CN102328504B - Device and method for solidifying ink on flexible circuit board - Google Patents
Device and method for solidifying ink on flexible circuit board Download PDFInfo
- Publication number
- CN102328504B CN102328504B CN 201110149265 CN201110149265A CN102328504B CN 102328504 B CN102328504 B CN 102328504B CN 201110149265 CN201110149265 CN 201110149265 CN 201110149265 A CN201110149265 A CN 201110149265A CN 102328504 B CN102328504 B CN 102328504B
- Authority
- CN
- China
- Prior art keywords
- unit
- ink
- module
- flex circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Printing Methods (AREA)
Abstract
The invention relates to a device and method for solidifying ink on a flexible circuit board. The device for solidifying ink on a flexible circuit board comprises a winding device, a drying device and an unwinding device, wherein the drying device comprises a transmission unit of which the width is more than twice that of a flexible circuit board needing ink solidification. The flexible circuit board enters the transmission unit of the drying device by virtue of the winding device, is subjected to ink solidification during the transmission process of the transmission unit and then is unwound by the unwinding device. In addition, the invention also provides a method for solidifying ink by using the device. The device for solidifying ink on a flexible circuit board can perform roll-to-roll continuous solidification of flexible circuit boards, thus the production efficiency is improved; moreover, the flexible circuit board can be prevented from absorbing foreign matters and generating creases during the ink solidification process, thus the quality of the flexible circuit board can be improved.
Description
Technical field
The present invention relates to a kind of apparatus and method for solidifying printing ink of flexible circuit board.
Background technology
At present, often by printing photosensitive solder resist printing ink at flex circuit application, with the welding resistance of assurance flex circuit application and the precision of welding spot size! And welding resistance ink printing process mainly comprises following 5 steps, is respectively ink printing, printing ink preparation drying, printing ink exposure, printing ink phenomenon, ink solidification.And the at present curing of welding resistance printing ink is undertaken by baking oven often, and each time of solidifying is about 2 hours, can only process individual goods at every turn, and production efficiency is low; And when printed flex circuit application is ultrathin products when (thickness is about 150 μ m), its take and the arrangement process in as easy as rolling off a log generation folding line, thereby reduce the quality of flex circuit application; In addition, flex circuit application is being placed before baking oven carries out ink solidification, need to treat to add all-glass paper between the flex circuit application of ink solidification, and all-glass paper adheres to foreign matter easily, under the baking oven hot conditions, the foreign matter that adheres on the all-glass paper shifts easily and is adsorbed on the flex circuit application, thereby causes the flex circuit application quality low.
Summary of the invention
In order to overcome the above-mentioned deficiency of prior art, one aspect of the present invention provides a kind of device for solidifying printing ink of flexible circuit board, this device can carry out continuous ink solidification to flex circuit application, improved production efficiency, can also prevent that flex circuit application from adsorbing foreign matter and folding line occurring in the ink solidification process, improved the quality of flex circuit application.In addition, the present invention also provides a kind of above-mentioned method of carrying out ink solidification for the device of solidifying printing ink of flexible circuit board of utilizing.
The present invention is achieved in that a kind of device for solidifying printing ink of flexible circuit board, comprising: be involved in device, drying unit and roll out device; Described drying unit comprises delivery unit and heating unit, described heating unit is used for the ink solidification of flex circuit application, be that described heating unit surrounding space to described delivery unit under the control of described control module heats, thereby realize the ink solidification of flex circuit application; Described delivery unit is used for transmitting flex circuit application, and the width of described delivery unit is more than 2 times of flex circuit application width that need carry out ink solidification; Flex circuit application enters into the delivery unit of drying unit by being involved in device, and realizes ink solidification in being transmitted the process that transmits the unit, and then rolls out by rolling out device.
By said apparatus, can carry out to flex circuit application the continuous ink solidification of volume to volume, improved production efficiency, can also prevent that flex circuit application from adsorbing foreign matter and folding line occurring in the ink solidification process, improved the quality of flex circuit application.
Described delivery unit comprises conveyer belt, and described conveyer belt is the network chain shape, is made by metal material.Like this, in transport process, it is more even to be heated for flex circuit application (no matter being single face or two-sided), fully, has further improved speed and the quality of ink solidification.
In order further to realize the automatic control in the solidifying printing ink of flexible circuit board process, described drying unit adopts reflow soldering apparatus, also comprises:
Control module is for the duty of control drying unit;
Driver element, described driver element drive delivery unit and transmit under the control of described control module;
Described heating unit adopts at least a in infrared heating mechanism, Far-infrared Heating mechanism and the hot body.
