CN102348528B - Laser machining apparatus - Google Patents
Laser machining apparatus Download PDFInfo
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- CN102348528B CN102348528B CN200980158060.3A CN200980158060A CN102348528B CN 102348528 B CN102348528 B CN 102348528B CN 200980158060 A CN200980158060 A CN 200980158060A CN 102348528 B CN102348528 B CN 102348528B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
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- Engineering & Computer Science (AREA)
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- Laser Beam Processing (AREA)
Abstract
A laser machining apparatus is provided with a power meter (5) which measures laser power of a pulsed laser outputted from a laser oscillator (1); an operating section (7) which calculates pulse irradiation patterns for the power meter (5) and a work (4), respectively, under laser machining conditions of the work (4), so that the pulsed laser is applied to the power meter (5) and the work (4) within a range of the oscillation performance of the laser oscillator (1) and the power measurement performance of the power meter (5); and a controller (6) which controls the laser oscillator (1) in accordance with the pulse irradiation pattern, and performs laser machining to the work (4) in the case where pulse energy calculated per one shot by using the laser power measured by the power meter (5) is within a previously set prescribed range.
Description
Technical field
The present invention relates to a kind of laser processing device that utilizes pulse laser workpiece to be carried out to Laser Processing.
Background technology
The laser processing device that uses pulse laser workpiece to be carried out to Laser Processing, according to various processing conditions such as the running fire in pulse energy or each hole (impulse ejection) numbers, processes workpiece.Above-mentioned laser processing device is in order to carry out stable Laser Processing, and the necessary pulse laser that uses appropriate frequency.Thus, in the time that laser processing device carries out Laser Processing, must measure exactly pulse energy, the pulse energy going out based on Accurate Determining, carries out the output adjustment of laser oscillation apparatus.
For example, in the energometry method of recording, forms by vibration that several pulse lasers are laggard has a rest in the ranks in patent documentation 1, thereby intermittently vibrate formation pulse laser.And, in the time measuring the energy of output pulse of laser oscillator, the pulse energy E of each is utilized to power output P, frequency of oscillation f, duration of oscillation T1, the intermittent time T2 of oscillator, calculate according to E=(P/f) × { T1/ (T1+T2) }.
Patent documentation 1: TOHKEMY 2003-90760 communique
Summary of the invention
But, in above-mentioned prior art, be in the limit of power of laser oscillation apparatus, to set operation condition (vibration dutycycle), do not consider the ability of energometry device side.Therefore, there is following problems, that is, sometimes owing to exceeding the light beam irradiates of mensuration ability of energometry device, and energometry device is destroyed.
In addition, determine the operation condition of laser oscillation apparatus if do not consider the ability of energometry device side, sometimes produce owing to carrying out energometry under compared with little condition in resolution ratio that to measure precision bad.In addition, the frequency characteristic of the pulse laser of exporting for laser oscillation apparatus, although life period responds different various phenomenons, in above-mentioned prior art, owing to a kind of phenomenon can only being taken into account, therefore the mensuration precision of energy is poor.As mentioned above, in the case of the mensuration precision of pulse energy is poor, there is following problems, that is, cannot carry out exactly the output adjustment of laser oscillation apparatus, its result, the quality of carrying out the hole of Laser Processing produces difference.
In addition, in the case of utilizing a laser processing device to carry out the variation processing of workpiece, with various power outputs to irradiated with pulse laser on workpiece.Therefore, for variation ground processing work, as energometry device, the wider device of output power range that must use can measure on workpiece shadow surface, but there is the high problem of price in such energometry device.
The present invention proposes in view of the above problems, and its object is, obtains a kind of laser processing device, and it prevents the damage of power meter, can carry out at an easy rate the stable Laser Processing of processing quality simultaneously.
In order to solve above-mentioned problem, realize object, laser processing device of the present invention is characterised in that to have: laser oscillation apparatus, it exports pulse laser, transmit optical system, it will be sent to the coplanar laser illumination of workpiece from the described pulse laser of described laser oscillation apparatus output, power measurement device, it measures the laser power of described pulse laser, operational part, its laser processing condition based on described workpiece, calculate respectively the pulse irradiation pattern irradiating respectively to described power measurement device and described workpiece, to make, in the vibration limit of power of described laser oscillation apparatus and in the power measurement limit of power of described power measurement device, irradiating described pulse laser to described power measurement device and described workpiece, and control device, it is according to described pulse irradiation pattern, control described laser oscillation apparatus, and, every 1 pulse energy of sending out pulse laser described calculating utilizing the laser power that determined by described power measurement device, drop in the situation in predefined prescribed limit, carry out the Laser Processing of described workpiece, described operational part, be the maximum of average frequency as the pulse irradiation quantity that is added the time per unit in the time obtaining in light beam turn-on time and intermittent time, calculate respectively following three maximum average frequencies: the 1st maximum average frequency that described laser oscillation apparatus can vibrate, in the pulse irradiation of described laser oscillation apparatus, by the described intermittent time be assumed to zero and repeatedly vibration form the 2nd maximum average frequency in the situation of impulse train, and the power bracket of setting in described power measurement device the 3rd maximum average frequency of allowing, and use minimum maximum average frequency from described the 1st～3rd maximum average frequency, calculate described pulse irradiation pattern, wherein, this light beam turn-on time is in the time of the perforate processing of the enterprising professional etiquette determined number of described workpiece, and this intermittent time is the time that with the stipulated time, laser generation is stopped after the perforate processing of described specified quantity.
The effect of invention
According to the present invention, owing to calculating pulse irradiation pattern, to make in the vibration limit of power of laser oscillation apparatus and at the power measurement limit of power internal radiation pulse laser of power measurement device, so there is following effect,, can prevent the damage of power meter, can carry out at an easy rate the stable Laser Processing of processing quality simultaneously.
Brief description of the drawings
Fig. 1 is the block diagram that represents the structure of the related laser processing device of embodiment 1.
Fig. 2 is for the figure of pulse energy along with the phenomenon of change of frequency is described.
Fig. 3 is for the figure of pulse energy along with the phenomenon of change of frequency is described.
Fig. 4 is for the figure of pulse energy along with the phenomenon of change of frequency is described.
Fig. 5 is for the figure of pulse energy along with the phenomenon of change of frequency is described.
Fig. 6 be for frequency characteristic is described time response difference figure.
Fig. 7 represents the figure of laser processing device to an example of the pulse irradiation pattern of the pulse laser of workpiece irradiation.
Fig. 8 is the flow chart that represents the action step of the related laser processing device of embodiment 1.
Fig. 9 is the flow chart that represents the action step of the related laser processing device of embodiment 1.
Figure 10 is the flow chart that represents the action step of the related laser processing device of embodiment 2.
