CN102244830B - Acoustic module, preparation method thereof and equipment with acoustic module - Google Patents
Acoustic module, preparation method thereof and equipment with acoustic module Download PDFInfo
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- CN102244830B CN102244830B CN 201010176244 CN201010176244A CN102244830B CN 102244830 B CN102244830 B CN 102244830B CN 201010176244 CN201010176244 CN 201010176244 CN 201010176244 A CN201010176244 A CN 201010176244A CN 102244830 B CN102244830 B CN 102244830B
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Abstract
The invention provides an acoustic module, a preparation method thereof and equipment with the acoustic module. The acoustic module provided by the invention comprises a loudspeaker, a first shell and a second shell, wherein the first shell is arranged at the front part of the loudspeaker; a front sound cavity is formed between the first shell and the loudspeaker; the voice outlet of the front sound cavity is formed on the first shell; the second shell is arranged at the rear part of the loudspeaker and tightly connected with the first shell; a rear sound cavity is formed at the rear part of the loudspeaker; the second shell is made of a material which can be activated by laser; a through hole is formed on the second shell; a metal layer which passes through the through hole is directly molded on the surface of the second shell through the laser; the metal layer is used as a conducting connection structure which is used for connecting the loudspeaker with a printed circuit board; and fillers which are used for closing the through hole are filled in the through hole or a covering layer which covers the through hole is formed outside the through hole, thereby enabling the rear soundcavity to be the closed rear sound cavity.
Description
Technical field
The present invention relates to electronic technology field, the equipment that relates in particular to a kind of acoustics module and preparation method thereof and have the acoustics module.
Background technology
A lot of electronic equipments (or claiming terminal) all have the acoustics module, and the acoustics module comprises loud speaker, preceding sound chamber, sound chamber, back and the syndeton that is electrically connected for the mainboard (printed circuit board (PCB) (PCB)) with loud speaker and electronic equipment.In order to guarantee good acoustics, the acoustics module structurally not only has higher requirement to the space in the forward and backward sound chamber of loud speaker, and the seal in sound chamber, back is also had higher requirement.Present electronic equipment is the connection that designs on the basis of satisfying above-mentioned requirements between loud speaker and the mainboard.In addition, when these electronic equipments have antenna, antenna can be attached on the acoustics module usually, thereby make electronic equipment have radio transmission-receiving function.
In the prior art, the loud speaker of acoustics module and PCB are carried out connection structure connecting and mainly comprise following design:
Design one, employing embed metal forming (insert metal molding) technology.As shown in Figure 1, be embedded into sheet metal 105 in the sound chamber lid 102 in sound chamber, loud speaker 103 back 109 by injection mo(u)lding, and sound chamber lid facing to the one side of loud speaker with facing to the one side of PCB exposed portions serve metal respectively, so that this sheet metal 105 is realized being electrically connected between loud speaker and the PCB as conduction connecting structure, the contact 107 of loud speaker 103 can be connected to this sheet metal 105 thus.In Fig. 1, back sound chamber 109 is loud speaker rear end and casing 101 and 102 spaces that form.Loud speaker 103 front ends for example the packing ring 106(by double-sided belt glue as for the bubble of compression cotton or other flexible material) be bonded on the casing 101 of sender 104, the front end of loud speaker 103 is sound chamber 108 before casing 101 and packing ring 106 form.
But employing embeds metal forming technology formation syndeton and has such shortcoming: (1) technology is too complicated, prepares to get up also too complexity thus, makes also that thus the manufacturing cost of acoustics module is too high.(2) because the metallic area that embeds is bigger, therefore can influence the performance of the antenna of electronic equipment, therefore the designs such as cabling of the metal pair antenna that embeds produce a lot of restrictions, has increased the design difficulty of equipment.(3) after adopting the embedding metal forming to produce sound chamber, back lid, if the change form of metal changes the mould cycle relatively than long and with high costs.And the change of metal dimension and profile also can influence antenna performance.(4) owing to embed the restriction of metal forming technical matters, the tie point of outside mainboard need be relatively near the tie point of loud speaker, like this electron circuit layout of mainboard is also had certain restricted.
