CN102355798B - Manufacturing method of cylindrical module circuit board and sintering bracket - Google Patents
Manufacturing method of cylindrical module circuit board and sintering bracket Download PDFInfo
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- CN102355798B CN102355798B CN201110326724.1A CN201110326724A CN102355798B CN 102355798 B CN102355798 B CN 102355798B CN 201110326724 A CN201110326724 A CN 201110326724A CN 102355798 B CN102355798 B CN 102355798B
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Abstract
The invention discloses a manufacturing method of a cylindrical module circuit board and a sintering bracket. The manufacturing method comprises the following steps: (a) integrally manufacturing the raw ceramic of low-temperature co-fired ceramic into a raw ceramic blank; (b) placing the raw ceramic blank on the arc surface of the sintering bracket, and performing cylindrical shaping through a pressure device, wherein the cylindrical shaping is meant to that the raw ceramic blank is processed into an arc shape matched with the arc surface from a plane shape; and (c) sintering the raw ceramic blank subjected to the cylindrical shaping to obtain the cylindrical module circuit board. In the invention, the cylindrical module circuit board is finally formed by adopting the low-temperature co-sintering ceramic special-shaped substrate technology, performing cylindrical shaping through the sintering bracket and sintering; and due to the specific shape, the volume and quality of the circuit board are relatively small, and the circuit board has strong temperature adaption and the relatively high performance.
Description
Technical field
the present invention relates to the technology of LTCC, particularly a kind of manufacture method of LTCC cylindrical module circuit board and sintering support.
Background technology
in recent years, multilayer low-loss low-temperature co-burning ceramic technology has represented stronger advantage in Engineering applications of microwave and millimeter waves field, this technology has solved the interconnect problem of chip and the intermodule of microwave and millimeter wave significantly, the multifunctional module that is widely used in microwave, millimeter wave, becomes one of key technology of the multifunctional modules such as modern Connectors for Active Phased Array Radar.
what application was maximum at present is plane modular circuit, can make of alumina ceramic material, also can make of materials such as flexible boards.Aluminium oxide ceramics can stand the test of high temperature, but can not be for the making of cylinder modular circuit; Flexible board can be made the module of cylinder, but can not meet the requirement of hot conditions, and the development of cylinder module is extremely restricted.Conventional LTCC modular circuit is all planar structure, need to also need relevant fixed structure etc. by stube cable and connector and cylindrical structure interconnection, this quality and volume that not only increases total device also strengthens system loss, reduces the reliability of system.
for further meeting the requirements at the higher level of cylinder module to miniaturization, modularization, multifunction, low cost, highly reliable, productibility, reduce loss, minimizing takes up room, researcher starts to consider module to be directly produced on the surface of cylindrical structure, thereby avoid traditional stube cable and connector, structure, further dwindle taking up room of module, and further improve system reliability.
Summary of the invention
the technical problem that the present invention will solve is to provide a kind of manufacture method of cylindrical module circuit board.
in order to solve the problems of the technologies described above, a kind of technical scheme that the present invention adopts is: a kind of manufacture method of cylindrical module circuit board, comprises the following steps:
(a), the integrated making of the green of LTCC is formed to green blank;
(b), described green blank is placed on the arc surface of sintering support to by pressure apparatus, to carry out cylinder moulding, the moulding finger of cylinder by described green blank by plane be processed into arc surface match circular-arc;
(c), to carrying out sintering through the moulding described green blank of cylinder, form cylindrical module circuit board.
in some embodiments, its step (b) is, on the arc surface of the sintering support described in described green blank is placed in and by both location; Both are together placed in to vacuum bag and carry out vacuum plastic sealing, the pressure 5-40min that gives both 5-20MPa by described pressure apparatus by green blank be processed into arc surface match circular-arc; The described green blank that plastic packaging and described sintering prop up under the room temperature that is placed on 25 ℃ ± 5 ℃ and keep 10h, take out described green blank and described sintering support from described vacuum bag.
in some embodiments, its step (c) is, by for preventing the arc surface of the sintering support of the bonding anti-stick powder of described green blank and described sintering support described in spreading upon equably, described sintering is propped up and is placed in baking oven, set temperature is 60 ℃, after baking 1h, takes out; Described green blank is placed in again on the arc surface of described sintering support, both are put into sintering furnace in the lump, the throughput arranging in described sintering furnace is 5m-20m, according to cylinder module multi-ladder sintering curre, carries out sintering.
