Y axle channel intersection point insulation course (dielectric film).It should be noted that and in this step, used the second road light shield.
(step 104,105): sputter one ITO layer is on insulation course; Utilize subsequently that photoresist (A) is coated with, makes public, processing such as roasting, development and stripping in advance on the ITO layer, use the X axle patterned layer (contain X axle channel) and Y axle patterned layer of formation as second conductive layer.It should be noted that and in this step, used the 3rd road light shield.
(step 106): sputter one metal level, utilize that photoresist (A) is coated with, makes public on this metal level, processing such as development, etching and stripping, use forming a plain conductor (Metal-trace) layer.It should be noted that and in this step, used the 4th road light shield.
(step 107): the sputter one ITO layer at the back side of this substrate, as the screen layer that intercepts electromagnetic interference (EMI).At last, formed projected capacitive touch panel is carried out processing such as wireline inspection, sliver, to make finished product.
See also Fig. 2, it is and the corresponding layering synoptic diagram of the projected capacitive touch panel manufacturing process of Fig. 1.Below cooperate and consult Fig. 1 and the layering synoptic diagram of key diagram 2.In Fig. 2, the layering 200 of projected capacitive touch panel is substrate 201, first conductive layer 202, insulation course 203, second conductive layer 204, metal carbonyl conducting layer 205, top coat 206 in regular turn, and protective seam 207 is positioned at the downside of this substrate 201.
See also Fig. 3 (a)-(h), it is the projected capacitive touch panel structural drawing with corresponding first preferred embodiment of Fig. 1.Below cooperate and consult Fig. 1 and the structural drawing of key diagram 3 (a)-(g).At Fig. 3 (a) and (b), first conductive layer 302 (Y axis channel) is formed on the base material 301, and material is ITO.At Fig. 3 (c) and (d); The intersection point insulation course 303 of X axle channel and Y axle channel is formed in the middle of the Y axis channel of this first conductive layer 302 partly and on the part of this substrate 301; And observe from G-G ' section, this insulation course 303 is to cover on this first conductive layer 302.In Fig. 3 (e); Second conductive layer 304 (comprising X axle channel, X axle pattern and Y axle pattern) is formed on base material 301, first conductive layer 302 and the dielectric film 303; And material is ITO; Wherein X axle channel connects X axle pattern, and the Y axle channel of this first conductive layer 302 connects Y axle pattern, and this insulation course 303 is with X axle channel and Y axle channel isolation.At Fig. 3 (f) and (g), H-H ' section and I-I ' cross sectional illustration second conductive layer 304 be divided into and have first partly 3041 and have second part 3042 of Y axle pattern of X axle channel and X axle pattern.Observe from H-H ' section, insulation course 303 covers first conductive layer 302, has first of X axle channel and X axle pattern and partly 3041 covers insulation course 303.Observe from I-I ' section, insulation course 303 covers the center section of first conductive layer 302, and first conductive layer 302 is electrically connected second part 3042 with Y axle pattern.
The existing processing of above-mentioned projected capacitive touch panel has disadvantage:
(1) development cost height and processing yield are low: need four road light shields by glass substrate (Glass) to accomplishing inductor (Sensor) finished product, cause development cost to improve and the reduction of processing yield.
(2) reduce Sensor sensitivity: cause end line resistance to improve because of adopting ITO bridge formation (Bridge), reduce the sensitivity of Sensor induction.
(3) surperficial ITO circuit maybe short circuit and opened circuit: glass substrate chip Workflow is dissipated to the ITO surface during because of the glass substrate cutting splitting, causes the problem of ITO line short and broken string.
(4) aluminium alloy (Alnd) wire influence end line resistance value: because of with Alnd as plain conductor, and the Alnd material is subject to ambient moisture influence and oxidation, so make the high easy end line resistance value that influences of Alnd lead resistance qualitative change.
