CN102347063A - Storage device and method for producing the same - Google Patents
Storage device and method for producing the same Download PDFInfo
- Publication number
- CN102347063A CN102347063A CN2010102436623A CN201010243662A CN102347063A CN 102347063 A CN102347063 A CN 102347063A CN 2010102436623 A CN2010102436623 A CN 2010102436623A CN 201010243662 A CN201010243662 A CN 201010243662A CN 102347063 A CN102347063 A CN 102347063A
- Authority
- CN
- China
- Prior art keywords
- circuit element
- circuit board
- storage device
- storage
- fixed sturcture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Semiconductor Memories (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to a storage device and a method for producing the same. The storage device comprises a circuit board, a control circuit element, a terminal module and a storage circuit element, wherein, the circuit board comprises a first surface, a second surface, a coupling end, a plurality of holes, a plurality of metal contacts, and a plurality of metal conducting strips; the holes penetrate from the first surface to the second surface, and the metal contacts are exposed to the first surface; the control circuit element and the storage circuit elements are configured on the circuit board; the terminal module is configured on the first surface and is provided with a plurality of elastic terminals, and each elastic terminal is provided with a first contact site and a second contact site; the first contact sites respectively contact the metal contacts, and the second contact sites respectively pass through the holes and protrude out of the second surface; and the metal conducting strips are configured on the second surface and arranged between the holes and the coupling end. According to the invention, the volume of the storage device can be effectively reduced.
Description
Technical field
The present invention relates to a kind of storage device and manufacturing approach thereof, relate in particular to a kind of method of using nonvolatile memory as the storage device and the manufacturing storage device of Storage Media.
Background technology
Along with Development of Multimedia Technology, it is more and more big that the digital document of made becomes.Though traditional 1.44MB floppy disk is easy to carry, its capacity can't satisfy present demand.In addition, though the hard disk of traditional magnetic disk structural formula can provide jumbo storage area, because of its volume causes the user to carry inconvenience greatly.Because the re-writeable nonvolatile memory has that data is non-volatile, power saving, volume is little and the characteristic of no mechanical structure etc., suitable portable use, the most suitable being used on the portable battery-powered product of this type.Dish is exactly a kind of with the storage device of NAND type flash memory (Flash Memory) as Storage Media with oneself.
In general, dish can comprise circuit board, control circuit element, storage circuit element and several flexible terminals and metallic conduction sheet (being also referred to as connector or connecting interface) in order to be connected with main frame with oneself.Though the microminiaturization of control circuit element and storage circuit element, can appropriateness is dwindled the volume of carry-on dish, but for fear of the size of connector, the further microminiaturization of dish with oneself has sizable degree of difficulty.Therefore, how on circuit board, to dispose control circuit element, storage circuit element and connector to dwindle the volume problem that those skilled in the art were devoted to solve of carry-on dish for this reason.
Summary of the invention
The present invention provides a kind of storage device and makes the method for storage device, and it can dwindle the volume of storage device effectively.
The embodiment of the invention provides a kind of storage device, and it comprises circuit board, control circuit element, terminal module and storage circuit element.Circuit board comprises first surface, the second surface with respect to this first surface, a link, a plurality of hole, a plurality of metallic contact and a plurality of metallic conduction sheet; Wherein these a little holes are through to second surface from first surface, and these a little metallic contacts are exposed on the first surface and corresponding each hole of each metallic contact disposes.The control circuit arrangements of components is on circuit board.The terminal module is configured on the first surface; Wherein this terminal module has a plurality of flexible terminals; Each flexible terminal has first contact site and second contact site, and these a little first contact sites contact these a little metallic contacts and this a little second contact sites respectively and pass these a little holes respectively and protrude in second surface.The storage circuit arrangements of components is on circuit board and be electrically connected to the control circuit element.A plurality of metallic conduction sheets are configured on the second surface, wherein these a little metallic conduction sheets between these a little holes and link and these a little metallic conduction sheets and control circuit element electrically connect.
In one embodiment of this invention, above-mentioned terminal module also has a fixed sturcture, and each flexible terminal also has a fixed part, and the fixed part of these a little flexible terminals is fixed in this fixed sturcture.
In one embodiment of this invention, above-mentioned fixed sturcture be shaped as strip, these a little first contact sites are piercing in a side of this fixed sturcture, and these a little second contact sites are piercing in another side of this fixed sturcture.
