JP2005101459A - Electronic component and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electronic component and electronic apparatus with the electronic component packaged therein, in which terminals 12, 13 of an electronic component 4 reduce the distortion of a soldering portion 10 by reducing stress of the terminals 12, 13 against a load from the outside. <P>SOLUTION: The electronic component 4 is composed of a main body and the terminals 12, 13 connected to the main body and an external electric circuit, and each of the terminals 12, 13 comprises a projecting portion that is protruded outward from the main body and partially comprises elastic structures 12c, 12d, 13c, and the bonding portion 10 that extends from the projecting portion while being bent and is soldered to the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component used in an electronic device such as a mobile phone, and more particularly to an electronic component having a terminal for soldering and joining to a substrate and an electronic device mounted with the electronic component.

  Conventionally, many electronic components have been soldered and connected by inserting terminals into through-holes formed in a printed wiring board, but in recent years, electronic devices such as mobile phones are becoming smaller and thinner, A surface-mounting type in which a terminal is brought into contact with a surface of a printed wiring board and soldered and joined has been widely used.

  FIG. 6 is a diagram showing a mobile phone 1 as an electronic device. 6A is an external front view of the mobile phone 1, and FIG. 6B is a cross-sectional view of the mobile phone 1 viewed from the side. In the figure, the mobile phone 1 is composed of an external housing 2 and an internal housing 3, and a key 7 is provided in the external housing 2 so as to be freely movable. A substrate 5 on which a plurality of electronic components 4 are mounted is mounted inside the mobile phone 1, and the electronic components 4 and the substrate 5 are connected via terminals 6.

  7 is an enlarged view of the vicinity of the electronic component 4 in FIG. 6B, FIG. 8 is a perspective view showing a mounting structure of the electronic component 4, and FIG. 9 is a terminal of the electronic component 4 when the key 7 is pressed. 6 is an enlarged view in the vicinity of 6. FIG. When the user presses the key 7, the actuator portion 8 presses the click spring 9 to come into contact with a switch portion (not shown) of the substrate 5, and is electrically connected to the electronic component 4 mounted on the substrate 5. Is configured to do. In addition, a plurality of metallic terminals 6 protrude from the side surface of the electronic component 4. The terminal 6 is provided with a bent portion 6a that bends to the bottom surface side of the electronic component 4 body at a position near the electronic component 4 body and a bent portion 6b that bends outward at a position near the tip portion of the terminal 6. The tip of the bent portion 6b of the terminal 6 is in contact with the substrate 5 in parallel, and a solder joint 10 is formed to be joined to the substrate 5 with solder. The substrate 5 is electrically connected. Further, the key 7 presses not only the clip spring 9 but also the substrate 5 in order to bring the top of the click spring 9 and the substrate 5 into full contact when the key 7 is pressed. A gap 11 is provided between the electronic component 4 and the internal housing 3 in order to prevent the electronic component 4 from colliding with the internal housing 3 due to the substrate 5 being bent by the load.

  As another conventional technique, in a mobile phone having a battery to be mounted on the casing and a main board mounted in the casing and mounted with various electronic components, at least one of the casing and the main board is in contact with the casing. One of the first protrusions and at least one second protrusion that contacts the battery are provided to prevent damage to the main board when a load is applied from the outside (see, for example, Patent Document 1).

JP 2002-185593 (page 2-3, FIG. 2)

In the conventional electronic component mounting structure, when an external load, for example, the key 7 is pressed in the P direction as shown in FIG. 9, the substrate 5 is also pressurized in the P direction. However, since the substrate 5 bends due to the pressure in the P direction, the terminals 6 of the electronic component 4 receive loads A and B from the substrate 5, so that stresses a, b, c, and d act on the terminals 6. As a result, if the key 7 is pressed too many times, the solder joint 10 is distorted and the connection between the solder joint 10 and the substrate 5 is broken, causing a failure of the product on which the electronic component 4 is mounted. There was a problem of becoming.
In addition, when the board 5 is bent by the load of pressing the key 7 and the top surface of the electronic component 4 collides with the internal housing 3, the stress applied to the terminal 6 is further increased, and the distortion generated in the solder joint 10 is large. Become. In order to prevent this, if the gap 11 is widened, there is a problem that the thinning of the mobile phone 1 is hindered.

  Furthermore, in the mobile phone of Patent Document 1, since the substrate is supported by the convex structure provided in the casing, if the convex structure is provided at a position shifted from directly below the key, a shearing force is generated on the substrate. There is a problem that it is necessary to provide a convex structure directly under the key and the structure is restricted.

  The present invention has been made to solve the above-described problems. In the terminal 6 of the electronic component 4, the stress of the terminal 6 with respect to an external load is reduced to reduce the distortion of the solder joint 10. It is an object of the present invention to obtain an electronic component and an electronic device on which the electronic component is mounted.

  According to a first aspect of the present invention, there is provided an electronic component comprising a main body and a terminal connected to the main body and an external electric circuit, the terminal protruding outward from the main body and partially A protruding portion provided with an elastic structure and a connecting portion that is bent and extended from the protruding portion and is soldered to the substrate.

  According to a fourth aspect of the present invention, there is provided an electronic device mounted on a substrate provided inside a housing, at least one electronic component mounted on one housing side on the substrate, and on the other housing side on the substrate. A push button switch electrically connected to at least one of the electronic components when pressed, the electronic component comprising a main body and a terminal for connecting the main body and an external electric circuit, the terminal being , Projecting outward from the main body, partly provided with an elastic structure, and composed of a connecting part that is bent and extended from the protruding part and soldered to the substrate is there.

  In the electronic component according to the first aspect of the present invention, since the elastic structure is provided in a part of the terminal, the stress applied to the terminal of the electronic component with respect to the external load can be reduced, and the strain generated in the joint portion is reduced There is an effect that can be made.

  Furthermore, an electronic device according to a fourth aspect of the present invention includes a substrate, at least one electronic component, and a push button switch, and the electronic component is provided with an elastic structure at a part of the terminal, so that an external load can be prevented. On the other hand, when the board is bent, the stress applied to the terminal can be reduced even if the top surface of the electronic component collides with the internal housing, so the gap between the top surface of the electronic component and the internal housing is narrowed. Thus, the electronic device can be thinned.

Embodiment 1 FIG.
The first embodiment will be described below.
1 is an enlarged view of the vicinity of the electronic component 4, FIG. 2 is a perspective view showing the mounting structure of the electronic component 4, and FIG. 3 is an enlarged view of the vicinity of the terminal 12 of the electronic component 4 when the key 7 is pressed. is there. A plurality of metallic terminals 12 project from the side surface of the electronic component 4, and the terminal 12 includes a bent portion 12 a that bends toward the bottom side of the electronic component 4 body at a position near the electronic component 4 body, A bent portion 12b that bends outward at a position in the vicinity of the tip portion of the terminal 12 is provided. The tip portion of the terminal 12 contacts the substrate 5 in parallel with the bent portion 12b and is joined to the substrate 5 with solder. A solder joint 10 is formed. Further, a curved portion 12c is formed in the terminal 12 portion sandwiched between the body portion of the electronic component 4 and the bent portion 12a, and the curved portion 12d is formed in the terminal 12 portion sandwiched between the bent portion 12a and the bent portion 12b. Forming.

In this way, by providing the bending portion 12c and the bending portion 12d so as to be easily deformed with respect to the load from the outside, the terminal 12 is loaded from the substrate 5 to the loads A and B by pressing the key 7 as shown in FIG. Even if the board 5 is bent in response, the shapes of the curved portions 12c and 12d of the terminal 12 are deformed and work as an elastic structure, so that the stress a ′ and c ′ of the terminal 12 with respect to the load A and the stress of the terminal 12 with respect to the load B Stress b 'and d' become small and the distortion which arises in the solder joint part 10 can be reduced. As a result, even if the key 7 is pressed excessively, it is possible to prevent the connection between the solder joint 10 and the substrate 5 from being broken.
Even if the top surface of the electronic component 4 collides with the internal housing 3 when the substrate 5 is bent by the load of pressing the key 7, the bending portion 12c and the bending portion 12d work as an elastic structure, so that the terminal 12 Since the stress can be reduced and the gap 11 can be narrowed, the mobile phone 1 can be thinned.

  In the first embodiment, the curved portions 12c and 12d are provided as the elastic structure of the terminal 12, but either one may be provided.