Figure 11 is the flow chart that represents the action step of the related laser processing device of embodiment 2.
The explanation of symbol
1 laser oscillation apparatus
2 transmit optical system
3 masks
4 workpiece
5 power meters
6 control device
7 operational parts
8 I/F portions
9 workpiece workbench
10 laser processing devices
Fg average frequency
The average location frequency of Fm_ave
Fp running fire frequency (burst frequency)
Ng impulse train quantity
Np running fire number
Detailed description of the invention
Based on accompanying drawing, describe the related laser processing device of embodiments of the present invention in detail below.In addition, the present invention is not limited by present embodiment.
Embodiment 1
Fig. 1 is the block diagram that represents the structure of the related laser processing device of embodiment 1.Laser processing device 10 has laser oscillation apparatus 1, transmission optical system 2, workpiece workbench 9, power meter (power measurement device) 5, control device 6, operational part 7 and I/F (interface) portion 8 and forms.
Laser oscillation apparatus 1 carries out impulse hunting and forms laser, and pulse laser is sent to transmitting optical system 2.In transmission optical system 2, dispose the mask 3 that carries out shaping for the spatial distribution shape of paired pulses laser.Transmit optical system 2 and utilize the switch elements such as mask 3 or AQ, be to be applicable to the beam condition (spatial distribution shape and output time waveform) of Laser Processing by the pulse laser shaping of exporting from laser oscillation apparatus 1, and by the pulse laser after shaping to the 9 side transmission of workpiece workbench.
Workpiece workbench 9 loads the workpiece 4 as Laser Processing object, and the Laser output (the average output power P of pulse laser) that power meter 5 is located the workpiece shadow surface position (workpiece 4 is by the position of Ear Mucosa Treated by He Ne Laser Irradiation) on workpiece workbench 9 is measured.Thus, the laser processing device 10 of present embodiment is configured to, to by fact measuring to the average output power P of the pulse laser irradiating on workpiece 4 after mask 3.
The processing conditions of operational part 7 based on inputting to I/F portion 8, considers the mensuration ability of power meter 5 etc., and pulse irradiation pattern described later (light beam Ton turn-on time and light beam intermittent time Toff etc.) is carried out to computing.In addition, operational part 7 is considered the mensuration ability of power meter 5 etc., determines the pulse irradiation quantity (average pulse frequency <f> described later) of time per unit.In addition, operational part 7 is connected with power meter 5, and the average output power P and the average pulse frequency <f> that utilize power meter 5 to determine calculate each average pulse energy E.Specifically, according to E=P/<f>, calculate the average pulse energy E of each.Operational part 7 sends the pulse irradiation pattern calculating to control device 6.
I/F portion 8 is the interfaces (the input and output portion of information) between laser processing device 10 and operating personnel, has mouse, keyboard etc. and forms.Input processing conditions etc. to I/F portion 8, I/F portion 8 sends the processing conditions of input to control device 6 and operational part 7.
The pulse irradiation pattern that the processing conditions of control device 6 based on sending from I/F portion 8 and operational part 7 calculate, to laser oscillation apparatus 1, transmit optical system 2, workpiece workbench 9, power meter 5, operational part 7 and I/F portion 8 and control.
Laser processing device 10 utilizes above-mentioned structure, the laser generation of laser oscillation apparatus 1 and transmission optical system 2 is controlled, to make irradiating the pulse laser corresponding with the mensuration ability of power meter 5 to power meter 5.
Laser processing device 10 is the processing conditions when carrying out Laser Processing and using using the pulse energy on workpiece shadow surface.For example, in the situation that workpiece 4 is carried out to perforate processing, the movement of laser processing device 10 by workpiece workbench 9 and being configured in transmit in optical system 2 can high-speed mobile the action of arrangement for deflecting (not shown electric scanning mirror etc.), thereby pattern position is arbitrarily carried out to perforate processing.Pulse irradiation pattern (irradiating plan) now has the uncertain time interval according to the position translational speed of the interval of hole Working position and arrangement for deflecting etc.Therefore, laser processing device 10 is according to the various information such as position of opening, the mensuration ability of power meter 5 of the device using in perforate processing (laser oscillation apparatus 1 and transmission optical system 2 etc.), pulse laser, the suitable pulse irradiation pattern while determining Laser Processing.
In addition, expect that the pulse energy on workpiece shadow surface is stable, but in fact sometimes change a little along with frequency.Especially, having mask 3 grades spatial distribution shape is carried out the optical system of shaping in transmission optical system 2, easily there is the exporting change producing because of frequency in the pulse energy on workpiece shadow surface mostly.As mentioned above, in the situation that utilizing pulse laser to process workpiece 4, sometimes produce various variations the time response of frequency characteristic.Therefore, sometimes because causing pulse energy, difference time response of frequency characteristic changes.
The phenomenon (variation of the pulse energy output causing because of the difference of time response) that pulse energy is changed because of the difference of frequency is described here.Fig. 2～Fig. 5 is for the figure of pulse energy along with the phenomenon of change of frequency is described.
As shown in Figure 2, the beam-pointing position of laser oscillation apparatus 1 changes sometimes.In the case, if frequency is low frequency, pulse laser is by the approximate centre of mask 3, and on the other hand, if frequency is high-frequency, pulse laser is by departing from the position at mask 3 centers.At pulse laser, by departing from the position at mask 3 centers, by compared with the situation of the approximate centre of mask 3, the light quantity of the pulse laser by mask 3 tails off with pulse laser.Therefore, in the situation that using mask 3, if irradiate high-frequency pulse laser, compared with low-frequency situation, the pulse energy step-down (output of the irradiation energy irradiating to workpiece shadow surface reduces) on workpiece shadow surface.
In addition, as shown in Figure 3, the light beam mould shape (mould number of times) of sometimes exporting from laser oscillation apparatus 1 changes.In the case, it is low when the pulse energy on workpiece shadow surface is than low frequency when high-frequency.
In addition, as shown in Figure 4, the beam diameter of the pulse laser of sometimes exporting from laser oscillation apparatus 1 changes, or changes at the beam diameter that transmits pulse laser in optical system 2.The in the situation that of this Fig. 4, pulse energy when high-frequency on workpiece shadow surface high during than low frequency (output improves).
In addition, as shown in Figure 5, in transmission optical system 2, light beam mould shape changes sometimes.For example, the light beam that is shaped as top cap (tophat) type in use, sometimes because pulse laser becomes high-frequency, and cause the distribution shape of light beam to depart from top shape for hat.In the case, it is low when the pulse energy on workpiece shadow surface is than low frequency when high-frequency.