Design two, employing float needle formula syndeton.Particularly, mainboard adopt flexible printed circuit board with float needle (Float pin) (Flexible Printed Circuit, FPC).The through hole that float needle can cover through the sound chamber in sound chamber later connects loud speaker, thereby realizes being electrically connected between FPC and the loud speaker.
But float needle formula syndeton has such shortcoming: the reliability that (1) has the FPC of float needle is not fine.(2) need extra number of assembling steps, this has not only increased the assembling complexity, has also increased the manufacturing cost of acoustics module.(3) restricted for the height of loud speaker and pcb board, pcb board can not be too low.
Summary of the invention
The present invention proposes in view of above-mentioned prior art problems.One aspect of the present invention is to provide a kind of acoustics module and preparation method thereof, so that the assembling of acoustics module is simple more and have a low cost.
Correspondingly, embodiments of the invention also provide a kind of equipment with acoustics module.
According to an aspect of the present invention, provide a kind of acoustics module, this acoustics module comprises loud speaker, first housing and second housing; Described first housing is arranged on the front portion of loud speaker, and sound chamber before being formed with between described first housing and described loud speaker, and described first housing is provided with the sender in described preceding sound chamber; Described second housing is arranged on the rear portion of described loud speaker and closely is connected with described first housing, forms sound chamber, back at the rear portion of described loud speaker; But described second housing is formed by the material of laser activation; Described second housing is provided with through hole; Run through connection line pattern described through hole, activation via laser irradiation formation on the two sides of described second housing; Deposit metal level on the described connection line pattern, form the metallic circuit structure that is used for connecting described loud speaker and printed circuit board (PCB) that runs through described through hole thus; And the outside that is filled with in the described through hole for the filler that seals described through hole or described through hole is formed with the cover layer that covers described through hole, makes that sound chamber, described back is the back sound chamber of sealing.
Preferably, described through hole is shaped as from the aperture of the nearer part in the end of through hole more than or equal to the aperture of the part away from from the end of through hole; Perhaps the aperture of described through hole increases gradually or reduces from the end to end of this through hole.Can more be conducive to laser like this and focus on, thereby be convenient to carry out laser activation.
Preferably, the width of described metallic circuit for example is 0.1～5mm.Under these circumstances, can be hardly the wires design of antenna be exerted an influence.
Preferably, described filler is sealing plug or fluid sealant; Described cover layer is sealing strip, sealing gasket or the label that has viscose glue.
According to a further aspect in the invention, also provide a kind of equipment with acoustics module, this equipment for example is provided with above-mentioned acoustics module.
Preferably, described printed circuit board (PCB) be connected with described metal level by conductive contact.
According to a further aspect in the invention, also provide a kind of manufacture method of acoustics module, this acoustics module comprises loud speaker, first housing and second housing.But described second housing is formed by the material of laser activation and described second housing is provided with through hole, described method comprises the steps: the laser irradiation is carried out in the part on the two sides of described second housing, runs through connection line pattern described through hole, activation with formation; Depositing metal layers on described connection line pattern forms the conduction connecting structure that is used for connecting described loud speaker and printed circuit board (PCB) that runs through described through hole thus; And in described through hole, be filled with and form the cover layer that covers described through hole for the filler of the described through hole of sealing or in the outside of described through hole; Described first housing is arranged on the front portion of loud speaker, and sound chamber before between described first housing and described loud speaker, forming, described first housing is provided with the sender in described preceding sound chamber; Described second housing is arranged on the rear portion of described loud speaker; And described second housing closely is connected with described first housing, to form the back sound chamber of sealing at the rear portion of described loud speaker.
Preferably, described through hole is shaped as from the aperture of the nearer part in the end of through hole more than or equal to the aperture of the part away from from the end of through hole; Perhaps the aperture of described through hole increases gradually or reduces from the end to end of this through hole.
Preferably, the width of described metallic circuit is 0.1～5mm.Under these circumstances, when designing, antenna can not consider the influence of this metal level.
Preferably, described filler is sealing plug or fluid sealant; Described cover layer is sealing strip, sealing gasket or the label that has viscose glue.