Based on foregoing, the applicant through concentrated inference and research, visualizes this case " projected capacitive touch panel and manufacturing approach thereof " in view of the disappearance that is produced in the prior art, can overcome above-mentioned shortcoming, below is the brief description of this case.
Summary of the invention
According to above-mentioned conception, a kind of projected capacitive touch panel that this case proposes comprises: a substrate has one first and one second; One conductive layer is configured in this first and have one first pattern, one second pattern and one the 3rd pattern; One insulation course is formed on the part of some and this conductive layer of this substrate; One metal is built bridge, and is configured in the central online of this insulation course, and in order to be electrically connected this first pattern and this second pattern; One protective seam is configured on this second of this substrate; One top coat is configured on this insulation course, and covers the metal bridge formation; And a peelable glue-line, be configured on this top coat.
Preferably, above-mentioned contact panel proposed by the invention, wherein the material of this substrate is a glass.
Preferably, above-mentioned contact panel proposed by the invention, wherein the material of this insulation course is a photoresistance type insulating material.
Preferably, above-mentioned contact panel proposed by the invention, wherein the material of this conductive layer and this protective seam is indium tin oxide (ITO).
Preferably; Above-mentioned contact panel proposed by the invention; Wherein this first pattern and this second pattern are argyle design and arrange along the X axle; And the 3rd pattern is one to have the Y axle argyle design of Y axle channel, and this first pattern and this second pattern and the 3rd pattern are each other with the complimentary fashion configuration, and this first pattern, this second pattern and the 3rd pattern are arranged with the array mode.
Preferably, above-mentioned contact panel proposed by the invention also comprises a metal and builds bridge and plain conductor, and wherein this metal is built bridge and is electrically connected this first pattern and this second pattern.
Preferably, above-mentioned contact panel proposed by the invention, wherein this metal bridge formation is a molybdenum aluminium molybdenum alloy (Mo-Al-Mo) with the material of this plain conductor.
Preferably, above-mentioned contact panel proposed by the invention, wherein the material of this top coat is silicon dioxide (SiO
2) material.
Preferably, above-mentioned contact panel proposed by the invention, wherein the material of this peelable glue-line is epoxy resin (Epoxy).
According to above-mentioned conception, this case reintroduces a kind of manufacturing approach of projected capacitive touch panel, comprises the following steps: that (A) provides a substrate; (B) on one first of this substrate, form a conductive layer, this conductive layer has one first figure, a second graph and one the 3rd figure; And (C) on the 3rd patterned conductive layer, form a conducting bridge fitting, make via this conducting bridge fitting and be electrically connected this first figure and this second graph to isolate with the 3rd figure.
Preferably, above-mentioned manufacturing approach proposed by the invention, wherein step (C) also comprises afterwards: (D) on this conductive layer, form an insulation course; (E) on the ITO protective seam of second of this substrate, form a photoresist layer; (F) form a silicon dioxide (SiO
2) material layer, and impose ultraviolet ray (UV) it is solidified; (G) form an epoxy resin (Epoxy) layer, and impose ultraviolet ray (UV) it is solidified to be made into a peelable glue-line; (H) this projected capacitive touch panel is carried out electric circuit inspection; (I) cut this projected capacitive touch panel; And (J) protective glasses (Cover lens) are preceding to remove peelable glue-line pasting.
Preferably, above-mentioned manufacturing approach proposed by the invention, wherein step (A) also comprises: (A1) provide have one first with one second a indium tin oxide (ITO) substrate.
Preferably, above-mentioned manufacturing approach proposed by the invention, wherein step (B) also comprises: (B1) coating one photoresist layer on this first, and to implementing the processing of one first exposure imaging on this photoresist layer; And (B2) implement one first etch processes and one first stripping and handle this first face is processed this conductive layer, wherein this first figure and this second graph are a lozenge diagram, the 3rd pattern is one to have the Y axle argyle design of Y axle channel.
