CN102345092A - 涂层、具有该涂层的被覆件及该被覆件的制备方法 - Google Patents

涂层、具有该涂层的被覆件及该被覆件的制备方法 Download PDF

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CN102345092A
CN102345092A CN2010102400744A CN201010240074A CN102345092A CN 102345092 A CN102345092 A CN 102345092A CN 2010102400744 A CN2010102400744 A CN 2010102400744A CN 201010240074 A CN201010240074 A CN 201010240074A CN 102345092 A CN102345092 A CN 102345092A
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张新倍
陈文荣
蒋焕梧
陈正士
马闯
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0664—Carbonitrides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

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Abstract

本发明提供一种涂层，该涂层包括一NiTiCN沉积层。该涂层具有良好的硬度和韧性。本发明还提供一种具有上述涂层的被覆件。该被覆件包括一基体、形成于该基体的一NiTi结合层及形成于该NiTi结合层上的一涂层。该涂层包括一NiTiCN沉积层。该NiTi结合层与NiTiCN沉积层结合，能显著提高该涂层的硬度及韧性。另外，本发明还提供了上述被覆件的制备方法。

Description

涂层、具有该涂层的被覆件及该被覆件的制备方法
技术领域
本发明涉及一种涂层、具有该涂层的被覆件及该被覆件的制备方法，特别涉及一种真空镀膜层、具有该真空镀膜层的被覆件及该被覆件的制备方法。
背景技术
PVD镀膜工艺在工业领域有着广泛的应用，其中，TiN、TiAlN薄膜镀覆在刀具或模具表面能大幅提高刀具和模具的使用寿命。然而，随着金属切削加工朝高切削速度、高进给速度、高可靠性、长寿命、高精度和良好的切削控制性方面发展，对表面涂层的性能提出了更高的要求。传统的TiN、TiAlN涂层在硬度、韧性等方面已经不能满足要求。
研究发现，在TiN中掺入Si可以进一步提高其硬度，但是韧性较低，在用于切削高硬度材料时，刀具的刃口易产生卷刃。
发明内容
有鉴于此，有必要提供一种具有良好硬度及韧性的涂层。
另外，还有必要提供一种应用上述涂层的被覆件。
另外，还有必要提供一种上述被覆件的制备方法。
一种涂层，包括一沉积层，该沉积层为一NiTiCN层
一种被覆件，包括一基体、形成于该基体的一结合层及形成于该结合层上的一涂层，该涂层包括一沉积层。该结合层为一NiTi层，该沉积层为一NiTiCN层。
一种被覆件的制备方法，包括以下步骤：
提供一基体；
将基体放入一镀膜机的真空室内，使用镍钛合金靶，抽真空至8.0×10-3Pa，通入流量为100～300sccm的氩气，调节偏压至-100～-300V，通过磁控溅射镀膜方法在该基体上形成一结合层，该结合层为一NiTi层；
通入流量为10～200sccm的氮气及流量为10～100sccm乙炔气体，调节真空室温度至100～200℃，于该结合层上形成一沉积层，该沉积层为一NiTiCN层。
相较于现有技术，本发明在形成NiTiCN沉积层时，N原子优先与Ti原子形成TiN晶粒，Ni原子则以独立形式偏聚在晶界上形成Ni相，其可抑制TiN晶粒的长大，因而使得沉积层中的TiN晶粒的粒径维持在纳米级，该纳米级的TiN晶粒可有效提高所述涂层的硬度和韧性。所述的被覆件在基体与沉积层之间设置一NiTi结合层，由于该结合层的化学稳定性与热膨胀系数介于基体与沉积层之间，可有效提高涂层与基体之间的结合力。所述涂层的硬度、韧性的提高及涂层与基体之间结合力的增强，可显著地提高所述涂层的使用性能。
附图说明
图1为本发明一较佳实施例的涂层的剖视图；
图2为本发明一较佳实施例的被覆件的剖视图；
图3为本发明一较佳实施例的被覆件的制备方法的流程图。
主要元件符号说明
基体          10
结合层        20
涂层          30
沉积层        31
颜色层        33
被覆件        40
具体实施方式
请参阅图1，本发明一较佳实施例的涂层30包括一沉积层31。该沉积层31为一NiTiCN层，其厚度为0.5～3μm。该沉积层31通过磁控溅射法形成。
可以理解的，在该沉积层31的表面还可镀覆一颜色层33，以增强该涂层30的美观性。
请参阅图2，本发明一较佳实施例的被覆件40包括一基体10、形成于该基体10的一结合层20及形成于该结合层20上的所述涂层30。该基体10的材质可以为高速钢、硬质合金及不锈钢等。该被覆件40可以为各类切削刀具、精密量具及模具等。
该结合层20为一NiTi层，其厚度为0.05～0.5μm。该结合层20通过磁控溅射法沉积形成。该结合层20的化学稳定性与热膨胀系数介于基体10与沉积层31之间，因而可有效提高涂层30与基体10之间的结合力。
请进一步参见图3，该被覆件40的方法主要包括如下步骤：
S1：提供一基体10。
所述基体10的材质可以为高速钢、硬质合金、金属陶瓷及烧结金刚石等。
S2：对该基体10进行前处理。
将基体10放入盛装有乙醇及/或丙酮溶液的超声波清洗器中进行震动清洗，以除去基体10表面的杂质和油污等。清洗完毕后烘干备用。
对经上述处理后的基体10的表面进行氩气等离子体清洗，进一步去除基体10表面的油污，以改善基体10表面与后续涂层的结合力。该等离子体清洗的具体操作及工艺参数可为：将基体10放入一磁控溅射镀膜机(南方创新公司制造，型号为SM-1100H-D)的真空室内，将该真空室抽真空至8.0×10-3Pa，通入流量为300～600sccm(标准状态毫升/分钟)的氩气(纯度为99.999％)，调节偏压至-300～-800V，对基体10表面进行等离子体轰击，轰击时间为3～10min。
S3：于该基体10上形成一结合层20。该结合层20为一NiTi层。
在对基体10进行等离子体清洗后，开启镍钛合金靶(该镍钛合金靶中Ni的质量百分含量为20～80％)的电源，调节氩气流量至100～300sccm，优选为150sccm；调节偏压至-100～-300V，开始沉积结合层20。该结合层20的沉积时间为20～60min。
S4：于该结合层20上形成一沉积层31。该沉积层31为一NiTiCN层。
形成所述结合层20后，向真空室中通入流量为10～200sccm的高纯度氮气及流量为10～100sccm的高纯度乙炔气体，调节真空室温度至100～200℃，开始沉积沉积层31。该沉积层31的沉积时间为90～200min。
关闭负偏压及镍钛合金靶电流，停止通入氩气、氮气及乙炔气体，待所述涂层30冷却后，向真空室内通入空气，打开真空室门，取出镀覆好的被覆件40。
可以理解的，制备所述被覆件40的方法还可包括在该沉积层31的表面镀覆一颜色层33，以增强被覆件40的美观性。
本发明在形成沉积层31时，选择镍钛合金作为靶材，以氮气及乙炔气体作为反应性气体，由于Ni不易与氮气反应，沉积过程中氮气中的N原子优先与Ti原子形成TiN晶粒，Ni原子则以独立形式偏聚在晶界上形成Ni相，其可抑制TiN晶粒的长大，因而使得沉积层31中的TiN晶粒的粒径维持在纳米级，该纳米级的TiN晶粒可有效提高所述涂层30的硬度和韧性。
所述的被覆件40在基体10与沉积层31之间设置一NiTi结合层20，由于该结合层20的化学稳定性与热膨胀系数介于基体10与沉积层31之间，因而可有效提高涂层30与基体10之间的结合力。所述涂层30的硬度、韧性的提高及涂层30与基体10之间结合力的增强，可显著地提高所述涂层30的使用性能。

