CN102267104A - Copper-bearing solidified abrasive grinding and polishing pad - Google Patents
Copper-bearing solidified abrasive grinding and polishing pad Download PDFInfo
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- CN102267104A CN102267104A CN2011102231331A CN201110223133A CN102267104A CN 102267104 A CN102267104 A CN 102267104A CN 2011102231331 A CN2011102231331 A CN 2011102231331A CN 201110223133 A CN201110223133 A CN 201110223133A CN 102267104 A CN102267104 A CN 102267104A
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- polishing pad
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- abrasive
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Abstract
The invention provides a copper-bearing solidified abrasive grinding and polishing pad. The copper-bearing solidified abrasive grinding and polishing pad is characterized by mainly being formed by uniformly mixing and solidifying abrasive, copper powder and resin; the mass percentage ratio of the abrasive to the copper powder to the resin is (5-50%):(0.1-30%):(20-90%). The copper-bearing solidified abrasive grinding and polishing pad provided by the invention is beneficial to enhancing of the rigidity of the grinding and polishing pad, improving of the surface accuracy of a workpiece, continuous performing of the machining process for a long time and improving of the machining efficiency and surface quality of the workpiece; and the copper-bearing solidified abrasive grinding and polishing pad is used for improving self-finishing capacity of the grinding and polishing pad while being matched with a grinding and polishing solution.
Description
Technical field
The present invention relates to a kind of finisher, especially a kind of grinding and polishing pad of grinding and polishing processing usefulness, specifically a kind of solidified abrasive grinding polishing pad of resin cupric.
Background technology
It is predicted that global LED illumination market scale 2012 will be up to 12,000,000,000 dollars, the demand growth of hand-held household electrical appliance is powerful, thereby saphire substrate material and glass display screen market are good.Country such as the U.S., China has successively started the nuclear fusion generation schedule, wherein only in the U.S. " country igniting plan ", the optical element consumption reaches more than 40,000, and optical element also is widely used in weapon precise guidance system, space remote sensing system, all-solid state laser demonstration and medical system etc.In the said goods, adopt the ultraprecision grinding polishing in a large number as its manufacturing process.Grinding and polishing process technology level is restricting China's hard disk, optics, semiconductor etc. and Chinese national economy security of operation and the closely-related technical development of national defense safety.Grinding and polishing pad is that grinding and polishing is processed one of most important instrument, final crudy, working (machining) efficiency and the processing cost of its decision device.
The polishing pad that uses in the grinding and polishing processing at present mainly contains pitch dish, polyurethane and flannelette grinding and polishing pad.The pitch dish is softer, and process is yielding, constantly repair to guarantee the face shape of polished workpiece, does not have the self-training ability; The polyurethane grinding and polishing is lined with certain rigidity, but polished workpiece easily is absorbed in polishing pad under the effect of pressure, workpiece easily collapse the limit, influence the surface figure accuracy of workpiece, simultaneously, abrasive grain easily is absorbed in the hole of polishing pad, proceeding of influence processing is so polishing pad needs finishing at set intervals; The flannelette polishing pad is softer, generally is used to improve the surface roughness of workpiece, not the surface figure accuracy of malleable workpiece.At present not enough, yielding, the surface figure accuracy that is difficult to guarantee workpiece of the grinding and polishing pad rigidity of using will constantly be repaired simultaneously to keep proceeding of processing, and working (machining) efficiency is low.
The resin copper dish that uses in the processing is mainly used in grinding at present, need to add the polishing fluid that contains abrasive material in the process, difficulty, the easy blunt of resin copper dish are cleaned in the processing back, need regularly finishing, working (machining) efficiency low, surface quality is poor, also need operation raising surface quality such as polishing after grinding.
Summary of the invention
The objective of the invention is that rigidity at grinding and polishing pad in the existing process is not enough, needs are constantly repaired, the problem of the surface figure accuracy of influence processing, reduction working (machining) efficiency is invented the solidified abrasive grinding polishing pad that a kind of rigidity height has the resin cupric of self-training function.
