CN102355979A - Contact with tubular solder member - Google Patents

Contact with tubular solder member Download PDF

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Publication number
CN102355979A
CN102355979A CN2010800111540A CN201080011154A CN102355979A CN 102355979 A CN102355979 A CN 102355979A CN 2010800111540 A CN2010800111540 A CN 2010800111540A CN 201080011154 A CN201080011154 A CN 201080011154A CN 102355979 A CN102355979 A CN 102355979A
Authority
CN
China
Prior art keywords
flow component
tubulose
electric
tubulose back
afterbody
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Granted
Application number
CN2010800111540A
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Chinese (zh)
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CN102355979B (en
Inventor
J·S·卡齐纳
J·R·扎诺利
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2INTERPLEX IND Inc 1
Interplex Industries Inc
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2INTERPLEX IND Inc 1
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Publication of CN102355979A publication Critical patent/CN102355979A/en
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Publication of CN102355979B publication Critical patent/CN102355979B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board

Abstract

An electrical connector configured to be electrically connected to a substrate. The electrical connector includes a housing with a plurality of electrical contact terminals disposed on a connection surface thereof. Each electrical contact terminal includes an elongate tail portion extending from the connection surface. The elongate tail portion of each electrical contact terminal is disposed in a central opening of a tubular reflowable element. The tail portion may optionally include a stress or tension relief mechanism. The tubular reflowable element extends beyond a free end of the elongate tail portion away from the connection surface. The electrical contact terminals are configured to be disposed in the vicinity of a corresponding substrate terminal such that the reflowable element of each electrical contact terminal electrically connects the contact terminal to the corresponding substrate terminal.

