CN102250317A - Rapid curable epoxy resin for electronic packaging, and application thereof - Google Patents
Rapid curable epoxy resin for electronic packaging, and application thereof Download PDFInfo
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- CN102250317A CN102250317A CN2011101180351A CN201110118035A CN102250317A CN 102250317 A CN102250317 A CN 102250317A CN 2011101180351 A CN2011101180351 A CN 2011101180351A CN 201110118035 A CN201110118035 A CN 201110118035A CN 102250317 A CN102250317 A CN 102250317A
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- epoxy resin
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Abstract
The invention belongs to the technical field of microelectronic packaging materials, specifically relates to a rapid curable epoxy resin and an application thereof. Main components of the rapid curable epoxy resin comprise rescinol diglycidyl ether and xylylenediamine. The rapid curable epoxy resin has a characteristic of rapid curing at a high temperature, wherein the resin can be cured in several seconds at the temperature more than 160 DEG C. The resulting cured product has good thermal mechanical property and good insulation property. The resin system can be as a substrate resin of an immobile bottom filling, an encapsulation agent, a chip sticking agent and other materials. According to the present invention, the packaging process temperature is reduced, the packaging internal stress is reduced, and the rapid curable epoxy resin has a wide application prospect in the field of electronic packaging.
Description
Technical field
The invention belongs to the microelectronic packaging material technical field, be specifically related to a kind of fast-curing epoxy resin and application thereof.
Background technology
Resins, epoxy has good binding property, electrical insulating property and chemical resistance, and its cured article has characteristics such as high strength, high heat-resisting and low cure shrinkage, therefore is used widely in the Electronic Packaging field.Resins, epoxy commonly used has bisphenol A epoxide resin, novolac epoxy, biphenyl type epoxy resin etc., and solidifying agent comprises amine, acid anhydrides, resol etc.Conventional Resins, epoxy/curative systems speed of response is relatively slow, when being applied to Electronic Packaging, needing long set time or post curing treatment, thereby has increased activity time, has reduced working efficiency.In encapsulation such as mobile display spare, packaging process such as hot bonding etc. fast need be used a kind of quick-setting bottom insulation stopping composition (NCF) that do not flow, and the NCF resin system that uses need be finished technology at the high temperature more than 180 ℃ at present; Research and development can be under lower technological temperature quick-setting resin system, not only can reduce technological temperature, enhance productivity, save cost, and can reduce the thermal stresses of package interior, reduce warpage of packaging assembly, improve package reliability.
The curing speed of epoxy-resin systems is mainly by the structures shape of resin and solidifying agent.Resorcinol glycidyl ether (Resorcinol diglycidyl ether) is a kind of aromatic series bifunctional epoxy resin of low-viscosity, and viscosity is 0.3 ~ 0.5Pas under the room temperature, and reactivity ratio's bisphenol A epoxide resin is higher; The aliphatics amine is one of the fastest epoxy curing agent of speed of response, the curing reaction speed of m-xylene diamine (m-Xylylene diamine) is suitable with the aliphatics amine, contain aromatic group in its chemical structure, cured product mechanical property and thermostability preferably are provided.The present invention selects for use high Resorcinol glycidyl ether of reactive behavior and m-xylene diamine to make and can be applicable to the fast setting basic resin system that fill the Electronic Packaging bottom.
Summary of the invention
It is fast to the purpose of this invention is to provide a kind of curing reaction speed, and technological temperature is lower, the production efficiency height, and the epoxy-resin systems of the good reliability of encapsulation is filled matrix resin with the bottom as Electronic Packaging technologies such as hot bondings.
The main composition of fast-curing epoxy resin provided by the invention is counted as follows by weight:
100 parts of Resorcinol glycidyl ethers
30～70 parts of m-xylene diamines.
The molecular structural formula of Resorcinol glycidyl ether (I) and m-xylene diamine (II) is as follows:
I II
The structure of the cured product of Resorcinol glycidyl ether and m-xylene diamine (III) can be represented by the formula:
III
In the formula, the polymerization and the crosslinking degree of n reflection curing system, n generally can be 2-50, and R represents H, or following structure fragment:
The present invention has provided the application conditions of this fast-curing epoxy resin, with Resorcinol glycidyl ether and m-xylene diamine in short mix under the room temperature evenly after, low-temperature storage is standby.The solidification value of this reaction system is a room temperature to 180 ℃, the several seconds of reaction times under from a few hours under the low temperature to high temperature.
According to application need, can add various mineral fillers in this fast-curing epoxy resin system, as silicon oxide, titanium oxide, aluminum oxide, zinc oxide, aluminium nitride, lime carbonate, Calucium Silicate powder etc., to regulate viscosity, modulus and the mechanical property of resin system.
