CN212191616U - Tin coating system of intensive pin device - Google Patents

Abstract

The utility model is suitable for an integrated circuit welding technology field. The utility model discloses a tin system that wards off of intensive pin device, including warding off the tin device, should ward off the tin device and include the tin nozzle that wards off, should ward off the tin nozzle and include the nozzle body that makes to be equipped with out the tin mouth, the nozzle body is equipped with the arc inclined plane that makes liquid soldering tin form the tin film from its surperficial tin stream, and the thickness top-down of this tin film thins gradually. Because the outer side surface of the nozzle body is provided with the arc-shaped inclined surface, when the tin output is constant and flows through the nozzle body with the arc-shaped inclined surface, a tin film which becomes thinner gradually from top to bottom is formed. The position that the pin passes through the tin film is confirmed according to the pin is intensive when warding off the tin, can guarantee again through surperficial cambered surface structure to ward off the tin when, the pin face and the arc inclined plane contact surface of device are less, simultaneously under tin flow combined action for be difficult to form even tin phenomenon between two pins at the warding off welding in-process, appear even tin phenomenon when avoiding warding off the welding.

Description

Tin coating system of intensive pin device

Technical Field

The utility model relates to an integrated circuit welding technology field, in particular to intensive pin device's tin system that wards off.

Background

The pre-soldering is to wet the lead of the component to be soldered or the conductive soldered portion with solder in advance, and is also generally called as tinning, or tinning. The existing tin-coating machine mainly comprises a common tin-coating machine and an ultrasonic tin-coating machine. Because the size and the distribution density of the pins of tin coating are different, the difficulty of the tin coating process is different.

At present, the tin-coating equipment usually adopts a plane water curtain type tin film formed by a nozzle, and the minimum distance of tin coating can only be 0.3mm, however, the minimum pin distance of pins of a common integrated circuit is 0.2 mm. Meanwhile, along with the development trend of integrated circuits, the integrated circuits have larger and larger functions and limited areas, the pin density of the integrated circuits is larger and larger, and the phenomenon of tin connection between two pins is easily caused by adopting the prior art, so that the short circuit between the pins of the integrated circuits is caused, and therefore, the requirements of gold removal and tin coating of the pins of the prior integrated circuits cannot be met, and the requirements of the development trend of the integrated circuits on tin coating cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides a tin system that wards off of intensive pin device, and this tin system that wards off of intensive pin device avoids warding off the bad that tin appears to the intensive device of pin distribution, and the intensive device that adapts to the pin distribution wards off the tin requirement, improves and wards off the tin quality.

In order to solve the problem, the utility model provides a tin system that wards off of intensive pin device. This intensive pin device's enameling tin system, including the control module who enamels tin device and control this enameling tin device work, should enameling tin device is including enameling tin nozzle, should enameling tin nozzle including the nozzle body that makes and be equipped with the tin outlet, the nozzle body is equipped with the arc inclined plane that makes liquid soldering tin form the tin film from its surperficial tin flow, and the thickness top-down of this tin film thins gradually.

Furthermore, the outer side of the nozzle body is conical by an arc inclined plane, and the tin outlet is positioned at the top of the conical nozzle.

Furthermore, the arc-shaped inclined plane of the nozzle body is at least provided with a uniform baffling groove which can slow down the flow speed of tin on the upper part and the thickness of the tin.

Further, when the outer side of the nozzle body is conical formed by the arc-shaped inclined plane, the surface baffling groove is annular or arc-shaped.

Furthermore, the plane of the baffle groove is preferably parallel to the plane of the tin outlet.

Further, the tin coating system also comprises a constant welding conveying device for controlling the tin outlet of the tin outlet to be constant.

The constant solder feeding device comprises a flow channel immersed in tin bath soldering tin liquid, one end of the flow channel is communicated with the conical nozzle, one end of the flow channel is provided with an impeller driven by a constant closed-loop servo motor, and one end of the flow channel, which is provided with the impeller, is also provided with a tin inlet communicated with the tin bath.

Furthermore, the tin coating system also comprises an upper tin-assistant device for applying a tin-assistant agent to the tin-coating welding pin.

Furthermore, the tin-coating system also comprises a preheating device for preheating the tin-coating welding pins.

The utility model discloses intensive pin device's tin system that wards off, including warding off the tin device and controlling this control module who wards off tin device work, should ward off the tin device including warding off the tin nozzle, should ward off the tin nozzle including making the nozzle body that is equipped with out the tin mouth, the nozzle body is equipped with the arc inclined plane that makes liquid soldering tin form the tin film from its surperficial tin flow, and the thickness top-down of this tin film thins gradually. Because the outer side surface of the nozzle body is provided with the arc-shaped inclined surface, when the tin output is constant and flows through the nozzle body with the arc-shaped inclined surface, a tin film which becomes thinner gradually from top to bottom is formed. The position that the pin passes through the tin film is confirmed according to the pin is intensive when warding off the tin, can guarantee again through surperficial cambered surface structure to ward off the tin when, the pin face and the arc inclined plane contact surface of device are less, and simultaneously under the momentum combined action of production in tin flows top-down flow for it is difficult to form the continuous tin phenomenon between two pins to ward off the welding in-process, appears the continuous tin phenomenon when avoiding warding off the welding.

