CN102380931A - Mould for injection packaging process - Google Patents

Mould for injection packaging process Download PDF

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Publication number
CN102380931A
CN102380931A CN2011103996862A CN201110399686A CN102380931A CN 102380931 A CN102380931 A CN 102380931A CN 2011103996862 A CN2011103996862 A CN 2011103996862A CN 201110399686 A CN201110399686 A CN 201110399686A CN 102380931 A CN102380931 A CN 102380931A
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CN
China
Prior art keywords
injection
die
mould
base plate
patrix
Prior art date
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Granted
Application number
CN2011103996862A
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Chinese (zh)
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CN102380931B (en
Inventor
潘益军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RF360 Technology Wuxi Co Ltd
Original Assignee
Epcos Technology Wuxi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Technology Wuxi Co Ltd filed Critical Epcos Technology Wuxi Co Ltd
Priority to CN201110399686.2A priority Critical patent/CN102380931B/en
Publication of CN102380931A publication Critical patent/CN102380931A/en
Application granted granted Critical
Publication of CN102380931B publication Critical patent/CN102380931B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention provides a mould for an injection packaging process. With the help of the mould, the problem that a product cannot be adhered to an injection port cross-section area on the product is avoided, the product yield is ensured and the production efficiency is promoted. The mould comprises an upper mould and a lower mould, wherein the upper mould is connected to an ejector rod; the lower mould is arranged on a base plate; the mould is characterized in that an upper mould body is in the shape of an inverted lug boss; the upper mould is buckled on a fixed block of a top base; the lower mould is of a split type and comprises a concave mould and an injection platform; a cavity is defined by the lug boss of the upper mould, the concave mould and the injection platform; the bottom end of the injection platform is connected with the base plate; the bottom end of the concave mould is connected with an adjusting screw rod; and the adjusting screw rod is mounted on the base plate.

