A kind of method of testing of ultrahard diamond thin film mechanical performance
Technical field
The present invention relates to a kind of measurement and assessment technique of ultrahard diamond thin film mechanical performance, specifically, the method of testing that relates to a kind of ultrahard diamond thin film mechanical performance, referring in particular to thickness range is the diamond thin of several microns (μ m) extremely hundreds of microns (μ m), and mechanical property comprises the adhesion between film hardness and elastic modulus, film and matrix.
Background technology
In recent years, utilize plasma enhanced chemical vapor deposition (PECVD, Plasma Enhanced Chemical Vapor Deposition) research for preparing the ultrahard diamond membraneous material of method such as method has obtained development rapidly, and the preparation and application of diamond thin have become the important research direction in membraneous material field.The diamond film mechanical property that comprises adhesion between hardness, elastic modulus and film and matrix is the important indicator that determines film military service performance, therefore how measuring the diamond film mechanical property is focus and the bottleneck problem that development and application both sides pay close attention to, especially the bonding properties of film and matrix has determined the serviceable life of coating to a great extent, being the precondition of performance film performance, also is the problem of generally being concerned about during coating is developed.
At present, diamond thin consistency and elasticity modulus can only adopt the nano hardness meter of import to measure, and the loading-unloading curve by film during the analysis to measure obtains film nano hardness and elastic mould value.Normally used during nano hardness instrumentation amount is the pressing of gold-plated diamond film, and pressing precision is very high, price very expensive (2-3 ten thousand yuan each); In the nano hardness instrumentation examination process, because the load that pressing can apply very little (being generally tens μ N between hundreds of mN), and the requirement to the sample surfaces roughness is very high, only is applicable to thickness at tens soft and ganoine thin films to the hundreds of nanometer range, but stops at superhard thin film.Reach tens for thickness, even hundreds of microns thick diamond film, and surfaceness is bigger, in hardness measurement process, needed theoretical compression distance should reach several microns to tens microns, and imposed load should be tens, hundreds of even thousands of N.Hence one can see that, and existing film hardness and nano-indenter test technology are tested elastic modulus can't satisfy the requirement that thick diamond film is measured.In fact, because the hardness of diamond thin own is very high, near natural diamond, and bigger, the hard diamond thin of roughness on surface is easy to cause the pressure head damage, and nobody agree carry out such test.
The method of measuring adhesion between film and matrix has a lot, as burnishing test, cloudburst test, bending test, tensile test, nanometer scarification, scratch test, indentation method etc.There are sizable difficulty in existing measuring technique and evaluation method aspect the bond strength of measuring between film and the matrix (especially thick diamond thin), burnishing test, cloudburst test can only detect general film qualitatively, and superhard film is difficult to realize peeling off of film; Crooked and tension test is very big to the restriction of matrix material, much materials owing to hardness greatly, more crisply be difficult to do bending and stretching; The nanometer scarification is just done scratch test at very thin film, and the adhesion of thick film is detected and can't realize.
Above-mentioned all situations have restricted applying of thick diamond thin to a great extent.
The method of adhesion has two kinds between the mensuration film of using always and matrix now: micron scarification and fixed load indentation method.Current, most popular is a micron scratch method for test, it has easy and simple to handle and advantage quantitative measurment, obtained this domain expert's approval both at home and abroad, domesticly also introduce, develop and produced multiple scratch test machine successively, and industry standard promulgated by the ministries or commissions of the Central Government " scratch method for test of vapor deposition film and matrix adhesive force " (JB/T 8554-1997) and GJB (GJB3632-97) are arranged.Scratch method for test is the effective ways of qualitative evaluation thin film basal body bond strength, the corresponding load of undergoing mutation of acoustical signal or friction signal during load measuring is referred to as critical load (Lc), utilize numerical values recited to be used as the judgment basis of adhesion between film matrix, generally crisp hard film is utilized acoustic-emission.Employed in the micron scarification is the pressure head that has the man-made diamond tip, by tip imposed load is acted on film surface in the cut process.Man-made diamond has such characteristic, the vertical direction load-bearing capacity is strong, but a little less than the horizontal direction load-bearing capacity, therefore the problem of adhesion is between scarification survey diamond film base, the load that progressively is increased in the adamas tip is streaked the diamond film surface in the horizontal direction, be easy to cause pressure head heel and toe wear, burst apart, cause test findings inaccurate, test repeated very poor.
Another adhesion measuring method is external fixed load indentation method, apply permanent load at film surface by pressure ball, estimate making qualitatively after impression pattern photo and the comparison of standard pattern photo, this method can not characterize the adhesion between diamond thin and matrix quantitatively.