Embodiment 2. FIG.
FIG. 4 is a perspective view showing the mounting structure of the electronic component 4 according to the second embodiment, and FIG. 5 shows the vicinity of the terminal 13 of the electronic component 4 according to the second embodiment when the key 7 is pressed. It is an enlarged view. A plurality of metallic terminals 13 project from the side surface of the electronic component 4, and the terminal 13 includes a bent portion 13 a that bends toward the bottom surface side of the electronic component 4 body at a position near the electronic component 4 body. A bent portion 13b that bends outward at a position in the vicinity of the tip portion of the terminal 13 is provided. The tip portion of the terminal 13 is in contact with the substrate 5 in parallel with the bent portion 13b, and is joined to the substrate 5 with solder. A solder joint 10 is formed.
In the second embodiment, the through hole 13 c is formed in the bent portion 13 a of the terminal 13.

  Thus, by providing the through hole 13c in the bent portion 13a so as to be easily deformed with respect to the load from the outside, the key 13 is pushed down in the P direction as shown in FIG. Even if the substrate 5 is bent, the bent portion 1a of the terminal 13 works as an elastic structure whose shape is easily deformed by the through hole 13c, so that the stress a ′ and c ′ of the terminal 13 with respect to the load A and the load B The stress b ′ and d ′ of the terminal 13 is reduced, and the strain generated in the solder joint 10 can be reduced.

  In the first and second embodiments, the direction of the terminal 12 or 13 from the main body of the electronic component 1 toward the bent portion 12a or 13a is the same as the direction from the bent portion 12b or 13b toward the tip portion. Alternatively, the same effects as those of the first and second embodiments can be obtained with the electronic component 4 formed so that the direction from the bent portion 12b or 13b of the thirteen toward the tip portion is directed toward the electronic component 4.

FIG. 3 is an enlarged view of the vicinity of an electronic component 4 in a mobile phone 1 according to Embodiments 1 and 2 of the present invention. It is the perspective view which showed the mounting structure of the electronic component 4 in the mobile telephone 1 which concerns on Embodiment 1 of this invention. It is the figure which showed a mode that the board | substrate 5 bent when the key 7 was pressed in the mobile telephone 1 which concerns on Embodiment 1 of this invention. It is the perspective view which showed the mounting structure of the electronic component 4 in the mobile telephone 1 which concerns on Embodiment 2 of this invention. It is the figure which showed a mode that the board | substrate 5 bent when the key 7 was pressed in the mobile telephone 1 which concerns on Embodiment 2 of this invention. 1 is a diagram showing a conventional mobile phone 1. FIG. It is an enlarged view of the vicinity of the electronic component 4 in the conventional mobile phone 1. It is the perspective view which showed the mounting structure of the electronic component 4 in the conventional mobile telephone 1. FIG. It is the figure which showed a mode that the board | substrate 5 bent when the key 7 in the conventional mobile telephone 1 was pressed down.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 External housing 3 Internal housing 6, 12, 13 Terminal 6a, 6b, 12a, 12b, 13a, 13b Bending part 12c, 12d Bending part 13c Through-hole 5 Substrate 7 Key 10 Solder joint part 11 Gap

Claims (6)

An electronic component comprising a main body and a terminal connected to the main body and an external electric circuit, wherein the terminal protrudes outward from the main body, and a protruding portion provided with an elastic structure in part, and the protrusion An electronic component comprising: a bent portion extending from an installed portion and soldered to a substrate. 2. The electronic component according to claim 1, wherein an elastic structure is formed by forming a curved shape in a part of the protruding portion of the terminal. 2. The electronic component according to claim 1, wherein a bent portion is provided in the protruding portion of the terminal, and a through hole is formed in the bent portion. A substrate provided inside the housing, at least one electronic component mounted on one housing side on the substrate, and at least one of the electronic components mounted on the other housing side on the substrate and pressed. And the electronic component comprises a main body and a terminal for connecting the main body and an external electric circuit, and the terminal protrudes outward from the main body and is partially An electronic apparatus comprising: a protruding portion provided with an elastic structure; and a connecting portion that is bent and extended from the protruding portion and is soldered to the substrate. 5. The electronic device according to claim 4, wherein an elastic structure is formed by forming a curved shape in a part of the protruding portion of the terminal. 5. The electronic apparatus according to claim 4, wherein a bent portion is provided in the protruding portion of the terminal, and a through hole is formed in the bent portion.

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