Described infrared heating mechanism realizes heating function by the emission infrared ray, thereby is used for the ink solidification of flex circuit application.Described Far-infrared Heating mechanism is by emitting far-infrared realization heating function, thereby is used for the ink solidification of flex circuit application.Then described hot body blows to hot blast described delivery unit by air is heated, thereby realizes the ink solidification of flex circuit application.
Preferably, described heating unit adopts infrared heating mechanism and hot body; Described infrared heating mechanism comprises the first infrared heating module and the second infrared heating module, described the first infrared heating module and the second infrared heating module include a plurality of infrared heaters, the relative up and down both sides of being located at described delivery unit with the second infrared heating module of described the first infrared heating module; Be equipped with infrared blocking unit between described the first infrared heating module and the second infrared heating module and the delivery unit, described infrared blocking unit is provided with a plurality of through holes, can prevent that so the complete direct irradiation of infrared ray from flex circuit application, causing hot-spot, burn out flex circuit application; Described hot body comprises heating module, flow-guiding channel, air-supply module and exhausting module, and heating module is used for adding hot-air, forms hot blast; Described exhausting module is located at the top of drying unit; Described air-supply module is sent the hot blast that described heating module forms into flow-guiding channel, then by flow-guiding channel the hot blast water conservancy diversion is passed through described through hole, thereby blows to described delivery unit, and last hot blast is extracted out by described exhausting module.By said apparatus, heating unit can be so that the temperature in space around the delivery unit remains on certain scope, and the temperature homogeneous, has guaranteed the quality of flex circuit application.
Preferably, described heating module adopts at least a in warm braw sheet or the heating wire.
The present invention also provides and has utilized the above-mentioned device that any is used for solidifying printing ink of flexible circuit board to carry out the method for ink solidification, may further comprise the steps:
A. by being involved in device 2 volumes are treated the parallel delivery unit of sending into drying unit of flex circuit application of ink solidification at least;
B. the delivery unit of the drying unit flex circuit application for the treatment of ink solidification transmits, and the heating unit of drying unit carries out ink solidification to flex circuit application simultaneously;
C. rolling out device will finish the flex circuit application of ink solidification and roll out.
By above-mentioned steps, realize the continuous ink solidification of flex circuit application volume to volume, and can carry out ink solidification to 2 volume flex circuit applications at least simultaneously, when enhancing productivity, also improved the quality of flex circuit application.
The hot blast that described hot body blows out is extremely relevant with the quality of flex circuit application and production efficiency, and temperature is too high, can burn out flex circuit application; Temperature is excessively low, and meeting is so that the Speed Reduction of solidifying printing ink of flexible circuit board; When therefore described printing ink was the UV photosensitive-ink, the hot blast temperature that described hot body blows out was between 190 to 230 ℃.
In addition, the transfer rate of described delivery unit is same extremely relevant with quality and the production efficiency of flex circuit application, and therefore, the transfer rate of described delivery unit is good between 0.7 m/min to 1 m/min.
Compared with prior art, the present invention utilizes the alternative baking oven of drying unit to carry out ink solidification, be involved in device and roll out device by setting simultaneously, the volume to volume that has realized flex circuit application is solidified continuously, improved production efficiency, can also prevent that flex circuit application from adsorbing foreign matter and producing folding line in the ink solidification process, improved the quality of flex circuit application.
Description of drawings
Fig. 1 is building-block of logic of the present invention.
Fig. 2 is the structural representation of the embodiment of device for solidifying printing ink of flexible circuit board of the present invention.
The specific embodiment
Below in conjunction with specific embodiments and the drawings the present invention is described in further detail.
As depicted in figs. 1 and 2, a kind of device for solidifying printing ink of flexible circuit board comprises: be involved in device 1, drying unit 2 and roll out device 3; Described drying unit comprises delivery unit 21 and heating unit 22, described heating unit is used for the ink solidification of flex circuit application, described delivery unit is used for transmitting flex circuit application, and the width of described delivery unit is more than 2 times of flex circuit application width that need carry out ink solidification; Flex circuit application enters into the delivery unit of drying unit by being involved in device, and realizes ink solidification in being transmitted the process that transmits the unit, and then rolls out by rolling out device.
Wherein, described delivery unit comprises conveyer belt, and described conveyer belt is the network chain shape, is made by metal material.