Fig. 6 be for frequency characteristic is described time response difference figure.The characteristic X1 of Fig. 6 is the characteristic without the ideal device of frequency characteristic, represents the time-independent situation of pulse energy (output) on workpiece shadow surface.
In addition, characteristic X2 carries out the characteristic in the situation of pulse laser machining with high-frequency, represents that the pulse energy on workpiece shadow surface is exceedingly fast over time, and keeps immediately stable situation.Characteristic X2 is that for example laser oscillation apparatus 1 is 3 axle orthogonal type CO2 laser oscillators, and is subject to the characteristic in situation of impact of last pulsed discharge etc. etc.
In addition, characteristic X3 carries out the characteristic in the situation of pulse laser machining with high-frequency, represents that pulse energy on workpiece shadow surface is over time than comparatively fast, and in situation stable after the stipulated time.Characteristic X3 is for example characteristic by thermal strain of optical resonator etc. and in the situation that causes that axle moves etc.
In addition, characteristic X4 carries out the characteristic in the situation of pulse laser machining with high-frequency, represents that the pulse energy on workpiece shadow surface is slower over time, and in situation stable after the stipulated time.Characteristic X4 is the characteristic being for example subject in the situation of impact of the thermal lens of optics etc.
As mentioned above, the reason of the exporting change being caused by frequency is present in laser oscillation apparatus 1 and transmits in optical system 2, therefore, the laser processing device 10 of present embodiment (with transmitting compared with optical system 2 more back segment) on workpiece shadow surface averages the mensuration of power output P.
As shown in the explanation that Fig. 6 carries out as utilized, in the situation that utilizing pulse laser to process workpiece 4, sometimes produce various variations the time response of frequency characteristic.For example, in the situation that utilizing multiple pulse to carry out Laser Processing to each hole, first pulse laser irradiates with the pulse energy output of the impact that is not subject to frequency.But the second pulse laser of sending out later irradiates with the pulse energy output of impact of the frequency that is subject to pulse laser.
Fig. 7 is the figure of an example of the pulse irradiation pattern of the pulse laser that represents that laser processing device irradiates.In Fig. 7, what illustrate is not the pulse irradiation pattern in actual processing, but reality is processed to the average pulse irradiation pattern of simulating.Running fire frequency determines according to processing conditions, but electrical scanner frequency is different along with actual hole site, in the present embodiment, and the pulse irradiation pattern while irradiation used average frequency as energy and using.In addition, be not to utilize the pulse irradiation pattern shown in Fig. 7 to carry out actual processing.Laser processing device 10 is to be processed and on workpiece 4, carried out the perforate processing in multiple holes by running fire.Running fire processing is the processing method of repeatedly carrying out following processing,, irradiates multiple pulse laser to a machining hole that is, then moves to next machining hole, irradiates multiple pulse laser.In Fig. 7, illustrate that running fire adds the pulse irradiation pattern in man-hour, being illustrated in running fire, to add man-hour be the situation of 3 to the transmitting quantity (counting Np hereinafter referred to as running fire) of 1 hole transmitting.
During the perforate processing of workpiece 4 being carried out to specified quantity, the group number of the impulse train (3) irradiating to 1 hole of workpiece 4 is impulse train quantity Ng (hole count).Until total transmitting quantity of irradiating to workpiece 4 in during intermittent time Toff is that impulse train quantity Ng is multiplied by that Np is counted in running fire and the value that obtains.
The frequency of sending out corresponding with 1 that laser processing device 10 adds in running fire the pulse laser irradiating man-hour is running fire frequency Fp.In addition, the mean value of the pulse laser being irradiated by laser processing device 10 for 1 machining hole is, average frequency (electrical scanner frequency) Fg in every 1 hole.The average frequency Fg in every 1 hole is the frequency of the pulse laser in total ascent time (process time in every 1 hole) of the traveling time that moves to the time of 1 machining hole irradiated with pulse laser with to next machining hole (making the time of electrical scanner, the action of electric scanning mirror).
Average location frequency Fm_ave is irradiation position that subtend machining hole the irradiates frequency while positioning, is the mean value that can utilize the number of times of the location that electrical scanner or electric scanning mirror carry out at time per unit.Average location frequency Fm_ave can be the average frequency in actual processing, can be also the frequency of utilizing additive method to calculate.In the present embodiment, average location frequency Fm_ave is made as to the half of maximum location frequency Fm_max described later.Maximum location frequency Fm_max is irradiation position that subtend machining hole the irradiates frequency while positioning, is the maximum that can utilize the number of times of the location that electrical scanner or electric scanning mirror carry out at time per unit.
Laser processing device 10 makes laser oscillation apparatus 1 carry out intermittence with the stipulated time (intermittent time Toff) in the timing of regulation as required, to make power meter 5 can stably measure average output power P.In the situation that must making laser oscillation apparatus 1 intermittently, laser oscillation apparatus 1 is after perforate processing from specified quantity to workpiece 4 that carry out, and in intermittent time Toff, the failure of oscillations forms pulse laser.
Frequency in the time (light beam Ton turn-on time) of perforate processing and the total ascent time of intermittent time Toff of the enterprising professional etiquette determined number of workpiece 4 is average pulse frequency <f>.In other words, pulse irradiation pattern (average pulse frequency <f>) be according to running fire add the frequency (running fire frequency Fp) of irradiating to 1 hole man-hour, the average frequency Fg in every 1 hole while having supposed to move speed together with the position of irradiating, the mean value of definite pulse frequency for the protection of the intermittent time Toff of power meter 5.In the present embodiment, by this pulse irradiation pattern is irradiated to power meter 5 repeatedly as one style, thereby average output power P is measured.
Operational part 7, according to formula (1), calculates the average frequency of pulse irradiation (the pulse irradiation quantity of time per unit) average pulse energy E in the situation of average pulse frequency <f>, every 1.P in formula (1) is the average output power P that utilizes power meter 5 to measure.
E=P／<f>…(1)
Therefore, the average pulse energy E of easily paired pulses irradiation pattern measures.Laser processing device 10 is by repeatedly carrying out the Laser Processing of average pulse frequency <f>, thereby workpiece 4 is carried out to Laser Processing.In the present embodiment, the processing conditions of the operational part 7 of laser processing device 10 based on workpiece 4, calculates the average pulse frequency <f> of applicable energometry.
The action step of the related laser processing device of embodiment 1 is described below.Fig. 8 and Fig. 9 are the flow charts that represents the action step of the related laser processing device of embodiment 1.Fig. 8 and Fig. 9 illustrate the step of computing of the average pulse frequency <f> carrying out based on the processing conditions of inputting to laser processing device 10 and the step of the mensuration processing of average pulse energy E.