Summary of the invention
The technical issues that need to address of the present invention just are to overcome the defective of prior art, and a kind of method of testing of ultrahard diamond thin film mechanical performance is provided, and it adopts the micron indentation method to measure the consistency and elasticity modulus of diamond thin; Utilize cheap man-made diamond pressure head to replace expensive gold-plated diamond film pressing, reduced the cost of experiment, reduced experimental error, and can satisfy the measurement requirement to thick adamantine consistency and elasticity modulus.
For addressing the above problem, the present invention adopts following technical scheme:
The invention provides a kind of method of testing of ultrahard diamond thin film mechanical performance, described method of testing is measured the consistency and elasticity modulus of diamond thin for adopting the micron indentation method; Utilize the autoloading structure that diamond thin is applied several N continuously to the heavy load of thousands of N scopes, by the man-made diamond pressure head continuous load is applied to diamond film surface, compression distance control is in the 1/10-1/15 of thickness scope, load-depth curve when obtaining the loading of material by displacement transducer and Computer Processing, the elastic deformation curve of autoloading structure self when obtaining unloading by the rate of debarkation of setting again passes through elastic modulus, hardness and the film-substrate cohesion that calculates material with these two groups of data that load and unload.
Described autoloading structure comprises main stand, and described main stand is provided with the sample platform, places on the described sample platform and fixing sample to be tested; The sample top is the load load maintainer, described load load maintainer connects continuous loading motor, described load load maintainer is provided with the man-made diamond pressure head that applies continuous load, described load load maintainer is connected with displacement transducer, loading force sensor and calibrate AE sensor, described displacement transducer, the loading force sensor is connected with computing machine by signal amplifier with calibrate AE sensor, described displacement transducer connects the depth transducer mobile motor, computing machine connects the control change device, described control change device respectively and load sensor, loading motor and depth transducer mobile motor connect continuously, and computing machine is connected with display and printer.
The autoloading structure directly is depressed on the sample platform by the man-made diamond pressure head, through extruding repeatedly, obtains the load-depth curve of many coincidences, is the elastic deformation curve of autoloading structure self;
The plastic deformation that utilizes repeatedly heavy duty (500N, maximum load is less than 500N during test) to push sample, sample reaches capacity, and obtains load-depth curve;
Because the maximum load during test is less than the added load of instrument self elastic deformation, load-the depth curve that obtains during test has comprised the elastic deformation of autoloading structure self and elastic deformation and the plastic deformation of institute's test sample product, remove the elastic deformation curve of autoloading structure self this moment, load-the depth curve that is sample that obtains, its formula is:
In the formula: H (displacement) is compression distance;
H (actual measurement) is the compression distance of actual measurement;
W (load) is imposed load;
Δ h (instrument) is the spontaneous real-time displacement deformation of instrument;
Δ W (load) is real-time load.
Advantage of the present invention has:
1, the present invention adopts the man-made diamond pressure head to replace the pressing of employed gold-plated diamond film usually, and the man-made diamond pressure head has the not available advantage of gold-plated diamond film pressing, and it can bear very big load (several N are to thousands of N); Can be pressed into interior several microns to tens microns of thick diamond film, therefore can satisfy the measurement requirement to thick adamantine consistency and elasticity modulus.
2, the present invention adopts micron indentation method to replace the consistency and elasticity modulus that traditional nano impress method is measured diamond film, has improved traditional fixed load indentation method, and has overcome the problem that exists during original micron indentation method measured.Take full advantage of the man-made diamond strong characteristic of load-bearing capacity in the vertical direction, utilizing continuous loading system to replace traditional fixed load acts on the pressure head, by detecting the variation of acoustic emission, according to acoustic emission signal intensity--critical load value place correspondence draws the acoustic emission peak on the curve of load, can determine the adhesion between thick diamond thin and matrix quantitatively.
3, the present invention is by calibrating load-depth curve, eliminate instrument itself and diamond penetrator to the negative effect of test result, thereby can utilize cheap man-made diamond pressure head to replace expensive gold-plated diamond film pressing, reduce the cost of experiment, reduce the error of equipment in the experiment.
The present invention has overcome the defective that prior art can only be measured the mechanical property of diamond thin item by item by nano hardness meter, micron scratching instrument and fixed load indentation method, and the quantitative measurment problem that is difficult to overcome of prior art existence, the invention provides a kind of micron impression method that can the described thick diamond thin mechanical property of quantitative measurment, thin film mechanical performance comprises adhesion between hardness, elastic modulus and film and matrix, and this method has low, the high reliability features of cost.
