CN102324905A - Method for extracting inner electrode of chip-type frequency device - Google Patents
Method for extracting inner electrode of chip-type frequency device Download PDFInfo
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- CN102324905A CN102324905A CN201110149530A CN201110149530A CN102324905A CN 102324905 A CN102324905 A CN 102324905A CN 201110149530 A CN201110149530 A CN 201110149530A CN 201110149530 A CN201110149530 A CN 201110149530A CN 102324905 A CN102324905 A CN 102324905A
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- end plate
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Abstract
The invention relates to a method for extracting an inner electrode of a chip-type frequency device. The method comprises the following steps of: A, manufacturing a plurality of ceramic intermediate plates (4) and two end plates (6,7); B, stamping strip-shaped outgoing wires (5,8) on the upper surfaces of all the intermediate plates (4) and one end plate (7) and carrying out silver electrode firing; sequentially overlapping and adhering one end plate (6) without an outgoing line, the plurality of intermediate plates (4) with the outgoing lines and one end plate (7) with the outgoing line by epoxy glue or glass glaze to form a composite ceramic block; D; pressurizing, heating and curing the composite ceramic block; E, cutting the cured composite ceramic block into ceramic slices (10) along a direction vertical to th length direction of the outgoing line, wherein the outgoing line is cut into penetrating electrodes; and F, respectively stamping an upper electrode (12) on the two faces of each slice sheet. Because the inner electrode is extracted by using the penetrating electrodes, the positioning precision is very high; and the method disclosed by the invention is especially suitable for smalls-sized products with high positioning precision.
Description
Technical field
The present invention relates to a kind of manufacture method of parts of chip frequency device, the outbound course of electrode in a kind of chip frequency device.
Background technology
The chip frequency device is mainly used in fields such as communication, TV, digital product, industrial automation, in these fields, is used to produce time-base oscillation or carries out frequency-selecting.The chip frequency device is that the principles of utilizing piezoelectric vibrator under the effect of alternating electric field, to produce mechanical oscillation forms.Therefore, it does not receive the influence of outside electromagnetic interference, in use need not resemble other frequency element to preventing that electromagnetic interference from carrying out complicated shielding, to the miniaturization of electronic product, integrated considerable meaning arranged.
Usually, the making of chip frequency device is piezoelectric vibrator to be bonded at a slice with conducting resinl have on the ceramic substrate of electrode.Then, covering cap encapsulation pottery or metal forms.Because it is very high that frequency device requires for frequency accuracy, so before covering cap encapsulation pottery or metal, need carry out frequency trim to piezoelectric vibrator.Need measure monitoring during frequency trim, measuring probe all is arranged on the reverse side of ceramic substrate usually.Like this, just need be drawn out to reverse side by the electrode that ceramic substrate is positive.At present, the unique method that can the electrode in ceramic substrate front be drawn out to reverse side is as shown in Figure 1, on ceramic substrate 1, punches 2 exactly, and coated with metal layer in the hole is guided to another side with the electrode 3 of one side.Hole on this ceramic substrate all is to form in the forming process before making the large stretch of sintering of ceramic substrate.Owing in sintering process, have unmanageable factors such as sintering shrinkage, make the positioning accuracy in hole can not do very highly., positioning accuracy request bigger in product size is feasible, still when not being too high, and be more and more littler along with product, when positioning accuracy request is increasingly high, the requirement that said method just can not filled with product.
Summary of the invention
The present invention is intended to propose the outbound course of electrode in a kind of chip frequency device, can produce the higher electrode of dimensional accuracy, is applicable to small-sized and requires the product of hi-Fix.
