TW201314304A - Touch panel having driver chip and method of manufacturing thereof - Google Patents

Abstract

An embodiment of the instant disclosure illustrates a touch panel having a driver chip. The touch panel includes an upper conductive layer and a bottom indium-tin-oxide (ITO) glass layer. The circuit of the upper conductive layer passes through the transition medium into the bottom ITO glass layer. And after the circuit from the upper layer is transferred to the bottom ITO layer, the pins of the driver chip are electrically connected to the corresponding circuit of the two layers on the surface of the bottom ITO layer. The instant disclosure provides a touch panel having a driver chip and a manufacturing method thereof. Furthermore, the instant disclosure provides an innovative structural design of the touch panel and the optimized manufacturing method thereof. Thereby, the difficulties of the circuit layout of the panel and the driving of the integrated circuit of the touch panel are overcome from the fundamental basis.

Description

Touch panel with driving wafer and manufacturing method thereof

The invention relates to a touch panel structure and a manufacturing method thereof, and in particular to a driving structure applicable to a touch panel such as a resistive type, a capacitive type, a piezoelectric type, a multi-point resistive type, and a manufacturing method thereof.

The integrated circuit (IC) driven wafer is directly fixed on the glass through the anisotropic conductive paste to realize its electrical conduction (ie, Chip On Glass, COG), which is currently mainly used in the field of liquid crystal display modules, especially A new type of drive integrated circuit assembly method for small and medium size liquid crystal modules. And with the further extension of the application, the effect and stability of its driving liquid crystal display has been recognized by the industry.

On the other hand, the advent of touch panels has gradually replaced traditional physical devices such as buttons, buttons, switches, etc., and has become a novel electrical control method. In recent years, touch panels have developed rapidly, and touch panels based on characteristics such as resistance, capacitance, and piezoelectricity have emerged in an endless stream. However, from the current development status of the touch panel, the composition of the touch panel mainly includes an upper conductive layer of internal wiring and another layer of internal wiring of Indium Tin Oxide (ITO) glass, and two layers of lines are The edge of the touch panel is led out, which in turn is connected to the drive device. The conventional structure has the defects of complicated wiring and leads, and it is inconvenient to connect the driving device after the touch panel is made.

In view of the above drawbacks of the prior art, the object of the present invention is to provide a touch panel having a driving wafer and a manufacturing method thereof, which solves the long-term difficulty in improving the driving performance of the touch panel.

An object of the present invention is achieved by the following technical solutions: a touch panel having a driving wafer, the touch panel comprising a matching upper conductive layer and a lower indium tin oxide glass, wherein the upper conductive layer defines The touch area of the touch panel is characterized in that: the line of the upper conductive layer is connected to the line of the underlying indium tin oxide glass through the switching medium, and the lower layer of indium tin oxide glass is mounted with the integrated body The circuit drives the wafer, and the two layers connected via the switching medium are connected to the corresponding pins of the integrated circuit driving wafer on the lower indium tin oxide glass.

Preferably, the lower layer of indium tin oxide glass is provided with a flexible circuit board, and the flexible circuit board is in communication with an output pin of the integrated circuit driving chip. Moreover, the integrated circuit driving chip and the flexible circuit board are disposed on the surface of the lower indium tin oxide glass outside the range of the touch area.

Another object of the present invention is to provide a method for manufacturing a touch panel, comprising separately pre-processing an upper conductive layer and a lower indium tin oxide glass, and then bonding the corresponding lines through the switching medium to form a touch panel, wherein: After the upper conductive layer is bonded to the underlying indium tin oxide glass, the two layers of the interconnected dielectric via the surface of the lower indium tin oxide glass are respectively connected to the pins of the integrated circuit driving wafer, and the opposite direction is used. The conductive paste drives the integrated circuit to drive the wafer.

Further, after the integrated circuit drives the wafer to be fixed, a flexible circuit board is further fixed on the edge of the lower indium tin oxide glass, and the flexible circuit board and the output pin of the integrated circuit driving chip are respectively connected to each other. The flexible circuit board is fixed on the upper indium tin oxide glass by single-sided conduction and isothermal pressing.

The invention provides a touch panel with a driving chip and a manufacturing method thereof, and provides a new structural idea and a perfect manufacturing process for the touch panel, thereby fundamentally solving the touch panel integrated circuit driving and panel wiring. Puzzle.

The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, so that the technical solutions of the present invention can be more easily understood and understood.

[First Embodiment]

FIG. 1 and FIG. 2 are schematic diagrams showing the structure of two preferred embodiments of the touch panel of the present invention. As can be seen from the figure, the touch panel has a driving chip, and the touch panel includes a matching upper layer. Conductive layer 1 and underlying indium tin oxide glass 2. The upper conductive layer 1 defines a touch area of the touch panel, which may be an indium tin oxide film (this embodiment) or an indium tin oxide glass.