Preferably, above-mentioned manufacturing approach proposed by the invention, wherein step (D) also comprises: (D1) coating one insulating material on this conductive layer, and on this insulating material, carry out one second exposure imaging and handle and process this insulation course; And (D2) to this insulation course implement one solid roasting handle make this insulation course more driving fit on this conductive layer.
Description of drawings
Fig. 1 is the manufacturing flow chart of existing projected capacitive touch panel phase;
Fig. 2 is and the corresponding layering synoptic diagram of the projected capacitive touch panel manufacturing process of Fig. 1;
Fig. 3 (a) reaches (b) for being formed on first conductive layer 302 (Y axis channel) on the base material 301;
It is the structural drawing of the intersection point insulation course 303 of X axle channel and Y axle channel that Fig. 3 (c) reaches (d), and observes from G-G ' section, and this insulation course 303 is to cover on this first conductive layer 302;
Fig. 3 (e) is second conductive layer 304 structural drawing of (comprising X axle channel, X axle pattern and Y axle pattern), and wherein X axle channel connects X axle pattern, and the Y axle channel of this first conductive layer 302 connects Y axle pattern, and this insulation course 303 is with X axle channel and Y axle channel isolation;
It is the structural drawing of H-H ' section and I-I ' section that Fig. 3 (f) reaches (g), has explained that second conductive layer 304 is divided into first part 3041 with X axle channel and X axle pattern and second part 3042 with Y axle pattern;
Fig. 4 is the manufacturing approach process flow diagram of the projected capacitive touch panel that this case proposed;
Fig. 5 is and the corresponding layering synoptic diagram of the projected capacitive touch panel manufacturing approach of Fig. 4;
It is the structural drawing and the sectional view of first figure, second graph and the 3rd figure that Fig. 6 (a) reaches (b);
It (d) is that intersection point insulation course (dielectric film) forms figure that Fig. 6 (c) reaches, and observes from G-G ' section, and this insulation course 603 is to cover to reach on this substrate 601 on this conductive layer 602;
Fig. 6 (e) builds bridge for metal and forms figure, and wherein insulation course 603 is built bridge this metal and separated with the 3rd patterned conductive layer;
Fig. 6 (f), (g) and (h) be the intersection point design drawing of X axle and Y axle, wherein H-H ' section and I-I ' cross sectional illustration how to design the part of X axle and the overlapping of Y axle.
Embodiment
For letting the object of the invention, characteristic and the effect can be obviously understandable, enumerate preferred embodiment especially, and conjunction with figs., elaborate as follows:
See also Fig. 4, it is the process flow diagram of the manufacturing approach of the projected capacitive touch panel that this case proposed.This manufacturing approach 400 comprises the following steps:
(step 401): provide have one first with one second a indium tin oxide (ITO) substrate, the material of this substrate is preferably glass material.
(step 402): coating one photoresist (A) forms one first photoresist layer on this first, and this photoresist layer is implemented one first exposure imaging handle; And coating one photoresist (A) forms one second photoresist layer on this second, to protect this ITO layer.
(step 403): on this first of this substrate, develop, processing such as etching and stripping, use forming conductive layer with one of one first figure, a second graph and one the 3rd figure.It should be noted that and in this step, used the first road light shield.
(step 404): coating one insulating material (B) on this conductive layer, and on this insulating material, carry out one second exposure imaging and handle to form an intersection point dielectric film, again with one solid roasting handle make this insulation course more driving fit on this conductive layer.It should be noted that and in this step, used the second road light shield.
(step 405): sputter one metal level, utilize that a photoresist (C) is coated with, makes public on this metal level, processing such as development, etching and stripping, use forming a metal and build bridge and plain conductor.It should be noted that and in this step, used the 3rd road light shield.
(step 406): on this metal bridge formation and plain conductor, utilize silicon dioxide (SiO
2) material prints, ultraviolet ray (UV) is solidified, and is coated with (Top Coating, TC) layer and form the top of insulating.
