CN102380931B - Mould for injection packaging process - Google Patents

Mould for injection packaging process Download PDF

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Publication number
CN102380931B
CN102380931B CN201110399686.2A CN201110399686A CN102380931B CN 102380931 B CN102380931 B CN 102380931B CN 201110399686 A CN201110399686 A CN 201110399686A CN 102380931 B CN102380931 B CN 102380931B
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China
Prior art keywords
mould
injection
die
base plate
patrix
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Application number
CN201110399686.2A
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Chinese (zh)
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CN102380931A (en
Inventor
潘益军
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RF360 Technology Wuxi Co Ltd
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Epcos Technology Wuxi Co Ltd
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Priority to CN201110399686.2A priority Critical patent/CN102380931B/en
Publication of CN102380931A publication Critical patent/CN102380931A/en
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Publication of CN102380931B publication Critical patent/CN102380931B/en
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Abstract

The invention provides a mould for an injection packaging process. With the help of the mould, the problem that a product cannot be adhered to an injection port cross-section area on the product is avoided, the product yield is ensured and the production efficiency is promoted. The mould comprises an upper mould and a lower mould, wherein the upper mould is connected to an ejector rod; the lower mould is arranged on a base plate; the mould is characterized in that an upper mould body is in the shape of an inverted lug boss; the upper mould is buckled on a fixed block of a top base; the lower mould is of a split type and comprises a concave mould and an injection platform; a cavity is defined by the lug boss of the upper mould, the concave mould and the injection platform; the bottom end of the injection platform is connected with the base plate; the bottom end of the concave mould is connected with an adjusting screw rod; and the adjusting screw rod is mounted on the base plate.

Description

A kind of mould for injection packaging process
Technical field
The present invention relates to the device in the production technology of chip surface acoustic wave filter product, be applicable to the LTCC(LTCC of integration module) injection molding packaging operation a kind of device used of product, be specially a kind of mould for injection packaging process.
Background technology
Along with communication, the develop rapidly of the relevant industries such as electronics, the demand of surface acoustic wave product is increasing, also more and more fierce, the current LTCC product of competition simultaneously adopts transfer type mould note equipment to complete in injection molding packaging operation, see Fig. 1, in the middle of patrix 1 body, injection hole 2 is set, injection moulding bar is set above patrix 1, product is placed on the injection-molding surfaces platform of counterdie 4, the punch that counterdie 4 is as a whole, when matched moulds, bottom recesses 5 and the counterdie 4 of patrix 1 surround cavity 6, and in figure, 7 is spring.This mould structure, injected plastics material is to pour into by injection hole 2, be extruded on product by injection moulding bar 3 application of forces again, it causes on product, is positioned at injection hole 2 times, and size is that the transverse cross-sectional area (about φ 19mm) of an injection hole 2 can not mount product, thereby cause the yield of product to reduce, and because the interval size of cavity 6 is fixed, in the time need to producing the product of different-thickness, just need to change counterdie, cause production efficiency low.
Summary of the invention
The problem existing for prior art, the invention provides a kind of mould for injection packaging process, can avoid an injection hole transverse cross-sectional area on product can not mount product, guarantees product yield, enhances productivity.
Its technical scheme is such: it comprises upper die and lower die, described patrix connects push rod, described counterdie is arranged on base plate, it is characterized in that: described upper mould body is the shape of falling boss, described patrix spiral-lock is on the fixed block of top base, described counterdie adopts split type, it comprises die and injection-molding surfaces platform, the boss of described patrix, described die, described injection-molding surfaces platform surround cavity jointly, the bottom of described injection-molding surfaces platform connects described base plate, the bottom of described die connects adjusting screw mandrel, and described adjusting screw mandrel is arranged on described base plate.
It is further characterized in that: on described fixed block body, concave station is set, described patrix spiral-lock is on the table top of described concave station; Described die body is annular, the cavity that the centre of described annular die is upper and lower perforation, and described injection-molding surfaces platform is placed in described cavity, and the upper surface of described injection-molding surfaces platform is lower than the upper surface of described die; Described push rod symmetry is hanging connected in described patrix two avris; On described base plate both sides, hole is set, described adjusting screw mandrel runs through described Kong Houqi top and connects described die, and its bottom connects described base plate; The quantity of described adjusting screw mandrel is at least two.
After the present invention adopts said structure, cancel the injection hole on patrix, injected plastics material is put into product below in advance, so just avoid original structure injection hole transverse cross-sectional area on product can not mount the defect of product, guarantee the yield of product, and when matched moulds, the boss of patrix, the die of counterdie, injection-molding surfaces platform surrounds cavity jointly, due to the adjusting screw mandrel of the die bottom regulating action in short transverse, and the mating reaction of push rod, make the interval size of this cavity become capable of regulating, pressure while regulating screw mandrel to guarantee matched moulds, like this, in the time producing the product of different-thickness without changing counterdie, only need governor motor parameter, therefore improved production efficiency.
Accompanying drawing explanation
Fig. 1 is prior art structural representation;
Fig. 2 is structural representation of the present invention.
the specific embodiment:
See Fig. 2, the present invention includes patrix 1, counterdie 4, patrix 1 connects push rod 5, counterdie 4 is arranged on base plate 6, patrix 1 body is the shape of falling boss, arrange on fixed block 8 in top base 7, on fixed block 8 bodies, concave station 8-1 is set, patrix 1 spiral-lock is on the table top of concave station 8-1, counterdie 4 is split type, comprise die 2 and injection-molding surfaces platform 3, die 2 bodies are annular, the centre of annular die 2 is upper, the cavity of lower perforation, injection-molding surfaces platform 3 is placed in cavity, the upper surface of injection-molding surfaces platform 3 is lower than the upper surface of die 2, the boss of patrix 1 when matched moulds, die 2, injection-molding surfaces platform 3 surrounds cavity 9 jointly, the bottom of injection-molding surfaces platform 3 is installed on base plate 6, the bottom of die 2 is by regulating screw mandrel 10 to be connected with base plate 6, 11 is installing hole, regulate the quantity of screw mandrel 10 to be at least two, push rod 5 symmetries are hanging connected in 1 liang of avris of patrix.

