CN102385445A - Encapsulating structure of optical mouse chip - Google Patents
Encapsulating structure of optical mouse chip Download PDFInfo
- Publication number
- CN102385445A CN102385445A CN2011102916860A CN201110291686A CN102385445A CN 102385445 A CN102385445 A CN 102385445A CN 2011102916860 A CN2011102916860 A CN 2011102916860A CN 201110291686 A CN201110291686 A CN 201110291686A CN 102385445 A CN102385445 A CN 102385445A
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- China
- Prior art keywords
- chip
- glass cover
- plastic frame
- optical mouse
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses an encapsulating structure of an optical mouse chip, which comprises a plastic frame, base material, a chip and a light-transmission glass cover; the base material is fixed on the plastic frame; the chip is welded on the base material and the base material is connected with the anode and the cathode of the chip; the plastic frame is a concave structure having bumps at two sides and is provided with a light-transmission glass cover; the light-transmission glass cover is covered on the two base angles of the plastic frame and is fixed in sealing manner; and a sealed space formed by the light-transmission glass cover and the plastic frame is filled with inert gas. The encapsulating structure of the optical mouse chip has the advantages of simple and rational structure, compact and clever design. The light-transmission glass cover can transmit light rays and protect the internal chip, so that the service life of the encapsulating structure of the optical mouse chip is greatly prolonged. Therefore, the encapsulating structure of the optical mouse chip is worthy of wide application in the market.
Description
Technical field
The present invention relates to the Chip Packaging field, specially refer to a kind of chip-packaging structure of optical mouse.
Background technology
There is a light emitting diode optical mouse inside, through the light that it sends, can illuminate optical mouse lower surface (this is the always luminous reason in mouse bottom).After this, optical mouse behind one group of optical lens, is transferred to imaging in the photoinduction device (little imager) through a part of light of lower surface reflected back.Like this, when optical mouse moved, its motion track just can be registered as the coherent image of one group of high-speed capture, by an inner special image analysis chip (DSP, the i.e. digital microprocessor) analyzing and processing of optical mouse.This chip is judged mouse moving direction and displacement through the variation of characteristic point position on these images is analyzed, thereby accomplishes the location of cursor.
Application number is that 200820234861 patent application document discloses a kind of sensitization electricity mouse ic core chip package, comprises metal framework, chip, and said chip is fixed on the said metal framework; Has photo-sensitive cell on the said chip; Wherein, further comprise the frame of moulding of a lid and a two sides opening, said frame one open side of moulding is fixed on the inner chamber that forms the said chip of an encirclement on the said metal framework; Said cover cap is located at said moulding on another open side of frame; Have the light hole corresponding with said photo-sensitive cell on the said lid, be provided with an insulation transparent body in the said inner chamber, the said transparent body is overlying between said chip surface and the said light hole.
Summary of the invention
The technical matters that the present invention mainly solves provides a kind of chip-packaging structure of optical mouse, can solve the not enough problem of traditional optical mouse sealing.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of optical mouse chip encapsulating structure is provided, comprises plastic frame, base material, chip and transparent glass cover; Said base material is fixed on the said plastic frame; Be welded with chip on the base material and connect the both positive and negative polarity of chip; Said plastic frame is the protruding sunk structures in both sides; And being provided with a transparent glass cover, said transparent glass cover is covered in two base angles and the sealing and fixing of plastic frame, fills with inert gas in the seal cavity that transparent glass cover and plastic frame are formed.
In preferred embodiment of the present invention, said transparent glass cover is a semisphere.
In preferred embodiment of the present invention, the thermoplastic epoxy sealing is adopted in the junction of said transparent glass cover and plastic frame.
The invention has the beneficial effects as follows: the present invention is simple and reasonable, and is compact to design ingenious, and the transparent glass cover can conducting light, can protect inside chip again, has prolonged serviceable life of the present invention greatly, is worth mass market to be promoted.
Description of drawings
Fig. 1 is the structural representation of a kind of optical mouse chip encapsulating structure of the present invention.