In the time calculating average pulse frequency <f>, input processing conditions (step S10) via I/F portion 8 to control device 6.This processing conditions can be inputted by operating personnel, also can receive from other devices.Processing conditions is for example to depend on the laser oscillation condition (pulsewidth Wd or current value I p etc.), machining benchmark energy (as the pulse energy of the benchmark of every 1) Est, the running fire that drop into electric power etc. to add and count to the running fire of 1 hole transmitting the running fire frequency Fp etc. that Np, running fire add man-hour man-hour.In the present embodiment, be that pulsewidth Wd=10 μ s, machining benchmark energy E st=10mJ, running fire count that Np=3 sends out, the situation of running fire frequency Fp=10000Hz describes for an example of processing conditions.
Input after processing conditions to control device 6, operational part 7 utilizes processing conditions etc., calculates the maximum average frequency Fmax_1 (step S20) of laser oscillation apparatus 1.The maximum average frequency Fmax_1 of laser oscillation apparatus 1 is the maximum average frequency that laser oscillation apparatus 1 can vibrate, for example maximum average frequency Fmax_1=3000Hz.Maximum average frequency Fmax_1 drops into electric power, obtains to the electric power (pulsewidth Wd or current value I p etc.) and the load that optics is caused etc. that drop in 1 according to the maximum of laser oscillation apparatus 1.
Then, operational part 7 is judged as initial processing conditions, ability (the maximum average frequency Fmax_1 of laser oscillation apparatus 1) and the ability of laser processing device 10 etc. based on laser oscillation apparatus 1, to laser processing device 10 under inputted processing conditions can move (processing conditions whether be applicable to) judge (step S30).
Under inputted processing conditions, laser processing device 10 cannot move (step S30, no), operational part 7 is refused inputted processing conditions (step S40).Specifically, in the case of having inputted the processing conditions of the performance that exceedes laser processing device 10 or exceeded the processing conditions of performance of laser oscillation apparatus 1, operational part 7 is refused inputted processing conditions.Thus, control device 6 notifies under inputted processing conditions laser processing device 10 cannot move this situation from I/F portion 8 to operating personnel.Then, again input processing conditions (step S10) to control device 6.Can move until operational part 7 is judged as laser processing device 10 under inputted processing conditions, laser processing device 10 carries out the processing of step S10～S30 repeatedly.
Under inputted processing conditions laser processing device 10 can move (step S30, be), operational part 7 utilizes average location frequency Fm_ave, running fire frequency Fp, pulsewidth Wd, running fire to count Np, calculates the average frequency Fg (step S50) in every 1 hole.As mentioned above, average location frequency Fm_ave is made as to for example half of maximum location frequency Fm_max.
In the situation that maximum location frequency Fm_max is Fm_max=2000Hz, Fm_ave=2000Hz/2=1000Hz.Operational part 7 utilizes formula (2) to calculate the average frequency Fg in every 1 hole.
Fg=1／{(Np-1)／Fp+Wd+(1／Fm_ave)}…(2)
If utilize this formula (2), the average frequency Fg in every 1 hole is Fg=1/{ (3-1)/10000+0.00001+ (1/1000) }=826Hz.
Then, operational part 7 calculates laser oscillation apparatus 1 and repeatedly vibrates and form the maximum average frequency Fmax_2 (step S60) in the situation of impulse train.Specifically, maximum average frequency Fmax_2 is Fmax_2=Fg × Np=2478Hz.
In addition, operational part 7 calculates the maximum average frequency Fmax_3 (step S70) that can allow in the power bracket of setting in laser processing device 10.This maximum average frequency Fmax_3 utilizes upper limit output PWR_max and the machining benchmark energy E st of power bracket to calculate.Upper limit output PWR_max (maximum output) in power bracket is 3W, Fmax_3=PWR_max/Est=3/0.01=300Hz.In addition, the processing of the processing of step S60 and step S70 which formerly all can.
Then, operational part 7 calculates average pulse frequency Fmax_min (step S80).The computing of average pulse frequency Fmax_min in this step S80 is the 1st computing c1 of average pulse frequency.Average pulse frequency Fmax_min is the average frequency of laser processing device 10 pulse laser of allowing.Operational part 7 compares maximum average frequency Fmax_1, Fmax_2, Fmax_3, using reckling as average pulse frequency Fmax_min.Its reason is, because maximum average frequency Fmax_1, Fmax_2, Fmax_3 are respectively the frequency of capacity limit, so in order to use, and be necessary for the frequency that is less than or equal to whole maximum average frequency Fmax_1, Fmax_2, Fmax-3 below capacity limit.In the example of present embodiment, Fmax_min=Fmax_3=300Hz.
Then, operational part 7 calculates impulse train quantity Ng (step S90).In the example of present embodiment, impulse train quantity Ng is Ng=Fmax_min/Np=300/3=100 group.
In the situation that average pulse frequency Fmax_min cannot be counted Np and divides exactly by running fire, operational part 7 is by carrying out micro-correction of average pulse frequency Fmax_min, thereby calculates micro-revised average pulse frequency Fx (step S100).The computing of average pulse frequency Fx in this step S100 is, the 2nd computing c2 of average pulse frequency.Specifically, operational part 7 is cast out the later value of decimal point of the impulse train quantity Ng calculating, makes impulse train quantity Ng become natural number.Then, count Np the obtained value that multiplies each other by becoming natural impulse train quantity Ng and running fire, be made as micro-revised average pulse frequency Fx.In the example of present embodiment, Fx=Ng × Np=100 × 3=300Hz, due to identical with the average pulse frequency Fmax_min before micro-correction, so also can omit the processing of this step S100.
In processing below, operational part 7 is which in Fmax_1, Fmax_2, Fmax_3 carries out different processing according to average pulse frequency Fmax_min.Therefore, operational part 7 confirms to have selected which (the step S110) in Fmax_1, Fmax_2, Fmax_3 for average pulse frequency Fmax_min.
(step S110 in the situation that selecting Fmax_1 or Fmax_3 as average pulse frequency Fmax_min, Fmax_1 or Fmax_3), operational part 7 drops in the mensuration limit of power of power meter 5 for the average frequency of the pulse laser that makes laser oscillation apparatus 1 vibration and form, and sets intermittent time Toff (step S120).In the example of present embodiment, due to Fmax_min=Fmax_3, so operational part 7 is set intermittent time Toff.If known intermittent time Toff is long, the mensuration deterioration in accuracy of power meter 5.In addition, although can realize from various angles the optimization of intermittent time Toff, in the present embodiment, the situation of the fixed value that is Toff=0.15s to intermittent time Toff describes.