(step 407): on this top coat, print, ultraviolet ray (UV) solidifies, and form a peelable glue-line.At last, formed projected capacitive touch panel is carried out processing such as wireline inspection, sliver, cutting, and protective glasses (Cover lens) are preceding to remove peelable glue-line to make finished product pasting.
See also Fig. 5, it is and the corresponding layering synoptic diagram of the manufacturing approach of projected capacitive touch panel shown in Figure 4.Below cooperate and consult Fig. 4 and the layering synoptic diagram of key diagram 5.In Fig. 5, the layering 500 of projected capacitive touch panel is that substrate 501, conductive layer 502, insulation course 503, metal are built bridge and plain conductor 504, top coat 505, peelable glue-line 506 in regular turn, and protective seam 507 is positioned on second of this substrate 501.
See also Fig. 6 (a)-(h), it is the projected capacitive touch panel structural drawing with the corresponding preferred embodiment of Fig. 4.Below cooperate and consult Fig. 4 and the structural drawing of key diagram 6 (a)-(h).At Fig. 6 (a) and (b); Promptly one first figure, a second graph and one the 3rd figure form figure; Conductive layer 602 is formed on the base material 601, and wherein this conductive layer 602 is one first figure, a second graph and one the 3rd figure, and material is preferably indium tin oxide (ITO).In this embodiment; First and second figure is restricted to axial two lozenge diagrams of x of Fig. 6 (a); The 3rd figure is restricted to the axial dumbbell shaped figure of y; Yet the technician in present technique field can be not limited to aforementioned name to the figure or the pattern name or the qualification arbitrarily of conductive layer.At Fig. 6 (c) and (d), promptly intersection point insulation course (dielectric film) forms figure, and intersection point insulation course 603 is formed on this conductive layer 602, and observes from G-G ' section, and this insulation course 603 is on this conductive layer 602 of covering and on this substrate 601.In Fig. 6 (e); Be metal bridge formation formation figure; This metal bridge formation 604 is formed on this conductive layer 602 and this dielectric film 603; And this metal 604 materials of building bridge are preferably molybdenum aluminium molybdenum alloy (Mo-Al-Mo), and so this insulation course 603 is built bridge this metal and separated to reach insulation effect with the 3rd patterned conductive layer.In Fig. 6 (f), (g) reach (h); It is the intersection point design drawing of X axle and Y axle; This H-H ' section and this I-I ' cross sectional illustration how to design the part that X axle and Y axle overlap, wherein this conductive layer 602 is divided into one first figure 6021 and second graph 6022 with lozenge diagram and one the 3rd figure 6023 with Y axle argyle design of Y axle channel.Observe from this I-I ' section, this insulation course 603 covers the Y axle channel strip of this conductive layer the 3rd pattern 6023, so that metal bridge formation 604 and these conductive layer the 3rd pattern 6023 mutually insulateds.Observe from this H-H ' section; This insulation course 603 covers the some of Y axle channel and this first pattern 6021 and this second pattern 6022 of the 3rd pattern 6023; This metal bridge formation 604 is electrically connected this first pattern 6021 and this second pattern 6022; And this insulation course 603 makes metal bridge formation 604 and these conductive layer the 3rd pattern 6023 mutually insulateds, and so this first pattern 6021, this second pattern 6022 and this metal bridge formation 604 will not have the electric leakage problem generation of the sensitivity decline that causes contact panel.The structure of the clear explaination preferred embodiment of above narration, make the art technology technician according to this tool with embodiment of the present invention.