In one embodiment of this invention; Above-mentioned fixed sturcture has front surface, rear surface and 4 sides; This front surface has groove; Above-mentioned second contact site is in this groove; And above-mentioned first contact site protrudes in these a little sides one of them, and wherein the front surface of this fixed sturcture is towards the first surface of circuit board.
In one embodiment of this invention, above-mentioned storage circuit element is positioned on the first surface of circuit board.
In one embodiment of this invention, above-mentioned storage circuit element is positioned on the second surface of circuit board.
In one embodiment of this invention; Above-mentioned storage circuit element comprises the first storage circuit module and the second storage circuit module, and this first storage circuit module is configured on the first surface of circuit board and this second storage circuit module is configured on the second surface of circuit board.
In one embodiment of this invention; Above-mentioned storage device also comprises adhesive body, and wherein above-mentioned control circuit element is positioned on the first surface and this adhesive body covers control circuit element, terminal module and storage circuit element on the first surface that is positioned at circuit board.
In one embodiment of this invention, wherein on this second surface the arrangement of a little therewith metallic conduction sheets of above-mentioned flexible terminal meet USB (universal serial bus) 3.0 transmission standards.
The embodiment of the invention provides a kind of method of making storage device.This method comprises the configuration circuit plate; Wherein this circuit board comprises first surface, the second surface with respect to first surface, a link, a plurality of hole and a plurality of metallic contact; These a little holes are through to second surface from first surface, and these a little metallic contacts are exposed on the first surface and corresponding each hole of each metallic contact disposes.This method also comprises a plurality of metallic conduction sheets of formation on second surface, and wherein these a little metallic conduction sheets are between link and hole.This method comprises that also the Engagement Control circuit component electrically connects to circuit board and with a little therewith metallic conduction sheets of control circuit element.This method also comprises on the first surface of splice terminal module to circuit board; Wherein this terminal module has a plurality of flexible terminals; Each flexible terminal has first contact site and second contact site, and these a little first contact sites contact these a little metallic contacts and this a little second contact sites respectively and pass these a little holes respectively and protrude in second surface.This method also comprises and engages the storage circuit element so far on the circuit board and with storage circuit element and the electric connection of control circuit element.
In one embodiment of this invention; Above-mentioned terminal module also has a fixed sturcture; This fixed sturcture be shaped as a strip, these a little first contact sites are piercing in a side of fixed sturcture, and these a little second contact sites are piercing in another side of fixed sturcture.And the step on the first surface of above-mentioned splice terminal module to circuit board comprises: engage on the first surface of fixed sturcture to circuit board.
In one embodiment of this invention; Above-mentioned terminal module also has a fixed sturcture; This fixed sturcture has a front surface, a rear surface and 4 sides; Front surface has a groove; These a little second contacts site are in this groove, and these a little first contact sites protrude in those sides one of them.And the step on above-mentioned splice terminal module to the first surface of circuit board comprises: with the front surface of fixed sturcture towards the first surface of circuit board and engage on this first surface of fixed sturcture to circuit board.
In one embodiment of this invention, above-mentioned joint storage circuit element to the step on the circuit board comprises: engage this storage circuit element on first surface.
In one embodiment of this invention, above-mentioned joint storage circuit element to the step on the circuit board comprises: engage the storage circuit element on second surface.
In one embodiment of this invention; Above-mentioned storage circuit element comprises the first storage circuit module and the second storage circuit module, and above-mentioned joint storage circuit element to the step on the circuit board comprises: the first storage circuit module is engaged on the first surface and with the second storage circuit module is bonded on the second surface.
In one embodiment of this invention, the method for above-mentioned manufacturing storage device also comprises: form adhesive body and cover control circuit element, terminal module and storage circuit element on the first surface.
Based on above-mentioned, the storage device of the embodiment of the invention and make the method for storage device can dwindle the volume of storage device effectively.
For allowing the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter specially lift embodiment, and conjunction with figs. elaborates as follows.
Description of drawings
Fig. 1 is the stereographic map of the storage device of first embodiment of the invention.
Fig. 2 is another stereographic map of the storage device of first embodiment of the invention.
Fig. 3 is the three-dimensional exploded view of Fig. 1.
Fig. 4 is the stereographic map of the storage device of second embodiment of the invention.
Fig. 5 is another stereographic map of the storage device of second embodiment of the invention.
Fig. 6 is the three-dimensional exploded view of Fig. 4.
Fig. 7 is the three-dimensional exploded view of Fig. 5.