Wherein, described drying unit also comprises:
Described heating unit comprises at least a in infrared heating mechanism, Far-infrared Heating mechanism and the hot body.
Wherein, described heating unit comprises infrared heating mechanism 221 and hot body 222; Described infrared heating mechanism comprises the first infrared heating module 2211 and the second infrared heating module 2212, described the first infrared heating module and the second infrared heating module include a plurality of infrared heaters 220, the relative up and down both sides of being located at described delivery unit with the second infrared heating module of described the first infrared heating module; Be provided with infrared blocking unit 25 between described the first infrared heating module and the second infrared heating module and the delivery unit, described infrared blocking unit is provided with a plurality of through holes 251; Described hot body 222 comprises heating module 2221, flow-guiding channel, air-supply module 2222 and exhausting module 2223, and heating module is used for adding hot-air, forms hot blast; Described exhausting module is located at the top of drying unit; Described air-supply module is sent the hot blast that described heating module forms into flow-guiding channel, then by flow-guiding channel the hot blast water conservancy diversion is passed through described through hole, thereby blows to described delivery unit, and last hot blast is extracted out by described exhausting module.
Wherein, described heating module adopts at least a in warm braw sheet or the heating wire.
In addition, the present invention also provides and has utilized the above-mentioned device that any is used for solidifying printing ink of flexible circuit board to carry out the method for ink solidification, may further comprise the steps:
A. by being involved in device 2 volumes are treated the parallel delivery unit of sending into drying unit of flex circuit application of ink solidification at least;
B. the delivery unit of the drying unit flex circuit application for the treatment of ink solidification transmits, and the heating unit of drying unit carries out ink solidification to flex circuit application simultaneously;
C. rolling out device will finish the flex circuit application of ink solidification and roll out.
Wherein, described printing ink is the UV photosensitive-ink, and the hot blast temperature that described hot body blows out is between 190 to 230 ℃.
Wherein, the transfer rate of described delivery unit is between 0.7 m/min to 1 m/min.
Above content is the further description of the present invention being done in conjunction with concrete preferred embodiment, can not assert that implementation of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (7)
1. a device that is used for solidifying printing ink of flexible circuit board is characterized in that, comprising: be involved in device, drying unit and roll out device; Described drying unit comprises delivery unit and heating unit, described heating unit is used for the ink solidification of flex circuit application, described delivery unit is used for transmitting flex circuit application, and the width of described delivery unit is more than 2 times of flex circuit application width that need carry out ink solidification; Flex circuit application enters into the delivery unit of drying unit by being involved in device, and realizes ink solidification in being transmitted the process that transmits the unit, and then rolls out by rolling out device;
Described heating unit comprises infrared heating mechanism and hot body; Described infrared heating mechanism comprises the first infrared heating module and the second infrared heating module, described the first infrared heating module and the second infrared heating module include a plurality of infrared heaters, the relative up and down both sides of being located at described delivery unit with the second infrared heating module of described the first infrared heating module; Be provided with infrared blocking unit between described the first infrared heating module and the second infrared heating module and the delivery unit, described infrared blocking unit is provided with through hole; Described hot body comprises heating module, flow-guiding channel, air-supply module and exhausting module, and heating module is used for adding hot-air, forms hot blast; Described exhausting module is located at the top of drying unit; Described air-supply module is sent the hot blast that described heating module forms into flow-guiding channel, then by flow-guiding channel the hot blast water conservancy diversion is passed through described through hole, thereby blows to described delivery unit, and last hot blast is extracted out by described exhausting module.
2. the device for solidifying printing ink of flexible circuit board as claimed in claim 1 is characterized in that, described delivery unit comprises conveyer belt, and described conveyer belt is the network chain shape, is made by metal material.
3. the device for solidifying printing ink of flexible circuit board as claimed in claim 1 is characterized in that, described drying unit adopts reflow soldering apparatus, also comprises:
Control module is for the duty of control drying unit;
Driver element, described driver element drive delivery unit and transmit under the control of described control module;
Described heating unit adopts at least a in infrared heating mechanism, Far-infrared Heating mechanism and the hot body.
4. the device for solidifying printing ink of flexible circuit board as claimed in claim 3 is characterized in that, described heating module adopts at least a in warm braw sheet or the heating wire.