Description

Contact with tubulose solder member
Technical field
The present invention relates to be used to provide the electric contact that is electrically connected between first and second electronic units, more specifically, but the present invention relates to have the electric contact of layout back-flow component (refiowable element) above that.
Background technology
Electric connector uses the electrical connection of BGA Package (BGA) type, usually is attached on the substrate, for example printed circuit board (PCB).Said BGA comprises a plurality of solder balls that are used for the electric contact of connector is connected to PCB.Typical B GA connector is connected to the array that electrically contacts pad or around the track of the surface arrangement of said substrate., solder ball is navigated to electrically contact on the pad to electrically contacting pad application of resin scaling powder (resin flux) through at first, and order about connector through reflow ovens, like this, solder ball is attached to contact pins.In the reflux technique process, solder ball utilizes scaling powder to be held in place, and is wetted to and electrically contacts on the pad.Except that the maintenance solder ball was in place, scaling powder promotion solder ball is wetting to electrically contact pad, and with chemical method cleaning contact pins surface.
Yet in BGA connected, the spherical form of solder ball caused connection height short between the pad of the contact of the electric contact of connector and substrate.If any moving taken place between connector and substrate, these short connections receive big mechanical stress.As a result, make soldering connect the result of fracture as stress, the connection between connector and substrate is easy to lose efficacy.
A kind of method of being applied on the contact of solder member that will be longer comprises, for example, and the solder member of row grid array.Yet this is very complicated and time-consuming technology.This technology is included in reflowed solder in the array of container or mould, and contact arrangement in each container, is made solder cooling and the solder that removes then on contact and the contact.When solder is applied on the contact, need the heating and cooling solder, this possibly be that cost is high and time-consuming.
Summary of the invention
The present invention provides a kind of electric connector that is configured to be electrically connected to substrate.Said electric connector comprises housing, and said housing has many electric contact joints of on its connection surface, arranging.Each electric contact joint comprises the elongated afterbody part that connects the surface extension from said.But the said elongated afterbody of each electric contact joint partly is arranged in the central opening of tubulose back-flow component.But said tubulose back-flow component extends beyond the free end that connects the elongated afterbody part on surface away from said.Said electric contact joint construction becomes to be arranged near the corresponding substrate joint, but makes the back-flow component of each electric contact joint that the contact joint is connected on the corresponding substrate joint.
In an embodiment, but through said afterbody is partly shifted onto in the central opening of said back-flow component, but said back-flow component can be disposed on the said afterbody part of each electric contact joint.But through removing the said reflow materials of heating and cooling with the requirement on the afterbody part that it is placed into said contact, this can reduce production costs and reduce the production time.
Description of drawings
Exemplary embodiment of the present invention will be described below, and schematically is shown in the accompanying drawing, in the accompanying drawings:
But Fig. 1 shows electric contact joint and tubulose back-flow component according to the embodiment of the invention;
But Fig. 2 is presented at the contact joint of the Fig. 1 that arranges in the tubulose back-flow component;
But Fig. 3 shows the contact joint and back-flow component of Fig. 1 of adjacent substrate joint arrangement;
After Fig. 4 was presented at backflow, the contact joint was attached to the substrate joint of Fig. 3;
Fig. 5-7 shows according to embodiments of the invention, but back-flow component is placed into the step on the joint contact;
Fig. 8 and Fig. 9 show the step that the joint contact of Fig. 5-7 is connected to substrate;
Figure 10 and Figure 11 show according to the alternate embodiment of electric contact joint of the present invention with the member that can reflux;
Figure 12 and Figure 13 show according to the alternate embodiment of electric contact joint of the present invention with the member that can reflux; And
Figure 14 shows that the electric contact joint with Figure 12 and Figure 13 is connected on the substrate.
The specific embodiment
Fig. 1 shows the electric contact joint 2 and conduction back-flow component 4 according to the embodiment of the invention.Electric contact joint 2 comprises that the body 8 of the joint 2 from the contact extends the elongated afterbody part of leaving 6.But conduction back-flow component 4 comprises first reflow materials 10 with elongated tubular product such shape.As depicted in figs. 1 and 2, but through the afterbody part 6 of contact joint 2 is shifted onto in the central opening of tubulose reflow materials 10, back-flow component 4 is arranged on the electric contact joint 2.In case back-flow component 4 is arranged on the afterbody part 6, it is adjacent with the corresponding conductive contact 12 of substrate 14 that the bottom of back-flow component 4 is arranged to, and substrate 14 is printed circuit board (PCB)s (PCB) for example shown in Figure 3.Then, back-flow component 4 is placed in the reflux temperature that has raise, and causes that back-flow component 4 is bonded to the afterbody part 6 of the substrate joint 12 and the contact joint 2 of conduction.As a result, as shown in Figure 4, utilize soldering to connect 11, electric contact joint 2 is electrically connected and is mechanically connected to substrate at substrate joint 12.
But the instance that is applicable to reflow materials 10 of the present invention is a solder.But solder can be used as reflow materials 10, this be because solder will be lower than parts that solder connects and around parts fusing point rising the temperature refluxed.For example, according to special material, solder can have the fusing point of scope between 90 ℃ and 450 ℃.Therefore, do not changing or melting under near the condition of any structure element (the for example housing of holding contact joint) contact joint 2, substrate joint 12, substrate 14 or the solder, said solder can reflux and contact joint 2 is connected to substrate joint 12.Exemplary suitable solder material comprises tin and plumbous mixture.Owing to reduce the government pressure of the amount of employed lead in electric component, it possibly be favourable using lead-free brazing.The instance of lead-free brazing usually comprises and has made up the for example tin of the other materials of copper, silver, bismuth, indium, zinc and antimony.Many suitable solders have and are lower than 220 ℃ reflux temperature.In whole specification, but comprise that the exemplary embodiment of the solder element 4 of tubulose solder material 10 is instances of back-flow component.
