CN102267080A - Disc type double-sided polishing machine for IC (identity card) grinding processing - Google Patents
Disc type double-sided polishing machine for IC (identity card) grinding processing Download PDFInfo
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- CN102267080A CN102267080A CN2010101924935A CN201010192493A CN102267080A CN 102267080 A CN102267080 A CN 102267080A CN 2010101924935 A CN2010101924935 A CN 2010101924935A CN 201010192493 A CN201010192493 A CN 201010192493A CN 102267080 A CN102267080 A CN 102267080A
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- bistrique
- grinding head
- polishing machine
- sided polishing
- disc type
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a disc type double-sided polishing machine for IC (identity card) grinding processing, which comprises an upper grinding head, a lower grinding head, a rotating-disc grinding head, a lifting mechanism and a lift motor, wherein the upper grinding head and the lower grinding head are respectively arranged at the upper part of a frame, the grinding surface of the upper grinding head is opposite to the grinding surface of the lower grinding head, a part (arranged at the middle position below the lower grinding head) of the frame is provided with an operating disc, and the inside of the operating disc is provided with two adjacent workpiece discs; and the rear side of the upper grinding head is provided with the lifting mechanism equipped with the lift motor, and the rear sides of the upper grinding head and the lower grinding head are respectively connected with an upper disc motor and a lower disc motor. The double-sided polishing machine provided by the invention has the advantages that a process from an operation of beginning to process a workpiece to an operation of completing the processing on the workpiece can be completed in an automated mode without manual operation, compared with the original process implemented by manually placing the workpiece, the times for taking and placing the workpiece are saved; and based on efficient revivification and cyclic utilization, both the cost for manufacturing new cards is saved, and the production efficiency is improved.
Description
Technical field
The present invention relates to a kind of polisher lapper, relate in particular to a kind of disc type Twp-sided polishing machine that is used for the IC-card attrition process.
Background technology
Various on the market at present IC-cards need constantly recycling and upgrade, and whole process is exactly card such as shabby, that surfacial pattern is fuzzy, literal is smudgy, misprint, content are expired, through going attrition process, makes it be reduced to white card to its surface; Existing equipment need be equipped with servicing unit, also needs certain streamline and associated production personnel to operate fast, though these means can reach basic printing and recycling purpose again, has increased the cost of making neocaine on foot.
Summary of the invention
At above defective, the invention provides a kind of disc type Twp-sided polishing machine that is used for the IC-card attrition process, thereby guaranteeing on the efficient multiple new and recycling basis, not only saved the making neocaine cost, but also improved production efficiency.
For achieving the above object, the present invention is by the following technical solutions:
A kind of disc type Twp-sided polishing machine that is used for the IC-card attrition process, comprise bistrique, following bistrique, rotating disk bistrique, elevating mechanism and lifting motor, last bistrique is arranged at upper rack respectively with following bistrique, it is described that upward bistrique is relative up and down with following bistrique buffed surface separately, described frame is positioned at bistrique below medium position place's installment work dish down, and this scratch diskette inside is provided with two adjacent workpiece plates; The described bistrique rear side of going up is provided with the elevating mechanism of being furnished with lifting motor, and last bistrique is connected coil motor and following coil motor respectively with following bistrique rear side.
The beneficial effect that is used for the disc type Twp-sided polishing machine of IC-card attrition process of the present invention is: can guarantee that workpiece need not artificial and adopts automation to finish from beginning to be worked into to machine, and has compared the artificial saving of placing of original needs and has picked and placeed the time; Make it on efficient multiple new and recycling basis, not only saved the making neocaine cost, but also improved production efficiency.
Description of drawings
With reference to the accompanying drawings the present invention is described in further detail below.
Fig. 1 is the described disc type Twp-sided polishing machine structural representation that is used for the IC-card attrition process of the embodiment of the invention;
Fig. 2 is the described vertical view that is used for the disc type Twp-sided polishing machine of IC-card attrition process of the embodiment of the invention;
Fig. 3 is the described side view that is used for the disc type Twp-sided polishing machine of IC-card attrition process of the embodiment of the invention;
Fig. 4 is the described upward view that is used for the disc type Twp-sided polishing machine of IC-card attrition process of the embodiment of the invention.
Among the figure:
1, frame; 2, go up bistrique; 3, following bistrique; 4, sheet case; 5, rotating disk bistrique; 6, rotary tray motor; 7, workpiece plate; 8, the groove that takes up; 9, elevating mechanism; 10, go up coil motor; 11, following coil motor; 12, lifting motor; 13, scratch diskette.