Fig. 8 is the process flow diagram that second embodiment of the invention is made storage device.
The main element symbol description:
110,410: circuit board; 120,420: the control circuit element;
130,430: the terminal module; 132,432: fixed sturcture;
134,434: flexible terminal; 140,440: the storage circuit element;
142: the first storage circuit modules; 144: the second storage circuit modules;
150,450: the metallic conduction sheet; 180,480: link;
202,402: first surface; 204,404: second surface;
206,406: hole; 208,408: metallic contact;
352,652: fixed part; 354,654: the second contact sites;
356,656: the first contact sites; 490: adhesive body;
502: front surface; 504: the rear surface;
512,514,516,518: side; S801, S803, S805: step.
Embodiment
Fig. 1 is another stereographic map of the stereographic map of the storage device of first embodiment of the invention, storage device that Fig. 2 is first embodiment of the invention and the three-dimensional exploded view that Fig. 3 is Fig. 1.
Please with reference to Fig. 1, Fig. 2 and Fig. 3, storage device comprises circuit board 110, control circuit element 120, terminal module 130 and storage circuit element 140.In the present embodiment, (SurfaceMount Technology abbreviates as: SMT) adhere on the circuit board 110 with the surface adhering technology with storage circuit element 140 for control circuit element 120, terminal module 130.
Circuit board 110 has first surface 202, second surface 204 and link 180.Configurable a plurality of circuit components on the first surface 202 of circuit board 110 and the second surface 204, and these a little circuit components can electrically connect through the circuit that on circuit board 110, is disposed.Link 180 is in order to be connected to the butt connector of host computer system.That is to say that storage device is to be inserted into host computer system with the direction from link 180.
In the present embodiment, circuit board 110 has a plurality of holes 206 and a plurality of metallic contacts 208.Hole 206 is to be through to second surface 204 from first surface 202, and metallic contact 208 is to be exposed on the first surface 202, and metallic contact 208 is between link 180 and hole 206.Particularly, metallic contact 208 is that corresponding respectively hole 206 is laid.For example, in the present embodiment, a metallic contact can corresponding hole.Yet, it must be appreciated that in another embodiment, a plurality of metallic contacts also can only corresponding hole.
Terminal module 130 is configured on the first surface 202 of circuit board 110.Terminal module 130 comprises fixed sturcture 132 and a plurality of flexible terminals 134.In embodiments of the present invention, fixed sturcture 132 is in order to be fixed in flexible terminal 134 on the circuit board 110.Yet, the invention is not restricted to this, in another embodiment of the present invention, flexible terminal 134 can directly be soldered on the first surface 202 of circuit board 110, and need not fixed sturcture 132.
In the present embodiment, fixed sturcture 132 is a strip.Yet, it must be appreciated, the invention is not restricted to this, in another embodiment of the present invention, also cylindrical or other shapes of fixed sturcture 132.
Each flexible terminal 134 has fixed part 352, second contact site 354 and first contact site 356.The fixed part 352 of flexible terminal 134 is to be fixed in the fixed sturcture 132, and second contact site 354 is that the side and first contact site 356 that protrude in fixed sturcture 132 are the opposite sides that protrude in fixed sturcture 132.Particularly, second contact site 354 passes hole 206 respectively and protrudes in second surface 204 and first contact site 356 contacting metal contact 208 respectively.
It must be appreciated that although in embodiments of the present invention, storage circuit element 140 is to comprise the first storage circuit module 142 and the second storage circuit module 144 that is positioned at second surface 204 that is positioned at first surface 202 simultaneously.Yet, the invention is not restricted to this, in another embodiment of the present invention, the first storage circuit module 142 and the second storage circuit module 144 also can be selected a configuration.That is to say that storage circuit element 140 also can only comprise first storage circuit module 142 that is positioned at first surface 202 or the second storage circuit module 144 that is positioned at second surface 204.
In embodiments of the present invention, circuit board 110 also comprises metallic conduction sheet 150.Metallic conduction sheet 150 is to be configured on the second surface 204 of circuit board 110 and between link 180 and hole 206.In the present embodiment, metallic conduction sheet 150 meets USB (universal serial bus) with the arrangement that protrudes in second contact site 354 of second surface 204 (UniversalSerial Bus abbreviates as: USB) 3.0 transmission standards on second surface 204.