Technical scheme of the present invention is:
A kind of cupric solidified abrasive grinding polishing pad is characterized in that it mainly by even mixing cured the forming of abrasive material, copper powder and resin, and the mass percent of described abrasive material, copper powder and resin is an abrasive material: copper powder: resin=5%-50%:0.1%-30%:20%-90%.
Described abrasive material is the one or more combination in diamond, silica, cerium oxide, aluminium oxide, carborundum, boron carbide, the zirconia.
The granularity of described abrasive material is 50 nanometers-100 micron.
Described copper powder is the one or more combination in atomizing pure copper powder, electrolytic copper powder, pure copper powder, brass powder, bronze powder, the copper powder.
Described copper powder granularity is 50 nanometers-50 micron.
Beneficial effect of the present invention:
Grinding and polishing pad of the present invention can be widely used in the grinding and polishing processing of materials such as semiconductor, glass, optical crystal, pottery, and process improves the surface figure accuracy of workpiece, the finishing grinding and polishing pad of avoiding stopping work, and working (machining) efficiency height, surface quality are excellent.
Grinding and polishing pad of the present invention is added copper powder in the solidified abrasive grinding polishing pad, improve the rigidity of grinding and polishing pad, and is not yielding in the process, improves the face shape of workpiece; Simultaneously, cooperate with grinding and polishing liquid in the process, improve the self-training ability of grinding and polishing pad, the finishing grinding and polishing pad of avoiding stopping work helps the process long-time continuous and carries out, and improves working (machining) efficiency; In resin copper dish, add abrasive material, improve the surface quality of working (machining) efficiency and workpiece.
The present invention is simple in structure, is easy to realize having the advantage that cost is low, output is high.
The present invention helps improving the rigidity of grinding and polishing pad, improves the workpiece surface figure accuracy; Cooperate with grinding and polishing liquid, improve the self-training ability of grinding and polishing pad, help the process long-time continuous and carry out, improve the surface quality of working (machining) efficiency and workpiece.
The specific embodiment
The present invention is further illustrated below in conjunction with embodiment.
Embodiment 1:A kind of cupric solidified abrasive grinding polishing pad, it by the 350g granularity be 40 microns diamond abrasive, atomizing pure copper powder that the 150g granularity is 20 microns and 500g resin (can adopt with existing polishing pad in the identical resin that uses, as hydrophilic resin, can adopt also that the applicant is 2007100248219,2008102440960,2008100227414,2009102135958 at the application number of first to file, employed resin formula is realized among the 201010145260X, down together) even mixing cured back forms, and its preparation method is identical with existing polishing pad.Key point of the present invention is to have increased copper powder in polishing pad, and all the other components are basic identical with prior art except that proportion relation.Improve 100% with making grinding and polishing pad processing K9 glass face shape, material removing rate improves 300%, and the self-training ability improves 50 times.The grinding and polishing monocrystalline silicon piece, face shape improves 80%, and material removing rate improves 400%, and the self-training ability improves 30 times.During concrete enforcement, abrasive material also can adopt the one or more combination in silica, cerium oxide, aluminium oxide, carborundum, boron carbide, the zirconia to replace, and the one or more combination in the also available electrolytic copper powder of copper powder, pure copper powder, brass powder, bronze powder, the copper powder replaces.
Embodiment 2:A kind of cupric solidified abrasive grinding polishing pad, it is evenly mixed by abrasive material, copper powder and resin, solidifies the back and forms, and its preparation method is identical with existing polishing pad.Wherein abrasive material is cerium oxide 200g, and copper powder is pure copper powder 250g, resin 550g.Key point of the present invention is to have increased copper powder in polishing pad, and all the other components are basic identical with prior art except that proportion relation.The granularity of cerium oxide is 10 microns, and the granularity of pure copper powder is 10 microns.Make grinding and polishing pad processing K9 glass face shape and improve 150%, material removing rate improves 200%, and the self-training ability improves 60 times.The grinding and polishing monocrystalline silicon piece, face shape improves 50%, and material removing rate improves 150%, and the self-training ability improves 20 times.During concrete enforcement, abrasive material also can adopt the one or more combination in silica, diamond, aluminium oxide, carborundum, boron carbide, the zirconia to replace, and the one or more combination in the also available electrolytic copper powder of copper powder, atomizing pure copper powder, brass powder, bronze powder, the copper powder replaces.
Embodiment 3:A kind of cupric solidified abrasive grinding polishing pad, it is evenly mixed by abrasive material, copper powder and resin, solidifies the back and forms, and its preparation method is identical with existing polishing pad, and wherein abrasive material is carborundum 400g, and copper powder is brass powder 150g: resin 450g.Key point of the present invention is to have increased copper powder in polishing pad, and all the other components are basic identical with prior art except that proportion relation.The granularity of described carborundum is the 50-60 micron, and the granularity of brass powder is 20 microns.Make grinding and polishing pad processing K9 glass face shape and improve 50%, material removing rate improves 300%, and the self-training ability improves 40 times.The grinding and polishing monocrystalline silicon piece, face shape improves 40%, and material removing rate improves 200%, and the self-training ability improves 20 times.
Embodiment 4:A kind of cupric solidified abrasive grinding polishing pad, it is that the diamond abrasive of 50 nanometers, atomizing pure copper powder and the even mixing cured back of 200g resin that the 1g granularity is 50 nanometers form by the 50g granularity, its preparation method is identical with existing polishing pad.Key point of the present invention is to have increased copper powder in polishing pad, and all the other components are basic identical with prior art except that proportion relation.Improve 80% with making grinding and polishing pad processing K9 glass face shape, material removing rate improves 200%, and the self-training ability improves 20 times.The grinding and polishing monocrystalline silicon piece, face shape improves 70%, and material removing rate improves 200%, and the self-training ability improves 20 times.During concrete enforcement, abrasive material also can adopt the one or more combination in silica, cerium oxide, aluminium oxide, carborundum, boron carbide, the zirconia to replace, and the one or more combination in the also available electrolytic copper powder of copper powder, pure copper powder, brass powder, bronze powder, the copper powder replaces.
Embodiment 5:A kind of cupric solidified abrasive grinding polishing pad, it is evenly mixed by abrasive material, copper powder and resin, solidifies the back and forms, and its preparation method is identical with existing polishing pad, and wherein abrasive material is cerium oxide 500g, and copper powder is pure copper powder 300g, resin 900g.Key point of the present invention is to have increased copper powder in polishing pad, and all the other components are basic identical with prior art except that proportion relation.The granularity of cerium oxide is 100 microns, and the granularity of pure copper powder is 50 microns.Make grinding and polishing pad processing K9 glass face shape and improve 120%, material removing rate improves 150%, and the self-training ability improves 40 times.The grinding and polishing monocrystalline silicon piece, face shape improves 30%, and material removing rate improves 140%, and the self-training ability improves 15 times.During concrete enforcement, abrasive material also can adopt the one or more combination in silica, diamond, aluminium oxide, carborundum, boron carbide, the zirconia to replace, and the one or more combination in the also available electrolytic copper powder of copper powder, atomizing pure copper powder, brass powder, bronze powder, the copper powder replaces.
The part that the present invention does not relate to prior art that maybe can adopt all same as the prior art is realized.
Claims (5)
1. a cupric solidified abrasive grinding polishing pad is characterized in that it mainly by even mixing cured the forming of abrasive material, copper powder and resin, and the mass percent of described abrasive material, copper powder and resin is an abrasive material: copper powder: resin=5%-50%:0.1%-30%:20%-90%.
2. cupric solidified abrasive grinding polishing pad according to claim 1 is characterized in that described abrasive material is the one or more combination in diamond, silica, cerium oxide, aluminium oxide, carborundum, boron carbide, the zirconia.
3. according to claim 1 or 2 described cupric solidified abrasive grinding polishing pads, the granularity that it is characterized in that described abrasive material is 50 nanometers-100 micron.
4.
Cupric solidified abrasive grinding polishing pad according to claim 1 is characterized in that described copper powder is the one or more combination in atomizing pure copper powder, electrolytic copper powder, pure copper powder, brass powder, bronze powder, the copper powder.
