CN102331879A - Touch panel with driving chip and manufacturing method thereof - Google Patents
Touch panel with driving chip and manufacturing method thereof Download PDFInfo
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- CN102331879A CN102331879A CN201110296277A CN201110296277A CN102331879A CN 102331879 A CN102331879 A CN 102331879A CN 201110296277 A CN201110296277 A CN 201110296277A CN 201110296277 A CN201110296277 A CN 201110296277A CN 102331879 A CN102331879 A CN 102331879A
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- driving
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- ito glass
- lower floor
- contact panel
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Abstract
The invention discloses a touch panel with a driving chip, which comprises an upper conductive layer and a lower ITO (indium tin oxide) glass layer which are jointed with each other, wherein a circuit of the upper conductive layer is transferred to the lower ITO glass layer through a transfer medium, and after the circuit of the upper layer is transferred to the lower ITO glass layer, a pin of an IC (integrated circuit) driving chip and two circuit layers communicated by the transfer medium are contra-positioned at the surface of the lower ITO glass layer, and the IC driving chip is bound by an anisotropic conductive adhesive. The touch panel with the driving chip and a manufacturing method thereof are provided by the invention to provide a novel concept in structure and a perfect scheme in manufacturing process, and fundamentally solve the difficulty of IC driving and panel wiring of the touch panel.
Description
Technical field
The present invention relates to a kind of touch panel structure provided and manufacturing approach, relate in particular to a kind of Drive Structure and manufacturing approach thereof that can be applicable to contact panels such as resistance-type, condenser type, piezoelectric type, multi-point electric resistance formula.
Background technology
Directly be bundled on glass through aeolotropic conductive the IC chip for driving; Thereby realize that its electrically conducting (is COG; Chip On Glass), be the current liquid crystal display module field that is mainly used in, the especially a kind of novel drive IC assembling mode of small-medium size liquid crystal module.And along with the further extension of using, the effect of its driving liquid crystal and stability have obtained the approval of industry.
On the other hand, the appearance of contact panel has day by day replaced physical devices such as conventional button, button, switch, becomes a kind of electric control mode of novelty.And contact panel development in recent years is swift and violent, and the contact panel of processing based on characteristics such as resistance, electric capacity, piezoelectricity emerges in an endless stream.Yet current situation: the upper strata conductive layer and another layer internal wiring lower floor ito glass that mainly comprise one deck internal wiring as the composition structure of contact panel from current contact panel; Two-layer circuit is drawn from the edge of contact panel, connects driving arrangement then.This kind conventional structure exists wiring, the complicated defective of lead-in wire, and contact panel is processed the back and is connected with driving arrangement inconvenience is arranged more.
Summary of the invention
Defective in view of above-mentioned prior art exists the objective of the invention is to propose a kind of contact panel and manufacturing approach thereof with chip for driving, solves the long-term difficulty that promotes the contact panel driveability.
One object of the present invention will be achieved through following technical scheme:
A kind of contact panel with chip for driving; Said contact panel comprises upper strata conductive layer and the lower floor's ito glass that fits; Said upper strata conductive layer defines the Touch Zone of said contact panel; It is characterized in that: the circuit that the link tester of said upper strata conductive layer is crossed switching medium and lower floor's ito glass joins, and mounts on the said lower floor ito glass to bind the IC chip for driving is arranged, and the two-layer circuit that is connected through the medium of transferring inserts the corresponding pin of IC chip for driving on lower floor's ito glass.
Preferably, said lower floor ito glass edge is provided with flexible PCB, and said flexible PCB is communicated with the output pin of IC chip for driving.And said IC chip for driving and flexible PCB are located at the lower floor ito glass surface outside the scope of Touch Zone.
The manufacturing approach of a kind of contact panel of another object of the present invention; Comprise preprocessing upper strata conductive layer and lower floor's ito glass respectively; Then both corresponding link testers are crossed the switching medium and engage the composition contact panel; It is characterized in that: at the upper strata conductive layer with after the lower floor ito glass engages, the two-layer circuit and the pin contraposition of IC chip for driving that will be connected through the switching medium, and the employing aeolotropic conductive is bound the IC chip for driving on lower floor ito glass surface.
