CN102301841A - Jet solder bath - Google Patents
Jet solder bath Download PDFInfo
- Publication number
- CN102301841A CN102301841A CN2010800057156A CN201080005715A CN102301841A CN 102301841 A CN102301841 A CN 102301841A CN 2010800057156 A CN2010800057156 A CN 2010800057156A CN 201080005715 A CN201080005715 A CN 201080005715A CN 102301841 A CN102301841 A CN 102301841A
- Authority
- CN
- China
- Prior art keywords
- fusion welding
- pipe section
- wave soldering
- mentioned
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Abstract
The invention provides a jet solder bath. The height of molten solder which is jetted from the tip of a nozzle is made uniform. A bath body (2) contains molten solder (20), a pump pressure-feeds the molten solder (20) contained in the bath body (2), a first duct (4) guides the molten solder (20) pressure-fed by the pump in the inflow direction (P1), a direction changing section (9) changes the inflow direction (P1) of the molten solder (20) which is guided by the first duct (4) to the inflow direction (P2), and a second duct (5) guides the molten solder (20) which is changed to the inflow direction (P2) by the direction changing section (9) to a nozzle body (6) in the inflow direction (P3). Since the direction changing section (9) prevents generation of turbulence of the molten solder (20) when the inflow direction (P1) of the molten solder (20) is changed to the inflow direction (P2) by the direction changing section (9), the current velocity and flow rate of the molten solder (20) which is guided from the second duct (5) to the nozzle body (6) are stabilized. As a result, the height of the molten solder (20) which is jetted from a nozzle mouth (3) can be made uniform.
Description
Technical field
The present invention relates to a kind of Wave soldering tank that makes the fusion welding jet flow and printed circuit board (PCB) etc. is carried out soldering.
Background technology
Usually, in order to produce in a large number and at an easy rate the printed circuit board (PCB) of the so tame electrical article of record reproducing devices such as display unit such as being used for being encased in television equipment and video tape recorder, utilize cross flow (flow) method that this printed circuit board (PCB) is carried out soldering mostly, this cross flow method is meant the method that the scolder (solder) of the prior fusion of use carries out soldering.
Because the cross flow method can be carried out soldering to the whole face of printed circuit board (PCB) once, therefore, comparing the cross flow method with other soldering is to be suitable for mass-produced soldering method.Carry out being provided with in the automatic soldering apparatus of soldering various processing unit such as fluxer (fluxer), pre-heater, Wave soldering tank and cooler utilizing the cross flow method.In these processing unit, also be provided with the conveyer belt of the ring-type that is used to carry printed circuit board (PCB).This automatic soldering apparatus is carried printed circuit board (PCB) with conveyer belt on one side, apply solder flux (flux) with fluxer on one side, prepare heating, make solder attachment with Wave soldering tank with pre-heater, cool off with cooler, thereby can carry out soldering the regulation position of printed circuit board (PCB).
As most important constitutive requirements in each processing unit of this automatic soldering apparatus, can list Wave soldering tank.Wave soldering tank is to be used for printed circuit board (PCB) is sprayed the device that fusion welding carries out soldering.This Wave soldering tank utilizes pump etc. that fusion welding is pressed and delivered in the pipeline, make fusion welding in pipeline flow into nozzle body after from the nozzle tip jet flow.Now, for Wave soldering tank, have for the first time spout nozzles and for the second time the Wave soldering tank of spout nozzles widely popularize; Use the purpose of above-mentioned first time of spout nozzles to be, reliably electronic unit etc. is carried out soldering, use the purpose of above-mentioned second time of spout nozzles to be, will remove attached to the scolder of the part except utilizing the regulation position that this first time, spout nozzles was adhered to (so-called prevent to build bridge bad).
On the printed circuit board (PCB) that utilizes the soldering of cross flow method, big polyhybird is carried and is disposed chip part with lead and the discrete component with lead.Be equipped with in the substrate of chip part and discrete component in this mixing, need make scolder reliably attached to the electrode part (pad) of chip part.Thereby the soldering that utilizes the cross flow method to carry out must increase from the influx of the fusion welding of the jet hole jet flow of Wave soldering tank, therefore, requires spout nozzles generation for the first time to have the jet flow of the fusion welding of the trend of gushing.
In addition, also need to make scolder fully attached to the through-holes of printed circuit boards portion of the lead that is inserted with discrete component.And, when the conductor length of discrete component is longer, be connected to the jet hole of Wave soldering tank by through-holes of printed circuit boards portion from the outstanding lead of the lower surface of this printed circuit board (PCB), thereby might cause the lead bending or discrete component is floated from printed circuit board (PCB).Like this, when utilizing the cross flow method to carry out soldering, need the jet flow of the fusion welding of constant altitude, therefore, require the jet flow of the highly even and stable fusion welding of spout nozzles generation for the second time.
In Wave soldering tank, rise by the rotating speed that makes pump, can access required jet flow in the cross flow method with constant altitude, fusion welding that influx is bigger.But, inhomogeneous easily from the height of the fusion welding of nozzle jet when the rotating speed that makes pump rises, might cause to be attached with in the part except that the regulation position that the bridge formation of scolder is bad, the open of attached solder is not bad at the regulation position.Its reason is, when the rotating speed of the pump that makes Wave soldering tank rose, the flow velocity of fusion welding accelerated, and fusion welding collides cowling panel etc. and causes turbulent flow, produces to be known as the such height disorder from the fusion welding of nozzle jet flow of pulsation.Particularly, for utilizing spout nozzles jet flow fusion welding for the second time, influx is less, and need be highly uniform, therefore, when causing the jet flow variation in altitude producing pulsation etc., causes that easily bridge formation is bad.
In patent documentation 1, as in being provided with the Wave soldering tank of pipeline, making, disclose and be provided with the stabilisation mechanism that makes the confinement plate that fusion welding can rise in the bottom that is in the pipe section under the nozzle from the method for the constant height of the fusion welding of nozzle jet.
In addition, the applicant also discloses following Wave soldering tank in patent documentation 2: the bottom that is being in the pipe section under the nozzle be provided with transverse width from pipe outlet towards a nozzle distant place to and the different a plurality of transition plates of transverse width that broaden successively.
Patent documentation 1: real public clear 50-10432 number of Japan
Patent documentation 2: Japan opens flat 1-114165 communique in fact
But, adopt patent documentation 1, in Wave soldering tank, for the jet flow that makes fusion welding rises, confinement plate is arranged on the bottom that is in the pipeline under the nozzle.But this Wave soldering tank exists that the jet flow of nozzle nearside is easy to raise, the jet flow in nozzle distally reduces such problem points.
In addition, adopt patent documentation 2, solved that jet flow as the nozzle nearside of the problem points of patent documentation 1 is easy to raise, the jet flow in nozzle distally reduces such problem, by the different a plurality of transition plates of transverse width that transverse width broadens to going towards a nozzle distant place successively from pipe outlet are set in Wave soldering tank, make the jet flow height in the jet flow of nozzle nearside and nozzle distally consistent, make highly stableization of jet flow of fusion welding.But the jet flow that runs into behind the wall of pipe interior runs into cowling panel and causes turbulent flow, has the such problem from the height disorder of the fusion welding of nozzle jet flow of pulsation that is known as that produces.
Summary of the invention
Therefore, the objective of the invention is to solve this problem, make from the height of the fusion welding of nozzle jet even.
Discoveries such as the inventor, the generation reason that is known as the height disorder of the such scolder from nozzle jet of pulsation is to cause what turbulent flow produced because the fusion welding by pipeline runs into the wall of pipe interior, if find not run into the wall of pipe interior by the fusion welding of pipeline, will reduce from the height disorder of the fusion welding of nozzle jet, and then finish the present invention.
Wave soldering tank of the present invention is characterised in that, comprising: the resettlement section, and it is used to accommodate fusion welding; Pressurized delivered portion, it is used for the fusion welding that pressurized delivered is accommodated in the resettlement section; The 1st pipe section, it is used for and will be guided to the inflow direction of regulation by the fusion welding that pressurized delivered portion pressurized delivered is come; Changes direction end, it is used to change by the inflow direction of the 1st pipe section to the fusion welding of the inflow direction guiding of regulation; The 2nd pipe section, it is used for and will utilizes changes direction end to change the direction guiding of the fusion welding of inflow direction to nozzle.
Adopt Wave soldering tank of the present invention, the resettlement section is used to accommodate fusion welding, pressurized delivered portion is used for the fusion welding that pressurized delivered is accommodated in the resettlement section, the 1st pipe section is used for and will be guided to the inflow direction of regulation by the fusion welding that pressurized delivered portion pressurized delivered is come, changes direction end is used to change by the inflow direction of the 1st pipe section to the fusion welding of the inflow direction guiding of regulation, and the 2nd pipe section is used for and will utilizes changes direction end to change the direction guiding of the fusion welding of inflow direction to nozzle.Thus, when utilizing the inflow direction of changes direction end conversion fusion welding, this changes direction end prevents the fusion welding turbulization, therefore, can make from flow velocity and the influx stabilisation of the 2nd pipe section to the fusion welding of the direction guiding of nozzle.
Adopt Wave soldering tank of the present invention, because from flow velocity and the influx stabilisation of the 2nd pipe section, therefore, can make from the height of the fusion welding of the top jet flow of nozzle even to the fusion welding of the direction of nozzle guiding.Thus, can reduce that the bridge formation that is attached with scolder at the position except that the regulation position is bad, the open of attached solder is not bad at the regulation position.
Description of drawings
Fig. 1 is the main cutaway view of structure example of the Wave soldering tank 1 of expression the 1st execution mode.
Fig. 2 is the cutaway view of expression with the structure example of the Wave soldering tank 1 of the cut-out of the A-A among Fig. 1.
Fig. 3 is the cutaway view of expression with the structure example of the Wave soldering tank 1 of the cut-out of the B-B among Fig. 2.
Fig. 4 is the flow chart of the action example of expression Wave soldering tank 1.
Fig. 5 is that the master of structure example of the Wave soldering tank 1A of expression the 2nd execution mode looks cutaway view.
Fig. 6 is the cutaway view of expression with the structure example of the Wave soldering tank 1A of the cut-out of the C-C among Fig. 5.
Fig. 7 is the cutaway view of expression with the structure example of the Wave soldering tank 1A of the cut-out of the D-D among Fig. 6.
Embodiment
Below, with reference to an example of the execution mode of description of drawings Wave soldering tank of the present invention.
The 1st execution mode
The Wave soldering tank 1 of present embodiment comprises the groove body portion 2 as an example of the resettlement section that is used to accommodate fusion welding 20, as being used for the pump portion 10 of an example of pressurized delivered portion that pressurized delivered is accommodated in the fusion welding 20 of groove body portion 2, be used for the fusion welding 20 that will come by pump portion 10 pressurized delivered the 1st pipe section 4 to the inflow direction guiding of regulation, be used to change by the changes direction end 9 of the 1st pipe section 4 to the inflow direction of the fusion welding 20 of the inflow direction guiding of regulation, and the fusion welding 20 that is used for utilizing changes direction end 9 to change inflow direction is directed to the 2nd pipe section 5 of nozzle body portion 6.Wave soldering tank 1 is when utilizing the inflow direction of changes direction end 9 conversion fusion weldings 20, this changes direction end 9 prevents fusion welding 20 turbulization, therefore, be directed to the flow velocity and the influx stabilisation of the fusion welding 20 of nozzle body portion 6 from the 2nd pipe section 5, can make from the height of the fusion welding 20 of jet hole 3 jet flows even.
The structure example of Wave soldering tank 1
As Fig. 1～shown in Figure 3, Wave soldering tank 1 is made of groove body portion 2, pump portion the 10, the 1st pipe section 4, changes direction end the 9, the 2nd pipe section 5 and nozzle body portion 6.
In groove body portion 2, contain fusion welding 20.Fusion welding 20 for example is a lead-free solder, is made of tin-silver-copper, tin-zinc-bismuth etc.Sidepiece in groove body portion 2 is provided with pump portion 10, is provided with the 1st pipe section 4, changes direction end the 9, the 2nd pipe section 5 and nozzle body portion 6 in the inside of groove body portion 2.Wave soldering tank 1 constitutes, under the effect of pump portion 10, the fusion welding 20 that is contained in groove body portion 2 is fed into nozzle body portion 6 via the 1st pipe section 4, changes direction end 9 and the 2nd pipe section 5, thus with fusion welding 20 from jet hole 3 jet flows to not shown printed circuit board (PCB).
By screw rod 16 rotations that pump portion 10 is had, fusion welding 20 pressurized conveyings.The fusion welding 20 that pressurized delivered is come utilizes the 1st pipe section 4 to the inflow direction of regulation (below be called inflow direction P1) guiding.
The 1st pipe section 4 is connected with changes direction end 9.Changes direction end 9 is used for and will be converted to inflow direction P2 (with reference to Fig. 2) by the inflow direction P1 of the next fusion welding 20 of the 1st pipe section 4 guiding, and fusion welding 20 is directed to the 2nd pipe section 5.For changes direction end 9, its wall has the arc of the inflow direction that is used for changing gradually fusion welding 20, collides in this curved wall by fusion welding 20, and the mobile quilt of fusion welding 20 relaxes, and prevents fusion welding 20 turbulization.Thus, the flow velocity of fusion welding 20 and influx are even.
In the 2nd pipe section 5, from the bottom of the 2nd pipe section 5 an above demarcation strip 7 (for example among Fig. 2 and Fig. 3, erect and be provided with 5 demarcation strips 7) is set to top abreast with inflow direction P3.This demarcation strip 7 will be divided into many parts in the 2nd pipe section 5, have flow velocity and the uniform more function of influx that makes fusion welding 20.For example, as shown in Figure 2, demarcation strip 7 is set, two Room about the 2nd pipe section 5 is divided at the center of the 2nd pipe section 5.Fusion welding 20 arrives nozzle body portion 6 by demarcation strip 7 backs.
The length that exchanges plate main part 8a, 8b, 8c has nothing in common with each other, and for example forms its length from the elongated successively (8a＜8b＜8c) towards ground, distally of the nearside of nozzle body portion 6.In addition, the height that exchange in the nozzle body portion that is arranged on 6 of an end of plate main part 8a, 8b, 8c have nothing in common with each other, and for example are set to its height and reduce (8c＜8b＜8a) successively towards ground, distally from the nearside of nozzle body portion 6.Preferably be set to, 8b is identical respectively with the interval of the peripheral part of the interval that exchanges plate main part 8c and interchange plate main part 8c and nozzle body portion 6 with the interval that exchanges plate main part 8b, interchange plate main part with the interval that exchanges plate main part 8a, interchange plate main part 8a for the peripheral part of nozzle body portion 6.Thus, fusion welding can be guided to jet hole 3 equably.
Be provided with jet hole 3 on the top that exchanges plate 8 and the top of nozzle body portion 6.Jet hole 3 is used for fusion welding 20 jet flows that flow velocity and influx are stable under the effect that exchanges plate 8 are arrived not shown printed circuit board (PCB).Because stable from the flow velocity and the influx of the fusion welding 20 of jet hole 3 jet flows, therefore, its jet flow height is even.Thus, the position except that the regulation position that can be reduced in printed circuit board (PCB) is attached with that the bridge formation of scolder is bad, the open of attached solder is not bad at the regulation position.
The action example of Wave soldering tank 1
The action example of the Wave soldering tank 1 of present embodiment then, is described.As shown in Figure 4, in step ST1, during with the electric power starting of Wave soldering tank 1, pump portion 10 drives, and the fusion welding 20 that will be in groove body portion 2 is pressed and delivered to the 1st pipe section 4.
Carry out the transition to step ST2, as shown in Figure 2, the fusion welding 20 that is come by pump portion 10 pressurized delivered is directed into changes direction end 9 in the mode that longshore current Inbound P1 flows in the 1st pipe section 4.
Carry out the transition to step ST3, the inflow direction P1 that is directed into the fusion welding 20 of the 1st pipe section 4 utilizes changes direction end 9 to be converted to inflow direction P2.At this moment, the fusion welding 20 that is directed into the 1st pipe section 4 collides with the curved wall that is positioned at changes direction end 9, thereby the mobile quilt of fusion welding 20 relaxes, and prevents this fusion welding 20 turbulization, makes the flow velocity and the influx stabilisation of this fusion welding 20.
Carry out the transition to step ST4, the fusion welding 20 that utilizes changes direction end 9 to change direction is directed nozzle body portion 6 by the 2nd pipe section 5 in the mode that longshore current Inbound P3 flows into.A plurality of demarcation strips 7 further stabilisations that the flow velocity of fusion welding 20 and influx utilize the 2nd pipe section 5 to be had.
Carry out the transition to step ST5, fusion welding 20 collides the interchange plate 8 that is had in nozzle body portion 6, thereby the inflow direction P3 of fusion welding 20 is to change into inflow direction P4 (with reference to Fig. 1) up towards the mode of jet hole 3.In addition, owing to interchange plate main part 8a, 8b, 8c have arc, therefore, collide flow velocity and influx difference homogenizing in the fusion welding 20 that exchanges plate main part 8a, 8b, 8c.
Carry out the transition to step ST6, the fusion welding 20 that flow velocity and influx have been stablized under changes direction end 9, demarcation strip 7 and the effect that exchanges plate 8 arrives jet holes 3.This fusion welding 20 is with the printed circuit board (PCB) of uniform height jet flow to the top of passing through jet hole 3.
Like this, adopt the Wave soldering tank 1 of the 1st execution mode, groove body portion 2 is used to accommodate fusion welding 20, pump portion 10 is used for and will be contained in fusion welding 20 pressurized delivered of groove body portion 2, the fusion welding 20 that the 1st pipe section 4 is used for being come by pump portion 10 pressurized delivered guides to inflow direction P1, changes direction end 9 is used for and will be converted to inflow direction P2 by the inflow direction P1 of the next fusion welding 20 of the 1st pipe section 4 guiding, and the fusion welding 20 that the 2nd pipe section 5 is used for utilizing changes direction end 9 to be converted to inflow direction P2 guides to nozzle body portion 6 with inflow direction P3.Thus, when the inflow direction P1 that utilizes changes direction end 9 with fusion welding 20 is converted to inflow direction P2, this changes direction end 9 prevents fusion welding 20 turbulization, therefore, can make the flow velocity and the influx stabilisation that are directed to the fusion welding 20 of nozzle body portion 6 from the 2nd pipe section 5.
Thus, can make from the height of the fusion welding 20 of jet hole 3 jet flows even.As a result, can be reduced in position except that the regulation position and be attached with that the bridge formation of scolder is bad, the open of attached solder is not bad at the regulation position.
The 2nd execution mode
In the present embodiment, the Wave soldering tank 1A that is provided with cowling panel 50 in above-mentioned Wave soldering tank 1 is described.In the 2nd execution mode,, therefore, omit its explanation owing to the member with above-mentioned execution mode same names and Reference numeral has identical functions.
As Fig. 5～shown in Figure 7, Wave soldering tank 1A is made of pump portion 10, groove body portion the 2, the 1st pipe section 4, changes direction end the 9, the 2nd pipe section 5, nozzle body portion 6 and cowling panel 50.Cowling panel 50 is arranged between the interchange plate 8 and jet hole 3 in the nozzle body portion 6.Cowling panel 50 has the function of the inflow direction P4 homogenizing that makes fusion welding 20.Cowling panel 50 is the latticed members that formed by metal, pottery.Utilize interchange plate 8 to pass through cowling panel 50, thereby make more even from the jet flow height of jet hole 3 towards the fusion welding 20 that becomes inflow direction P4.
Like this, adopt the Wave soldering tank 1A of the 2nd execution mode, owing in nozzle body portion 6, be provided with and be used to make the flow velocity of fusion welding 20 and the cowling panel 50 of influx stabilisation, therefore, can make from the height of the fusion welding 20 of jet hole 3 jet flows more even.As a result, can further be reduced in position except that the regulation position and be attached with that the bridge formation of scolder is bad, the open of attached solder is not bad at the regulation position.
In addition, in the present invention, with 3 interchange plate main part 8a, 8b, 8c Wave soldering tank 1,1A have been described, but have been not limited thereto that the quantity that exchanges plate main part 8a, 8b, 8c can be arbitrarily.In addition, in the present invention, be provided with the 1st pipe section 4 in the both sides of the 2nd pipe section 5, but be not limited thereto, also can be only in one-sided the 1st pipe section 4 that is provided with of the 2nd pipe section 5.In addition, in the present invention, with 5 demarcation strips 7 Wave soldering tank has been described, but has been not limited thereto that the quantity of demarcation strip 7 can be arbitrarily.
Industrial applicibility
The present invention very is suitable for the Wave soldering tank that the jet flow fusion welding comes printed circuit board (PCB) etc. is carried out soldering.
Description of reference numerals
1,1A, Wave soldering tank;
2, groove body portion;
3, jet hole;
4, the 1st pipe section;
5, the 2nd pipe section;
6, nozzle body portion;
7, demarcation strip;
8, exchange plate;
8a, 8b, 8c, interchange plate main part;
9, changes direction end;
10, pump portion;
20, fusion welding;
50, cowling panel.
Claims (6)
1. a Wave soldering tank is characterized in that,
Comprise:
The resettlement section, it is used to accommodate fusion welding;
Pressurized delivered portion, it is used for the fusion welding that pressurized delivered is accommodated in above-mentioned resettlement section;
The 1st pipe section, it is used for and will be guided to the inflow direction of regulation by the next fusion welding of above-mentioned pressurized delivered portion's pressurized delivered;
Changes direction end, it is used to change by the above-mentioned inflow direction of above-mentioned the 1st pipe section to the fusion welding of the inflow direction guiding of regulation;
The 2nd pipe section, it is used for and will utilizes above-mentioned changes direction end to change the direction guiding of the fusion welding of inflow direction to nozzle.
2. Wave soldering tank according to claim 1 is characterized in that,
This Wave soldering tank is provided with two above-mentioned the 1st pipe section;
Above-mentioned the 2nd pipe section is arranged between two above-mentioned the 1st pipe section.
3. Wave soldering tank according to claim 1 and 2 is characterized in that,
Above-mentioned changes direction end has the arc of the inflow direction that is used for changing gradually fusion welding.
4. according to each described Wave soldering tank in the claim 1～3, it is characterized in that,
In above-mentioned the 2nd pipe section, erect with the direction almost parallel ground of said nozzle more than one demarcation strip is set.
5. according to each described Wave soldering tank in the claim 1～4, it is characterized in that,
In said nozzle, be provided with interchange plate with arc;
Above-mentioned interchange plate has a plurality of interchange plate main parts that the distance that passes through has nothing in common with each other, and above-mentioned interchange plate main part is arranged at the height that has nothing in common with each other.
6. according to each described Wave soldering tank in the claim 1～5, it is characterized in that,
In said nozzle, be provided with cowling panel with latticed metallic or ceramic.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009015867A JP5332654B2 (en) | 2009-01-27 | 2009-01-27 | Jet solder bath |
| JP2009-015867 | 2009-01-27 | ||
| PCT/JP2010/050981 WO2010087341A1 (en) | 2009-01-27 | 2010-01-26 | Jet solder bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102301841A true CN102301841A (en) | 2011-12-28 |
Family
ID=42395602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800057156A Pending CN102301841A (en) | 2009-01-27 | 2010-01-26 | Jet solder bath |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5332654B2 (en) |
| CN (1) | CN102301841A (en) |
| WO (1) | WO2010087341A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192155A (en) * | 2012-01-06 | 2013-07-10 | 株式会社田村制作所 | Solder groove |
| CN110385498A (en) * | 2018-04-20 | 2019-10-29 | 欧姆龙株式会社 | Jet type welding apparatus |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5601342B2 (en) | 2012-04-27 | 2014-10-08 | 千住金属工業株式会社 | Drift plate and jet device |
| JP6806638B2 (en) * | 2017-07-03 | 2021-01-06 | 株式会社デンソーテン | Soldering equipment and soldering method |
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| JPS561264A (en) * | 1979-06-14 | 1981-01-08 | Matsushita Electric Ind Co Ltd | Soldering device |
| JPS61126960A (en) * | 1984-11-26 | 1986-06-14 | Tamura Seisakusho Co Ltd | Jet type soldering device |
| JP3874567B2 (en) * | 1999-01-18 | 2007-01-31 | 日本電熱計器株式会社 | Soldering equipment |
| JP2003205363A (en) * | 2002-01-15 | 2003-07-22 | Nihon Dennetsu Keiki Co Ltd | Soldering jet wave forming device by induction type electromagnetic pump system |
| JP2003347720A (en) * | 2002-05-23 | 2003-12-05 | Nissan Motor Co Ltd | Wave soldering apparatus |
| JP2008030072A (en) * | 2006-07-27 | 2008-02-14 | Nihon Dennetsu Keiki Co Ltd | Alip type flow soldering apparatus |
-
2009
- 2009-01-27 JP JP2009015867A patent/JP5332654B2/en active Active
-
2010
- 2010-01-26 CN CN2010800057156A patent/CN102301841A/en active Pending
- 2010-01-26 WO PCT/JP2010/050981 patent/WO2010087341A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103192155A (en) * | 2012-01-06 | 2013-07-10 | 株式会社田村制作所 | Solder groove |
| CN103192155B (en) * | 2012-01-06 | 2016-12-28 | 株式会社田村制作所 | Solder bath |
| CN110385498A (en) * | 2018-04-20 | 2019-10-29 | 欧姆龙株式会社 | Jet type welding apparatus |
| CN110385498B (en) * | 2018-04-20 | 2022-02-18 | 欧姆龙株式会社 | Jet welding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5332654B2 (en) | 2013-11-06 |
| JP2010177287A (en) | 2010-08-12 |
| WO2010087341A1 (en) | 2010-08-05 |
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Application publication date: 20111228 |