5. one kind is utilized claim 1 to 4 each describedly carries out the method for ink solidification for the device of solidifying printing ink of flexible circuit board, it is characterized in that, may further comprise the steps:
A. by being involved in device 2 volumes are treated the parallel delivery unit of sending into drying unit of flex circuit application of ink solidification at least;
B. the delivery unit of the drying unit flex circuit application for the treatment of ink solidification transmits, and the heating unit of drying unit carries out ink solidification to flex circuit application simultaneously;
C. rolling out device will finish the flex circuit application of ink solidification and roll out.
6. ink solidification method as claimed in claim 5, it is characterized in that: described printing ink is the UV photosensitive-ink, the hot blast temperature that described hot body blows out is between 190 to 230 ℃.
7. such as claim 5 or 6 described ink solidification methods, it is characterized in that: the transfer rate of described delivery unit is between 0.7 m/min to 1 m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110149265 CN102328504B (en) | 2011-06-03 | 2011-06-03 | Device and method for solidifying ink on flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110149265 CN102328504B (en) | 2011-06-03 | 2011-06-03 | Device and method for solidifying ink on flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102328504A CN102328504A (en) | 2012-01-25 |
| CN102328504B true CN102328504B (en) | 2013-04-17 |
Family
ID=45480590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110149265 Active CN102328504B (en) | 2011-06-03 | 2011-06-03 | Device and method for solidifying ink on flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102328504B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540328B (en) * | 2014-12-31 | 2018-05-25 | 广州兴森快捷电路科技有限公司 | PCB graphic makings device and PCB pattern-producing methods |
| CN110497690B (en) * | 2019-08-23 | 2021-02-09 | 江苏上达电子有限公司 | Baking device adopting isolation belt |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4747211A (en) * | 1987-02-09 | 1988-05-31 | Sheldahl, Inc. | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films |
| WO1994027193A1 (en) * | 1993-05-19 | 1994-11-24 | Siemens Nixdorf Informationssysteme Aktiengesellschaft | Electrographic printing device for printing recording media shaped as tapes of various widths |
| JP2005236071A (en) * | 2004-02-20 | 2005-09-02 | Koki Tec Corp | Reflow soldering device |
| DE102004051263A1 (en) * | 2004-10-21 | 2006-04-27 | Man Roland Druckmaschinen Ag | Druckmaschinen arrangement |
| JP4042737B2 (en) * | 2004-10-27 | 2008-02-06 | セイコーエプソン株式会社 | Pattern forming system |
| CN202106665U (en) * | 2011-06-03 | 2012-01-11 | 珠海紫翔电子科技有限公司 | Device for solidifying printing ink of flexible circuit board |
-
2011
- 2011-06-03 CN CN 201110149265 patent/CN102328504B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102328504A (en) | 2012-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202106665U (en) | Device for solidifying printing ink of flexible circuit board | |
| CN102333418B (en) | Device and method for carrying out printing ink curing on flexible circuit board | |
| CN102320188B (en) | Lifting type ultraviolet (UV) light curing machine | |
| HK1081265A1 (en) | Manufacture of electrochemical sensors by moveable flat screen printing | |
| CN102328504B (en) | Device and method for solidifying ink on flexible circuit board | |
| MY155126A (en) | Method and printing press for printing a substrate | |
| CN102947013A (en) | Apparatus for providing transient thermal profile processing on a moving substrate | |
| CN109572182A (en) | A kind of multipurpose moulding press | |
| CN206999875U (en) | Printed matter solidifies drying device | |
| CN202037964U (en) | Paper preheating laminating machine | |
| CN202111943U (en) | Device for ink solidification of flexible circuit board | |
| CN102328497B (en) | Device and method for continuous printing and printing ink drying of flexible circuit board | |
| CN203713241U (en) | Drying machine for digital printing fabric | |
| CN205573273U (en) | Screen process press | |
| CN102706116A (en) | Printed circuit board drying device | |
| CN209869667U (en) | Multipurpose moulding press | |
| CN204123751U (en) | A kind of delivery heating device for paper board material overlay film | |
| CN202169763U (en) | Device for eliminating residues and odor of silk screen product solvent | |
| CN202115086U (en) | Device for continuous printing and ink drying of flexible circuit board | |
| CN209697387U (en) | UV solidification equipment | |
| CN202106657U (en) | Device for continuously printing and drying flexible circuit board | |
| CN102328500B (en) | Device and method for continuously printing and drying flexible circuit boards | |
| CN203077767U (en) | Rolling device | |
| CN110341304A (en) | A kind of ink prints two-sided while irradiation UV machine | |
| CN201849041U (en) | Heat coating machine and preheating device thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |