CN102364295A - Method for measuring thickness of side piece of crystal ingot - Google Patents

Method for measuring thickness of side piece of crystal ingot Download PDF

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Publication number
CN102364295A
CN102364295A CN2011101800481A CN201110180048A CN102364295A CN 102364295 A CN102364295 A CN 102364295A CN 2011101800481 A CN2011101800481 A CN 2011101800481A CN 201110180048 A CN201110180048 A CN 201110180048A CN 102364295 A CN102364295 A CN 102364295A
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China
Prior art keywords
piece
flaw
frock
measurement
side piece
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Application number
CN2011101800481A
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Chinese (zh)
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CN102364295B (en
Inventor
赵霞
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Trina Solar Co Ltd
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Changzhou Trina Solar Energy Co Ltd
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Priority to CN 201110180048 priority Critical patent/CN102364295B/en
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Publication of CN102364295B publication Critical patent/CN102364295B/en
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Abstract

The invention relates to a method for measuring the thickness of a side piece of a crystal ingot, which comprises the steps that: a tool is firstly produced, two adjacent edges of the tool are provided with hems which are vertical to each other and are attached to the side pice of the crystal ingot, the tool is provided with a measurement-position mark point, a distance from the measurement-position mark point to the inner side of the hem which is attached to a benchmark bottom surface of the side piece is 63mm, a distance from the measurement-position mark point to the inner side of the hem which is attached to the side surface of side piece is 78mm, the tool 1 is closely attached to a cutting surface of the side piece, the hems are closely attached to the benchmark bottom surface and the side surface of the side piece, the thickness of the side piece at the measurement-position mark point can be measured by utilizing a vernier caliper. Through the method, the measurement points can be simple and rapidly fixed, the error on fixing the measurement points caused by the conicity of the side piece can be avoided, and the accuracy of the measured value can be guaranteed so as to reduce the mistake judgment. The tool can be repeatedly used for a long time and is simple to operate, the measurement points can be fixed only by attaching the tool onto the surface of a work-piece.

Description

A kind of measuring method of crystal ingot flaw-piece thickness
Technical field
The present invention relates to cut the measuring method of a kind of crystal ingot flaw-piece thickness in the silicon ingot technology at photovoltaic.
Background technology
Detect at present the crystal ingot evolution and whether squint, employing be to measure behind the evolution thickness of four sides flaw-piece respectively to accomplish.The job instruction requirement is that the one side bottom the corresponding crystal ingot of flaw-piece is the measuring basis face, and with X axle 78mm, Y axle 63mm is a measurement point.The range of control of evolution flaw-piece thickness be 17+/-3mm.Existing measure adopt a little be visual, because of there is the conical surface in flaw-piece, Gu the deviation of measurement point has a strong impact on measurement numerical value, the erroneous judgement that causes evolution to squint.
Summary of the invention
Technical matters to be solved by this invention is: a kind of measuring method of crystal ingot flaw-piece thickness is provided, guarantees that each measurement point all fixedly drops on job instruction requirement X axle 78mm, the position of Y axle 63mm.
The technical solution adopted for the present invention to solve the technical problems is: a kind of measuring method of crystal ingot flaw-piece thickness; At first make a kind of frock; The adjacent dual-side of this frock has the orthogonal flanging of fitting with flaw-piece, and the measuring position gauge point is set on frock, and this measuring position gauge point is 63mm to the distance of the flanging inboard of fitting with the benchmark bottom surface of flaw-piece; The inboard distance of flanging to fitting with the side of flaw-piece is 78mm; When utilizing this frock to carry out the flaw-piece thickness measure, only need this frock 1 is close to the flaw-piece cut surface, flanging is close to the benchmark bottom surface and the side of flaw-piece; The X axle 78mm that measuring position gauge point on the frock promptly requires corresponding to job instruction, the position of Y axle 63mm, this moment, the flaw-piece thickness with this gauge point place, measuring position of vernier caliper measurement got final product.
The invention has the beneficial effects as follows: through this method can be simply, fixed measuring point efficiently, avoid tapering because of flaw-piece to produce and get point tolerance, guarantee to measure the accuracy of numerical value, thereby reduce erroneous judgement.And this frock can prolonged and repeatedly be used, and is simple to operate, and being covered on surface of the work is desirable point.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified;
Fig. 1 is a stereographic map of the present invention;
Fig. 2 is a user mode side view of the present invention;
Fig. 3 is a user mode stereographic map of the present invention;
Among the figure, 1. frock, 2. flaw-piece, 3. flanging, 4. circular hole, 5. frock wedge angle.
Embodiment
A kind of measuring method of crystal ingot flaw-piece thickness; At first make a kind of frock; The adjacent dual-side of this frock has the orthogonal flanging of fitting with flaw-piece, and the measuring position gauge point is set on frock, and this measuring position gauge point is 63mm to the distance with the flanging of the benchmark bottom surface applying of flaw-piece; Distance to the flanging of fitting with the side of flaw-piece is 78mm; When utilizing this frock to carry out the flaw-piece thickness measure, only need this frock 1 is close to the flaw-piece cut surface, flanging is close to the benchmark bottom surface and the side of flaw-piece; The X axle 78mm that measuring position gauge point on the frock promptly requires corresponding to job instruction, the position of Y axle 63mm, this moment, the flaw-piece thickness with this gauge point place, measuring position of vernier caliper measurement got final product.
Embodiment:
Like Fig. 1,2, shown in 3, this crystal ingot flaw-piece thickness measure point location frock is a rectangle, and length is 78mm, and width is 63mm, and the length and width of this frock is equal to the X axle 78mm of job instruction measurement requirement defined, Y axle 63mm.Have the flanging 3 of fitting with flaw-piece 2 at the adjacent dual-side of frock 1, the width of flanging 3 is consistent with the benchmark bottom width of flaw-piece 2, make somebody a mere figurehead when avoiding fitting with flaw-piece, thereby assurance frock and flaw-piece is fitted fully.Two circular holes 4 are set on the flanging 3 of frock 1 one sides, and this purpose is for the fixing tool reference field, avoids obscuring of this design frock X axle and Y axle.In Fig. 1, the embodiment shown in 2 and 3, circular hole is arranged on the flanging 3 of length direction, and the frock wedge angle 5 on the flanging opposite of this frock is the measuring position gauge point.
At first frock 1 is had on the flaw-piece 2 that 4 of circular holes will measure as vertical being attached in bottom surface when using, frock 1 is close to the face that the flaw-piece cut surface is a zero draft.Effect after the applying is shown in Fig. 2 and 3, and requiring frock 1 inward flange and flaw-piece 2 is driving fits, and collect reading with vernier caliper measurement angular alignment frock wedge angle 5 and get final product this moment.In order to make the measurement gimmick more smooth and easy, also can earlier frock 1 be fitted on the flaw-piece 2 closely by above requirement, with a described point, take down frock 1, vernier caliper alignment mark point measurement reading at frock wedge angle 5 places.