The acoustics module that the embodiment of the invention provides, not only easy to assembly, and low-cost, also have high reliability.
In addition, because the connecting line construction in the at first module of the present invention is by adopting laser activation to form, need not masterplate and mould, can design arbitrarily, adjust and/or revise connection line according to actual condition, so can accomplish to reduce the restriction of antenna wiring and to the influence of antenna RF performance, can also improve the radio-frequency performance of antenna.
And the tie point of the connection line of the outside, back sound chamber of acoustics module can arbitrarily be adjusted according to the layout needs of mainboard, and to the electron circuit layout of mainboard with highly can not exert an influence.
By the detailed description of carrying out below in conjunction with accompanying drawing, can more be expressly understood feature of the present invention and effect.
Description of drawings
By following detailed description, by reference to the accompanying drawings, can more be expressly understood the features and advantages of the present invention.Wherein, can make up with key element and the feature shown in other figure in the key element shown in the figure and feature.Part in the accompanying drawing is proportional drafting not necessarily, and focusing on clearly, example illustrates principle of the present invention.In addition, in all figure, same or analogous label is indicated same or analogous key element.In the accompanying drawings:
Fig. 1 is the generalized section of existing loud speaker module;
Fig. 2 is the generalized section of acoustics module according to an embodiment of the invention;
Fig. 3 is the decomposing schematic representation of acoustics module according to another embodiment of the present invention;
Fig. 4 a is the schematic diagram in front of second housing of embodiment shown in Figure 3;
Fig. 4 b is the schematic diagram at the back side of second housing of embodiment shown in Figure 3;
Fig. 5 be embodiment shown in Figure 3 installation the schematic diagram of second housing of loud speaker;
Fig. 6 is for having installed the schematic diagram of second housing of loud speaker according to another embodiment of the present invention; And
Fig. 7 is the schematic flow sheet of module making method according to an embodiment of the invention.
Embodiment
With reference to the accompanying drawings, the specific embodiment of the present invention is elaborated.In the following description, the unrestricted purpose for explanation has been set forth detail, to help to understand all sidedly the present invention.Yet, it will be apparent to those skilled in the art that also and can in having broken away from other execution mode of these details, put into practice the present invention.
Should be emphasized that the term of Shi Yonging " comprises/comprise/have " and is used for indicating the existence of described feature, step, parts etc. in the following description, and does not get rid of the existence of further feature, step, parts or their combination.
In addition, in the following description, will the present invention will be described based on " electronic equipment ".Be appreciated that said " electronic equipment " can be any electronic equipment with acoustics module here, include, but not limited to mobile phone, personal digital assistant, MP3/MP4 player, computer, television set and audio amplifier equipment etc. independently.
Problem at conduction connecting structure existence in the existing acoustics module, and consider simultaneously the seal requirement in sound chamber afterwards, in embodiments of the present invention, (laser directly structuring, LDS) technology generates the new conduction connecting structure between loud speaker and the PCB mainboard to adopt laser direct forming.The basic principle of LDS is: activate the plastic body of injection mo(u)lding by focussed laser beam, line pattern is transferred on the surface of plastic body, be about to make position activation and the surface, roughening figure position of conductive pattern; Deposited conducting metal by the figure position of laser activation then, thereby producing conductive pattern at plastic body.Because characteristics such as the high-energy-density of laser and high directivities, laser can be used for the making of ultra tiny circuit, and does not need to make mould or the mask of conductive pattern, therefore flexible design not only, and also cost is lower.In order to make laser can activate plastic body, be that raw material is made but need plastic body to adopt the modified plastics of laser activation.Current, LDS has been used for the manufacturing of three dimensional mold interconnecting device (MID).In embodiments of the present invention, LDS is applied to the acoustics module, the connecting structure for electrical equipment that can solve the variety of issue in the conventional acoustic module is provided.
Describe below in conjunction with specific embodiments.