The outbound course of electrode comprises the steps: in this chip frequency device
Intermediate plate and two end plates of A, preparation several piece pottery grind and hold mill to intermediate plate and end plate, and the thickness of intermediate plate and end plate is decided according to the dimensional requirement of product;
B, on the upper surface of each a piece intermediate plate and an end plate; Method with silk screen printing; Stamp the lead-out wire of strip with the silver slurry; And carry out silver ink firing and handle, lead-out wire is parallel to each other, and the width that the centre-to-centre spacing between two whenever adjacent lead-out wires equals chip frequency device substrate adds the width that a cutting is stitched;
C, the end plate of a no lead-out wire, intermediate plate and end plate that lead-out wire is arranged that polylith has lead-out wire are superimposed successively and are glued together with epoxy glue or glass glaze, become a composite ceramic block;
D, the composite ceramic block pressurized, heated that C step is processed are solidified;
Garden cutting in carry out with the perpendicular direction of the length direction of lead-out wire on E, the composite ceramic block edge that D step is processed; Cut into thickness and the identical ceramic sheet of chip frequency device substrate thickness, described lead-out wire is blocked into two ends and is exposed the through electrode in the one-tenth array distribution on two surfaces of ceramic sheet;
F, go on foot at E stamp respectively on two faces of prepared ceramic sheet or sputter on the electrode that is connected respectively with the two ends of through electrode.
The through electrode that the outbound course utilization of electrode is arranged in the ceramic substrate in this chip frequency device links to each other interior electrode with external electrode; Because through electrode is to be produced on sintering and machining is good the ceramic wafer; The temperature that composite ceramic block the is heating and curing sintering temperature than pottery again is low; Therefore the positioning accuracy of through electrode is very high, is specially adapted to small-sized and requires the product of hi-Fix.
Description of drawings
Fig. 1 is the large stretch of structure of the narrow meshed ceramic substrate of prior art;
Fig. 2 is the structure of intermediate plate;
Fig. 3 is a kind of end plate;
Fig. 4 is second kind of end plate;
Fig. 5 is polylith intermediate plate and two sketch mapes that end plate is bonding;
Fig. 6 is a composite ceramic block;
Fig. 7 is for to cut into ceramic sheet with composite ceramic block;
Fig. 8 is the ceramic substrate sheet of the band through electrode processed with method of the present invention;
Fig. 9 is the ceramic substrate of the single chip frequency device of the band through electrode processed with method of the present invention;
Figure 10 is the ceramic substrate of the single chip frequency device of the another kind of band through electrode of processing with method of the present invention.
Embodiment
The outbound course of electrode comprises the steps: in this chip frequency device
The intermediate plate 4 of A, preparation several piece pottery as shown in Figure 2 and Fig. 3, two end plates 6,7 shown in Figure 4 grind and hold mill to intermediate plate and end plate, and the thickness of intermediate plate and end plate is decided according to the dimensional requirement of product; For example, when the chip frequency device had two external electrodes, the thickness of two end plates was that an end of chip frequency device arrives the distance between the external electrode center line of this end; The quantity of intermediate plate is odd number; The thickness of first intermediate plate is the distance between the center line of two external electrodes of chip frequency device; The thickness of second intermediate plate is two cutting seams extraordinarily of the distance of an end between the external electrode center line of this end of chip frequency device, and ensuing intermediate plate replaces repetition by above-mentioned two kinds of thickness.Again for example, when the chip frequency device had three external electrodes, the thickness of two end plates was that an end of chip frequency device arrives the distance between the external electrode center line of this end; The quantity of intermediate plate is 3N+2 piece (N is a natural number); The thickness of first and second intermediate plate is the distance between the center line of two adjacent external electrodes of chip frequency device; The thickness of the 3rd intermediate plate is two cutting seams extraordinarily of the distance of an end between the external electrode center line of this end of chip frequency device, and ensuing intermediate plate replaces repetition by above-mentioned two kinds of thickness.
B, on the upper surface of each a piece intermediate plate 4 and an end plate 7; Method with silk screen printing; Stamp the lead-out wire 5,8 of strip with the silver slurry; And carry out silver ink firing and handle, lead-out wire is parallel to each other, and the width that the centre-to-centre spacing between two whenever adjacent lead-out wires equals chip frequency device substrate adds the width that a cutting is stitched;
C, as shown in Figure 5 is superimposed the end plate 6 of a no lead-out wire, intermediate plate 4 and end plate 7 that lead-out wire is arranged that polylith has lead-out wire successively and is glued together with epoxy glue or glass glaze, becomes composite ceramic block shown in Figure 69;
D, composite ceramic block 9 pressurized, heated that C step is processed are solidified;
E, as shown in Figure 7; The cutting of interior garden is carried out with the perpendicular direction of the length direction of lead-out wire in the composite ceramic block edge that the D step processes; Cut into the thickness ceramic sheet 10 identical with chip frequency device substrate thickness, described lead-out wire 5,8 is blocked into two ends and is exposed the through electrode 11 in two lip-deep one-tenth array distribution of ceramic sheet 10;
F, as shown in Figure 8, go on foot at E stamp respectively on two faces of prepared ceramic sheet 10 or sputter on the electrode 12 that is connected respectively with the two ends of through electrode 11, become the ceramic substrate sheet.A large stretch of lip-deep electrode of this ceramic substrate is interior electrode, and another lip-deep electrode is an external electrode.
