CN102291098A - Insulating moisture-proof method of chip of other piezoelectric ceramic radial vibration mode frequency device - Google Patents
Insulating moisture-proof method of chip of other piezoelectric ceramic radial vibration mode frequency device Download PDFInfo
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- CN102291098A CN102291098A CN2010102090235A CN201010209023A CN102291098A CN 102291098 A CN102291098 A CN 102291098A CN 2010102090235 A CN2010102090235 A CN 2010102090235A CN 201010209023 A CN201010209023 A CN 201010209023A CN 102291098 A CN102291098 A CN 102291098A
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- chip
- piezoelectric ceramic
- frequency device
- radial vibration
- insulating
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Abstract
The invention relates to an insulating moisture-proof method of a chip of an other piezoelectric ceramic radial vibration mode frequency device. The insulation and moisture proof method of the chip of the other piezoelectric ceramic radial vibration mode frequency device is characterized in that the parts of ceramics positioned on the four end surfaces of the chip are sealed by using insulating moisture-proof materials to form an insulating protection layer enabling the ceramics to be impossibly polluted by insulating the ceramics and an external environment before the piezoelectric ceramic radial vibration mode frequency device is assembled, wherein the parts do not have electrodes, and the insulating moisture-proof materials are resins, printing ink or paint; the insulating protection layer formed by the insulating moisture-proof materials is covered between two electrodes of the ceramic chip, the insulating protection layer covers the end surface of the integral chip, and even both ends of the insulating protection layer span on the edge of the electrodes, and therefore, the possibility of pollution between the electrode and the electrode is prevented and the work stability of the piezoelectric ceramic chip is facilitated; and in addition, the forming time of the insulating protection layer can be carried out by small chips or combining the small chips together, and therefore, a production process is greatly simplified, large-scale industrialized production is facilitated and production cost is reduced.
Description
[technical field] the present invention relates to a kind of method of insulating electronic device protection against the tide, is the method for the piezoelectric ceramic radial vibration frequency device chip insulation protection against the tide of a kind of frequency in the 190-1250KHZ scope specifically.
[background technology] as electronic component, its insulation impedance must reach certain requirement, otherwise complete machine is with regard to cisco unity malfunction.Piezoelectric ceramic strength is chip to be placed in the cavity of shell to the typical structure of vibration frequency device, fix by indicator clip, chip electrode exit embedding at shell has insulating cement, the insulation impedance of this device is mainly determined by chip, and chip is made up of the argent electrode on pottery and ceramic two sides, pottery all is porous, absorb moisture easily, the thickness of chip generally has only between the 0.3-1.0mm, if chip sides is contained pollutions such as the hand perspiration of metal ion or saliva, insulation impedance is qualified when drying, once the insulation impedance that makes moist will be defective.The insulation and moisture method that generally adopts is to stop to pollute by strict technology management and control after ceramic chip cleans up at present, as the humidity when guaranteeing to assemble, the employee wears masks, wears before gloves and finger-stall, the filling casting glue with oven drying etc., but product still often lost efficacy the decline of insulating because of making moist or polluting behind last complete machine.
[summary of the invention] the purpose of this invention is to provide the method for another kind of piezoelectric ceramic radial vibration frequency device chip insulation protection against the tide, so that the insulation impedance of ceramic chip is not subjected to external condition to influence or pollute, the insulation impedance of ceramic chip can not descend when guaranteeing work.
For solving its technical problem, the technical solution used in the present invention is: in piezoelectric ceramic strength before vibration mode frequencies device assembling, seal the pottery of four end faces of chip with the insulation and moisture material, form one deck and cut off the ceramic insulating protective layer that pottery can not be polluted with external environment, further method is that insulating protective layer extends to the edge of sealing double-sided electrode;
Said insulation and moisture material is resin, printing ink or paint;
Described insulating protective layer can be cross on the electrode on two sides from the end face pottery, or only covers the end face ceramic segment;
The time that described insulating protective layer forms is to carry out on little chip, or carries out behind little chip portfolio;
The method that described insulating protective layer forms be with writing brush be coated with, the mode of hairbrush brush, silk screen printing, spraying or bat printing carries out.
Compared with prior art, the present invention has following substantive distinguishing features and obvious improvement:
1, is coated with the insulating protective layer of one usefulness insulation and moisture material composition because of (end face) between two electrodes of ceramic chip; This insulating protective layer covers the entire chip end face, and further the insulating protective layer two ends all are cross on the electrode edge, has therefore cut off contamination of heavy between electrode and the electrode, helps the job stability of ceramic chips.
2, the time that forms because of described insulating protective layer can be that little chip carries out or little chip portfolio carries out together; Therefore simplified production process greatly, helped large-scale industrial production again, reduced production costs.
[embodiment] the present invention is further described below in conjunction with embodiment:
Embodiment one: the method for single little chip insulation protection against the tide: directly be stained with the insulative water-proof material with writing brush or hairbrush and be coated onto on four end faces on the little core back and solidify, this insulative water-proof material is not limited to resin, printing ink and paint; The protection of insulative water-proof material has all been arranged on such chip electrode edge and the end face, just can not make moist in the follow-up production and the course of work again, product just can not quit work because of insulation descends yet.
Embodiment two: little chip portfolio is the method for insulation and moisture into strips: earlier a plurality of little chips are built up one rectangular, make the end face of little chip build up a face, one deck insulative water-proof material and oven dry are sprayed with the method for spraying in the back on four faces of strip combined chip, this insulative water-proof material is not limited to resin, printing ink and paint, breaks into single little chip then off with the fingers and thumb; The protection of insulative water-proof material has all been arranged on such chip electrode edge and the end face, just can not make moist in the follow-up production and the course of work again, product just can not quit work because of insulation descends yet.
Embodiment three: little chip portfolio is the method for insulation and moisture into strips: earlier a plurality of little chips are built up one rectangular, make the end face of little chip form a face, the back stamps one deck insulative water-proof material and oven dry with the method for silk screen printing on four faces of strip combined chip, this insulative water-proof material is not limited to resin, printing ink and paint, breaks into single little chip then off with the fingers and thumb; The protection of insulative water-proof material has been arranged on the end face between such chip electrode, just can not make moist in the follow-up production and the course of work again, product just can not quit work because of insulation descends yet.
Claims (5)
1. the method for another kind of piezoelectric ceramic radial vibration frequency device chip insulation protection against the tide; it is characterized in that: in piezoelectric ceramic strength before vibration mode frequencies device assembling; seal the part that does not have electrode on the pottery of four end faces of chip with the insulation and moisture material, form one deck and cut off pottery and makes pottery can not be subjected to polluting exhausted edge protective layer with external environment.
2. the method for another kind of piezoelectric ceramic radial vibration frequency device chip insulation according to claim 1 protection against the tide, it is characterized in that: said insulation and moisture material is resin, printing ink or paint.
3. the method for another kind of piezoelectric ceramic radial vibration frequency device chip insulation according to claim 1 protection against the tide, it is characterized in that: described insulating protective layer is to be cross on the electrode on two sides from the end face pottery, or only covers the end face ceramic segment.
4. according to the method for claim 1 or 3 described another kind of piezoelectric ceramic radial vibration frequency device chip insulation protection against the tide, it is characterized in that the time that described insulating protective layer forms is to carry out on little chip, or carry out after together at little chip portfolio.
5. according to the method for claim 1 or 3 or 4 described another kind of piezoelectric ceramic radial vibration frequency device chip insulation protection against the tide, it is characterized in that method that described insulating protective layer forms be with writing brush be coated with, the mode of hairbrush brush, silk screen printing, spraying or bat printing carries out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102090235A CN102291098A (en) | 2010-06-21 | 2010-06-21 | Insulating moisture-proof method of chip of other piezoelectric ceramic radial vibration mode frequency device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102090235A CN102291098A (en) | 2010-06-21 | 2010-06-21 | Insulating moisture-proof method of chip of other piezoelectric ceramic radial vibration mode frequency device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102291098A true CN102291098A (en) | 2011-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102090235A Pending CN102291098A (en) | 2010-06-21 | 2010-06-21 | Insulating moisture-proof method of chip of other piezoelectric ceramic radial vibration mode frequency device |
Country Status (1)
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| CN (1) | CN102291098A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104579215A (en) * | 2014-12-04 | 2015-04-29 | 湖南嘉业达电子有限公司 | Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device |
| CN104867634A (en) * | 2015-05-28 | 2015-08-26 | 江苏联能电子技术有限公司 | Double-member alternating-working piezoelectric fan insulation structure and electric fan thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2100029U (en) * | 1991-09-07 | 1992-03-25 | 张学成 | Piezoelectric ceramic power generator |
| CN1926763A (en) * | 2004-03-05 | 2007-03-07 | 株式会社村田制作所 | Boundary acoustic wave device |
| US20070252481A1 (en) * | 2005-06-16 | 2007-11-01 | Murata Manufacturing Co., Ltd. | Piezoelectric device and method for producing same |
-
2010
- 2010-06-21 CN CN2010102090235A patent/CN102291098A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2100029U (en) * | 1991-09-07 | 1992-03-25 | 张学成 | Piezoelectric ceramic power generator |
| CN1926763A (en) * | 2004-03-05 | 2007-03-07 | 株式会社村田制作所 | Boundary acoustic wave device |
| US20070252481A1 (en) * | 2005-06-16 | 2007-11-01 | Murata Manufacturing Co., Ltd. | Piezoelectric device and method for producing same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104579215A (en) * | 2014-12-04 | 2015-04-29 | 湖南嘉业达电子有限公司 | Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device |
| CN104867634A (en) * | 2015-05-28 | 2015-08-26 | 江苏联能电子技术有限公司 | Double-member alternating-working piezoelectric fan insulation structure and electric fan thereof |
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Application publication date: 20111221 |