Solder element 4 shown in Fig. 1-4 is included in the core of the scaling powder of arranging in the central opening of tubulose solder material 10 16.When solder reflow, scaling powder 16 can be used in several purposes.The first, scaling powder is deoxidation from the surface that is electrically connected.When the temperature that scaling powder 16 has been raise, scaling powder 16 is also the wetting characteristics of aid in improved liquid solder material 10 in soldering processes.When contact joint 2 was inserted in the solder element 4, as shown in Figure 2, the afterbody part 6 of contact joint was pulled in the scaling powder 16.Many suitable flux material at room temperature are ductile.Therefore, afterbody part 6 can be inserted in the central opening of solder element 4 and need not temperature is elevated near the temperature spot the reflux temperature.When afterbody part 16 was inserted into, scaling powder 16 was open.Therefore, under the temperature of the reflux temperature that is less than about solder greatly, afterbody part 6 can be pulled in the tubulose solder element 4.For example, according to employed solder, afterbody part 6 can be less than about 220 ℃ or even be less than about greatly under 90 ℃ the temperature and be inserted in the tube element 4 greatly.Yet, in other embodiments, scaling powder core 16 can by under push away and release tubulose solder material 10, and do not cause any distortion of solder.
Substrate joint 12 is illustrated as the contact pad at Fig. 3 and Fig. 4.The contact pad is arranged in one deck solder paste 18 on the pad of contact before being included in solder reflow.Through with the wetting of solder material 10 promotion contact pads and through before soldering processes, preventing contact pad 12 ingresss of air, solder paste 18 is auxiliary to be soldered to contact joint 2 on the substrate joint 12.As an example, solder paste can comprise the powdered filler metal material that is suspended in the scaling powder medium.
As shown in Figure 2, the afterbody part 6 of contact joint 2 can have the length than tubulose solder element 4 weak points, thereby portion's section 20 of solder element 4 is extended below the free end 22 of afterbody part 6.Compare with being connected by the formed soldering of solder ball, portion's section 20 of this extension allows solderings to connect 11 to have the length of having extended.As a result, soldering connects 11 and more is not easy to rupture because of the housing of holding contact joint 2 and the mechanical stress that minute movement produced between the substrate 14.
According to the present invention, the illustrative methods that tubulose solder element 4 is applied on the afterbody part 6 of one group of contact joint 2 is shown among Fig. 5 to 7.Fig. 5 shows the one group of contact joint 2 that extends from the electrical connection surface 25 of connector shell 24.Being electrically connected surface 25 in fact can be any conductive material that is used for an electric component is connected to another electric component.In certain embodiments, connector shell 24 is the parts that are used for substrate 14 is connected to the connector of another substrate, another connector etc.In these embodiment; Be electrically connected surface 25 and be provided at each contact joint 2 (after soldering; Contact joint 2 finally is connected to substrate 14) and each respective electrical contact point (not shown, and respective electrical contact point finally is connected to another substrate or another connector) between parallel connection.The afterbody part 6 of contact joint is extended away from housing 24 ground on roughly consistent and parallel direction.In the embodiment shown, the sub-fraction of the body 8 of contact joint has just been extended connector shell 24 a little.Yet also possible is that the body of contact joint is remained in the housing 24 fully, has only afterbody part 6 to stretch out from housing 24.For tubulose solder element 4 is applied on the afterbody part 6, housing 24 is placed in the vicinity of the keeper 26 of solder element.Each afterbody part 6 is in line with the cavity 28 interior respective tubular solder elements 4 that remain in the keeper 26.As shown in Figure 6, the afterbody part 6 of contact joint 4 is placed with next-door neighbour's tubulose solder element 4.Then, housing 24 moves towards keeper 26, makes each tubulose solder element 4 be pulled on the corresponding afterbody part 6 that kind as shown in Figure 7.
In case tubulose solder element 4 has been placed on the contact joint 2, connector shell 24 is disposed in substrate 14 or PCB is contiguous.Then; As shown in Figure 8; Connector shell 24 is placed to carefully, makes the solder element 4 of each contact joint 2 utilize substrate contact 12 or the solder paste 18 between the substrate 14 at solder element 4 and substrate 14 to be positioned to adjacent with the substrate contact 12 of substrate 14.For illustration substrate contact clearly 12 and solder paste 18, substrate contact 12 extends upward from substrate, and solder paste 18 only covers the part of contact 12 with stepped form.Yet in many examples, substrate contact 12 will be substantially flush with substrate 14, and solder paste 18 will cover contact 12 fully.The present invention has reckoned with all this modification.
For connector shell 24 is electrically connected to substrate 14,10 of the solders of each solder element 4 are heated, and make solder reflow.As a result, between each contact joint 2 and corresponding substrate contact 12, form soldering and connect 11, as shown in Figure 9.
Figure 10 and Figure 11 show another embodiment of connector of the present invention, and wherein, scaling powder core is different with having shown in Fig. 1-4, and tube element 4 has the opening core.The opening core of solder element can be as shown in the figure, do not have any scaling powder, perhaps can have the scaling powder that is arranged in other positions on the element, for example on the outer surface of tube element or tube element inner.In the present embodiment, the afterbody part 6 of joint contact is pulled in the opening core, makes the surface of afterbody part engage with the inner surface 28 of tubulose solder element 4.In order to guarantee that solder element 4 will be securely held on the joint of contact, the diameter of afterbody part 6 can roughly be similar to the diameter of the inner surface 28 of tubulose solder element 4, perhaps less times greater than the diameter of the inner surface 28 of tubulose solder element 4.Therefore, afterbody part 6 is a tight fit in the opening core.
Another embodiment of Figure 12-14 illustration contact joint 4, contact joint 4 auxiliary mechanical stresses of bearing in the soldering connection 11.The afterbody part 6 of each contact joint 4 can be similar to previous embodiment, and as stated, is inserted in the scaling powder core 16 of solder element 4 or in the opening core.Yet contact joint 4 can also be included in stress or the tension force arranged between body 8 and the free end 22 of contact joint 4 and absorb or spring element 32.Spring element 32 can be the part of afterbody part 6 or can be the unitary part of contact joint.When afterbody part 6 was inserted in the tubulose solder element 34, spring element 32 was stayed the outside of tubulose solder element 34.As a result, when housing 24 was electrically connected with substrate 14, spring element 32 was positioned between soldering connection 11 and the connector shell 24.Therefore, any mobile a little caused mechanical stress between connector shell 24 and the substrate 14 can be absorbed by spring element 32.Spring element 32 can be formed by the one or more bendings (bend) 34 in the joint contact 4.Shown spring element 32 comprises three bendings.Like this, element shown in can absorb the mobile caused stress toward each other, away from each other or in a lateral direction because of substrate 14 and connector shell 24.
Though shown and described preferred form of the present invention, many characteristics can change, as to those skilled in the art institute significantly.Therefore, the present invention is intended to only to receive the restriction of the protection domain of appended claims.

