CN102316706B - 具有c形歧管和毫通道冷却的热沉 - Google Patents

具有c形歧管和毫通道冷却的热沉 Download PDF

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Publication number
CN102316706B
CN102316706B CN201110192448.4A CN201110192448A CN102316706B CN 102316706 B CN102316706 B CN 102316706B CN 201110192448 A CN201110192448 A CN 201110192448A CN 102316706 B CN102316706 B CN 102316706B
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China
Prior art keywords
manifold
shape
outlet
inlet
main body
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Expired - Fee Related
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CN201110192448.4A
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English (en)
Chinese (zh)
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CN102316706A (zh
Inventor
A·G·保特施
S·S·冈图里
P·J·拉扎丁
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General Electric Co
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General Electric Co
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201110192448.4A 2010-06-29 2011-06-29 具有c形歧管和毫通道冷却的热沉 Expired - Fee Related CN102316706B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/826,016 US8218320B2 (en) 2010-06-29 2010-06-29 Heat sinks with C-shaped manifolds and millichannel cooling
US12/826016 2010-06-29

Publications (2)

Publication Number Publication Date
CN102316706A CN102316706A (zh) 2012-01-11
CN102316706B true CN102316706B (zh) 2015-07-29

Family

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CN201110192448.4A Expired - Fee Related CN102316706B (zh) 2010-06-29 2011-06-29 具有c形歧管和毫通道冷却的热沉

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Country Link
US (1) US8218320B2 (https=)
EP (1) EP2402988B1 (https=)
JP (1) JP5702677B2 (https=)
CN (1) CN102316706B (https=)
RU (1) RU2580374C2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8622754B2 (en) * 2011-07-31 2014-01-07 General Electric Company Flexible power connector
US9433075B2 (en) * 2012-08-27 2016-08-30 Mitsubishi Electric Corporation Electric power semiconductor device
US9241423B2 (en) * 2013-04-11 2016-01-19 Intel Corporation Fluid-cooled heat dissipation device
EP2887787A3 (en) * 2013-12-13 2015-08-19 Hitachi, Ltd. Cooling structure for heating element and power converter
US9781866B2 (en) * 2015-04-15 2017-10-03 Ford Global Technologies, Llc Vehicle power module assemblies and manifolds
US10916931B2 (en) * 2018-01-15 2021-02-09 Infineon Technologies Ag Temperature sensing and fault detection for paralleled double-side cooled power modules
US10353084B1 (en) * 2018-04-02 2019-07-16 General Electric Company Systems and methods for cooling an imaging system
JP7236845B2 (ja) * 2018-11-15 2023-03-10 株式会社Kelk 温調装置
US11350545B2 (en) * 2019-12-05 2022-05-31 Ge Aviation Systems Llc Cold plate assembly for an electronic component
JP7294152B2 (ja) * 2020-01-14 2023-06-20 セイコーエプソン株式会社 光源装置およびプロジェクター
RU198076U1 (ru) * 2020-02-07 2020-06-17 Акционерное общество "Научно-производственное предприятие "Пульсар" Теплоотвод из композита алюминий-карбид кремния
DE102021112415A1 (de) * 2021-05-12 2022-11-17 Erwin Quarder Systemtechnik Gmbh Kühleinrichtung zum Abführen von Wärme
KR20230158286A (ko) 2022-05-11 2023-11-20 현대자동차주식회사 파워모듈용 냉각장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1875238A (zh) * 2003-10-27 2006-12-06 丹佛斯西利康动力股份有限公司 流量分配装置和冷却单元
CN100565856C (zh) * 2005-07-13 2009-12-02 埃托特克德国有限公司 微结构化的冷却器及其用途

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029141A (en) 1974-12-17 1977-06-14 Thomson-Csf Cooling device for components which dissipate large amounts of heat
US4010489A (en) 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
US4392153A (en) 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4313128A (en) 1979-05-08 1982-01-26 Westinghouse Electric Corp. Compression bonded electronic device comprising a plurality of discrete semiconductor devices
EP0144579B1 (de) 1983-11-02 1987-10-14 BBC Brown Boveri AG Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen
US4559580A (en) 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
JPS60206050A (ja) * 1984-03-30 1985-10-17 Hitachi Ltd 内部冷却水路を有する部品
US5006921A (en) 1988-03-31 1991-04-09 Kabushiki Kaisha Toshiba Power semiconductor switching apparatus with heat sinks
US5161089A (en) * 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
DE59107655D1 (de) 1991-02-22 1996-05-09 Asea Brown Boveri Abschaltbares Hochleistungs-Halbleiterbauelement
FR2701600B1 (fr) 1993-02-10 1995-09-08 Gec Alsthom Transport Sa Dispositif de refroidissement de composants electriques de puissance.
FR2701554B1 (fr) 1993-02-12 1995-05-12 Transcal Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
US5727618A (en) 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
DE19514548C1 (de) 1995-04-20 1996-10-02 Daimler Benz Ag Verfahren zur Herstellung einer Mikrokühleinrichtung
DE19530264A1 (de) 1995-08-17 1997-02-20 Abb Management Ag Leistungshalbleitermodul
DE19643717A1 (de) 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
DE19710783C2 (de) 1997-03-17 2003-08-21 Curamik Electronics Gmbh Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise
DE19843309A1 (de) 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul
DE10006215A1 (de) 2000-02-11 2001-08-16 Abb Semiconductors Ag Baden Kühlvorrichtung für ein Hochleistungs-Halbleitermodul
US6688381B2 (en) 2000-06-05 2004-02-10 The State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University Multiscale transport apparatus and methods
US6388317B1 (en) 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
CA2329408C (en) 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
EP1263045A1 (en) 2001-06-01 2002-12-04 ABB Schweiz AG High power semiconductor module
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
EP1318547B1 (de) 2001-12-06 2013-04-17 ABB Research Ltd. Leistungshalbleiter-Modul
EP1324386B1 (de) 2001-12-24 2011-06-15 ABB Research Ltd. Halbleitermodul und Verfahren zum Herstellen eines Halbleitermoduls
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US7156159B2 (en) * 2003-03-17 2007-01-02 Cooligy, Inc. Multi-level microchannel heat exchangers
US6903929B2 (en) 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US7355277B2 (en) * 2003-12-31 2008-04-08 Intel Corporation Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
US7009842B2 (en) * 2004-01-30 2006-03-07 Isothermal Systems Research, Inc. Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
US7414843B2 (en) 2004-03-10 2008-08-19 Intel Corporation Method and apparatus for a layered thermal management arrangement
US7139172B2 (en) 2004-07-01 2006-11-21 International Business Machines Corporation Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
US7230334B2 (en) * 2004-11-12 2007-06-12 International Business Machines Corporation Semiconductor integrated circuit chip packages having integrated microchannel cooling modules
US7353859B2 (en) 2004-11-24 2008-04-08 General Electric Company Heat sink with microchannel cooling for power devices
US7327024B2 (en) 2004-11-24 2008-02-05 General Electric Company Power module, and phase leg assembly
TWI273210B (en) 2004-12-30 2007-02-11 Delta Electronics Inc Heat-dissipation device and fabricating method thereof
KR100619076B1 (ko) * 2005-04-11 2006-08-31 삼성전자주식회사 전자소자 방열용 히트싱크장치
US7331378B2 (en) 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
JP4675285B2 (ja) * 2006-06-19 2011-04-20 トヨタ自動車株式会社 冷却器
US20070295482A1 (en) 2006-06-23 2007-12-27 Fitzgerald Thomas J Heat spreader for use in conjunction with a semiconducting device and method of manufacturing same
US7460369B1 (en) 2007-06-01 2008-12-02 Advanced Micro Devices, Inc. Counterflow microchannel cooler for integrated circuits
US7817422B2 (en) * 2008-08-18 2010-10-19 General Electric Company Heat sink and cooling and packaging stack for press-packages
US20100038774A1 (en) * 2008-08-18 2010-02-18 General Electric Company Advanced and integrated cooling for press-packages
US7952875B2 (en) * 2009-05-29 2011-05-31 GM Global Technology Operations LLC Stacked busbar assembly with integrated cooling

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1875238A (zh) * 2003-10-27 2006-12-06 丹佛斯西利康动力股份有限公司 流量分配装置和冷却单元
CN100565856C (zh) * 2005-07-13 2009-12-02 埃托特克德国有限公司 微结构化的冷却器及其用途

Also Published As

Publication number Publication date
JP5702677B2 (ja) 2015-04-15
RU2580374C2 (ru) 2016-04-10
EP2402988A2 (en) 2012-01-04
CN102316706A (zh) 2012-01-11
JP2012015509A (ja) 2012-01-19
RU2011126276A (ru) 2013-01-10
US20110317368A1 (en) 2011-12-29
EP2402988B1 (en) 2014-11-26
US8218320B2 (en) 2012-07-10
EP2402988A3 (en) 2012-12-05

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