Description

A kind of injection moulding packaging technology mould
 
Technical field
The present invention relates to the device in the production technology of chip surface acoustic wave filter product, be applicable to the used a kind of device of injection moulding packaging process of LTCC (LTCC) product of integration module, be specially a kind of injection moulding packaging technology mould.
Background technology
Along with communication, the develop rapidly of relevant industries such as electronics, the surface acoustic wave product demand is increasing, competes also more and more fierce simultaneously; Present LTCC product is to adopt transfer type mould notes equipment to accomplish on the injection moulding packaging process, sees Fig. 1, and injection hole 2 is set in the middle of patrix 1 body; The injection moulding bar is set above patrix 1, and product places on the injection-molding surfaces platform of counterdie 4, the punch that counterdie 4 is as a whole; During matched moulds, the bottom recesses 5 and the counterdie 4 of patrix 1 surround cavity 6, and 7 is spring among the figure.This mould structure, injected plastics material are to pour into through injection hole 2, are extruded on product by injection moulding bar 3 application of forces again; It causes on product, is positioned at injection hole 2 times, and size is that the transverse cross-sectional area (about φ 19mm) of an injection hole 2 can not mount product; Thereby cause the yield of product to reduce; And because the interval size of cavity 6 is fixed, when needs are produced the product of different-thickness, just need to change counterdie, cause production efficiency low.
Summary of the invention
Problem to prior art exists the invention provides a kind of injection moulding packaging technology mould, can avoid that an injection hole transverse cross-sectional area can not mount product on product, guarantees the product yield, enhances productivity.
Its technical scheme is such: it comprises upper die and lower die, and said patrix connects push rod, and said counterdie is arranged on the base plate; It is characterized in that: the said mould body of going up is the shape of falling the boss; Said patrix spiral-lock is on the fixed block of top base, and said counterdie adopts split type, and it comprises die and injection-molding surfaces platform; The boss of said patrix, said die, said injection-molding surfaces platform surround cavity jointly; The bottom of said injection-molding surfaces platform connects said base plate, and said bottom of female die connects regulates screw mandrel, and said adjusting screw mandrel is installed on the said base plate.
It is further characterized in that: on said fixed block body, concave station is set, said patrix spiral-lock is on the table top of said concave station; Said die body is an annular, and the centre of said annular die is the cavity of upper and lower perforation, and said injection-molding surfaces platform places in the said cavity, and the upper surface of said injection-molding surfaces platform is lower than the upper surface of said die; Said push rod symmetry is hung and is connected on said patrix two avris; On said base plate both sides the hole is set, said adjusting screw mandrel runs through said Kong Houqi top and connects said die, and its bottom connects said base plate; The quantity of said adjusting screw mandrel is at least two.
The present invention adopts after the said structure, has cancelled the injection hole on the patrix, and injected plastics material is put into the product below in advance; So just avoid original structure injection hole transverse cross-sectional area on product can not mount the defective of product, guaranteed the yield of product, and during matched moulds; The boss of patrix, the die of counterdie, injection-molding surfaces platform surround cavity jointly, because the regulating action of adjusting screw mandrel on short transverse of die bottom, and the mating reaction of push rod; Make the interval size of this cavity become and to adjust; Pressure when the adjusting screw mandrel can also guarantee matched moulds like this, need not to change counterdie when producing the product of different-thickness; Only need the governor motor parameter to get final product, therefore improved production efficiency.
Description of drawings
Fig. 1 is the prior art structural representation;
Fig. 2 is a structural representation of the present invention.
The specific embodiment:
See Fig. 2, the present invention includes patrix 1, counterdie 4, patrix 1 connects push rod 5, and counterdie 4 is arranged on the base plate 6; Patrix 1 body is the shape of falling the boss, is provided with on the fixed block 8 in top base 7, on fixed block 8 bodies, concave station 8-1 is set, and patrix 1 spiral-lock is on the table top of concave station 8-1; Counterdie 4 is split type, comprises die 2 and injection-molding surfaces platform 3, and die 2 bodies are annular; The centre of annular die 2 is the cavity of upper and lower perforation, and injection-molding surfaces platform 3 places in the cavity, and the upper surface of injection-molding surfaces platform 3 is lower than the upper surface of die 2; The boss of patrix 1, die 2, injection-molding surfaces platform 3 surround cavity 9 jointly during matched moulds, and the bottom of injection-molding surfaces platform 3 is installed on base plate 6, and the bottom of die 2 is connected with base plate 6 through regulating screw mandrel 10; 11 is installing hole, and the quantity of regulating screw mandrel 10 is at least two, and push rod 5 symmetries are hung and are connected on 1 liang of avris of patrix.

Claims (6)

1. injection moulding packaging technology mould, it comprises upper die and lower die, said patrix connects push rod; Said counterdie is arranged on the base plate, it is characterized in that: said upward mould body is the shape of falling the boss, and said patrix spiral-lock is on the fixed block of top base; Said counterdie adopts split type; It comprises die and injection-molding surfaces platform, and the boss of said patrix, said die, said injection-molding surfaces platform surround cavity jointly, and the bottom of said injection-molding surfaces platform connects said base plate; Said bottom of female die connects regulates screw mandrel, and said adjusting screw mandrel is installed on the said base plate.
2. a kind of injection moulding packaging technology mould according to claim 1 is characterized in that: on said fixed block body, concave station is set, said patrix spiral-lock is on the table top of said concave station.
3. a kind of injection moulding packaging technology mould according to claim 1; It is characterized in that: said die body is annular; The centre of said annular die is the cavity of upper and lower perforation; Said injection-molding surfaces platform places in the said cavity, and the upper surface of said injection-molding surfaces platform is lower than the upper surface of said die.
4. a kind of injection moulding packaging technology mould according to claim 1 is characterized in that: said push rod symmetry is hung and is connected on said patrix two avris.
5. a kind of injection moulding packaging technology mould according to claim 1 is characterized in that: on said base plate both sides the hole is set, said adjusting screw mandrel runs through said Kong Houqi top and connects said die, and its bottom connects said base plate.
6. a kind of injection moulding packaging technology mould according to claim 1, it is characterized in that: the quantity of said adjusting screw mandrel is at least two.
CN201110399686.2A 2011-12-06 2011-12-06 Mould for injection packaging process Active CN102380931B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110399686.2A CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110399686.2A CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Publications (2)