in some further execution mode, described anti-stick powder is mixed according to the part by weight of 1:1 by alcohol and ceramic anti-stick powder.
in some embodiments, the surface roughness of described cylindrical module circuit board is 0.8-12.5.
in some embodiments, the radius>=100mm of described cylindrical module circuit board, the radian of described cylindrical module circuit board is 20 °-120 °.
another technical problem that the present invention will solve is to provide a kind of sintering support.
in order to solve the problems of the technologies described above, a kind of technical scheme that the present invention adopts is: a kind of sintering support, comprise base, be arranged on described base for place described green blank arc surface, be arranged at described arc surface one side for by the convex lattice gear of described green blank location.
in some embodiments, described sintering support is made by carbon body stainless steel.
scope of the present invention, is not limited to the technical scheme that the particular combination of above-mentioned technical characterictic forms, and also should contain by above-mentioned technical characterictic or its equivalent feature and carry out combination in any and other technical scheme of forming simultaneously.The technical characterictic that has a similar functions such as disclosed in above-mentioned feature and the application (but being not limited to) is replaced mutually and technical scheme of forming etc.
because technique scheme is used, the present invention compared with prior art has following advantages: by the present invention, adopt LTCC abnormity substrate process technology, by sintering support, carry out cylinder more moulding, again through oversintering and detection, the final cylindrical module circuit board that forms, due to its specific shape, makes circuit board volume and quality less, and temperature adaptive capacity is stronger, and performance is higher.
Accompanying drawing explanation
the front view that accompanying drawing 1 is cylindrical module circuit board;
the stereogram that accompanying drawing 2 is cylindrical module circuit board;
accompanying drawing 3 is cylindrical module circuit board and the relative position schematic diagram of sintering support when sintering;
accompanying drawing 4 is the stereogram of sintering support;
accompanying drawing 5 is process flow diagram.
wherein: 1, cylindrical module circuit board; 2, sintering support; 3, anti-stick powder; 4, base; 5, arc surface; 6, convex lattice gear.
Embodiment
as shown in Figure 5, a kind of manufacture method of cylindrical module circuit board, comprises the following steps:
(a), the integrated making of the green of LTCC is formed to green blank; Its concrete technology flow process comprises:
1. selection material system, green off-chip, punching; According to domain, carry out the processing of monolithic domain, line of cut and wire mark mating holes are made in picture mosaic, select suitable material system to carry out substrate processing, and we select the A6M of Ferro company green here.A6M green sanction, be the size of 8 inches * 8 inches, on green, with laser, according to layout design position, punch that through-hole diameter 150 μ m ± 10 μ m use 3D measuring instrument monitoring through hole precision after punching;
2. inter-level interconnects metallization, holding wire and ground wire are made and are checked: first with the thick copper sheet of 0.5mm, make filling perforation mask plate, by filling perforation mask plate, in green through hole, fill metal paste, dry, leveling can interconnect by plated-through hole the upper and lower surface of green.Choose the parameters such as suitable meshcount, tension force, angle, string diameter and make screen printing screens, then with electric slurry, by silk screen printing, the surface of the green after filling perforation forms holding wire or ground wire, dry, the thicknesses of layers of measurement signal line and lines precision, keep thicknesses of layers, lines precision.The dried green of wire mark is carried out to figure inspection, by the scanning of machine, guarantee lines printing quality and precision;
3. the making of cavity packing module: after selecting DOW CORNING SILASTIC J RTV type two-component silicone rubber to mix with silicon dioxide (SiO2) powder, under the vacuum of 28～29 inches of mercury, slough the air of sneaking into, mixture is promptly poured in cavity template and is evenly spread out, under room temperature (22 ℃～24 ℃), after 6～8 hours, be just solidified into elastic caoutchouc, then get final product the demoulding standby;
4. after cavity, draw and integrated making: tens layers of green of figure passed examination, with drawing cavity according to design layout after laser on green.Completing the green of drawing after cavity, with lamination stacking table, pass through lamination mating holes, they are stacked successively, after lamination completes, cavity stopper is filled in the green after lamination, cover lamination cover plate, after extracting vacuum, by the tens layers of green of pressure handle of heating, force together and form an integral body, form green blank.The green blank of lamination being crossed with cutting machine cuts according to the ready-made line of cut of design, green blank is cut into the size needing.