Fig. 4 is the three-dimensional exploded views that another stereographic map of the stereographic map of the storage device of second embodiment of the invention, storage device that Fig. 5 is second embodiment of the invention, three-dimensional exploded view that Fig. 6 is Fig. 4 and Fig. 7 are Fig. 5.
Please with reference to Fig. 4, Fig. 5, Fig. 6 and Fig. 7, storage device comprises circuit board 410, control circuit element 420, terminal module 430, storage circuit element 440 and adhesive body 490.In the present embodiment, control circuit element 420, terminal module 430 are that (System In Package abbreviates as: SIP) technology uses adhesive body 490 to encapsulate through system in package with storage circuit element 440.
In the present embodiment, circuit board 410 has a plurality of holes 406 and a plurality of metallic contacts 408.Hole 406 is to be through to second surface 404 from first surface 402, and metallic contact 408 is to be exposed on the first surface 402, and metallic contact 408 is between link 480 and hole 406.Particularly, metallic contact 408 is that corresponding respectively hole 406 is laid.That is to say that a metallic contact can corresponding hole.
In the present embodiment, fixed sturcture 432 has front surface 502, rear surface 504 and 4 sides (that is, side 512, side 514, side 516 and side 518).Particularly, the front surface 502 of fixed sturcture 432 is towards the first surface 402 of circuit board 410 and have groove 522.
Each flexible terminal 434 has fixed part 652, second contact site 654 and first contact site 656.The fixed part 652 of flexible terminal 434 is to be fixed in the fixed sturcture 432, and second contact site 654 is to be positioned at this groove, and first contact site 656 passes the side 514 of fixed sturcture 432.Particularly, second contact site 654 passes hole 406 respectively and protrudes in second surface 404 and first contact site 656 contacting metal contact 408 respectively.
In embodiments of the present invention, circuit board 410 also comprises metallic conduction sheet 450.Metallic conduction sheet 450 is to be configured on the second surface 404 of circuit board 410 and between link 480 and hole 406.In the present embodiment, metallic conduction sheet 450 meets USB 3.0 transmission standards with the arrangement that protrudes in second contact site 654 of second surface 404 on second surface 404.
Fig. 8 is the process flow diagram of the manufacturing storage device of second embodiment of the invention.
Please with reference to Fig. 8, at first, configuration circuit plate 410 (step S801).Then, Engagement Control circuit component 420, terminal module 430 and storage circuit element 440 to circuit board 410 (step S803).Specifically, in step S803, control circuit element 420 can be engaged on the first surface 402 of circuit board 410 with storage circuit element 440.And, can be engaged in step S803 middle-end submodule group 430 on the first surface 402 of circuit board 410 so that first contact site 656 of flexible terminal 434 respectively second contact site 654 of contacting metal contact 408 and flexible terminal 434 pass the second surface 404 that hole 406 protrudes in circuit board 410 respectively.For example, control circuit element 420, terminal module 430 are engaged to circuit board 410 with the mode that storage circuit element 440 is to use routing to engage (wire bonding) or chip bonding (flip chip bonding).
Afterwards, on the first surface 402 of circuit board 410, form adhesive body 490 with coverage control circuit component 420, terminal module 430 and storage circuit element 440 (step S805).
In sum, the structure of the storage device of the embodiment of the invention and manufacturing approach thereof can be dwindled the volume of storage device effectively.
Though the present invention discloses as above with embodiment; But it is not that any those skilled in the art are not breaking away from the spirit and scope of the present invention in order to qualification the present invention; Can do suitably change and be equal to replacement, so protection scope of the present invention should be as the criterion with the scope that claims were defined.
Claims (17)
1. a storage device is characterized in that, comprising:
One circuit board; Comprise a first surface, a second surface, a link, a plurality of hole and a plurality of metallic contact with respect to said first surface; Wherein said a plurality of hole is through to said second surface from said first surface, and said a plurality of metallic contacts are exposed on the said first surface and corresponding each described hole of each said metallic contact disposes;
One control circuit element is configured on the said circuit board;
One terminal module; Be configured on the said first surface; Wherein said terminal module has a plurality of flexible terminals; Each said flexible terminal has one first contact site and one second contact site, and said a plurality of first contact sites contact said a plurality of metallic contact and said a plurality of second contact site respectively and pass said a plurality of hole respectively and protrude in said second surface;
One storage circuit element is disposed on the said circuit board and is electrically connected to said control circuit element; And
A plurality of metallic conduction sheets are configured on the said second surface, wherein said a plurality of metallic conduction sheets between said a plurality of holes and said link and said a plurality of metallic conduction sheet and said control circuit element electrically connect.