Method of testing of the present invention has reduced testing cost effectively when guaranteeing test accuracy, can promote applying of thick diamond thin material effectively.
Description of drawings
Fig. 1 is micron indentation test instrument structured flowchart.
Embodiment
The test of carrying out is all tested at homemade MFT-5000 micron indentation test instrument, and the machine pressure head is changed into the man-made diamond pressure head.
As shown in Figure 1, a micron indentation test instrument comprises main stand, and described main stand is provided with the sample platform, places on the described sample platform and fixing testing sample; The sample top is the load load maintainer, described load load maintainer connects continuous loading motor, described load load maintainer is provided with the man-made diamond pressure head that applies continuous load, described load load maintainer is connected with displacement transducer, load sensor and calibrate AE sensor, described displacement transducer, load sensor is connected with computing machine by signal amplifier with calibrate AE sensor, described displacement transducer connects the depth transducer mobile motor, computing machine connects the control change device, described control change device respectively and load sensor, loading motor and depth transducer mobile motor connect continuously, and computing machine is connected with display and printer.
The concrete operations step is as follows:
One, micron indentation test instrument is measured the consistency and elasticity modulus of diamond thin;
1, unclamps the outstanding button in overarm location, overarm is clockwise rotated 45 weights and measures, sample is fixed on the anchor clamps of sample platform, again overarm is resetted and screw overarm and locate outstanding button.
2, the installation of test suite: test suite is fastened on the test instrument side plate with screw, by in " sample adjustment " menu bar " on ", the D score button adjusts test instrument head height, look pressure head and just contact with sample.
3, adjust the displacement contact position by " ↑ " in " system state " menu bar, " ↓ ", make screen contact position bar (yellow bar) be shown in the green segment and more on the lower side.
4, input sample number into spectrum, title material, input test parameters.
5, click " on ", the D score knob, the power that will be written into is adjusted into zero.
6, click START button, begin test.
Load is acted on sample surfaces by the loading speed of setting by pressure head, pass through displacement transducer, obtain the load-depth curve of material through Computer Processing, load-depth curve when obtaining unloading by the rate of debarkation of setting again passes through elastic modulus, hardness and the film-substrate cohesion that calculates material by two groups of data.
By acoustic emission testing technology, detect diamond thin and matrix begin to burst apart, subside, when peeling off, the corresponding magnitude of load that applies.
Two, eliminate testing apparatus to the negative effect of film hardness and elastic modulus measurement
Micron indentation test instrument directly is depressed on the sample platform by the man-made diamond pressure head, through extruding repeatedly, obtains the load-depth curve of many coincidences, is the elastic deformation curve of micron indentation test instrument self;
The plastic deformation that utilizes repeatedly heavy duty (500N, maximum load is less than 500N during test) to push sample, sample reaches capacity, and obtains load-depth curve;
Because the maximum load during test is less than the added load of instrument self elastic deformation, load-the depth curve that obtains during test has comprised the elastic deformation of micron indentation test instrument self and elastic deformation and the plastic deformation of institute's test sample product, remove the elastic deformation curve of micron indentation test instrument self this moment, load-the depth curve that is sample that obtains, its formula is:
In the formula: H (displacement) is compression distance;
H (actual measurement) is the compression distance of actual measurement;
W (load) is imposed load;
Δ h (instrument) is the spontaneous real-time displacement deformation of instrument;
Δ W (load) is real-time load.
Principle of work of the present invention is: under the loading of pressing in effect that increases continuously in the vertical direction, the film surface crack initiation, when reaching film critical load Lc (pressure head crushes the needed minimum load of film), the phenomenon peeling off even burst apart, subside can appear in film surface, and this moment, load can produce fluctuation; Since film cracked, peel off compression distance and can increase suddenly; Meanwhile, crisp hard diamond thin can send acoustic emission signal and show breakage of thin film applied, the variable quantity of the acoustic emission signal when obtaining impression by sensor, the variable quantity of load, tangential force compression distance is handled through amplifying, the input computing machine is depicted as figure through conversion with measurement result, critical load value place correspondence draws the acoustic emission peak on the acoustic emission signal curve of load, and this moment, critical load was the criterion of film and substrate combinating strength.
It should be noted that at last: obviously, above-described embodiment only is for example of the present invention clearly is described, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give all embodiments exhaustive.And the apparent variation of being amplified out thus or change still are among protection scope of the present invention.