Can, this be divided into individual devices again processing array sheet arranged frequency device above ceramic substrate sheet after; Be assembled into device again after also can cutting into single substrate; Can also cut into the substrate small pieces that contain a plurality of substrates; After processing a plurality of chip frequency devices in the above, cut into individual devices again.Extraction electrode on the substrate of single chip frequency device can be 2, also can be 3 or more.Fig. 9 and the single substrate that is when finally processing the chip frequency device shown in Figure 10, wherein Fig. 9 is 2 extraction electrodes, Figure 10 is 3 extraction electrodes.
Claims (1)
1. the outbound course of the interior electrode of chip frequency device is characterized in that comprising the steps:
Intermediate plate (4) and two end plates (6,7) of A, preparation several piece pottery grind and hold mill to intermediate plate and end plate, and the thickness of intermediate plate and end plate is decided according to the dimensional requirement of product;
B, on the upper surface of each a piece intermediate plate (4) and an end plate (7); Method with silk screen printing; Stamp the lead-out wire (5,8) of strip with the silver slurry; And carry out silver ink firing and handle, lead-out wire is parallel to each other, and the width that the centre-to-centre spacing between two whenever adjacent lead-out wires equals chip frequency device substrate adds the width that a cutting is stitched;
C, the end plate (6) of a no lead-out wire, intermediate plate (4) and end plate (7) that lead-out wire is arranged that polylith has lead-out wire are superimposed and are glued together with epoxy glue or glass glaze successively, become a composite ceramic block;
D, composite ceramic block (9) pressurized, heated that C step is processed are solidified;
Garden cutting in carry out with the perpendicular direction of the length direction of lead-out wire on E, the composite ceramic block edge that D step is processed; Cut into the thickness ceramic sheet (10) identical with chip frequency device substrate thickness, described lead-out wire (5,8) is blocked into two ends and is exposed the through electrode (11) in the one-tenth array distribution on two surfaces of ceramic sheet (10);
F, go on foot at E stamp respectively on two faces of prepared ceramic sheet or sputter on the electrode (12) that is connected respectively with the two ends of through electrode (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110149530A CN102324905A (en) | 2011-06-01 | 2011-06-01 | Method for extracting inner electrode of chip-type frequency device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110149530A CN102324905A (en) | 2011-06-01 | 2011-06-01 | Method for extracting inner electrode of chip-type frequency device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102324905A true CN102324905A (en) | 2012-01-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110149530A Pending CN102324905A (en) | 2011-06-01 | 2011-06-01 | Method for extracting inner electrode of chip-type frequency device |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174356A (en) * | 1998-12-01 | 2000-06-23 | Murata Mfg Co Ltd | Piezoelectric transformer and its manufacture |
| CN201263138Y (en) * | 2008-08-25 | 2009-06-24 | 浙江嘉康电子股份有限公司 | Sheet type frequency device |
| JP2010093038A (en) * | 2008-10-08 | 2010-04-22 | Murata Mfg Co Ltd | Multilayer ceramic capacitor and method of manufacturing the same |
-
2011
- 2011-06-01 CN CN201110149530A patent/CN102324905A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174356A (en) * | 1998-12-01 | 2000-06-23 | Murata Mfg Co Ltd | Piezoelectric transformer and its manufacture |
| CN201263138Y (en) * | 2008-08-25 | 2009-06-24 | 浙江嘉康电子股份有限公司 | Sheet type frequency device |
| JP2010093038A (en) * | 2008-10-08 | 2010-04-22 | Murata Mfg Co Ltd | Multilayer ceramic capacitor and method of manufacturing the same |
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Application publication date: 20120118 |