Operational part 7 calculates light beam Ton turn-on time (step S130).In the example of present embodiment, Ton=Ng/Fg=100/826=0.121s.Then, operational part 7 carries out the judgement (step S140) of light beam Ton turn-on time.Specifically, whether operational part 7 is judged than largest beam Ton_max turn-on time is short light beam Ton turn-on time.Largest beam Ton_max turn-on time is allowed light beam turn-on time, and laser processing device 10 only allows the irradiation of pulse laser in than the short time durations of this largest beam Ton_max turn-on time.
In the situation that light beam Ton turn-on time is more than or equal to largest beam Ton_max turn-on time (step S140, no), operational part 7 calculates average pulse frequency Fx (step S150) again.The computing of average pulse frequency Fx in this step S150 is, the 3rd computing c3 of average pulse frequency.In the situation that light beam Ton turn-on time is more than or equal to largest beam Ton_max turn-on time, light beam Ton turn-on time is fixed as Ton_max by operational part 7, calculates average pulse frequency <f> (step S160).As mentioned above, in the situation that having set intermittent time Toff, by light beam Ton turn-on time and the definite average pulse frequency <f> of intermittent time Toff sometimes the ability based on power meter 5 limit.
(step S140 in the situation that turn-on time, Ton_max being short than largest beam at light beam Ton turn-on time, be), average pulse frequency <f> is defined as <f>=Fx (step S160) by operational part 7.For example, suppose that largest beam Ton_max turn-on time is Ton_max=0.15s.In the case, light beam Ton turn-on time is less than largest beam Ton_max turn-on time, and therefore average pulse frequency <f> is <f>=Fx=300Hz.In other words,, in the example of present embodiment, light beam Ton turn-on time drops in the scope of largest beam Ton_max turn-on time, therefore average pulse frequency is defined as to <f>=Fx=300Hz.
In addition, in the situation that selecting Fmax_2 as average pulse frequency Fmax_min (step S110, Fmax_2), irradiate with the irradiation pattern of desirable impulse train.Therefore, operational part 7 is judged as the setting that does not need to carry out intermittent time Toff, do not set intermittent time Toff, and average pulse frequency <f> is defined as to <f>=Fx (step S160).
Determining that after the condition (average pulse frequency <f>) of irradiating pattern, power meter 5 starts the mensuration of average output power (actual power) P.First, power meter 5 is moved on workpiece workbench 9, and be fixed on the irradiation position of pulse laser.Then, form pulse laser from laser oscillation apparatus 1 vibration, irradiate to power meter 5 via transmitting optical system 2.Thus, power meter 5 is measured the average output power P (step S170) of pulse laser.The average output power P that power meter 5 is determined sends to operational part 7.
Whether the power bracket (actual power scope) of operational part 7 to average output power P drops in prescribed limit is judged (step S180).Specifically, the lower limit output PWR_min that whether average output power P is dropped on to power bracket judges to the scope of the upper limit output PWR_max of power bracket.In other words, whether operational part 7 pulse laser that 1 vibration forms to laser oscillation apparatus is that the pulse laser that exceedes the mensuration ability of power meter 5 is judged.
If average output power P (measured value) drops on power bracket outer (step S180, no), operational part 7 sends result of determination to control device 6.Thus, control device 6 makes laser oscillation apparatus 1 stop light beam output (step S190), warns demonstration (a1) (step S200) from I/F portion 8 grades.Warning shows that (a1) represents that average output power P drops on the information of outer this situation of power bracket etc.
If average output power P drops in power bracket (step S180 is), operational part 7 calculates average pulse energy E (step S210) according to E=P/<f>.Then, operational part 7 is as energy judgement, and whether paired pulses average energy E drops in prescribed limit is judged (step S220).
If for example average pulse energy E does not drop on (in machining benchmark energy E st ± x%) (step S220 within the scope of the precision prescribed of the average pulse energy of predetermining, no), operational part 7 is judged as average pulse energy E and drops on outside prescribed limit, and this judged result is notified to control device 6.
In the situation that average pulse energy E drops on outside prescribed limit, operational part 7 is counted (step S230) to the adjustment number of times of the pulse laser output after being adjusted by control device 6, and whether the adjustment number of times counting out is dropped in the predefined maximum scope of adjusting number of times and judge (step S240).
If the adjustment number of times counting out drops on (adjusting in the permissible range of number of times) (step S240 in the predefined maximum scope of adjusting number of times, be), average pulse energy E is dropped on to outer this situation of prescribed limit and notify to control device 6.Thus, control device 6 is controlled laser oscillation apparatus 1 and is transmitted optical system 2, adjusts the output (step S250) of pulse laser.Then, laser processing device 10 returns to the processing of step S170, carries out step S170 processing afterwards.
If the adjustment number of times counting out exceedes the predefined maximum number of times (step S240, no) of adjusting, the adjustment number of times counting out is exceeded to maximum this situation of number of times of adjusting and send to control device 6.Thus, control device 6 makes laser oscillation apparatus 1 stop light beam output (step S260), warns demonstration (a2) (step S270) from I/F portion 8 grades.Warning shows that (a2) represents that the adjustment number of times that average pulse energy E drops on outer this situation of prescribed limit and pulse laser output exceedes the maximum information of adjusting this situation of number of times etc.
In the time that energy is judged (step S220), if for example average pulse energy E drops on the machining benchmark energy E st ± x% predetermining with interior (step S220, be), operational part 7 is judged as average pulse energy E and drops in prescribed limit, and this judged result is notified to control device 6.Thus, control device 6 completes the mensuration (step S280) of average pulse energy E.Then, the pulse irradiation pattern (average pulse irradiate quantity <f>) of control device 6 based on utilizing the pulse energy assay method of above-mentioned present embodiment to obtain, controls laser oscillation apparatus 1 and transmission optical system 2.
As mentioned above, if input processing conditions from I/F portion 8, automatically set the suitable pulse irradiation pattern (average pulse frequency <f>) after the ability of ability, the power meter 5 of having considered laser oscillation apparatus 1.And, due to from pulse irradiation pattern arbitrarily, set suitable pulse irradiation pattern, so can measure suitable average output power P.And, calculate average pulse energy E accurately by E=P/<f>, therefore can carry out the Laser Processing of the average pulse energy E based on suitable.Thus, the processing quality that can realize workpiece 4 entirety improves.
In addition, even the in the situation that of there is instrument error in frequency characteristic, because the suitable average pulse energy E based on calculating is carried out Laser Processing, so can make the processing quality difference of workpiece 4 entirety less.In addition, because the mensuration ability that can not exceed power meter 5 is measured average output power P, so can prevent the damage of the laser light accepting part (power measurement light accepting part) of power meter 5.