Claims (1)

1. the measuring method of a crystal ingot flaw-piece thickness; It is characterized in that: at first make a kind of frock; The adjacent dual-side of this frock has the orthogonal flanging of fitting with flaw-piece, and the measuring position gauge point is set on frock, and this measuring position gauge point is 63mm to the distance of the flanging inboard of fitting with the benchmark bottom surface of flaw-piece; The inboard distance of flanging to fitting with the side of flaw-piece is 78mm; When utilizing this frock to carry out the flaw-piece thickness measure, only need this frock 1 is close to the flaw-piece cut surface, flanging is close to the benchmark bottom surface and the side of flaw-piece; The X axle 78mm that measuring position gauge point on the frock promptly requires corresponding to job instruction, the position of Y axle 63mm, this moment, the flaw-piece thickness with this gauge point place, measuring position of vernier caliper measurement got final product.
CN 201110180048 2011-06-30 2011-06-30 Method for measuring thickness of side piece of crystal ingot Active CN102364295B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110180048 CN102364295B (en) 2011-06-30 2011-06-30 Method for measuring thickness of side piece of crystal ingot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110180048 CN102364295B (en) 2011-06-30 2011-06-30 Method for measuring thickness of side piece of crystal ingot

Publications (2)

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CN102364295A true CN102364295A (en) 2012-02-29
CN102364295B CN102364295B (en) 2013-03-06

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CN 201110180048 Active CN102364295B (en) 2011-06-30 2011-06-30 Method for measuring thickness of side piece of crystal ingot

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder
CN201264318Y (en) * 2008-10-14 2009-07-01 浙江华友电子有限公司 Silicon chip locating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder
CN201264318Y (en) * 2008-10-14 2009-07-01 浙江华友电子有限公司 Silicon chip locating device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李保军等,1: "多线切割工艺中切割线直径对翘曲度影响的研究", 《电子工业专用设备》 *

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Address after: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou

Patentee after: trina solar Ltd.

Address before: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou

Patentee before: CHANGZHOU TRINA SOLAR ENERGY Co.,Ltd.

Address after: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou

Patentee after: TRINASOLAR Co.,Ltd.

Address before: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou

Patentee before: trina solar Ltd.