2. storage device according to claim 1 is characterized in that, said terminal module also has a fixed sturcture, and each said flexible terminal also has a fixed part, and said a plurality of fixed parts of said a plurality of flexible terminals are fixed in the said fixed sturcture.
3. storage device according to claim 2; It is characterized in that; Said fixed sturcture be shaped as a strip, said a plurality of first contact sites are piercing in a side of said fixed sturcture, and said a plurality of second contact site is piercing in another side of said fixed sturcture.
4. storage device according to claim 2; It is characterized in that; Said fixed sturcture has a front surface, a rear surface and 4 sides; Said front surface has a groove; Said a plurality of second contact site is in said groove; And said a plurality of first contact site protrudes in said 4 sides one of them
The said front surface of wherein said fixed sturcture is towards the said first surface of said circuit board.
5. storage device according to claim 1 is characterized in that, said storage circuit element is positioned on the said first surface.
6. storage device according to claim 1 is characterized in that, said storage circuit element is positioned on the said second surface.
7. storage device according to claim 1; It is characterized in that; Said storage circuit element comprises one first storage circuit module and one second storage circuit module, and the said first storage circuit module is configured on the said first surface and the said second storage circuit module is configured on the said second surface.
8. storage device according to claim 5; It is characterized in that; Also comprise an adhesive body, wherein said control circuit element is positioned on the said first surface and the covering of said adhesive body is positioned at the said control circuit element on the said first surface, said terminal module and said storage circuit element.
9. storage device according to claim 1 is characterized in that, meets USB (universal serial bus) 3.0 transmission standards in the arrangement of the above a plurality of flexible terminal of said second surface and said a plurality of metallic conduction sheets.
10. a method of making storage device is characterized in that, comprising:
Dispose a circuit board; Wherein said circuit board comprises a first surface, the second surface with respect to said first surface, a link, a plurality of hole and a plurality of metallic contact; Said a plurality of hole is through to said second surface from said first surface, and said a plurality of metallic contacts are exposed on the said first surface and corresponding each described hole of each said metallic contact disposes;
Form a plurality of metallic conduction sheets on said second surface, wherein said a plurality of metallic conduction sheets are between said link and said a plurality of hole;
Engage on a control circuit element to the said circuit board and and electrically connect said control circuit element and said a plurality of metallic conduction sheet;
Engage on a terminal module to the said first surface of said circuit board; Said terminal module has a plurality of flexible terminals; Each said flexible terminal has one first contact site and one second contact site, and said a plurality of first contact sites contact said a plurality of metallic contact and said a plurality of second contact site respectively and pass said a plurality of hole respectively and protrude in said second surface; And
Engage on a storage circuit element to the said circuit board and and electrically connect said storage circuit element and said control circuit element.
11. the method for manufacturing storage device according to claim 10; It is characterized in that; Said terminal module also has a fixed sturcture; Said fixed sturcture be shaped as a strip; Said a plurality of first contact site is piercing in a side of said fixed sturcture, and said a plurality of second contact site is piercing in another side of said fixed sturcture
The step that wherein engages on said terminal module to the said first surface of said circuit board comprises:
Engage on said fixed sturcture to the said first surface of said circuit board.
12. the method for manufacturing storage device according to claim 10; It is characterized in that; Said terminal module also has a fixed sturcture; Said fixed sturcture has a front surface, a rear surface and 4 sides; Said front surface has a groove; Said a plurality of second contact site is in said groove, and said a plurality of first contact site protrudes in said 4 sides one of them
The step that wherein engages on said terminal module to the said first surface of said circuit board comprises:
With the said front surface of said fixed sturcture towards the said first surface of said circuit board and engage on said fixed sturcture to the said first surface of said circuit board.
13. the method for manufacturing storage device according to claim 10 is characterized in that, the step that engages on said storage circuit element to the said circuit board comprises:
Engage said storage circuit element on said first surface.
14. the method for manufacturing storage device according to claim 10 is characterized in that, the step that engages on said storage circuit element to the said circuit board comprises:
Engage said storage circuit element on said second surface.
15. the method for manufacturing storage device according to claim 10; It is characterized in that; Said storage circuit element comprises one first storage circuit module and one second storage circuit module, and the step that engages on said storage circuit element to the said circuit board comprises:
The said first storage circuit module is engaged on the said first surface; And
The said second storage circuit module is bonded on the said second surface.