Claims (2)

1. a mould for injection packaging process, it comprises upper die and lower die, described patrix connects push rod, described counterdie is arranged on base plate, it is characterized in that: described upper mould body is the shape of falling boss, described patrix spiral-lock is on the fixed block of top base, described counterdie adopts split type, it comprises die and injection-molding surfaces platform, the boss of described patrix, described die, described injection-molding surfaces platform surround cavity jointly, the bottom of described injection-molding surfaces platform connects described base plate, and the bottom of described die connects adjusting screw mandrel, and described adjusting screw mandrel is arranged on described base plate; Described die body is annular, the cavity that the centre of described annular die is upper and lower perforation, and described injection-molding surfaces platform is placed in described cavity, and the upper surface of described injection-molding surfaces platform is lower than the upper surface of described die; On described fixed block body, concave station is set, described patrix spiral-lock is on the table top of described concave station; Described push rod symmetry is hanging connected in described patrix two avris; On described base plate both sides, hole is set, described adjusting screw mandrel runs through described Kong Houqi top and connects described die, and its bottom connects described base plate.
2. a kind of mould for injection packaging process according to claim 1, is characterized in that: the quantity of described adjusting screw mandrel is at least two.
CN201110399686.2A 2011-12-06 2011-12-06 Mould for injection packaging process Active CN102380931B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110399686.2A CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110399686.2A CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Publications (2)

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CN102380931A CN102380931A (en) 2012-03-21
CN102380931B true CN102380931B (en) 2014-06-18

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9844498B2 (en) 2012-07-02 2017-12-19 Parfums Christian Dior Method for manufacturing a cosmetic article having a decorative embossed and/or debossed surface
CN102801398B (en) * 2012-08-16 2014-11-05 爱普科斯科技(无锡)有限公司 Working platform of plate passive surface acoustic wave filter
CN106273170A (en) * 2016-08-23 2017-01-04 太仓市威士达电子有限公司 A kind of mould structure of integrated circuit plastic packaging shell
CN106881826A (en) * 2017-02-24 2017-06-23 日月光封装测试(上海)有限公司 Encapsulating mould and the injection moulding process using the encapsulating mould
WO2020108617A1 (en) * 2018-11-30 2020-06-04 浙江三花智能控制股份有限公司 Eletromagnetic coil, mold, and electromagnetic coil manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
JP2009126027A (en) * 2007-11-22 2009-06-11 Citizen Electronics Co Ltd Mold structure for injection molding of plastic
CN202357357U (en) * 2011-12-06 2012-08-01 爱普科斯科技(无锡)有限公司 Improved injection molding package process die

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153536B2 (en) * 2008-09-17 2013-02-27 Towa株式会社 Mold for semiconductor chip compression molding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
JP2009126027A (en) * 2007-11-22 2009-06-11 Citizen Electronics Co Ltd Mold structure for injection molding of plastic
CN202357357U (en) * 2011-12-06 2012-08-01 爱普科斯科技(无锡)有限公司 Improved injection molding package process die

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Address after: 214028 Jiangsu city of Wuxi province Quxi Shi Wu New Road No. 17

Patentee after: Full spectrum radio frequency technology (Wuxi) Co., Ltd.

Address before: 214028, 2, Xindu Road, Wuxi Singapore Industrial Park, Wuxi New District, Jiangsu

Patentee before: EPCOS Technology (Wuxi) Co., Ltd.