In sum; This case has proposed a kind of projected capacitive touch panel and manufacturing approach thereof; Because X axle ITO patterned layer of the present invention, Y axle ITO channel are adopted plated film one time with Y axle ITO patterned layer; And be not that X axle ITO patterned layer, Y axle ITO channel are adopted plated film respectively twice with Y axle ITO patterned layer, thereby can make the film look consistent and be unlikely to have obvious argyle design to produce, and reduce extra plated film program.If directly use substrate again with ITO layer, can avoid causing plate the ITO processing second time that photoresist solidifies, so can make stripping more easy.Moreover, the present invention only on the Y axis channel (contain insulation course and metal build bridge) have outside three layers of overlapping, all the other are all single layer structure, thereby can reduce the obstruct of light and improve the surperficial transmitance of contact panel.Moreover the present invention adopts molybdenum aluminium molybdenum alloy to replace aluminium alloy and builds bridge and plain conductor as metal, reduces end line resistance value and loop resistance value.Moreover, not having short circuit problem for making first X axle and Y axle ITO patterned layer, the present invention can adopt the photoresistance insulating material of ability microetch to form insulation course, thereby can make the insulation course area tiny accurate with the position, and then improves the transmitance of contact panel.In addition, the present invention appends the peelable rete of one deck on insulation course, prevents that glass substrate glass substrate chip Workflow when cutting splitting is dissipated to the ITO surface, thereby can avoid the ITO line short or open circuit.In addition, for above-mentioned reasons, can make that also handling yield promotes greatly, so the present invention has patentability.
Above-described embodiment is merely explanation principle of the present invention and effect thereof, and unrestricted the present invention.Therefore, be familiar with the present technique field the technician can without prejudice to spirit of the present invention to modification and variation that the foregoing description carries out, all should be encompassed in the protection domain of the appended claim of the present invention.
Claims (10)
1. contact panel comprises:
One substrate has one first;
One conductive layer is configured in first of this substrate and has one first pattern and one second pattern;
One insulation course is configured on this conductive layer; And
One metal is built bridge, and is configured on this conductive layer and in order to be electrically connected this first pattern and this second pattern.
2. contact panel as claimed in claim 1 also comprises:
One protective seam is configured on one second of this substrate;
One top coat is configured on this insulation course; And
One peelable glue-line is configured on this top coat.
3. contact panel as claimed in claim 1, wherein the material of this substrate is a glass, and the material of this conductive layer and this protective seam is indium tin oxide (ITO), and the material of this insulation course is a photoresistance type insulating material, and the material of this top coat is silicon dioxide (SiO
2) material, the material of this peelable glue-line is an epoxy resin.
4. contact panel as claimed in claim 1; Wherein this first pattern and this second pattern are argyle design and arrange along the X axle; And this conductive layer also has one the 3rd pattern; The 3rd pattern is one to have the Y axle argyle design of Y axle channel, this first with this second pattern and the 3rd pattern each other with the complimentary fashion configuration, this first pattern, this second pattern and the 3rd pattern are arranged with the array mode.
5. contact panel as claimed in claim 1, wherein the dielectric coefficient of this metal bridge formation is less than the dielectric coefficient of these patterns, and the material that this metal is built bridge is a molybdenum aluminium molybdenum alloy (Mo-Al-Mo).
6. the manufacturing approach of a contact panel comprises:
(A) substrate is provided;
(B) on one first of this substrate, form a conductive layer, this conductive layer has one first figure and a second graph; And
(C) on this conductive layer, form a conducting bridge fitting, make via this conducting bridge fitting and be electrically connected this first figure and a second graph.
7. manufacturing approach as claimed in claim 6, wherein step (C) also comprises afterwards:
(D) on this conductive layer, form an insulation course;
(E) on indium tin oxide (ITO) protective seam of second of this substrate, form a photoresist layer;
(F) form a silicon dioxide (SiO
2) material layer, and impose ultraviolet ray (UV) it is solidified;
(G) form an epoxy resin layer, and impose ultraviolet ray (UV) it is solidified.
8. manufacturing approach as claimed in claim 6, wherein step (A) also comprises:
(A1) provide have one first with one second a indium tin oxide (ITO) substrate.
9. manufacturing approach as claimed in claim 6, wherein step (B) also comprises:
(B1) coating one photoresist layer on this first, and to implementing the processing of one first exposure imaging on this photoresist layer; And
(B2) implement one first etch processes and one first stripping and handle this first face is processed this conductive layer, wherein this first figure and this second graph are a lozenge diagram, and the 3rd pattern is one to have the Y axle argyle design of Y axle channel.