(b), described green blank is placed on the arc surface 5 of sintering support 2 to by pressure apparatus, to carry out cylinder moulding, the moulding finger of cylinder by described green blank by plane be processed into arc surface 5 match circular-arc; Its concrete technology flow process is, on the arc surface 5 of the sintering support 2 described in described green blank is placed in and by both location; Both are together placed in to vacuum bag and carry out vacuum plastic sealing, the pressure 5-40min that gives both 5-20MPa by described pressure apparatus by green blank be processed into arc surface 5 match circular-arc; The described green blank that plastic packaging and described sintering support 2 are placed under the room temperature of 25 ℃ ± 5 ℃ and keep 10h, take out described green blank and described sintering support 2 from described vacuum bag.
(c), by carrying out sintering through the moulding described green blank of cylinder by cylinder module sintering process, form cylindrical module circuit board 1; Its concrete technology flow process is, cylinder module sintering process described in its step (c) is, on the arc surface 5 of the sintering support 2 described in anti-stick powder 3 is spread upon equably, described sintering support 2 to be placed in to baking oven, set temperature is 60 ℃, after baking 1h, takes out; Described green blank is placed in again on the machined surface of described sintering support 2, both are put into sintering furnace in the lump, it is that 5m-20m carries out sintering according to cylinder module multi-ladder sintering curre that throughput is set.Wherein said anti-stick powder 3 is mixed according to the part by weight of 1:1 by alcohol and ceramic anti-stick powder.
wherein LTCC green material is comprised of ceramic components and organic solvent, first needs through the binder removal phase, the organic principle in green material " burning " to be exhausted in sintering process, and green now has become more loose powder.After binder removal, along with the continuous rising of temperature, the ceramic components in green material starts to undergo phase transition reaction, forms gradually molten state and mutually wraps up infiltration combination, completes the densification process of ceramic components in the megathermal period.For cylinder module, fire difficulty, the shortcoming that matching gap is larger, we take existing sintering curre as basis, adjust the sintering conditions such as temperature, heating rate, throughput and fire cylinder low-temperature co-fired ceramic substrate, the impacts of factor on cylinder low-temperature co-fired ceramic substrate sintering such as research temperature, heating rate, throughput, final formation cylinder module multi-ladder sintering curre is as shown in table 1
table 1
| Temperature range (℃) | Heating-up time (min) |
| 18-500 | 800-900 |
| 400-500 | 200-300 |
| 450-550 | 20-60 |
| 400-600 | 50-80 |
| 500-900 | 100-150 |
| 700-900 | 5-10 |
| 800-950 | 5-20 |
| 950-200 | 100-200 |
| 400-18 | 5-10 |
after cylindrical module circuit board 1 sintering completes, also to test to described cylindrical module circuit board 1, comprise on off test and substrate evaluation.Particularly, the cylindrical module circuit board 1 sintering being completed opens circuit and short-circuit conditions according to domain testing circuit board.As shown in accompanying drawing 1, accompanying drawing 2, cylindrical module circuit board 1 comprises low-temperature co-fired ceramic substrate 7, be arranged at the silk screen printing holding wire 8 on described low-temperature co-fired ceramic substrate 7 and support plate metal 9 is installed, is opened in the cavity 10 on described low-temperature co-fired ceramic substrate 7, measure the size of low-temperature co-fired ceramic substrate 7, scale error=(low-temperature co-fired ceramic substrate actual size-low-temperature co-fired ceramic substrate design size)/low-temperature co-fired ceramic substrate design size * 100%, scale error is not more than 1%.Whether cylinder radius error and radian be uniform according to periphery decile, and low-temperature co-fired ceramic substrate 7 is less than 0.3mm with the matching gap that support plate metal 9 is installed.
the surface roughness of described cylindrical module circuit board 1 is 0.8-12.5.Conventionally surface roughness is 3.2.
radius>=the 100mm of described cylindrical module circuit board 1, the radian of described cylindrical module circuit board 1 is 20 °-120 °.
as shown in accompanying drawing 3, accompanying drawing 4, a sintering support, comprise base 4, be arranged on described base 4 for place described green blank arc surface 5, be arranged at described arc surface 5 one sides for by the convex lattice gear 6 of described green blank location.The concrete size of described arc surface 5 designs according to the size of domain, when cylinder is moulding, green blank and convex lattice are kept off 6 adjacent, avoid green blank slant setting to cause sintering after radian there is deviation.
described sintering support 2 is made by carbon body stainless steel.Carbon body stainless steel can with the LTCC green material timbering material of sintering together, can match with expanding with heat and contract with cold of LTCC green material, not react to each other, be easy to shape with LTCC green material.
as mentioned above, we are illustrated according to aim of the present invention completely, but the present invention is not limited to above-described embodiment and implementation method.The practitioner of correlative technology field can carry out different variations and enforcement in the scope of technological thought license of the present invention.