Claims (10)

1.一种涂层，包括一沉积层，其特征在于：该沉积层为一NiTiCN层。
2.如权利要求1所述的涂层，其特征在于：该沉积层的厚度为0.5～3μm。
3.如权利要求1所述的涂层，其特征在于：该涂层还包括一形成于该沉积层上的颜色层。
4.一种被覆件，包括一基体、形成于该基体的一结合层及形成于该结合层上的一涂层，该涂层包括一沉积层，其特征在于：该结合层为一NiTi层，该沉积层为一NiTiCN层。
5.如权利要求4所述的被覆件，其特征在于：该结合层的厚度为0.05～0.5μm。
6.如权利要求5所述的被覆件，其特征在于：该基体为高速钢、硬质合金及不锈钢中的一种。
7.一种被覆件的制备方法，包括以下步骤：
提供一基体；
将基体放入一镀膜机的真空室内，使用镍钛合金靶，抽真空至8.0×10-3Pa，通入流量为100～300sccm的氩气，调节偏压至-100～-300V，通过磁控溅射镀膜方法在该基体上形成一结合层，该结合层为一NiTi层；
通入流量为10～200sccm的氮气及流量为10～100sccm乙炔气体，调节真空室温度至100～200，于该结合层上形成一沉积层，该沉积层为一NiTiCN层。
8.如权利要求7所述的被覆件的制备方法，其特征在于：该结合层的沉积时间为20～60min。
9.如权利要求7所述的被覆件的制备方法，其特征在于：该镍钛合金靶中镍的质量百分含量为20～80％。
10.如权利要求7所述的被覆件的制备方法，其特征在于：该沉积层的沉积时间为90～200min。
CN2010102400744A 2010-07-29 2010-07-29 涂层、具有该涂层的被覆件及该被覆件的制备方法 Pending CN102345092A (zh)

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CN109136844A (zh) * 2018-10-12 2019-01-04 佛山科学技术学院 一种玫瑰金镀层及其制备工艺

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CN102628156A (zh) * 2012-04-09 2012-08-08 上海仟纳真空镀膜科技有限公司 一种pvd超黑涂层
CN109136844A (zh) * 2018-10-12 2019-01-04 佛山科学技术学院 一种玫瑰金镀层及其制备工艺

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