Drawings

In order to illustrate more clearly the embodiments of the invention or the solutions of the prior art, reference will now be made briefly to the attached drawings that are needed in the description of the embodiments or the prior art, it being understood that the drawings in the description illustrate only some embodiments of the invention and are therefore not to be considered limiting of its scope, and that, to a person skilled in the art, other related drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural view of an embodiment of a tin-coating system of the dense pin device of the present invention.

Fig. 2 is a schematic structural view of an embodiment of the constant welding device of the present invention.

Fig. 3 is a schematic view of the solder flow direction during the operation of the tin coating system of the dense pin device of the present invention.

Fig. 4 is a schematic diagram of the relationship between the dense pin device and the nozzle during tin plating.

Fig. 5 is a schematic view showing the cross-sectional view of the position of the nozzle during tin coating of the dense pin device of the present invention.

FIG. 6 is a schematic structural view of an embodiment of the nozzle.

Fig. 7 is a schematic view of an embodiment of the tin-coating method for the dense pin device according to the present invention.

Fig. 8 is a schematic flow chart of another embodiment of the tin-coating method for the dense pin device according to the present invention.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The following claims are presented in conjunction with the detailed description of the invention and the accompanying drawings, it being understood that the embodiments described are only some embodiments of the invention and not all embodiments. Based on the embodiments of the present invention, those skilled in the art can find out all other embodiments without creative efforts, and all the embodiments also belong to the protection scope of the present invention.

It should be understood that in the description of the present invention, all directional terms such as "upper", "lower", "left", "right", "front", "back", etc. are used only for convenience of description and simplification of the present invention, and are not intended to limit the present invention, since they indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and are not necessarily limited to the present invention. For the purpose of explaining the relative positional relationship of the components, the movement, etc., as shown in the drawings, when the specific attitude is changed, the directional indication may be changed accordingly.

Furthermore, the use of ordinal numbers such as "first", "second", etc., in the present application is for distinguishing purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. The features defining "first" and "second" may be explicit or implicit in relation to at least one of the technical features. In the description of the present invention, "a plurality" means at least two, i.e., two or more, unless expressly defined otherwise; the meaning of "at least one" is one or both.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

The utility model relates to a controller, control module, control circuit are the conventional control of technical staff in the field, can realize through the simple programming of technical staff in the field like the control circuit of controller, the supply also belongs to the common general knowledge in this field, and the utility model discloses main utility model technical point lies in improving mechanical device, so the utility model discloses specific circuit control relation and circuit connection are no longer explained in detail.

As shown in fig. 1-6, the present invention provides an embodiment of a tin-coating system for a dense pin device.

This intensive pin device's tin system that wards off includes and wards off tin device and control module (the attached drawing does not mark) of controlling this tin device work, and this tin device that wards off is including warding off the tin nozzle, should warding off the tin nozzle including making the nozzle body 1 that is equipped with tin outlet 11, nozzle body 1 is equipped with the arc inclined plane 10 that makes liquid soldering tin form soldering tin membrane C from its surface tin stream, and this soldering tin membrane C's thickness top-down thins gradually.

In this way, the dense pin device B of the present invention refers to a device with dense pins, such as an integrated circuit IC; the dense pins B1 mean that the gap between the pins is small. The control module is controlled by adopting a conventional technology, and conventional software is used for realizing the control of the tin coating device by adopting the existing programming in the field, such as the control of the constant welding device.

Because the outer side surface of the nozzle body 1 is provided with the arc-shaped inclined surface 13, when the tin outlet 11 has constant tin outlet quantity and flows through the nozzle body 1 with the arc-shaped inclined surface 10, a tin film C which becomes thinner gradually from top to bottom is formed. According to the pin intensive condition when warding off the tin, confirm the pin and bore tin through the tin film C position of different thickness, can guarantee again through surperficial arc inclined plane 10 structure when warding off the tin, pin B1 and the arc inclined plane 10 contact surface of intensive pin device B are less, simultaneously because the tin flows from going up from F orientation down from tin outlet 11, it produces certain momentum for at the same time, be difficult to form the continuous tin phenomenon between two pins at the warding off welding in-process, appear the continuous tin phenomenon when avoiding warding off the welding.

The thickness of the arc-shaped inclined surface 10 of the nozzle body 11 and the contact position of the tin film and the soldering tin during tin coating can be determined through limited tests and obtained empirical values according to the tin output and the area flowing through the arc-shaped inclined surface 11.

The nozzle body 1 can adopt a structure that the outer side of the nozzle body 1 is formed into a cone shape by an arc inclined plane 10, and the tin outlet 11 is positioned at the top of the cone-shaped nozzle.

According to the needs, the arc inclined surface 10 of the nozzle body 11 is at least provided with a baffling groove 12, the baffling groove 12 divides the arc inclined surface 10 into two discontinuous first arc inclined surfaces 13 and second arc inclined surfaces 14, and the baffling groove 12 can enable tin flow to get down from the surface of the second arc inclined surfaces 14 along the direction F to have certain resistance, so that the tin flow C speed of the first arc inclined surfaces 13 on the upper portion of the baffling groove 12 is reduced, and the thickness of the tin film C on the surface of the first arc inclined surfaces 13 on the upper portion of the baffling groove 12 tends to be uniform.

The number of the baffle grooves 12 is set according to the requirement, and can be one, two or more, the shape of the baffle groove 12 is the same with the shape of the surface of the nozzle body 1, if the outer surface of the nozzle body 1 is the arc inclined plane 10, the baffle groove 12 is arc, when the nozzle body 11 is conical formed by the arc inclined plane 10, the baffle groove 12 is ring-shaped. The plane of the diversion groove 12 is preferably parallel to the plane of the tin outlet 11, so as to ensure that the thickness of the tin film on the arc-shaped inclined plane 10 on the same circle or arc is the same.

According to the needs, the tin coating system of the dense pin device C further comprises a constant solder sending device for controlling the tin outlet 11 to have constant tin outlet amount, and the tin amount coming out from the nozzle tin outlet is ensured to be stable, so that the thickness of a tin film distributed at the same position on the arc-shaped inclined plane of the nozzle body is ensured to be relatively stable. The constant solder feeding device comprises a flow channel 3 immersed in solder liquid A of a tin bath 2, one end of the flow channel 3 is communicated with a conical nozzle body 1, one end of the flow channel 3 is provided with an impeller 4 driven by a constant closed-loop servo motor 6, and one end of the flow channel 3 provided with the impeller 4 is also provided with a tin inlet 5 communicated with the tin bath 3. The servo motor 6 can use a belt to drive the impeller rotating shaft 61 and then drive the impeller 4 to work. The impeller 4 is not an improvement of the present invention and can be realized by adopting the prior art. The above-mentioned

According to the requirement, the tin-coating system of the pin-dense device further comprises a preheating device for preheating the pins of the pin-dense device before tin coating. The preheating device needs to heat the activity of the soldering flux to excite the activity of the soldering flux through preheating the soldering flux, so that oxides can be better removed, the temperature difference during tin coating is reduced, the possibility of deformation is reduced, and the thermal shock during tin coating of the integrated circuit IC is reduced. Preheating device can not the utility model discloses improve the main points, can adopt prior art to realize. And adhering the soldering flux to the pins of the dense pin device through the soldering flux adhering device before preheating according to the requirement, so that subsequent preheating and slush welding are facilitated.

According to the needs, the tin system that wards off still includes to warding off the preheating device that carries out preheating to warding off the welding pin with the last tin agent device that helps the tin agent on the welding pin, wherein go up and help tin agent device and preheating device not the utility model discloses a utility model point, it adopts prior art to realize, no longer gives unnecessary details.

According to the needs, still be equipped with the guiding mechanism 7 of adjustment nozzle position on the tin-coating device, it includes four double-screw bolts that are located both sides respectively, and every double-screw bolt is equipped with the nut, realizes position adjustment through four nuts respectively and the cooperation between four double-screw bolt positions. The position of the nozzle can be adjusted, specifically, the height of the nozzle, the levelness of a tin outlet of the nozzle and other positions can be adjusted.

As shown in fig. 7, the present invention further provides a tin-coating method for the dense pin device, which comprises,

and S1, controlling the constant tin output, specifically, enabling the tin output of the nozzle tin outlet to be constant, namely, the tin output is constant when the same device pin is subjected to tin enameling, or the tin output flowing through the tin outlet is the same when any device is subjected to tin enameling, and realizing tin enameling of different pin densities through a specific nozzle structure.

And S2, forming a tin film on the surface of the nozzle, specifically, uniformly dispersing the constant tin amount of the tin outlet on the arc-shaped inclined plane of the nozzle to form the tin film, wherein the tin film is formed to be gradually reduced in thickness distributed from top to bottom, and specifically, when the tin amount of the tin outlet is constant and flows through the nozzle body with the arc-shaped inclined plane, the tin film gradually thinned from top to bottom is formed. The pin is confirmed according to the pin intensive condition and is warded off tin through the tin film position of different thickness when warding off tin, can guarantee through surface cambered surface structure again when warding off tin, and the pin and the arc inclined plane contact surface of device are less, simultaneously because the tin flows from last flowing from bottom to bottom, and its produces certain momentum for at the slush welding in-process be difficult to form the continuous tin phenomenon between two pins, appear the continuous tin phenomenon when avoiding the slush welding.

And S3, tinning the pins of the dense pin device, horizontally moving the dense pin device at a uniform speed, enabling the pins of the dense pin device to be subjected to slush welding to enter a tin film and slide from the surface of the nozzle, and finishing the slush welding.

Because the outer side surface of the nozzle body is provided with the arc-shaped inclined surface, when the tin outlet amount of the tin outlet is constant and flows through the nozzle body with the arc-shaped inclined surface, a tin film which becomes thinner gradually from top to bottom is formed. The pin is confirmed according to the pin intensive condition and is warded off tin through the tin film position of different thickness when warding off tin, can guarantee through surface cambered surface structure again when warding off tin, and the pin and the arc inclined plane contact surface of device are less, simultaneously because the tin flows from last flowing from bottom to bottom, and its produces certain momentum for at the slush welding in-process be difficult to form the continuous tin phenomenon between two pins, appear the continuous tin phenomenon when avoiding the slush welding.

The arc inclined plane of the surface of the outer side of the nozzle body is at least provided with a baffling groove which enables the flow velocity of tin at the upper part to slow down the tin thickness and is uniform, the baffling groove adopts the structure of the embodiment, the effect and the function are the same, and the description is omitted.

As shown in fig. 8, the method for enameling tin in the dense pin device further includes a step S4 of preheating the pins of the dense pin device before enameling tin in the pins of the dense pin device, specifically, preheating the flux to activate the activity of the flux, so as to better remove the oxide, reduce the temperature difference during enameling tin, and reduce the possibility of deformation, thereby reducing the thermal shock during enameling tin in the integrated circuit IC.

When the same nozzle is adopted and the tin output amount is the same, when the pins of the pin dense device are subjected to the slush welding of the devices with different pin densities, the position of the pin with higher pin density in contact with the tin film on the surface of the nozzle is lower than the position of the pin with lower pin density in contact with the tin film on the surface of the nozzle when the pin with higher pin density is subjected to the slush welding. Specifically speaking, because the nozzle body outside arc inclined plane structure is from going out the tin mouth to the regional area of keeping away from the direction from increasing, when going out the tin volume the same, the regional tin film thickness that the area is great is thinner, therefore can bore tin to the IC that the pin is more intensive, avoids appearing the continuous tin phenomenon.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.

Claims (9)

1. The tin system that wards off of intensive pin device, including warding off the tin device and controlling the control module that this warded off the tin device work, should warded off the tin device and include warding off the tin nozzle, should warded off the tin nozzle and include the nozzle body that makes to be equipped with the tin outlet, its characterized in that, the nozzle body is equipped with the arc inclined plane that makes liquid soldering tin form the tin film from its surperficial tin stream, and the thickness top-down of this tin film thins gradually.

2. The tin-coating system for dense pin devices as claimed in claim 1, wherein: the outer side of the nozzle body is conical formed by an arc inclined plane, and the tin outlet is positioned at the top of the conical nozzle.

3. The tin-coating system for dense pin devices as claimed in claim 1 or 2, wherein: the arc-shaped inclined plane of the nozzle body is at least provided with a uniform baffling groove which can slow down the flow speed of tin at the upper part and the thickness of the tin.

4. The tin-coating system for dense pin devices as claimed in claim 3, wherein: when the outer side of the nozzle body is conical formed by the arc-shaped inclined plane, the surface baffling groove is annular or arc-shaped.

5. The tin-coating system for dense pin devices as claimed in claim 3, wherein: the baffling groove is parallel to the tin outlet of the nozzle.

6. The tin-coating system for dense pin devices as claimed in claim 1, wherein: the tin coating system also comprises a constant welding conveying device for controlling the tin outlet of the tin outlet to be constant.

7. The tin-coating system for dense pin devices as claimed in claim 6, wherein: the constant solder feeding device comprises a flow channel immersed in tin bath soldering tin liquid, one end of the flow channel is communicated with the conical nozzle, one end of the flow channel is provided with an impeller driven by a constant closed-loop servo motor, and one end of the flow channel, which is provided with the impeller, is also provided with a tin inlet communicated with the tin bath.

8. The tin-coating system for dense pin devices as claimed in claim 1, wherein: the tin coating system also comprises an upper tin flux assisting device for assisting tin flux on the tin coating welding pin.

9. The tin-coating system for dense pin devices as claimed in claim 1 or 8, wherein: the tin-coating system further comprises a preheating device for preheating the tin-coating welding pins.

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