16. the method for manufacturing storage device according to claim 12 is characterized in that, also comprises:
Form an adhesive body and cover the said control circuit element on the said first surface, said terminal module and said storage circuit element.
17. the method for manufacturing storage device according to claim 10 is characterized in that, meets USB (universal serial bus) 3.0 transmission standards in the arrangement of the above a plurality of flexible terminal of said second surface and said a plurality of metallic conduction sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010243662.3A CN102347063B (en) | 2010-07-29 | 2010-07-29 | Storage device and method for producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010243662.3A CN102347063B (en) | 2010-07-29 | 2010-07-29 | Storage device and method for producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102347063A true CN102347063A (en) | 2012-02-08 |
| CN102347063B CN102347063B (en) | 2015-02-25 |
Family
ID=45545667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010243662.3A Active CN102347063B (en) | 2010-07-29 | 2010-07-29 | Storage device and method for producing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102347063B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107173A (en) * | 2011-11-10 | 2013-05-15 | 群联电子股份有限公司 | Storage device and manufacturing method thereof |
| CN103473200A (en) * | 2012-06-06 | 2013-12-25 | 智瑞达科技（苏州）有限公司 | Universal serial bus device and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010044227A1 (en) * | 1999-02-22 | 2001-11-22 | Amphenol Corporation | Modular HSSDC plug connector and improved receptacle therefor |
| CN2850020Y (en) * | 2005-11-14 | 2006-12-20 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
| US20090093136A1 (en) * | 2003-12-02 | 2009-04-09 | Super Talent Electronics, Inc. | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
| CN201594595U (en) * | 2009-12-30 | 2010-09-29 | 林梓梁 | USB interface and mobile terminal |
-
2010
- 2010-07-29 CN CN201010243662.3A patent/CN102347063B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010044227A1 (en) * | 1999-02-22 | 2001-11-22 | Amphenol Corporation | Modular HSSDC plug connector and improved receptacle therefor |
| US20090093136A1 (en) * | 2003-12-02 | 2009-04-09 | Super Talent Electronics, Inc. | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
| CN2850020Y (en) * | 2005-11-14 | 2006-12-20 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
| CN201594595U (en) * | 2009-12-30 | 2010-09-29 | 林梓梁 | USB interface and mobile terminal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107173A (en) * | 2011-11-10 | 2013-05-15 | 群联电子股份有限公司 | Storage device and manufacturing method thereof |
| CN103107173B (en) * | 2011-11-10 | 2016-01-20 | 群联电子股份有限公司 | Storage device and manufacture method thereof |
| CN103473200A (en) * | 2012-06-06 | 2013-12-25 | 智瑞达科技（苏州）有限公司 | Universal serial bus device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102347063B (en) | 2015-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI408799B (en) | Storage apparatus and manufacture method thereof | |
| WO2020259322A1 (en) | Electronic device | |
| CN102082373B (en) | Chip-on-board (COB) storing device | |
| US8979596B2 (en) | Storage interface module | |
| CN103747611A (en) | Solid device | |
| CN101782888A (en) | Low thickness eSATA storage device | |
| CN102324637A (en) | Electrical-connector plug and socket, double-surfaced U disk, card reader and interface converter | |
| CN101452744B (en) | Mini side disk with plug-in resisting concatenation groove | |
| CN102347063B (en) | Storage device and method for producing same | |
| CN217693391U (en) | Electronic device | |
| CN217562852U (en) | Electronic equipment, card connector, card seat and card seat assembly | |
| CN101826666A (en) | Double junction storage device | |
| CN201465166U (en) | Double-interface storage device | |
| CN202384522U (en) | Electric connector plug and socket, double-faced U disk, convenient slot card reader and convenient interface converter | |
| CN201365048Y (en) | eSATA connector with double interfaces | |
| CN103107173B (en) | Storage device and manufacture method thereof | |
| CN218676064U (en) | Memory card | |
| CN203014102U (en) | Novel cellphone mobile power plug | |
| CN101859589B (en) | Minitype flash memory device | |
| WO2024067341A1 (en) | Electronic device | |
| US9585272B2 (en) | Storage device | |
| CN117479550B (en) | Chip packaging structure and manufacturing method thereof | |
| CN207800737U (en) | A kind of battery pack sampling structure | |
| CN101740101B (en) | Access device and method thereof | |
| CN104064209B (en) | Memory interface component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |