CN102277613A - electroplating device - Google Patents
electroplating device Download PDFInfo
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- CN102277613A CN102277613A CN2011101591147A CN201110159114A CN102277613A CN 102277613 A CN102277613 A CN 102277613A CN 2011101591147 A CN2011101591147 A CN 2011101591147A CN 201110159114 A CN201110159114 A CN 201110159114A CN 102277613 A CN102277613 A CN 102277613A
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- cylindrical portion
- plating tank
- electroplating
- electroplanting device
- electronplate
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Abstract
The invention provides an electroplating device, which applies an electroplating groove capable of horizontally rotating around a vertical shaft and is enabled to alleviate the complexity of a conventional electroplating device and form uniform electroplating layers on a plurality of electroplated objects. The electroplating device comprises an electroplating groove capable of horizontally rotating along a vertical shaft, cathodes configured on the inner circumferential part of the electroplating groove, and anodes equipped on the central part inside the electroplating groove. The inner circumferential part of the electroplating groove is composed of an inclined part and a cylindrical part. The inclined part is continuous in a way to expand a bottom from the circular-disc-shaped bottom. The cylindrical part is connected with the inclined part. The upper surface of the electroplating groove is covered by a flat-shaped upper cover parallel to the above-mentioned bottom.
Description
Technical field
The present invention relates to be applicable to microballoon is carried out galvanized electroplanting device.
Background technology
In recent years, along with the densification of semiconductor packages (package), as with BGA (Ball Grid Array, spherical point contacts array) for the terminal of the face battle array of representative (area array) terminal type encapsulation etc., use the compound ball that is formed with tin coating.In this purposes, require the following ball of diameter 1000 μ m.
In order to use plating tank on such microballoon, to form electrolytic coating,, need to improve the dispersiveness of ball in order to prevent that ball is attached to each other in electroplating processes.
For example, following method is disclosed in patent documentation 1, with the interior perimembranous of cathode arrangement in plating tank, with the central part of anode arrangement in plating tank, by making the plating tank high speed rotating, utilize centrifugal force to be gathered negative electrode, thereby electroplate by electronplate, wherein, above-mentioned plating tank has and utilizes the rotational circle perimembranous will be sent to the structure that can discharge around the electroplate liquid in the plating tank that Z-axis rotates in the horizontal direction.In the method, by periodically just changeing repeatedly, reversing, the dispersiveness of ball is improved, thereby prevent that ball is attached to each other.
And, in patent documentation 2, essential structure and patent documentation 1 similar electroplating technology are disclosed, proposed following technology: negative electrode sets in the mode of the perisporium of formation electroplating processes chamber, to be provided for and to be induced to the guiding wall of negative electrode by electronplate with the roughly regional uniformly mode that contacts of the current density of negative electrode by electronplate, increase is formed uniform electrolytic coating thus by the touch opportunity of electronplate and negative electrode.
[patent documentation 1] Japanese kokai publication hei 11-92994 communique
[patent documentation 2] TOHKEMY 2006-37184 communique
Investigation according to the inventor, for a plurality of balls in above-mentioned such size form electrolytic coating, even if use the plating tank that is provided with guiding wall, also can't fully guarantee the touch opportunity of ball and negative electrode, existing problems aspect the even and level and smooth electrolytic coating of formation as patent documentation 2.
Summary of the invention
The object of the present invention is to provide a kind of electroplanting device, using and in the electroplanting device of the plating tank that Z-axis horizontally rotates, can improve the complicated of electroplanting device, and can be formed uniform film thickness and the good electrolytic coating of outward appearance by electronplate a plurality of.
The inventor finds, when using can be around plating tank that Z-axis horizontally rotates the time, even if the rake of regulation is set and the simple structure of flat loam cake is set in the interior perimembranous of plating tank, also can suppress the change of electroplate liquid liquid level, and making is a plurality ofly increased by the touch opportunity of electronplate and negative electrode, can be formed uniform film thickness and the good electrolytic coating of outward appearance by electronplate a plurality of, thereby reach the present invention.
That is, the invention provides a kind of electroplanting device, above-mentioned electroplanting device possesses: plating tank, and this plating tank can horizontally rotate around Z-axis; Negative electrode, this negative electrode are equipped on perimembranous in the above-mentioned plating tank; And anode, this anode is arranged at the central part in the above-mentioned plating tank, the interior perimembranous of above-mentioned plating tank is made of rake and cylindrical portion, above-mentioned rake begins in the mode of expanding above-mentioned bottom continuous from discoid bottom, above-mentioned cylindrical portion is connected with this rake, and the plating tank upper surface is covered by the flat loam cake parallel with above-mentioned bottom.
Above-mentioned cylindrical portion can be made of first cylindrical portion and second cylindrical portion, and above-mentioned first cylindrical portion is connected with above-mentioned rake, and above-mentioned cathode arrangement is in this first cylindrical portion, and above-mentioned second cylindrical portion is continuous in the mode of dwindling above-mentioned first cylindrical portion.
Preferably the central part at above-mentioned loam cake is formed with peristome, is connected with cylinder part at this peristome.
According to electroplanting device of the present invention, can form uniform film thickness and the good electrolytic coating of outward appearance at the such smallclothes of microballoon.
Description of drawings
Fig. 1 is the synoptic diagram of an example of expression electroplanting device of the present invention.
Fig. 2 is another routine synoptic diagram of expression electroplanting device of the present invention.
Label declaration
1 ... Z-axis; 2 ... plating tank; 2a ... the plating tank bottom; 2b ... rake; 2c ... cylindrical portion; 3 ... anode; 4 ... electroplate liquid; 5 ... by electronplate; 6 ... loam cake; 7a ... the plating tank bottom; 7b ... rake; 7c ... first cylindrical portion; 7d ... second cylindrical portion; 8 ... cylinder part; α ... the angle of inclination.
Embodiment
As mentioned above, key character of the present invention is, is formed with rake and cylindrical portion at the circumferential part of plating tank, and adopts flat loam cake, and rake begins in the mode of expanding above-mentioned bottom continuous from discoid bottom, and cylindrical portion is connected with this rake.Thus, the invention provides a kind of electroplanting device, can be with the designs simplification that is easy to become complicated electroplanting device, and can be formed uniform film thickness and the good electrolytic coating of outward appearance by electronplate a plurality of.Below, use the accompanying drawing of expression concrete example that electroplanting device of the present invention is elaborated.
Fig. 1 is the synoptic diagram of an example of expression electroplanting device of the present invention.
For electroplanting device of the present invention, circumferential part by the plating tank that horizontally rotates 2 of Z-axis 1 supporting is made of rake 2b and cylindrical portion 2c, wherein, rake 2b is connected with discoid bottom 2a and is continuous in the mode of expanding above-mentioned bottom, cylindrical portion 2c is connected with this rake 2b, and negative electrode is equipped on this cylindrical portion 2c, the upper surface of plating tank 2 is covered by the flat loam cake parallel with above-mentioned bottom 2a 6, and loam cake 6 is connected with this cylindrical portion 2c, above the plating tank central part, set anode 3, in plating tank 2, maintain electroplate liquid 4.
In electroplanting device of the present invention, the upper surface of plating tank 2 is covered by the flat loam cake parallel with the bottom 6.
The situation that does not have loam cake or loam cake for situation along with the trend plating tank 2 centers shape that square neck is oblique up under, when plating tank 2 high speed rotating, during counter-rotating, electroplate liquid moves towards the top by centrifugal force perimembranous in the plating tank 2.Be accompanied by moving of electroplate liquid, the electroplate liquid liquid level of the central part of plating tank 2 descends, the anode 3 that is disposed at the plating tank center exposes from electroplate liquid, anode 3 reduces with the contact area of electroplate liquid, thereby magnitude of voltage becomes than the magnitude of voltage height of regulation, can't obtain the good electrolytic coating of uniform film thickness and outward appearance.
In the present invention, utilize the flat loam cake parallel 6 to cover the upper surface of plating tank 2 with the bottom.Loam cake is formed the tabular parallel with the bottom rather than has the shape of inclination, can make the simplification of electroplanting device become easy.And, by utilizing the upper surface of loam cake 6 covering plating tanks 2, the change of the electroplate liquid liquid level of plating tank 2 central parts in the time of can suppressing plating tank 2 high speed rotating.Thus, electroplanting device of the present invention can prevent that anode 3 from exposing from electroplate liquid, therefore, can switch in the voltage that keeps regulation consistently, can form the good electrolytic coating of uniform film thickness and outward appearance.
And, for electroplanting device of the present invention, be formed with at the central part of loam cake 6 and be used for anode 3 is inserted into peristome in the plating tank 2, for dispersing of the electroplate liquid that prevents to cause, preferably be connected with cylinder part 8 at this peristome because of high speed rotating, counter-rotating.The height of preferably drum parts 8 is for lower than the upper surface of anode 3 and be after just carrying out high speed rotating or electroplate liquid can not disperse during the counter-rotating under the electroplate liquid flow state height.And the diameter of cylinder part 8 is preferably the diameter that can guarantee the plating liquid measure stipulated.
In electroplanting device of the present invention, the circumferential part of plating tank 2 possesses rake 2b, and this rake 2b is connected with discoid bottom 2a and expands above-mentioned bottom 2a.