Resins, epoxy of the present invention has quick-setting characteristics, more than 160 ℃ only 5--10 just can finish reaction second; Cured product thermomechanical property and insulativity are good.This resin system can be used as the matrix resin of the materials such as underfill material, encapsulation agent, chip adhesive that do not flow, and reduces the packaging process temperature, reduces to encapsulate internal stress, has broad application prospects in the Electronic Packaging field.
Description of drawings
Fig. 1 is the DSC cure profile of Resorcinol glycidyl ether/m-xylene diamine resin.
Fig. 2 is the dynamic mechanical analysis curve of Resorcinol glycidyl ether/m-xylene diamine resin.
Embodiment
The invention is further illustrated by the following examples.
The preparation of embodiment 1 Resorcinol glycidyl ether/m-xylene diamine resin: with 100 parts of Resorcinol glycidyl ethers and 60.8 parts of m-xylene diamines in short mix under the room temperature evenly after, put into the mould of certain size, solidify 20min, 120 ℃ of curing 20min in 80 ℃.The second-order transition temperature of cured product is 74.5 ℃ (DSC); Storage modulus 2600 MPa(25 ℃); The linear expansivity of vitreous state is 54.9 * 10
-6/ ℃ (30-80 ℃), the linear expansivity of rubbery state is 177.9 * 10
-6/ ℃ (120-180 ℃); Resistivity is 2.5 * 10
10Ω m.
Claims (4)
1. fast-curing epoxy resin is characterized in that the main component weight share meter of this Resins, epoxy is as follows:
Resorcinol glycidyl ether 100
M-xylene diamine 30～70.
2. fast-curing epoxy resin according to claim 1 is characterized in that solidification value is a room temperature to 180 ℃.
3. fast-curing epoxy resin according to claim 1, it is characterized in that mineral filler is selected from one or more in silicon oxide, titanium oxide, aluminum oxide, zinc oxide, aluminium nitride, lime carbonate, the Calucium Silicate powder by adding viscosity, modulus and the mechanical property that mineral filler comes the regulating ring epoxy resin system.
4. fast-curing epoxy resin according to claim 1 is as the application of the matrix resin of the underfill material that do not flow, encapsulation agent, chip attach agent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101180351A CN102250317A (en) | 2011-05-09 | 2011-05-09 | Rapid curable epoxy resin for electronic packaging, and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101180351A CN102250317A (en) | 2011-05-09 | 2011-05-09 | Rapid curable epoxy resin for electronic packaging, and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102250317A true CN102250317A (en) | 2011-11-23 |
Family
ID=44977911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101180351A Pending CN102250317A (en) | 2011-05-09 | 2011-05-09 | Rapid curable epoxy resin for electronic packaging, and application thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN102250317A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI557150B (en) * | 2012-02-27 | 2016-11-11 | 氰特科技股份有限公司 | Curable resin composition and short-cure method |
| CN110699024A (en) * | 2012-08-03 | 2020-01-17 | Lg化学株式会社 | Adhesive film and organic electronic device packaging product using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1350030A (en) * | 2000-10-19 | 2002-05-22 | 长春人造树脂厂股份有限公司 | Fireproof epoxy resin composite and its application |
| JP2004025102A (en) * | 2002-06-24 | 2004-01-29 | Saehan Ind Inc | Method for manufacturing selective separation membrane having excellent stain resistance |
| CN101440268A (en) * | 2008-12-30 | 2009-05-27 | 黑龙江省科学院石油化学研究院 | Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof |
-
2011
- 2011-05-09 CN CN2011101180351A patent/CN102250317A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1350030A (en) * | 2000-10-19 | 2002-05-22 | 长春人造树脂厂股份有限公司 | Fireproof epoxy resin composite and its application |
| JP2004025102A (en) * | 2002-06-24 | 2004-01-29 | Saehan Ind Inc | Method for manufacturing selective separation membrane having excellent stain resistance |
| CN101440268A (en) * | 2008-12-30 | 2009-05-27 | 黑龙江省科学院石油化学研究院 | Low temperature curing high temperature resistant inorganic / organic hybridization epoxy adhesive and preparation thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI557150B (en) * | 2012-02-27 | 2016-11-11 | 氰特科技股份有限公司 | Curable resin composition and short-cure method |
| CN110699024A (en) * | 2012-08-03 | 2020-01-17 | Lg化学株式会社 | Adhesive film and organic electronic device packaging product using the same |
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Application publication date: 20111123 |