The specific embodiment
Shown in Fig. 1-4, the described disc type Twp-sided polishing machine that is used for the IC-card attrition process of the embodiment of the invention, comprise bistrique 1, following bistrique 2, rotating disk bistrique 5, elevating mechanism 9 and lifting motor 12, it is described that upward bistrique 1 is relative up and down with the buffed surface position that following bistrique 2 is arranged at frame 1 top and two bistriques respectively, described frame 1 is positioned at the horizontal installment work dish 13 in medium position place, bistrique 3 below down, these scratch diskette 7 inside are provided with two adjacent workpiece plates 7, each workpiece plate 7 marginal position place is provided with sheet case 4, the groove 8 that takes up is offered on described case 4 tops, and the bottom of workpiece plate 7 is provided with rotating disk bistrique 5; Described bistrique 1 rear side of going up connects and goes up coil motor 10 in order to drive and bistrique 1 action of polishing is up and down gone up in control, described bistrique 3 rear sides down connect coil motor 11 down, each rotating disk bistrique 5 center position is provided with rotary tray motor 6 in order to drive using 5 spinning movements of rotating disk bistrique below being provided with and driving rotating shaft and this bistrique, and described bistrique 1 rear side of going up is provided with the elevating mechanism 9 of being furnished with lifting motor 12.During work, by up and down two polishing disk bistriques rotations at a high speed in opposite directions, about two working rotary tables transmit workpiece, workpiece box is positioned on the card, can snap into workpiece in the station of working rotary table continuously, thereby reach continuously workpiece is carried out attrition process.
Claims (5)
1. disc type Twp-sided polishing machine that is used for the IC-card attrition process, comprise bistrique (1), following bistrique (2), rotating disk bistrique (5), elevating mechanism (9) and lifting motor (12), last bistrique (1) is arranged at frame (1) top respectively with following bistrique (2), it is characterized in that: described upward bistrique (1) is relative up and down with following bistrique (2) buffed surface separately, described frame (1) is positioned at bistrique (3) below medium position place's installment work dish (13) down, and this scratch diskette (7) inside is provided with adjacent two workpiece plates (7); Described bistrique (1) rear side of going up is provided with the be furnished with lifting motor elevating mechanism (9) of (12).
2. the disc type Twp-sided polishing machine that is used for the IC-card attrition process according to claim 1 is characterized in that: each workpiece plate (7) marginal position place is provided with sheet case (4).
3. the disc type Twp-sided polishing machine that is used for the IC-card attrition process according to claim 2 is characterized in that: the groove that takes up (8) is offered on described case (4) top.
4. the disc type Twp-sided polishing machine that is used for the IC-card attrition process according to claim 1 is characterized in that: the described bistrique (1) of going up is connected coil motor (10) and following coil motor (11) respectively with following bistrique (3) rear side.
5. the disc type Twp-sided polishing machine that is used for the IC-card attrition process according to claim 1 is characterized in that: each rotating disk bistrique (5) center position is provided with rotary tray motor (6) below being provided with and driving rotating shaft and this bistrique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101924935A CN102267080A (en) | 2010-06-03 | 2010-06-03 | Disc type double-sided polishing machine for IC (identity card) grinding processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101924935A CN102267080A (en) | 2010-06-03 | 2010-06-03 | Disc type double-sided polishing machine for IC (identity card) grinding processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102267080A true CN102267080A (en) | 2011-12-07 |
Family
ID=45049642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101924935A Pending CN102267080A (en) | 2010-06-03 | 2010-06-03 | Disc type double-sided polishing machine for IC (identity card) grinding processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102267080A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1441713A (en) * | 2000-05-31 | 2003-09-10 | 三菱住友硅晶株式会社 | Method of polishing semiconductor wafer by using double-sided polisher |
| US20050159089A1 (en) * | 2003-12-22 | 2005-07-21 | Kashiwara Machine Mfg. Co., Ltd. | Double-side polishing method and apparatus |
| CN2843743Y (en) * | 2005-10-12 | 2006-12-06 | 廖敌江 | Four main cone double-ended grinding machine |
| CN101058161A (en) * | 2007-05-18 | 2007-10-24 | 宁波甬微集团有限公司 | Double face abrading machine |
| CN101106082A (en) * | 2006-07-13 | 2008-01-16 | 硅电子股份公司 | Method for the simultaneous double-side grinding of a plurality of semiconductor wafers, and semiconductor wafer having outstanding flatness |
| EP1970159A1 (en) * | 2007-03-13 | 2008-09-17 | Peter Wolters GmbH | Processing machine with means for recording processing parameters |
| CN101264585A (en) * | 2007-03-15 | 2008-09-17 | 不二越机械工业株式会社 | Double-side polishing apparatus |
-
2010
- 2010-06-03 CN CN2010101924935A patent/CN102267080A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1441713A (en) * | 2000-05-31 | 2003-09-10 | 三菱住友硅晶株式会社 | Method of polishing semiconductor wafer by using double-sided polisher |
| US20050159089A1 (en) * | 2003-12-22 | 2005-07-21 | Kashiwara Machine Mfg. Co., Ltd. | Double-side polishing method and apparatus |
| CN2843743Y (en) * | 2005-10-12 | 2006-12-06 | 廖敌江 | Four main cone double-ended grinding machine |
| CN101106082A (en) * | 2006-07-13 | 2008-01-16 | 硅电子股份公司 | Method for the simultaneous double-side grinding of a plurality of semiconductor wafers, and semiconductor wafer having outstanding flatness |
| EP1970159A1 (en) * | 2007-03-13 | 2008-09-17 | Peter Wolters GmbH | Processing machine with means for recording processing parameters |
| CN101264585A (en) * | 2007-03-15 | 2008-09-17 | 不二越机械工业株式会社 | Double-side polishing apparatus |
| CN101058161A (en) * | 2007-05-18 | 2007-10-24 | 宁波甬微集团有限公司 | Double face abrading machine |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111207 |