Claims (5)
1. a manufacture method for cylindrical module circuit board, is characterized in that: comprise the following steps:
(a), the integrated making of the green of LTCC is formed to green blank;
(b), described green blank is placed in to the arc surface (5) of sintering support (2), and upper by pressure apparatus, to carry out cylinder moulding, the moulding finger of cylinder by described green blank by plane be processed into arc surface (5) match circular-arc;
(c), to carrying out sintering through the moulding described green blank of cylinder, form cylindrical module circuit board (1);
Its step (b) is that the arc surface (5) that described green blank is placed in to described sintering support (2) above and by both is located; Both are together placed in to vacuum bag and carry out vacuum plastic sealing, the pressure 5-40min that gives both 5-20MPa by described pressure apparatus by green blank be processed into arc surface (5) match circular-arc; The described green blank that plastic packaging and described sintering support (2) are placed under the room temperature of 25 ℃ ± 5 ℃ and keep 10h, take out described green blank and described sintering support (2) from described vacuum bag.
2. the manufacture method of cylindrical module circuit board according to claim 1, it is characterized in that: its step (c) is, by for preventing the arc surface (5) of the sintering support (2) of the bonding anti-stick powder (3) of described green blank and described sintering support (2) described in spreading upon equably, described sintering support (2) is placed in to baking oven, set temperature is 60 ℃, after baking 1h, takes out; The arc surface (5) that described green blank is placed in again to described sintering support (2) is upper, and both are put into sintering furnace in the lump, and the throughput arranging in described sintering furnace is 5m-20m, according to cylinder module multi-ladder sintering curre, carries out sintering.
3. the manufacture method of cylindrical module circuit board according to claim 2, is characterized in that: described anti-stick powder (3) is mixed according to the part by weight of 1:1 by alcohol and ceramic anti-stick powder.
4. the manufacture method of cylindrical module circuit board according to claim 1, is characterized in that: the surface roughness of described cylindrical module circuit board (1) is 0.8-12.5.
5. the manufacture method of cylindrical module circuit board according to claim 1, is characterized in that: the radius >=100mm of described cylindrical module circuit board (1), the radian of described cylindrical module circuit board (1) is 20 °-120 °.
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| CN201110326724.1A CN102355798B (en) | 2011-10-25 | 2011-10-25 | Manufacturing method of cylindrical module circuit board and sintering bracket |
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| CN201110326724.1A CN102355798B (en) | 2011-10-25 | 2011-10-25 | Manufacturing method of cylindrical module circuit board and sintering bracket |
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| CN102355798A CN102355798A (en) | 2012-02-15 |
| CN102355798B true CN102355798B (en) | 2014-04-23 |
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| CN103236347B (en) * | 2013-04-19 | 2015-06-17 | 山西汇镪磁性材料制作有限公司 | Method for manufacturing magnetic tiles with magnetic field lines diffusing in radiating mode |
| CN104284534B (en) * | 2014-10-29 | 2017-03-15 | 中国兵器工业集团第二一四研究所苏州研发中心 | Super many number of plies ultra-deep cavity ltcc substrate manufacturing process |
| CN114040599B (en) * | 2021-11-30 | 2024-03-29 | 中国兵器工业集团第二一四研究所苏州研发中心 | Annular LTCC substrate manufacturing method |
| CN115781894B (en) * | 2021-12-31 | 2024-06-07 | 江苏惟哲新材料有限公司 | Preparation method of low-temperature co-fired ceramic |
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| JPS5924481B2 (en) * | 1976-06-15 | 1984-06-09 | 東芝セラミツクス株式会社 | arcuate sleeve |
| JPH03109270A (en) * | 1989-09-20 | 1991-05-09 | Rohm Co Ltd | Method for calcining ceramic substrate for electronic parts and setter for calcining substrate to be used therefor |
| DE19715540C2 (en) * | 1997-04-15 | 2002-02-07 | Curamik Electronics Gmbh | Method of manufacturing a domed metal-ceramic substrate |
| CN1151094C (en) * | 2001-02-22 | 2004-05-26 | 北京航空材料研究院 | Method and special mold for preparing unfired ceramic element sheet |
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