Further, after said IC chip for driving is bound, continue to bind a flexible PCB at the edge of lower floor's ito glass, and with output pin respectively corresponding join of said flexible PCB with the IC chip for driving.Wherein said flexible PCB adopts the mode of single face conducting, antarafacial hot pressing to be bundled on the ito glass of upper strata.
The present invention is a kind of with the contact panel of chip for driving and the proposition of manufacturing approach thereof, for touch panel provides perfect scheme on thinking new on the structure and the manufacturing process, solved fundamentally that contact panel IC drives and the difficult problem of panel wiring.
Following constipation closes the embodiment accompanying drawing, and specific embodiments of the invention is done further to detail, so that technical scheme of the present invention is easier to understand, grasp.
Description of drawings
Fig. 1 is the structural representation of contact panel of the present invention;
Fig. 2 is the structural representation at another visual angle of contact panel of the present invention.
Embodiment
The structural representation at two visual angles of contact panel of the present invention one preferred embodiment as depicted in figs. 1 and 2, from visible shown in the figure, this contact panel has chip for driving, and this contact panel comprises the upper strata conductive layer 1 and lower floor's ito glass 2 that fits.Wherein this upper strata conductive layer 1 defines the Touch Zone of said contact panel, and it can be ITO FILM (present embodiment), also can be ito glass.
The circuit that the link tester of this upper strata conductive layer 1 is crossed switching medium 3 and lower floor's ito glass 2 joins, and the medium 3 of wherein transferring is conducting mediums such as general reference switching silver, ACF, ACP.What contact panel of the present invention was different with conventional art is: mounting on this lower floor's ito glass 2 to bind has IC chip for driving 4, and the two-layer circuit that warp switching medium 3 is connected inserts the corresponding pin of IC chip for driving 4 on lower floor's ito glass 2.And then these lower floor's ito glass 2 edges connect establishes a flexible PCB 5, and flexible PCB 5 is distinguished corresponding one by one connection with the output pin of IC chip for driving 4.
For keeping the integrality and the contact panel integral aesthetic property of the operation of contact panel Touch Zone, the present invention designs this IC chip for driving 4 and flexible PCB 5 is located at lower floor's ito glass 2 surfaces outside the scope of Touch Zone.
From manufacturing approach: the preorder technology of this contact panel comprises preprocessing upper strata conductive layer and lower floor's ito glass respectively, then both corresponding link testers is crossed the switching medium and engages the composition contact panel.Especially; The upper strata conductive layer engage with the lower floor ito glass and functional test after; To link to each other with the pin contraposition of IC chip for driving through the two-layer circuit that is connected of switching medium on lower floor ito glass surface, and aeolotropic conductive such as employing ACF is bound the IC chip for driving.For further carrying out the allomeric function test of contact panel; After this IC chip for driving is bound; Continue to bind a flexible PCB at the edge of lower floor's ito glass; And, conveniently be designed to the routine data transmission interface thus with corresponding respectively the joining of output pin of said flexible PCB with the IC chip for driving, contact panel is outreached test.What deserves to be mentioned is that flexible PCB is the single face wiring board here, adopt the mode of single face conducting, antarafacial hot pressing to be bundled on the ito glass of upper strata; Cost is than the dual platen low price on the one hand, and the hot pressing of being more convenient for is on the other hand bound.
The present invention is a kind of with the contact panel of chip for driving and the proposition of manufacturing approach thereof, for touch panel provides perfect scheme on thinking new on the structure and the manufacturing process, solved fundamentally that contact panel IC drives and the difficult problem of panel wiring.
Certainly, more than only be concrete exemplary applications of the present invention, protection scope of the present invention is not constituted any limitation.Except that the foregoing description, the present invention can also have other embodiment.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop within the present invention's scope required for protection.
Claims (6)
1. contact panel with chip for driving; Said contact panel comprises upper strata conductive layer and the lower floor's ito glass that fits; Said upper strata conductive layer defines the Touch Zone of said contact panel; It is characterized in that: the circuit that the link tester of said upper strata conductive layer is crossed switching medium and lower floor's ito glass joins, and mounts on the said lower floor ito glass to bind the IC chip for driving is arranged, and the two-layer circuit that is connected through the medium of transferring inserts the corresponding pin of IC chip for driving on lower floor's ito glass.