In addition, owing to measuring the average output power P that reality is processed to the average frequency of simulating on workpiece shadow surface, so can be determined at the frequency characteristic of the pulse output producing in laser oscillation apparatus 1, and can measure the P of average output power accurately having added transmitting the heat affecting being subject in optical system 2.In addition, there is for light beam mould shape being carried out the mask 3 of shaping the impact that the beam-pointing that the pulse energy on workpiece shadow surface also can be subject to producing in laser oscillation apparatus 1 changes in the case of transmitting in optical system 2.In the case, also can be by measure average output power P on workpiece shadow surface, thus measure average output power P accurately.
As mentioned above, according to embodiment 1, because the pattern to approach the average irradiation pattern that adds man-hour is implemented the mensuration of the average output power P of pulse laser, so can make the processing quality of whole workpiece improve.In addition, measure the average output power P of pulse laser owing to can not exceeding the mensuration ability of power meter 5, so can prevent the damage of power meter 5.In addition, due to the mensuration capacity calculation average pulse energy E based on power meter 5, so can calculate average pulse energy E accurately, can suitably carry out the output adjustment of the pulse laser based on this average pulse energy E.Therefore, can prevent the damage of power meter 5, can carry out at an easy rate the stable Laser Processing of processing quality simultaneously.
Embodiment 2
With reference to Figure 10, Figure 11, the laser processing device that embodiment 2 is related is described below.In embodiment 2, be configured to and the power bracket of power meter 5 can be switched to multiple grades.For example, in the time measuring lower average output power P, measure with lower power bracket, in the time measuring higher average output power P, measure with higher power bracket.In addition, processing conditions that also can be based on inputting from I/F portion 8, automatically setting power scope.In addition, the related laser processing device 10 of embodiment 2 has the structure that the laser processing device 10 related with embodiment 1 is identical, and therefore the description thereof will be omitted.
The action step of the related laser processing device of embodiment 2 10 is described below.Figure 10 and Figure 11 are the flow charts that represents the action step of the related laser processing device of embodiment 2.Figure 10 and Figure 11 represent the step of computing of the average pulse frequency <f> carrying out based on the processing conditions of inputting to laser processing device 10 and the step of the mensuration processing of average pulse energy E.In addition, for the step of carrying out the processing identical with the laser processing device 10 of embodiment 1, the description thereof will be omitted sometimes.
The laser processing device 10 conduct processing identical with the step S10～S60 of embodiment 1, and carry out the processing of step S310～S360.,, in the time calculating average pulse frequency <f>, input processing conditions (step S310) via I/F portion 8 to control device 6.In the present embodiment, be that pulsewidth Wd=10 μ s, machining benchmark energy E st=10mJ, running fire count that Np=3 sends out, the situation of running fire frequency Fp=10000Hz describes for an example of processing conditions.
Input after processing conditions to control device 6, operational part 7 utilizes the maximum average frequency Fmax_1 (step S320) of the calculating laser oscillation apparatus 1 such as processing conditions.For example, maximum average frequency Fmax_1=3000Hz.
Then, operational part 7 is as initial processing conditions judgement, and can the ability of the ability based on laser oscillation apparatus 1 and optics transfer system 2 etc., move and judge (step S330) laser processing device 10 under inputted processing conditions.
Under inputted processing conditions, laser processing device 10 cannot move (step S330, no), operational part 7 is refused inputted processing conditions (step S340).Thus, control device 6 notifies under inputted processing conditions laser processing device 10 cannot move this situation from I/F portion 8 to operating personnel.Then, again input processing conditions (step S310) to control device 6.Can move until operational part 7 is judged as laser processing device 10 under inputted processing conditions, laser processing device 10 carries out the processing of step S310～S330 repeatedly.
Under inputted processing conditions laser processing device 10 can move (step S330, be), operational part 7 utilizes average location frequency Fm_ave, running fire frequency Fp, pulsewidth Wd, running fire to count Np, calculates the average frequency Fg (step S350) in every 1 hole.As mentioned above, average location frequency Fm_ave is made as to for example half of maximum location frequency Fm_max.
In the situation that maximum location frequency Fm_max is Fm_max=2000Hz, Fm_ave=2000Hz/2=1000Hz.Operational part 7 utilizes in embodiment 1 formula (2) of explanation, calculates the average frequency Fg in every 1 hole, if utilize formula (2), with the situation of embodiment 1 in the same manner, Fg=826Hz.
Then, operational part 7 calculates laser oscillation apparatus 1 and repeatedly vibrates and form the maximum average frequency Fmax_2 (step S360) in the situation of impulse train.Specifically, maximum average frequency Fmax_2 is Fmax_2=Fg × Np=2478Hz.
Operational part 7 is exported by the mean power of calculating the pulse laser irradiating to workpiece shadow surface, thereby anticipation average output power PW_2 is predicted to (step S370).In the example of present embodiment, anticipation average output power PW_2 becomes PW_2=Est × Fmax_2=0.01 × 2478=24.8W.
In the present embodiment, in power meter 5, set 4 kinds of power brackets shown below.The power bracket of setting in power meter 5 is (1) power bracket R1:0～1W, (2) power bracket R2:1～3W, (3) power bracket R3:3～5W, (4) power bracket R4:5～10W.
In the power bracket that operational part 7 sets at power meter 5, by the power bracket at anticipation average output power PW_2 place or the power bracket approaching with anticipation average output power PW_2, be temporarily set as power bracket PW_max (1) (step S380).In the example of present embodiment, need the large power bracket of power bracket than (4) power bracket R4:5～10W, but owing to not setting the large power bracket of specific power scope R4 in power meter 5, so use power bracket R4 in power meter 5, set (4) PW_max=10W.
Operational part 7 calculates in laser processing device 10 the maximum average frequency Fmax_3 (n) that the power bracket set can allow (n be in R1～R4 some) (step S390).This maximum average frequency Fmax_3 (n) utilizes upper limit output PWR_max (10W) and the machining benchmark energy E st of power bracket R4 to calculate.Because the maximum of power bracket is output as 10W, therefore maximum average frequency Fmax_3 (R4) is Fmax_3 (R4)=PWR_max/Est=10/0.01=1000Hz.
Then, operational part 7 calculates average pulse frequency Fmax_min (step S400).The computing of average pulse frequency Fmax_min in this step S400 is, the 1st computing c11 of average pulse frequency.Operational part 7 compares maximum average frequency Fmax_1, Fmax_2, Fmax_3 (n), using reckling as average pulse frequency Fmax_min.In the example of present embodiment, Fmax_min=Fmax_3 (4R)=1000Hz.
Then, operational part 7 calculates impulse train quantity Ng (step S410).In the example of present embodiment, impulse train quantity Ng is Ng=Fmax_min/Np=1000/3=333.3 group.