For example, carry out under the galvanized situation at the plating tank that uses simple drum, when high speed rotating, be trapped in the bottom of perimembranous in the plating tank 2 owing to centrifugal force by electronplate 5, can occur contact with negative electrode by electronplate 5, therefore be difficult to whole by the uniform electrolytic coating of electronplate 5 formation.Therefore,, rake 2b is set, is born centrifugal force by electronplate 5 and raised in interior perimembranous by interior perimembranous at plating tank 2 for electroplanting device of the present invention.Thus, can prevent to be trapped in the bottom of perimembranous in the plating tank, can make by electronplate 5 easily to contact with negative electrode by electronplate 5.
The inclined angle alpha of rake 2b surpasses 90 ° of 0 ° and less thaies, can be preferably 45 ° according to suitably being selected by the speed of rotation of the treatment capacity of electronplate, plating tank 2 etc.
For electroplanting device of the present invention, negative electrode is provided in the cylindrical portion 2c of plating tank 2.Form electrolytic coating by when being contacted with negative electrode, switching on by electronplate 5.As the negative electrode of the cylindrical portion 2c that is equipped on plating tank 2, for example can use titanium, brass, stainless steel, copper etc.
Moved by centrifugal force perimembranous in plating tank 2 of electronplate 5, simultaneously, moved towards the top with the interior perimembranous of electroplate liquid 4 by electronplate 5, and leave from the bottom surface of plating tank 2 along plating tank 2 by the high speed rotating of plating tank 2.Therefore, in the present invention, the position that is the cylindrical portion 2c that will be detained by being moved by electronplate 5 when high speed rotating the time set negative electrode, and can make by the touch opportunity of electronplate 5 with negative electrode increases, and can form the good electrolytic coating of uniform film thickness and outward appearance.
If negative electrode is not switched on by being covered by electronplate 5 with under the electroplate liquid state of contact when plating tank 2 high speed rotating the time, then can form and electroplate overlay film at negative electrode itself.At negative electrode is that formed plating overlay film can be peeled off under the situation of titanium, stainless steel etc., therefore, exists because of this plating overlay film is attached to by electronplate 5 or enters into by the electrolytic coating of electronplate 5 to cause that the quality of electrolytic coating reduces the situation of such problem.
Therefore, the negative electrode that is equipped on cylindrical portion 2c forms following structure: be disposed at part or all of cylindrical portion 2c, and when plating tank 2 high speed rotating by being covered by electronplate 5.For example,, when plating tank 2 high speed rotating, moved towards the top of cylindrical portion 2c by electronplate to being undertaken under the situation of electroplating processes of a spot of light specific gravity by electronplate 5, therefore, can be with the top of cathode arrangement at cylindrical portion 2c, and by being covered by electronplate 5.And to a large amount of being undertaken under the situation of electroplating processes by electronplate, preferably with whole negative electrodes that are made as of cylindrical portion 2c, the height that is equipped on the negative electrode of cylindrical portion 2c can suitably be selected.
In the electroplanting device of Fig. 1, Z-axis 1 support plated trench bottom 2a, and can rotate and reverse.
As plating tank 2, can use with respect to electroplate liquid to be inert material, for example plastics or stainless steel surface to be carried out material that resin treatment forms etc.In the present invention, for plating tank 2, preferably there is not gap as the porous ring that in patent documentation 1, patent documentation 2, is equipped on plating tank, that be used for discharging electroplate liquid from the circumferential part of plating tank.Its reason is, can the simplification device structure, in addition, in electroplating processes, can not lose by electronplate, and, by not discharging electroplate liquid, need not to use in large quantities expensive electroplate liquid just can electroplate.
Another example of expression electroplanting device of the present invention among Fig. 2.
The cylindrical portion of Fig. 2 has: the 1st cylindrical portion 7c, and the 1st cylindrical portion 7c is connected with rake 7b, and cathode arrangement is in the 1st cylindrical portion 7c; And the 2nd cylindrical portion 7d, the 2nd cylindrical portion 7d is continuous with the mode and the 1st cylindrical portion 7c that dwindle this first cylindrical portion 7c.
Thus, for example to little being undertaken under the situation of electroplating processes of a spot of surface-area by electronplate 5, can make by electronplate 5 and promptly move towards the negative electrode that is equipped on the first cylindrical portion 7c, can make whole chances of being switched on by electronplate 5 is become impartial, electroplating efficiency can be improved, the good electrolytic coating of uniform film thickness and outward appearance can be formed.
And the internal diameter of the second cylindrical portion 7d is littler than the internal diameter of the first cylindrical portion 7c, and can be according to suitably being selected by the treatment capacity of electronplate 5.The internal diameter of the second cylindrical portion 7d is the equal internal diameter of minimum diameter of the rake 7b bottom being connected in preferably.
Claims (3)
1. electroplanting device,
Described electroplanting device possesses:
Plating tank, this plating tank can horizontally rotate around Z-axis;
Negative electrode, this negative electrode are equipped on perimembranous in the described plating tank; And
Anode, this anode are arranged at the central part in the described plating tank,
Described electroplanting device is characterised in that,
The interior perimembranous of described plating tank is made of rake and cylindrical portion, described rake begins in the mode of expanding described bottom continuous from discoid bottom, described cylindrical portion is connected with described rake, and the plating tank upper surface is covered by the flat loam cake parallel with described bottom.
2. electroplanting device according to claim 1 is characterized in that,
Described cylindrical portion is made of first cylindrical portion and second cylindrical portion, and described first cylindrical portion is connected with described rake, and described cathode arrangement is in this first cylindrical portion, and described second cylindrical portion is continuous in the mode of dwindling described first cylindrical portion.
3. electroplanting device according to claim 1 and 2 is characterized in that,
Central part at described loam cake is formed with peristome, is connected with cylinder part at this peristome.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010130821A JP5598754B2 (en) | 2010-06-08 | 2010-06-08 | Plating equipment |
| JP2010-130821 | 2010-06-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102277613A true CN102277613A (en) | 2011-12-14 |
| CN102277613B CN102277613B (en) | 2014-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110159114.7A Active CN102277613B (en) | 2010-06-08 | 2011-06-08 | Electroplating device |
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| JP (1) | JP5598754B2 (en) |
| CN (1) | CN102277613B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103789816A (en) * | 2012-10-31 | 2014-05-14 | 上村工业株式会社 | Surface treating apparatus, tank body and squirting device |
| CN104630858A (en) * | 2015-03-11 | 2015-05-20 | 韩立艳 | Self-rotating type electroplating device capable of uniformly plating chromium in axial and circumferential directions |
| CN108385155A (en) * | 2017-02-03 | 2018-08-10 | 株式会社村田制作所 | Plating unit and the plater for including the plating unit |
| WO2019127014A1 (en) * | 2017-12-26 | 2019-07-04 | 汉玛科技股份有限公司 | Electroplating assembly mechanism |
| CN110475913A (en) * | 2017-04-14 | 2019-11-19 | Ykk株式会社 | Electro-plating method and device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6386271B2 (en) * | 2014-07-02 | 2018-09-05 | 株式会社イデヤ | Electroplating equipment |
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| CN1278874A (en) * | 1997-10-09 | 2001-01-03 | 住友特殊金属株式会社 | Method for producing very small metal ball |
| US6287444B1 (en) * | 1997-10-09 | 2001-09-11 | Sumitomo Special Metals Co., Ltd. | Method for producing very small metal ball |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103789816A (en) * | 2012-10-31 | 2014-05-14 | 上村工业株式会社 | Surface treating apparatus, tank body and squirting device |
| CN103789816B (en) * | 2012-10-31 | 2018-06-12 | 上村工业株式会社 | Surface processing device, groove body and blowoff |
| CN104630858A (en) * | 2015-03-11 | 2015-05-20 | 韩立艳 | Self-rotating type electroplating device capable of uniformly plating chromium in axial and circumferential directions |
| CN104630858B (en) * | 2015-03-11 | 2017-07-14 | 南京运诚制版有限公司 | A kind of uniform chromium plating electroplanting device of rotation type axial and circumferential |
| CN107119299A (en) * | 2015-03-11 | 2017-09-01 | 李祥 | A kind of uniform chromium plating electroplanting device of rotation type axial and circumferential and its operating method |
| CN107119299B (en) * | 2015-03-11 | 2018-11-27 | 长乐品苑建材科技有限公司 | A kind of uniform chromium plating electroplanting device of rotation type axial and circumferential and its operating method |
| CN108385155A (en) * | 2017-02-03 | 2018-08-10 | 株式会社村田制作所 | Plating unit and the plater for including the plating unit |
| CN108385155B (en) * | 2017-02-03 | 2020-06-16 | 株式会社村田制作所 | Plating cell and plating apparatus including the same |
| CN110475913A (en) * | 2017-04-14 | 2019-11-19 | Ykk株式会社 | Electro-plating method and device |
| CN110475913B (en) * | 2017-04-14 | 2020-09-01 | Ykk株式会社 | Electroplating method and apparatus |
| WO2019127014A1 (en) * | 2017-12-26 | 2019-07-04 | 汉玛科技股份有限公司 | Electroplating assembly mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011256420A (en) | 2011-12-22 |
| JP5598754B2 (en) | 2014-10-01 |
| CN102277613B (en) | 2014-12-24 |
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Effective date of registration: 20220110 Address after: No. 508-51, Wen Xian Road, Bende District, Tainan, Taiwan, China Patentee after: ACCURUS SCIENTIFIC Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI METALS, Ltd. |