5. according to claim 1 or 4 described cupric solidified abrasive grinding polishing pads, it is characterized in that described copper powder granularity is 50 nanometers-50 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011102231331A CN102267104A (en) | 2011-08-05 | 2011-08-05 | Copper-bearing solidified abrasive grinding and polishing pad |
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| CN2011102231331A CN102267104A (en) | 2011-08-05 | 2011-08-05 | Copper-bearing solidified abrasive grinding and polishing pad |
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| CN102267104A true CN102267104A (en) | 2011-12-07 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102632453A (en) * | 2012-04-24 | 2012-08-15 | 浙江浦江敏锐精密机械科技有限公司 | Thermosetting resin grinding pad and preparation method thereof |
| CN104924195A (en) * | 2015-06-12 | 2015-09-23 | 浙江工业大学 | Sapphire wafer efficient ultra-precision machining method |
| CN104924200A (en) * | 2015-06-12 | 2015-09-23 | 衢州学院 | Dispersion strengthening grinding disk for ultra-precision machining of sapphire wafer |
| CN106363528A (en) * | 2016-08-30 | 2017-02-01 | 天通银厦新材料有限公司 | Fixed abrasive and grinding technique for sapphire |
| CN107282931A (en) * | 2017-07-11 | 2017-10-24 | 广州克思曼研磨科技有限公司 | A kind of special grind resin copper dish and preparation method thereof |
| CN108747869A (en) * | 2018-05-25 | 2018-11-06 | 苏州珂玛材料科技股份有限公司 | Polishing disk and preparation method thereof |
| CN111113288A (en) * | 2020-01-15 | 2020-05-08 | 包头中科雨航抛光材料有限公司 | Polishing pellet capable of carrying out superfine part grinding and preparation method thereof |
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| CN101386154A (en) * | 2008-09-28 | 2009-03-18 | 广东奔朗超硬材料制品有限公司 | Resin anchoring agent diamond grinding wheel and production method thereof |
| CN101722478A (en) * | 2010-01-21 | 2010-06-09 | 厦门致力金刚石工具有限公司 | Diamond dry grinding disc and manufacturing method thereof |
| CN101941186A (en) * | 2010-09-15 | 2011-01-12 | 广东奔朗新材料股份有限公司 | Diamond chamfering polishing wheel for glass and preparation method thereof |
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Patent Citations (6)
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| GB548536A (en) * | 1939-07-28 | 1942-10-14 | J K Smit & Sons Inc | Abrasive tools |
| US3899307A (en) * | 1970-11-10 | 1975-08-12 | Dresser Ind | Resin bonded diamond wheels with copper and silicon carbide fillers |
| JP2004130499A (en) * | 2002-06-14 | 2004-04-30 | General Electric Co <Ge> | Abrasive particle tool having precisely controlled arrangement of abrasive particle, and its manufacturing method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102632453A (en) * | 2012-04-24 | 2012-08-15 | 浙江浦江敏锐精密机械科技有限公司 | Thermosetting resin grinding pad and preparation method thereof |
| CN104924195A (en) * | 2015-06-12 | 2015-09-23 | 浙江工业大学 | Sapphire wafer efficient ultra-precision machining method |
| CN104924200A (en) * | 2015-06-12 | 2015-09-23 | 衢州学院 | Dispersion strengthening grinding disk for ultra-precision machining of sapphire wafer |
| CN106363528A (en) * | 2016-08-30 | 2017-02-01 | 天通银厦新材料有限公司 | Fixed abrasive and grinding technique for sapphire |
| CN107282931A (en) * | 2017-07-11 | 2017-10-24 | 广州克思曼研磨科技有限公司 | A kind of special grind resin copper dish and preparation method thereof |
| CN108747869A (en) * | 2018-05-25 | 2018-11-06 | 苏州珂玛材料科技股份有限公司 | Polishing disk and preparation method thereof |
| CN108747869B (en) * | 2018-05-25 | 2020-05-12 | 苏州珂玛材料科技股份有限公司 | Polishing disk and manufacturing method thereof |
| CN111113288A (en) * | 2020-01-15 | 2020-05-08 | 包头中科雨航抛光材料有限公司 | Polishing pellet capable of carrying out superfine part grinding and preparation method thereof |
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Application publication date: 20111207 |