In the situation that average pulse frequency Fmax_min cannot be counted Np and divides exactly by running fire, operational part 7 is by carrying out micro-correction of average pulse frequency Fmax_min, thereby calculates micro-revised average pulse frequency Fx (n) (step S420).The computing of average pulse frequency Fx in this step S420 is, the 2nd computing c12 of average pulse frequency.Specifically, operational part 7 is cast out the later value of decimal point of the impulse train quantity Ng calculating, makes impulse train quantity Ng become natural number.In the example of present embodiment, impulse train quantity Ng=333.And, count Np the obtained value that multiplies each other by becoming natural impulse train quantity Ng and running fire, be made as micro-revised average pulse frequency Fx.In the example of present embodiment, Fx=Ng × Np=333 × 3=999Hz.In addition, in the situation (average pulse frequency Fmax_min is counted by running fire the situation that Np is divided exactly) identical with micro-revised average pulse frequency Fx of the average pulse frequency Fmax_min before micro-correction, the processing that also can omit this step S420.
In processing below, operational part 7 is which in Fmax_1, Fmax_2, Fmax_3 carries out different processing according to average pulse frequency Fmax_min.Its reason is, along with average pulse frequency Fmax_min be above-mentioned which, whether can determine needs to set intermittent time Toff, whether need to carry out the switching of power bracket.
For example, if selected maximum average frequency Fmax_1, because the frequency of pulse laser is the value of exporting from laser oscillation apparatus 1, so there is the possibility of power switched scope, and owing to being the frequency lower than the power bracket of maximum average frequency Fmax_2, need to set intermittent time Toff so can be judged as.
In addition, if selected maximum average frequency Fmax_2,, because the frequency of pulse laser is according to the value of the irradiation pattern output of desirable impulse train, so there is not the problem of power bracket, can be judged as and not need to set intermittent time Toff.
In addition, if selected maximum average frequency Fmax_3 (n), although can think the problem of power bracket of not existing, owing to being the frequency lower than the power bracket of maximum average frequency Fmax_2, need to set intermittent time Toff so can be judged as.
Therefore, operational part 7 confirms to have selected which (the step S430) in Fmax_1, Fmax_2, Fmax_3 for average pulse frequency Fmax_min.In the situation that having selected Fmax_1 as average pulse frequency Fmax_min (step S430, Fmax_1), operational part 7 calculates anticipation average output power PW_n (step S440).Then, operational part 7 is by the power bracket of anticipation average output power PW_n and current setting is compared, thereby again judges power bracket (step S450).Whether operational part 7 drops on power bracket lower limit output PWR_min to average output power P judges to the scope of the upper limit output PWR_max of power bracket.For example, can be also the difference between anticipation average output power PW_n and the power bracket of current setting or than being more than or equal to setting, the power bracket that operational part 7 is judged as current setting is improper.
In the inappropriate situation of power bracket of current setting (step S450, no), operational part 7 is judged (step S460) to whether switching to new power bracket from the power bracket of current setting.In other words, whether operational part 7 is judged than the power bracket of current setting is more suitable other power bracket.Operational part 7, in the case of switching to (step S460 is) new power bracket from the power bracket of current setting, changes to suitable power bracket (step S470) by power bracket.Then, laser processing device 10 returns to the processing of step S390, carries out step S390 processing afterwards.
On the other hand, at suitable situation (the step S450 of the power bracket of current setting, be) or can not switch to from the power bracket of current setting situation (the step S460 of new power bracket, no) under, laser processing device 10 does not change the power bracket of power meter 5, and sets intermittent time Toff (step S480).
In addition, (step S430 in the situation that selecting Fmax_3 (n) as average pulse frequency Fmax_min, Fmax_3 (n)), operational part 7 is dropped in the mensuration limit of power of power meter 5 by the vibrate average frequency of the pulse laser that forms of laser oscillation apparatus 1 in order to make, and sets intermittent time Toff (step S480).In the example of present embodiment, due to Fmax_min=Fmax_3 (R4), so operational part 7 is set intermittent time Toff.If known intermittent time Toff is long, the mensuration deterioration in accuracy of power meter 5.In addition, although can realize from various angles the optimization of intermittent time Toff, in the present embodiment, the situation of the fixed value that is Toff=0.15s to intermittent time Toff describes.
Operational part 7 calculates light beam Ton turn-on time (step S490).In the example of present embodiment, Ton=Ng/Fg=333/826=0.403s.Then, operational part 7 carries out the judgement (step S500) of light beam Ton turn-on time.Specifically, whether operational part 7 is judged than largest beam Ton_max turn-on time is short light beam Ton turn-on time.
In the situation that light beam Ton turn-on time is more than or equal to largest beam Ton_max turn-on time (step S500, no), operational part 7 calculates average pulse frequency Fx (n) (step S510) again.The computing of average pulse frequency Fx (n) in this step S510 is, the 3rd computing c13 of average pulse frequency.For example, suppose that largest beam Ton_max turn-on time is Ton_max=0.15s.In the case, in the example of present embodiment, light beam Ton turn-on time is more than or equal to largest beam Ton_max turn-on time, therefore light beam Ton turn-on time is fixed as to Ton_max, calculates average pulse frequency <f>.The impulse train quantity Ng2 being included in light beam Ton turn-on time is Ng2=Ton_max/ (1/Fg)=0.15/ (1/826)=123.9.Therefore, if the later value of decimal point of impulse train quantity Ng2 is cast out, impulse train quantity Ng2=123 group.Thus, micro-revised average pulse frequency Fx (R4)=Ng2 × Np=123 × 3=369Hz.
Then, operational part 7 calculates anticipation average output power PW_n (step S520).Anticipation average output power PW_n in the example of present embodiment is PW_ (R4)=Est × Fx (R4)=0.01 × 369=3.69W.And operational part 7 is by the power bracket of anticipation average output power PW_n and current setting is compared, thereby again judge power bracket (step S530).Whether operational part 7 drops on power bracket lower limit output PWR_min to average output power P judges to the scope of the upper limit output PWR_max of power bracket.
In the inappropriate situation of power bracket of current setting (step S530, no), operational part 7 is judged (step S540) to whether switching to new power bracket from the power bracket of current setting.In other words, whether operational part 7 is judged than the power bracket of current setting is more suitable other power brackets.Operational part 7, in the case of switching to (step S540 is) new power bracket from the power bracket of current setting, changes to suitable power bracket by power bracket.In the example of present embodiment, due to anticipation average output power, PW_n is 3.69W, so compared with power bracket R4, more preferably power bracket R2 (3～5W).Therefore, laser processing device 10 changes to 5W (step S550) by the power bracket of power meter 5 from 10W, determines average pulse frequency <f> (step S560).