Claims (20)

1. electric connector that is used to be electrically connected to substrate, said connector comprises:
Has the housing that is electrically connected the surface;
Be arranged in the lip-deep a plurality of electric connecting joints of said electrical connection, wherein, each electric connecting joint in said a plurality of electric connecting joints has the elongated afterbody part that is electrically connected the surface extension away from said; And
But a plurality of tubulose back-flow components, wherein, but but each the tubulose back-flow component in said a plurality of tubulose back-flow component be arranged on the respective elongated afterbody part.
2. electric connector according to claim 1 is characterized in that,
But but each the tubulose back-flow component in said a plurality of tubulose back-flow component comprises solder.
3. electric connector according to claim 1 is characterized in that,
But but each the tubulose back-flow component in said a plurality of tubulose back-flow component has the low-melting fusing point than each the electric contact joint in said a plurality of electric contact joints; And wherein, but but the fusing point of each the tubulose back-flow component in said a plurality of tubulose back-flow component is lower than the fusing point of said housing.
4. electric connector according to claim 1 is characterized in that,
Each elongated afterbody partial parallel each in other elongated afterbodys parts, and in the said elongated afterbody part each is all extended on consistent direction relative to each other.
5. electric connector according to claim 1 is characterized in that,
In said a plurality of electric contact each all comprises body, and wherein, the sub-fraction of each body is extended said housing.
6. electric connector according to claim 1 is characterized in that,
In said a plurality of electric contact each all comprises body, and wherein, each body is all remained in the said housing fully.
7. connector according to claim 1 is characterized in that,
But but each the tubulose back-flow component in said a plurality of tubulose back-flow component be arranged on the respective elongated afterbody part, but make the part of each tubulose back-flow component extend beyond the free end of said corresponding afterbody part on away from the said direction that is electrically connected the surface.
8. electric connector according to claim 1 is characterized in that,
In said a plurality of electric contact joint each also comprises body and the spring element of between said body and elongated afterbody part, arranging.
9. electric connector according to claim 8 is characterized in that,
In the said spring element each comprises at least one bending.
10. electric connector according to claim 1 is characterized in that,
In said a plurality of electric contact joint each also comprises body; And wherein; For in said a plurality of electric contact joints each; The elongated afterbody of said electric contact joint partly comprises spring element, and wherein, said spring element is arranged between the body and elongated afterbody free end partly of said electric contact joint.
11. electric connector according to claim 10 is characterized in that,
In the said spring element each comprises at least one bending.
12. electric connector according to claim 1 is characterized in that,
But but each the tubulose back-flow component in said a plurality of tubulose back-flow component has central opening; And wherein; The elongated afterbody of each of said electric contact joint partly is inserted in the said corresponding central opening, makes the afterbody of said electric connecting joint partly be a tight fit in the said corresponding central opening.
13. electric connector according to claim 12 is characterized in that,
Said central opening also comprises scaling powder core, wherein, but but said scaling powder core under low-melting temperature, be ductile than each the tubulose back-flow component in said a plurality of tubulose back-flow components.
14. an electric connector that is used to be electrically connected to substrate, said electric connector comprises:
Electric contact joint with afterbody part; And
But the tubulose back-flow component with central opening, wherein, but said tubulose back-flow component be arranged on the said afterbody part, but but make said tubulose back-flow component be inserted in the central opening of said tubulose back-flow component.
15. electric connector according to claim 14 is characterized in that,
But said tubulose back-flow component is arranged on the said afterbody part, but makes said tubulose back-flow component extend beyond the free end of said afterbody part.
16. electric connector according to claim 14 is characterized in that,
But said tubulose back-flow component has the low-melting fusing point than said electric contact joint.
17. a method that is used to be electrically connected to substrate comprises:
But the elongated afterbody of electric contact joint partly is inserted in the atrium of tubulose back-flow component.
18. method according to claim 17 is characterized in that,
Realization partly is inserted into the elongated afterbody of said electric contact joint in the said atrium, but makes the part of said tubulose back-flow component extend beyond the free end of said elongated afterbody part.
19. method according to claim 17 is characterized in that,
But said tubulose back-flow component has the low-melting fusing point than said electric contact joint.
20. method according to claim 17 is characterized in that,
Said method also comprises:
But be arranged to the bottom of said tubulose back-flow component adjacent with the conductive contact of said substrate; And
But said back-flow component is bonded to said substrate, and wherein, said bonding utilizes following method to realize: but it is high, lower and than the low-melting temperature of said substrate than the fusing point of said electric contact that environment temperature is elevated to fusing point than said tubulose back-flow component.
CN201080011154.0A 2009-03-11 2010-03-11 Contact with tubular solder member Active CN102355979B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15929809P 2009-03-11 2009-03-11
US61/159,298 2009-03-11
PCT/US2010/027027 WO2010105086A1 (en) 2009-03-11 2010-03-11 Contact with tubular solder member