The line of the upper conductive layer 1 is connected to the line of the lower indium tin oxide glass 2 through the transfer medium 3, wherein the transfer medium 3 is generally referred to as silver, ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), etc. Conductive medium. The touch panel of the present invention is different from the conventional technology in that the lower layer indium tin oxide glass 2 is mounted with an integrated circuit driving wafer 4, and the two layers connected via the switching medium 3 are on the lower indium tin oxide glass 2. Accessing the integrated circuit drives the corresponding pins of the wafer 4. Further, a flexible circuit board 5 is connected to the edge of the lower indium tin oxide glass 2, and the flexible circuit board 5 and the output pins of the integrated circuit driving wafer 4 are respectively connected in one-to-one correspondence.

In order to maintain the integrity of the touch panel touch area and the overall aesthetics of the touch panel, the present invention designs the integrated circuit driving chip 4 and the flexible circuit board 5 to be disposed under the touch area to inferior indium tin oxide glass. 2 surface.

From the manufacturing method, the pre-processing of the touch panel includes pre-processing the upper conductive layer and the lower indium tin oxide glass, and then bonding the corresponding lines through the switching medium to form a touch panel. In particular, after the upper conductive layer is bonded to the underlying indium tin oxide glass and functionally tested, the two layers of the interconnected via the via dielectric are connected to the pins of the integrated circuit driving wafer on the lower indium tin oxide glass surface. And using an anisotropic conductive paste such as ACF to drive the integrated circuit to drive the wafer. In order to further perform the overall functional test of the touch panel, after the integrated circuit drives the wafer to be fixed, a flexible circuit board is further fixed on the edge of the lower indium tin oxide glass, and the flexible circuit board and the integrated circuit drive the wafer. The output pins are respectively connected to each other, thereby being conveniently designed into a conventional data transmission interface, and the touch panel is tested in an external connection. It is worth mentioning that the flexible circuit board is a single-sided circuit board, which is fixed on the upper indium tin oxide glass by single-sided conduction and different-surface hot pressing; on the one hand, the cost is cheaper than the double panel, on the other hand, Easy to heat and fix.

The invention provides a touch panel with a driving chip and a manufacturing method thereof, and provides a new structural idea and a perfect manufacturing process for the touch panel, thereby fundamentally solving the touch panel integrated circuit driving and panel wiring. Puzzle.

Of course, the above is only a specific application example of the present invention, and does not impose any limitation on the scope of protection of the present invention. In addition to the above-described embodiments, the present invention may have other embodiments. Any technical solution formed by equivalent replacement or equivalent transformation falls within the scope of the present invention.

1. . . Conductive layer

2. . . Indium tin oxide glass

3. . . Transfer media

4. . . Driver chip

5. . . Flexible circuit board

1 is a schematic structural view of a touch panel of the present invention.

2 is a schematic structural view of another view of the touch panel of the present invention.

1. . . Conductive layer

2. . . Indium tin oxide glass

3. . . Transfer media

4. . . Driver chip

5. . . Flexible circuit board

Claims (6)

A touch panel having a driving chip, the touch panel includes a matching upper conductive layer and a lower indium tin oxide glass, and the upper conductive layer defines a touch area of the touch panel, wherein: The line of the upper conductive layer is connected to the line of the underlying indium tin oxide glass through the switching medium, and the lower layer of indium tin oxide glass is mounted with the integrated circuit driving chip mounted thereon, and the two layers of the line connected by the switching medium The corresponding pins of the integrated circuit driving wafer are connected to the underlying indium tin oxide glass. The touch panel with a driving chip according to claim 1, wherein the lower layer of indium tin oxide glass is provided with a flexible circuit board, and the flexible circuit board and the integrated circuit drive the output of the wafer. Pin connected. The touch panel with a driving chip according to the second aspect of the invention is characterized in that: the integrated circuit driving chip and the flexible circuit board are disposed on a surface of the lower indium tin oxide glass outside the range of the touch area. A manufacturing method of a touch panel with a driving chip, comprising separately pre-processing an upper conductive layer and a lower indium tin oxide glass, and then combining the corresponding lines through the switching medium to form a touch panel, wherein: After the upper conductive layer is bonded to the underlying indium tin oxide glass, the two layers of the interconnected dielectric via the surface of the lower indium tin oxide glass are respectively connected to the pins of the integrated circuit driving wafer, and the opposite direction conductive is used. The glue drives the integrated circuit to drive the wafer. The method for manufacturing a touch panel having a driving chip according to claim 4, wherein the integrated circuit drives the wafer to be fixed, and then continues to fix a flexible circuit board on the edge of the lower indium tin oxide glass. And connecting the flexible circuit board and the output pins of the integrated circuit driving chip respectively. The method for manufacturing a touch panel with a driving chip according to claim 5, wherein the flexible circuit board is fixed on the upper indium tin oxide glass by single-sided conduction and isothermal pressing. .