Embodiment 1
Fig. 2 is the generalized section of acoustics module in one embodiment of the invention.In Fig. 2, the acoustics module comprises that first housing 201, loud speaker 203 and second housing, 202, the first housings 201 are arranged on the front portion of loud speaker 203, and sound chamber 208 before being formed with between first housing 201 and loud speaker 203.Concrete, loud speaker 203 front ends can directly be bonded on the casing 201 of sender 204 or for example the packing ring 206(by double-sided belt glue as for the bubble of compression cotton or other flexible material) be bonded on the casing 201 of sender 204, the front end of loud speaker 203 can omit with casing 201 and packing ring 206() form before sound chamber 208.In addition, the sender 204 in sound chamber 208 before first housing 201 is provided with.Second housing 202 is arranged on the rear portion of described loud speaker 203 and closely is connected with first housing 201, forms sound chamber, back 209 at the rear portion of loud speaker 203.Just, back sound chamber 209 is the space that loud speaker rear end and first housing 201 and second housing 202 form.For the electronic equipment with acoustics module, this first housing 201 can be the casing (as front housing) of this electronic equipment or the part of casing.Second housing can be done the housing (being also referred to as sound chamber, back lid) of sound chamber, back lid for special use, perhaps also can be the part of the casing of electronic equipment.
In the present embodiment, generate connecting structure for electrical equipment between loud speaker and the PCB in order to adopt LDS, but second housing 202 is formed by the plastics of laser activation.Herein, PA6/6T(aromatization polyamide), polyester thermoplastics (PBT, PET) and polymer blend thereof, photocrosslinking PBT(Polybutylene terephthalate but the plastics of laser activation for example include but not limited to:, poly-butyl terephthalic acids fat), LCP(Liquid Crystal Polymer, liquid crystal high polymers) and/or PC/ABS(polycarbonate/acrylonitrile-butadiene-styrene copolymer) etc. thermoplastics or other material.But owing on market, just can buy the material of various laser activations at present as required, therefore do not enumerate one by one and describe in detail at this.But the material with laser activation is raw material, but adopts common injection molding apparatus, mould or other technology just can inject second housing 202 of the laser activation of reservation shape.
In the present embodiment, second housing 202 is provided with through hole 211.The number of through hole 211 can be one or more, and only example has gone out two through holes 211 in Fig. 2.Described through hole can be designed as different shape, for example be circular port, square hole etc., but the present invention is not limited to this, as long as can realize the function of through hole.In addition, for the ease of focussed laser beam through hole is shone (activation), in the present embodiment preferably with via design be: (this moment, the longitudinal section of described through hole for example can be " || " shape more than or equal to the aperture of the part away from from the end of through hole from the aperture of the nearer part in the end of through hole, "〉＜" different shape such as shape or ") (" shape), perhaps, the aperture of described through hole increases gradually or reduces (this moment, the longitudinal section of through hole for example can be " eight " word just or the different shape such as " eight " word that falls) from the end to end of this through hole, but the present invention is not limited to these shapes.
Further, be formed with via laser focusing irradiation on the two sides of second housing 202 and run through connection line pattern through hole 211, activation.If have a plurality of through holes, can form at least one connection line pattern at each through hole.Particularly, for example can adopt computer control laser to shine at second housing, 202 upslides of three-dimensional, form the connection line pattern, and do not need to make mould or the mask of conductive pattern, can be directly according to computer-aided design (CAD) data moulding conductive pattern.The shape of this connecting line pattern can design flexible or modification, even therefore behind completed line pattern or metallic conduction figure, also can be at an easy rate to the circuit processing of making amendment, and change difficulty the mould when embedding the metal forming technology unlike existing employing.In the present embodiment, the laser beam of focusing not only can activate according to predetermined figure at surface of shell, equally can be easily the inwall of through hole 211 be activated so that in described through hole plated metal, what therefore form is three-dimensional line pattern.Because characteristics such as the high-energy-density of laser and high directivities, what the connection line pattern that forms by laser can be very is fine, for example can reach 0.15mm, by controlling the focusing of laser more subtly, and connection line pattern even can reach 0.1mm or thinner.