Embodiment
As shown in Figure 1, the invention discloses a kind of optical mouse chip encapsulating structure, comprise plastic frame 110, base material 220, chip 210 and transparent glass cover 310; Said base material 220 is fixed on the said plastic frame 110; Be welded with chip 210 on the base material 220 and connect the both positive and negative polarity of chip 210; Said plastic frame 110 is the protruding sunk structures in both sides, and is provided with a transparent glass cover 310, and said transparent glass cover 310 is a semisphere; Be covered in two base angles of plastic frame 110 and adopt the thermoplastic epoxy sealing and fixing, fill with inert gas in the seal cavity that transparent glass cover 310 and plastic frame 110 are formed.
Beneficial effect of the present invention is: simple and reasonable, compact to design ingenious, the transparent glass cover can conducting light, can protect inside chip again, has prolonged serviceable life of the present invention greatly, is worth mass market to be promoted.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (3)
1. an optical mouse chip encapsulating structure is characterized in that, comprises plastic frame, base material, chip and transparent glass cover; Said base material is fixed on the said plastic frame; Be welded with chip on the base material and connect the both positive and negative polarity of chip; Said plastic frame is the protruding sunk structures in both sides; And being provided with a transparent glass cover, said transparent glass cover is covered in two base angles and the sealing and fixing of plastic frame, fills with inert gas in the seal cavity that transparent glass cover and plastic frame are formed.
2. a kind of optical mouse chip encapsulating structure according to claim 1 is characterized in that said transparent glass cover is a semisphere.
3. a kind of optical mouse chip encapsulating structure according to claim 1 is characterized in that, the thermoplastic epoxy sealing is adopted in the junction of said transparent glass cover and plastic frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102916860A CN102385445A (en) | 2011-09-30 | 2011-09-30 | Encapsulating structure of optical mouse chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102916860A CN102385445A (en) | 2011-09-30 | 2011-09-30 | Encapsulating structure of optical mouse chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102385445A true CN102385445A (en) | 2012-03-21 |
Family
ID=45824916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102916860A Pending CN102385445A (en) | 2011-09-30 | 2011-09-30 | Encapsulating structure of optical mouse chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102385445A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501460B1 (en) * | 2001-09-05 | 2002-12-31 | Samsung Electro-Mechanics Co., Ltd. | Light-receiving unit for optical mouse and optical mouse having the same |
| CN101477413A (en) * | 2008-07-01 | 2009-07-08 | 北京希格玛和芯微电子技术有限公司 | Optical mouse apparatus |
| CN201298553Y (en) * | 2008-12-09 | 2009-08-26 | 深圳市矽格半导体科技有限公司 | A package structure of an integrated circuit chip of an electronic mouse |
| CN201327632Y (en) * | 2008-12-24 | 2009-10-14 | 北京希格玛和芯微电子技术有限公司 | Optical mouse device |
| TW201115775A (en) * | 2009-10-19 | 2011-05-01 | Everlight Electronics Co Ltd | Light emitting diode package structure |
-
2011
- 2011-09-30 CN CN2011102916860A patent/CN102385445A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6501460B1 (en) * | 2001-09-05 | 2002-12-31 | Samsung Electro-Mechanics Co., Ltd. | Light-receiving unit for optical mouse and optical mouse having the same |
| CN101477413A (en) * | 2008-07-01 | 2009-07-08 | 北京希格玛和芯微电子技术有限公司 | Optical mouse apparatus |
| CN201298553Y (en) * | 2008-12-09 | 2009-08-26 | 深圳市矽格半导体科技有限公司 | A package structure of an integrated circuit chip of an electronic mouse |
| CN201327632Y (en) * | 2008-12-24 | 2009-10-14 | 北京希格玛和芯微电子技术有限公司 | Optical mouse device |
| TW201115775A (en) * | 2009-10-19 | 2011-05-01 | Everlight Electronics Co Ltd | Light emitting diode package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120321 |