On the other hand, (step S530 in the case of the power bracket of current setting is suitable, be) or can not switch to (step S540 the situation of new power bracket from the power bracket of current setting, no), laser processing device 10 does not change the power bracket of power meter 5, and determines average pulse frequency <f> (step S560).
In addition, (step S500 in the situation that turn-on time, Ton_max being short than largest beam at light beam Ton turn-on time, be), operational part 7 does not change power bracket, and determines average pulse frequency <f> (step S560).
In addition, in the situation that selecting Fmax_2 as average pulse frequency Fmax_min (step S430, Fmax_2), irradiate with the irradiation pattern of desirable impulse train.Therefore, operational part 7 is judged as the not change of required power scope and the setting of intermittent time Toff.Therefore, operational part 7 does not carry out the change of power bracket and the setting of intermittent time, and determines average pulse frequency <f> (step S560).
In the example of present embodiment, due to Fmax_min=Fmax3 (R4), so average pulse frequency <f> is defined as <f>=Fx (R4)=369Hz.After average pulse frequency <f> determines, power meter 5 starts the mensuration of average output power P.Then, laser processing device 10, by the processing identical with the laser processing device 10 of embodiment 1, carries out the mensuration of average pulse energy E, and therefore the description thereof will be omitted.In addition, the processing of the step S570～S680 shown in Figure 11 is corresponding with the processing of the step S170～S280 shown in Fig. 9.Then, the average pulse energy E of control device 6 based on utilizing the pulse energy assay method of above-mentioned present embodiment to obtain, controls laser oscillation apparatus 1 and transmission optical system 2.
As mentioned above, according to embodiment 2, power bracket can be switched to suitable power bracket, calculate average pulse energy E accurately simultaneously, can suitably carry out the output adjustment of the pulse laser based on this average pulse energy E.Therefore, can carry out at an easy rate the stable Laser Processing of processing quality.
Industrial applicibility
As mentioned above, laser processing device involved in the present invention is applicable to utilize the Laser Processing of the workpiece that pulse laser carries out.
Claims (5)
1. a laser processing device, is characterized in that, has:
Laser oscillation apparatus, it exports pulse laser;
Transmit optical system, it will be sent to the coplanar laser illumination of workpiece from the described pulse laser of described laser oscillation apparatus output;
Power measurement device, it measures the laser power of described pulse laser;
Operational part, its laser processing condition based on described workpiece, calculate respectively the pulse irradiation pattern irradiating respectively to described power measurement device and described workpiece, to make, in the vibration limit of power of described laser oscillation apparatus and in the power measurement limit of power of described power measurement device, irradiating described pulse laser to described power measurement device and described workpiece; And
Control device, it is according to described pulse irradiation pattern, control described laser oscillation apparatus, and, every 1 pulse energy of sending out pulse laser described calculating utilizing the laser power that determined by described power measurement device, drop in the situation in predefined prescribed limit, carry out the Laser Processing of described workpiece
Described operational part,
Be the maximum of average frequency as the pulse irradiation quantity that is added the time per unit in the time obtaining in light beam turn-on time and intermittent time, calculate respectively following three maximum average frequencies:
The 1st maximum average frequency that described laser oscillation apparatus can vibrate;
In the pulse irradiation of described laser oscillation apparatus, by the described intermittent time be assumed to zero and repeatedly vibration form the 2nd maximum average frequency in the situation of impulse train; And
The 3rd maximum average frequency that the power bracket of setting in described power measurement device is allowed,
And use minimum maximum average frequency from described the 1st～3rd maximum average frequency, calculate described pulse irradiation pattern,
Wherein, this light beam turn-on time is in the time of the perforate processing of the enterprising professional etiquette determined number of described workpiece, and this intermittent time is the time that with the stipulated time, laser generation is stopped after the perforate processing of described specified quantity.
2. laser processing device according to claim 1, is characterized in that,
The position of described power measurement device in the time that described workpiece is carried out to Laser Processing, measures the laser power of described pulse laser.
3. laser processing device according to claim 1, is characterized in that,
Described transmission optical system has the mask that carries out shaping for the spatial distribution shape to described pulse laser,
Described pulse laser is being carried out after shaping spatial distribution shape by described mask, irradiates to described power measurement device and described workpiece.
4. laser processing device according to claim 1, is characterized in that,
Described power measurement device is configured to, and can switch measuring power bracket with multiple grades, and the size of the laser power based on anticipation, switches described mensuration power bracket.
5. laser processing device according to claim 1, is characterized in that,
Described operational part is the pulse irradiation quantity divided by time per unit by laser power that described power measurement device is determined, thereby calculate the pulse energy of described every 1,
Described control device, in the case of in the pulse energy being calculated by described operational part drops on predefined prescribed limit, carries out the Laser Processing of described workpiece.
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| PCT/JP2009/054896 WO2010103657A1 (en) | 2009-03-13 | 2009-03-13 | Laser machining apparatus |
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| KR (1) | KR101246473B1 (en) |
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| CN104191091B (en) * | 2014-08-27 | 2015-11-11 | 武汉凌云光电科技有限责任公司 | Flexible PCB stacking-type laser soldering device and method |
| KR102496546B1 (en) * | 2017-12-19 | 2023-02-06 | 비아 메카닉스 가부시키가이샤 | Laser machining apparatus, laser machining method, and computer-readable recording medium storing laser machining program |
| US20220234145A1 (en) * | 2019-06-13 | 2022-07-28 | Honda Motor Co., Ltd. | Method for determining laser irradiation state |
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| JP2003090760A (en) | 2001-09-18 | 2003-03-28 | Sumitomo Heavy Ind Ltd | Energy measurement method and apparatus for output pulse in laser oscillator |
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| JP5690051B2 (en) * | 2009-05-27 | 2015-03-25 | 公益財団法人名古屋産業科学研究所 | Method of joining members using laser |
| JP2010279978A (en) * | 2009-06-05 | 2010-12-16 | At's Japan Co Ltd | Manufacturing method and machining device for elastic member of trimming die |
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| CN1169349A (en) * | 1996-05-14 | 1998-01-07 | 阿尔卡塔尔海底网络公司 | Longitudinal sealed welding wire for metal tube |
| CN101274391A (en) * | 2007-03-28 | 2008-10-01 | 日立比亚机械股份有限公司 | Laser energy measuring unit and laser machining apparatus |
| CN101219506A (en) * | 2008-01-07 | 2008-07-16 | 江苏大学 | Laser production method for metal base ultra-hydrophobicity micro-structure surface |
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| CN102348528A (en) | 2012-02-08 |
| JP5414782B2 (en) | 2014-02-12 |
| KR20110126696A (en) | 2011-11-23 |
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| TWI374069B (en) | 2012-10-11 |
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