CN102380931B - Mould for injection packaging process - Google Patents

Mould for injection packaging process Download PDF

Info

Publication number
CN102380931B
CN102380931B CN201110399686.2A CN201110399686A CN102380931B CN 102380931 B CN102380931 B CN 102380931B CN 201110399686 A CN201110399686 A CN 201110399686A CN 102380931 B CN102380931 B CN 102380931B
Authority
CN
China
Prior art keywords
mould
injection
die
base plate
patrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110399686.2A
Other languages
Chinese (zh)
Other versions
CN102380931A (en
Inventor
潘益军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RF360 Technology Wuxi Co Ltd
Original Assignee
Epcos Technology Wuxi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Technology Wuxi Co Ltd filed Critical Epcos Technology Wuxi Co Ltd
Priority to CN201110399686.2A priority Critical patent/CN102380931B/en
Publication of CN102380931A publication Critical patent/CN102380931A/en
Application granted granted Critical
Publication of CN102380931B publication Critical patent/CN102380931B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a mould for an injection packaging process. With the help of the mould, the problem that a product cannot be adhered to an injection port cross-section area on the product is avoided, the product yield is ensured and the production efficiency is promoted. The mould comprises an upper mould and a lower mould, wherein the upper mould is connected to an ejector rod; the lower mould is arranged on a base plate; the mould is characterized in that an upper mould body is in the shape of an inverted lug boss; the upper mould is buckled on a fixed block of a top base; the lower mould is of a split type and comprises a concave mould and an injection platform; a cavity is defined by the lug boss of the upper mould, the concave mould and the injection platform; the bottom end of the injection platform is connected with the base plate; the bottom end of the concave mould is connected with an adjusting screw rod; and the adjusting screw rod is mounted on the base plate.

Description

A kind of mould for injection packaging process
Technical field
The present invention relates to the device in the production technology of chip surface acoustic wave filter product, be applicable to the LTCC(LTCC of integration module) injection molding packaging operation a kind of device used of product, be specially a kind of mould for injection packaging process.
Background technology
Along with communication, the develop rapidly of the relevant industries such as electronics, the demand of surface acoustic wave product is increasing, also more and more fierce, the current LTCC product of competition simultaneously adopts transfer type mould note equipment to complete in injection molding packaging operation, see Fig. 1, in the middle of patrix 1 body, injection hole 2 is set, injection moulding bar is set above patrix 1, product is placed on the injection-molding surfaces platform of counterdie 4, the punch that counterdie 4 is as a whole, when matched moulds, bottom recesses 5 and the counterdie 4 of patrix 1 surround cavity 6, and in figure, 7 is spring.This mould structure, injected plastics material is to pour into by injection hole 2, be extruded on product by injection moulding bar 3 application of forces again, it causes on product, is positioned at injection hole 2 times, and size is that the transverse cross-sectional area (about φ 19mm) of an injection hole 2 can not mount product, thereby cause the yield of product to reduce, and because the interval size of cavity 6 is fixed, in the time need to producing the product of different-thickness, just need to change counterdie, cause production efficiency low.
Summary of the invention
The problem existing for prior art, the invention provides a kind of mould for injection packaging process, can avoid an injection hole transverse cross-sectional area on product can not mount product, guarantees product yield, enhances productivity.
Its technical scheme is such: it comprises upper die and lower die, described patrix connects push rod, described counterdie is arranged on base plate, it is characterized in that: described upper mould body is the shape of falling boss, described patrix spiral-lock is on the fixed block of top base, described counterdie adopts split type, it comprises die and injection-molding surfaces platform, the boss of described patrix, described die, described injection-molding surfaces platform surround cavity jointly, the bottom of described injection-molding surfaces platform connects described base plate, the bottom of described die connects adjusting screw mandrel, and described adjusting screw mandrel is arranged on described base plate.
It is further characterized in that: on described fixed block body, concave station is set, described patrix spiral-lock is on the table top of described concave station; Described die body is annular, the cavity that the centre of described annular die is upper and lower perforation, and described injection-molding surfaces platform is placed in described cavity, and the upper surface of described injection-molding surfaces platform is lower than the upper surface of described die; Described push rod symmetry is hanging connected in described patrix two avris; On described base plate both sides, hole is set, described adjusting screw mandrel runs through described Kong Houqi top and connects described die, and its bottom connects described base plate; The quantity of described adjusting screw mandrel is at least two.
After the present invention adopts said structure, cancel the injection hole on patrix, injected plastics material is put into product below in advance, so just avoid original structure injection hole transverse cross-sectional area on product can not mount the defect of product, guarantee the yield of product, and when matched moulds, the boss of patrix, the die of counterdie, injection-molding surfaces platform surrounds cavity jointly, due to the adjusting screw mandrel of the die bottom regulating action in short transverse, and the mating reaction of push rod, make the interval size of this cavity become capable of regulating, pressure while regulating screw mandrel to guarantee matched moulds, like this, in the time producing the product of different-thickness without changing counterdie, only need governor motor parameter, therefore improved production efficiency.
Accompanying drawing explanation
Fig. 1 is prior art structural representation;
Fig. 2 is structural representation of the present invention.
the specific embodiment:
See Fig. 2, the present invention includes patrix 1, counterdie 4, patrix 1 connects push rod 5, counterdie 4 is arranged on base plate 6, patrix 1 body is the shape of falling boss, arrange on fixed block 8 in top base 7, on fixed block 8 bodies, concave station 8-1 is set, patrix 1 spiral-lock is on the table top of concave station 8-1, counterdie 4 is split type, comprise die 2 and injection-molding surfaces platform 3, die 2 bodies are annular, the centre of annular die 2 is upper, the cavity of lower perforation, injection-molding surfaces platform 3 is placed in cavity, the upper surface of injection-molding surfaces platform 3 is lower than the upper surface of die 2, the boss of patrix 1 when matched moulds, die 2, injection-molding surfaces platform 3 surrounds cavity 9 jointly, the bottom of injection-molding surfaces platform 3 is installed on base plate 6, the bottom of die 2 is by regulating screw mandrel 10 to be connected with base plate 6, 11 is installing hole, regulate the quantity of screw mandrel 10 to be at least two, push rod 5 symmetries are hanging connected in 1 liang of avris of patrix.