Publication Number Publication Date
CN102380931A true CN102380931A (en) 2012-03-21
CN102380931B CN102380931B (en) 2014-06-18

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Family Applications (1)

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CN201110399686.2A Active CN102380931B (en) 2011-12-06 2011-12-06 Mould for injection packaging process

Country Status (1)

Country Link
CN (1) CN102380931B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102801398A (en) * 2012-08-16 2012-11-28 爱普科斯科技(无锡)有限公司 Working platform of plate passive surface acoustic wave filter
WO2014005265A1 (en) * 2012-07-02 2014-01-09 Parfums Christian Dior Method for manufacturing a cosmetic article having a decorative embossed and/or debossed surface
CN106273170A (en) * 2016-08-23 2017-01-04 太仓市威士达电子有限公司 A kind of mould structure of integrated circuit plastic packaging shell
CN106881826A (en) * 2017-02-24 2017-06-23 日月光封装测试(上海)有限公司 Encapsulating mould and the injection moulding process using the encapsulating mould
WO2020108617A1 (en) * 2018-11-30 2020-06-04 浙江三花智能控制股份有限公司 Eletromagnetic coil, mold, and electromagnetic coil manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
JP2009126027A (en) * 2007-11-22 2009-06-11 Citizen Electronics Co Ltd Mold structure for injection molding of plastic
JP2010069656A (en) * 2008-09-17 2010-04-02 Towa Corp Method and mold for compression-molding semiconductor chip
CN202357357U (en) * 2011-12-06 2012-08-01 爱普科斯科技(无锡)有限公司 Improved injection molding package process die

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5971734A (en) * 1996-09-21 1999-10-26 Anam Semiconductor Inc. Mold for ball grid array semiconductor package
JP2009126027A (en) * 2007-11-22 2009-06-11 Citizen Electronics Co Ltd Mold structure for injection molding of plastic
JP2010069656A (en) * 2008-09-17 2010-04-02 Towa Corp Method and mold for compression-molding semiconductor chip
CN202357357U (en) * 2011-12-06 2012-08-01 爱普科斯科技(无锡)有限公司 Improved injection molding package process die

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014005265A1 (en) * 2012-07-02 2014-01-09 Parfums Christian Dior Method for manufacturing a cosmetic article having a decorative embossed and/or debossed surface
CN104520088A (en) * 2012-07-02 2015-04-15 克丽丝汀迪奥香水化妆品公司 Method for manufacturing a cosmetic article having a decorative embossed and/or debossed surface
US9844498B2 (en) 2012-07-02 2017-12-19 Parfums Christian Dior Method for manufacturing a cosmetic article having a decorative embossed and/or debossed surface
CN102801398A (en) * 2012-08-16 2012-11-28 爱普科斯科技(无锡)有限公司 Working platform of plate passive surface acoustic wave filter
CN102801398B (en) * 2012-08-16 2014-11-05 爱普科斯科技(无锡)有限公司 Working platform of plate passive surface acoustic wave filter
CN106273170A (en) * 2016-08-23 2017-01-04 太仓市威士达电子有限公司 A kind of mould structure of integrated circuit plastic packaging shell
CN106881826A (en) * 2017-02-24 2017-06-23 日月光封装测试(上海)有限公司 Encapsulating mould and the injection moulding process using the encapsulating mould
WO2020108617A1 (en) * 2018-11-30 2020-06-04 浙江三花智能控制股份有限公司 Eletromagnetic coil, mold, and electromagnetic coil manufacturing method

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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
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CP03 Change of name, title or address

Address after: 214028 Jiangsu city of Wuxi province Quxi Shi Wu New Road No. 17

Patentee after: Full spectrum radio frequency technology (Wuxi) Co., Ltd.

Address before: 214028, 2, Xindu Road, Wuxi Singapore Industrial Park, Wuxi New District, Jiangsu

Patentee before: EPCOS Technology (Wuxi) Co., Ltd.

CP03 Change of name, title or address