10. manufacturing approach as claimed in claim 7, wherein step (D) also comprises:
(D1) coating one insulating material on this conductive layer, and on this insulating material, carry out one second exposure imaging and handle and process this insulation course; And
(D2) to this insulation course implement one solid roasting handle make this insulation course more driving fit on this conductive layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102683404A CN102385461A (en) | 2010-08-30 | 2010-08-30 | Projecting capacitor type touch panel and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102683404A CN102385461A (en) | 2010-08-30 | 2010-08-30 | Projecting capacitor type touch panel and manufacture method thereof |
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Cited By (8)
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| CN102622154A (en) * | 2012-04-27 | 2012-08-01 | 福州华映视讯有限公司 | Capacitive touch panel |
| CN102693056A (en) * | 2012-05-25 | 2012-09-26 | 芜湖长信科技股份有限公司 | Capacitive touch screen and process for manufacturing same |
| CN105302400A (en) * | 2015-11-12 | 2016-02-03 | 昆山群安电子贸易有限公司 | Capacitive screen and manufacturing method thereof |
| CN105446564A (en) * | 2015-11-12 | 2016-03-30 | 昆山群安电子贸易有限公司 | Capacitive screen and manufacturing method therefor |
| CN106249950A (en) * | 2016-07-28 | 2016-12-21 | 京东方科技集团股份有限公司 | Touch-control display panel and display device |
| CN103412694B (en) * | 2013-07-18 | 2017-11-03 | 四川点燃科技有限公司 | Realize the method and capacitance plate of capacitance plate impedance reduction |
| CN108845701A (en) * | 2018-06-28 | 2018-11-20 | 京东方科技集团股份有限公司 | Touch panel and preparation method thereof, display device |
| CN109947293A (en) * | 2019-03-18 | 2019-06-28 | 信利光电股份有限公司 | A kind of production method and touch screen of touch screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102622154A (en) * | 2012-04-27 | 2012-08-01 | 福州华映视讯有限公司 | Capacitive touch panel |
| CN102622154B (en) * | 2012-04-27 | 2015-08-05 | 福州华映视讯有限公司 | Capacitance type touch-control panel |
| CN102693056A (en) * | 2012-05-25 | 2012-09-26 | 芜湖长信科技股份有限公司 | Capacitive touch screen and process for manufacturing same |
| CN103412694B (en) * | 2013-07-18 | 2017-11-03 | 四川点燃科技有限公司 | Realize the method and capacitance plate of capacitance plate impedance reduction |
| CN105302400A (en) * | 2015-11-12 | 2016-02-03 | 昆山群安电子贸易有限公司 | Capacitive screen and manufacturing method thereof |
| CN105446564A (en) * | 2015-11-12 | 2016-03-30 | 昆山群安电子贸易有限公司 | Capacitive screen and manufacturing method therefor |
| CN105302400B (en) * | 2015-11-12 | 2019-04-12 | 昆山群安电子贸易有限公司 | Capacitance plate and its manufacturing method |
| CN105446564B (en) * | 2015-11-12 | 2019-06-14 | 昆山群安电子贸易有限公司 | The manufacturing method of capacitance plate |
| CN106249950A (en) * | 2016-07-28 | 2016-12-21 | 京东方科技集团股份有限公司 | Touch-control display panel and display device |
| CN108845701A (en) * | 2018-06-28 | 2018-11-20 | 京东方科技集团股份有限公司 | Touch panel and preparation method thereof, display device |
| CN108845701B (en) * | 2018-06-28 | 2020-06-05 | 京东方科技集团股份有限公司 | Touch panel, manufacturing method thereof and display device |
| CN109947293A (en) * | 2019-03-18 | 2019-06-28 | 信利光电股份有限公司 | A kind of production method and touch screen of touch screen |
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Application publication date: 20120321 |