Claims (2)

1. a mould for injection packaging process, it comprises upper die and lower die, described patrix connects push rod, described counterdie is arranged on base plate, it is characterized in that: described upper mould body is the shape of falling boss, described patrix spiral-lock is on the fixed block of top base, described counterdie adopts split type, it comprises die and injection-molding surfaces platform, the boss of described patrix, described die, described injection-molding surfaces platform surround cavity jointly, the bottom of described injection-molding surfaces platform connects described base plate, and the bottom of described die connects adjusting screw mandrel, and described adjusting screw mandrel is arranged on described base plate; Described die body is annular, the cavity that the centre of described annular die is upper and lower perforation, and described injection-molding surfaces platform is placed in described cavity, and the upper surface of described injection-molding surfaces platform is lower than the upper surface of described die; On described fixed block body, concave station is set, described patrix spiral-lock is on the table top of described concave station; Described push rod symmetry is hanging connected in described patrix two avris; On described base plate both sides, hole is set, described adjusting screw mandrel runs through described Kong Houqi top and connects described die, and its bottom connects described base plate.
2. a kind of mould for injection packaging process according to claim 1, is characterized in that: the quantity of described adjusting screw mandrel is at least two.
CN201110399686.2A 2011-12-06 2011-12-06 Mould for injection packaging process Active CN102380931B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110399686.2A CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110399686.2A CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Publications (2)

Publication Number Publication Date
CN102380931A CN102380931A (en) 2012-03-21
CN102380931B true CN102380931B (en) 2014-06-18

Family

ID=45820969

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110399686.2A Active CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Country Status (1)

Country Link
CN (1) CN102380931B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102023515B1 (en) * 2012-07-02 2019-09-20 빠르펭크리스티앙디오르 Method for manufacturing a cosmetic article having a decorative embossed and/or debossed surface
CN102801398B (en) * 2012-08-16 2014-11-05 爱普科斯科技(无锡)有限公司 Working platform of plate passive surface acoustic wave filter
CN106273170A (en) * 2016-08-23 2017-01-04 太仓市威士达电子有限公司 A kind of mould structure of integrated circuit plastic packaging shell
CN106881826B (en) * 2017-02-24 2022-11-11 日荣半导体(上海)有限公司 Packaging mold and injection molding method using same
EP3889481A4 (en) * 2018-11-30 2022-09-14 Zhejiang Sanhua Intelligent Controls CO., Ltd. Eletromagnetic coil, mold, and electromagnetic coil manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
JP2009126027A (en) * 2007-11-22 2009-06-11 Citizen Electronics Co Ltd Mold structure for injection molding of plastic
CN202357357U (en) * 2011-12-06 2012-08-01 爱普科斯科技(无锡)有限公司 Improved injection molding package process die

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153536B2 (en) * 2008-09-17 2013-02-27 Towa株式会社 Mold for semiconductor chip compression molding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
JP2009126027A (en) * 2007-11-22 2009-06-11 Citizen Electronics Co Ltd Mold structure for injection molding of plastic
CN202357357U (en) * 2011-12-06 2012-08-01 爱普科斯科技(无锡)有限公司 Improved injection molding package process die

Also Published As

Publication number Publication date
CN102380931A (en) 2012-03-21

Similar Documents

Publication Publication Date Title
CN102380931B (en) Mould for injection packaging process
CN204035303U (en) A kind of Furniture manufacturing tubing corner cut equipment
CN202357357U (en) Improved injection molding package process die
CN208980569U (en) A kind of molding die of chalcogenide glass aspherical lens
CN102463623A (en) Porcelain bushing press forming die
CN202343710U (en) Compound die mechanism for blanking and drawing
CN204622492U (en) A kind of movable insert formula of injection mold takes structure out of
CN201913779U (en) Front mold inclined ejection structure for injection mold
CN201848968U (en) Banana gate die
CN202169316U (en) Punching and forming integrated mould
CN202556684U (en) Injection mould
CN202316780U (en) Mold structure for punching and molding head part of worm of spiral clamping hoop
CN202241950U (en) Molding device for blow molding film into bubble cap
CN201451213U (en) Blowing device for candy demolding
CN202480336U (en) Mold with pre-broken structure
CN204585738U (en) A kind of injection mould for the production of bottle lid of cosmetics
CN220499783U (en) Silica gel seat forming die with one die and multiple cavities
CN204622506U (en) A kind of epoxy resin pressure gelation process air pressure ejection die
CN103331872B (en) Pressing ring injection mould
CN203317678U (en) Nozzle injection mould
CN203650839U (en) Structure enabling intra-mould injection moulding insert to be not adhered to front mould
CN209006508U (en) Foot one-pass molding stamping die inside and outside a kind of copper strips
CN202527658U (en) Engine water outlet pipe pouring die structure
CN203157207U (en) Modified structure of cup mold
CN202965189U (en) Hot press forming die

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 214028 Jiangsu city of Wuxi province Quxi Shi Wu New Road No. 17

Patentee after: Full spectrum radio frequency technology (Wuxi) Co., Ltd.

Address before: 214028, 2, Xindu Road, Wuxi Singapore Industrial Park, Wuxi New District, Jiangsu

Patentee before: EPCOS Technology (Wuxi) Co., Ltd.