2. a kind of contact panel with chip for driving according to claim 1 is characterized in that: said lower floor ito glass edge is provided with flexible PCB, and said flexible PCB is communicated with the output pin of IC chip for driving.
3. a kind of contact panel with chip for driving according to claim 2 is characterized in that: said IC chip for driving and flexible PCB are located at the lower floor ito glass surface outside the scope of Touch Zone.
4. the manufacturing approach of the said a kind of contact panel of claim 1; Comprise preprocessing upper strata conductive layer and lower floor's ito glass respectively; Then both corresponding link testers are crossed the switching medium and engage the composition contact panel; It is characterized in that: at the upper strata conductive layer with after the lower floor ito glass engages, the two-layer circuit and the pin contraposition of IC chip for driving that will be connected through the switching medium, and the employing aeolotropic conductive is bound the IC chip for driving on lower floor ito glass surface.
5. the manufacturing approach of a kind of contact panel according to claim 4; It is characterized in that: after said IC chip for driving is bound; Continue to bind a flexible PCB at the edge of lower floor's ito glass, and with output pin respectively corresponding join of said flexible PCB with the IC chip for driving.
6. the manufacturing approach of a kind of contact panel according to claim 5 is characterized in that: said flexible PCB adopts the mode of single face conducting, antarafacial hot pressing to be bundled on the ito glass of upper strata.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110296277A CN102331879A (en) | 2011-09-27 | 2011-09-27 | Touch panel with driving chip and manufacturing method thereof |
| TW100147043A TW201314304A (en) | 2011-09-27 | 2011-12-19 | Touch panel having driver chip and method of manufacturing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110296277A CN102331879A (en) | 2011-09-27 | 2011-09-27 | Touch panel with driving chip and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102331879A true CN102331879A (en) | 2012-01-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110296277A Pending CN102331879A (en) | 2011-09-27 | 2011-09-27 | Touch panel with driving chip and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102331879A (en) |
| TW (1) | TW201314304A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103336640A (en) * | 2013-06-18 | 2013-10-02 | 苏州市健邦触摸屏技术有限公司 | Capacitive touch screen and manufacturing method thereof |
| CN103365495A (en) * | 2012-03-27 | 2013-10-23 | 苏州市健邦触摸屏技术有限公司 | Projection-type capacitive multi-touch screen |
| CN103365496A (en) * | 2012-03-27 | 2013-10-23 | 苏州市健邦触摸屏技术有限公司 | Capacitive touch screen with circuit on panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226287A (en) * | 2008-02-14 | 2008-07-23 | 友达光电股份有限公司 | Sensing structure of display |
| CN101561739A (en) * | 2008-04-14 | 2009-10-21 | 比亚迪股份有限公司 | Resistance type touch screen and production method thereof |
| US20110140720A1 (en) * | 2009-12-15 | 2011-06-16 | Sony Corporation | Electrostatic capacitance-type input device, method of testing electrostatic capacitance-type input device, and driving device for electrostatic capacitance-type input device |
-
2011
- 2011-09-27 CN CN201110296277A patent/CN102331879A/en active Pending
- 2011-12-19 TW TW100147043A patent/TW201314304A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226287A (en) * | 2008-02-14 | 2008-07-23 | 友达光电股份有限公司 | Sensing structure of display |
| CN101561739A (en) * | 2008-04-14 | 2009-10-21 | 比亚迪股份有限公司 | Resistance type touch screen and production method thereof |
| US20110140720A1 (en) * | 2009-12-15 | 2011-06-16 | Sony Corporation | Electrostatic capacitance-type input device, method of testing electrostatic capacitance-type input device, and driving device for electrostatic capacitance-type input device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103365495A (en) * | 2012-03-27 | 2013-10-23 | 苏州市健邦触摸屏技术有限公司 | Projection-type capacitive multi-touch screen |
| CN103365496A (en) * | 2012-03-27 | 2013-10-23 | 苏州市健邦触摸屏技术有限公司 | Capacitive touch screen with circuit on panel |
| CN103336640A (en) * | 2013-06-18 | 2013-10-02 | 苏州市健邦触摸屏技术有限公司 | Capacitive touch screen and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201314304A (en) | 2013-04-01 |
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Application publication date: 20120125 |