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CN102355979A true CN102355979A (en) 2012-02-15
CN102355979B CN102355979B (en) 2014-12-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111843276A (en) * 2020-06-29 2020-10-30 上海邑和汽车科技有限公司 Paste-free brazing process and combined solder

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050621A (en) * 1976-11-03 1977-09-27 Bunker Ramo Corporation Method and apparatus for soldering electric terminals to double-sided circuit boards
JPS5460625U (en) * 1977-10-05 1979-04-26
JPS5844947Y2 (en) * 1979-02-15 1983-10-12 東レ株式会社 solder bead array
US4813128A (en) * 1988-01-13 1989-03-21 Cray Research, Inc. High density disposable printed circuit inter-board connector
JPH0269371A (en) * 1988-09-02 1990-03-08 Alpha:Kk Production of surface-strengthened gypsum product
JPH0969371A (en) * 1995-06-23 1997-03-11 Amp Japan Ltd Electric connector and manufacture thereof
CN1398018A (en) * 2001-07-13 2003-02-19 模帝科技株式会社 Connector and its mfg. method
JP2003163434A (en) * 2001-11-29 2003-06-06 Hitachi Ltd Jack mounting structure and small electronic apparatus
JP2005101459A (en) * 2003-09-26 2005-04-14 Mitsubishi Electric Corp Electronic component and electronic apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050621A (en) * 1976-11-03 1977-09-27 Bunker Ramo Corporation Method and apparatus for soldering electric terminals to double-sided circuit boards
JPS5460625U (en) * 1977-10-05 1979-04-26
JPS5844947Y2 (en) * 1979-02-15 1983-10-12 東レ株式会社 solder bead array
US4813128A (en) * 1988-01-13 1989-03-21 Cray Research, Inc. High density disposable printed circuit inter-board connector
JPH0269371A (en) * 1988-09-02 1990-03-08 Alpha:Kk Production of surface-strengthened gypsum product
JPH0969371A (en) * 1995-06-23 1997-03-11 Amp Japan Ltd Electric connector and manufacture thereof
CN1398018A (en) * 2001-07-13 2003-02-19 模帝科技株式会社 Connector and its mfg. method
JP2003163434A (en) * 2001-11-29 2003-06-06 Hitachi Ltd Jack mounting structure and small electronic apparatus
JP2005101459A (en) * 2003-09-26 2005-04-14 Mitsubishi Electric Corp Electronic component and electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111843276A (en) * 2020-06-29 2020-10-30 上海邑和汽车科技有限公司 Paste-free brazing process and combined solder

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WO2010105086A1 (en) 2010-09-16
CN102355979B (en) 2014-12-24

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