Further, deposit metal level 212 on the connection line pattern, form the metallic circuit structure that is used for connecting described loud speaker and printed circuit board (PCB) that runs through described through hole thus.Be conducive to the deposition of metal through the surface texture of laser activation, thereby can form adhering to reliably of metal level.In the embodiment of the invention, described metal level 212 can directly form in the line pattern of laser activation by methods such as plating.The material of described metal level can be single-layer metal, also can be the combination of more multi-layered different metal or alloy, and wherein said metal includes but not limited to Cu, Ni, Au, Sn, Sn/Pb, Ag and/or Ag/Pd etc.Fig. 4 a and Fig. 4 b are respectively the one side towards loud speaker (can be described as the front) and the schematic diagram of the one side of loud speaker (can be described as the back side) dorsad of second housing 202 of one embodiment of the invention.As Fig. 4 a and Fig. 4 b as seen, the front and back at second housing is formed with the metallic circuit that runs through through hole 211.In the front of second housing, loud speaker 203 can be connected with the connection gasket of front metal circuit 212 by contact 207.At the back side of second housing, pcb board can be connected with the connection gasket of back metal circuit 212 by conductive contact (as elastic sheet metal, metal protuberance or metal needle etc.).
In embodiments of the present invention, can control the width of the metallic circuit that forms at the connection line pattern by the width of connection line in the control connection line pattern.For example, when the electronic equipment with acoustics module does not possess antenna, to the width of metallic circuit in the acoustics module without limits, can arbitrarily design the width of connection line in the connection line pattern thus.And when in electronic equipment, needing antenna is set, can form thinner connection line, thereby form thinner metallic circuit at connection line, so that this metallic circuit can be ignored for the influence of the radio-frequency performance of antenna in the electronic equipment under the acoustics module.Therefore, in the present embodiment, the width of metallic circuit can design as required.For example, when needs are considered the influencing of antenna, the width of connection line or metallic circuit in the connection line pattern can be limited in 0.1～5mm, for example the width of metallic circuit is set to any one value (as 0.2mm, 0.5mm, 1.0mm or 2.0mm etc.) or any one scope (as 0.5～2.0mm, 0.2～3.0mm or 1～4.0mm etc.) in 0.1～5mm neatly, but as above numeral is example only, and the present invention is not limited to this.
As mentioned above, second housing, 202 surfaces are gone up and are formed with the metallic circuit 212 that runs through through hole 211 by LDS, and this metallic circuit 212 is as the conduction connecting structure that is used for connecting loud speaker and PCB.This moment, through hole 211 was not what seal.Owing to for the acoustics module, need to form the back sound chamber of sealing.For this reason, in the embodiment of the invention, the outside that further is filled with in the described through hole for the filler that seals described through hole or described through hole is formed with the cover layer that covers described through hole, thereby can make the back sound chamber of sound chamber, back for sealing.Described filler or cover layer can be viscosity or inviscid material.
For example, as shown in Figure 2, the one side towards loud speaker 203 of second housing 202 is provided with cover layer 213, and this cover layer covers through hole 211 and exposes the connection gasket part that is connected with loud speaker of metal connection line.Fig. 3 is the decomposing schematic representation of the acoustics module in another embodiment of the present invention.In Fig. 3, also can be clear that for the cover layer 213 that covers described through hole.Fig. 5 is the schematic diagram that second housing of loud speaker has been installed.Among Fig. 5, can see the through hole 211 on second back side of shell, this through hole 211 is positive sealed from second housing.Described cover layer 213 for example can be label, sealing strip or the gasket seal etc. that have viscose glue, but the present invention is not limited to this.Alternatively, described cover layer also can be arranged on the one side towards pcb board (being the back side) of second housing 202, perhaps on the two sides of second housing 202 cover layer is set all.
Alternatively, also can be filled with the filler for the described through hole of sealing in through hole, substitute cover layer, this moment, filler for example can be sealing plug, fluid sealant or other viscosity or non-sticky encapsulant, but the present invention is not limited to this.Fig. 6 for the installation of another embodiment of invention the schematic diagram of second housing of loud speaker.As shown in Figure 6, the through hole on second housing 202 adopts filler 214 to fill.
Aforesaid acoustics module, owing to adopted the LDS technology to form the connecting structure for electrical equipment that connects loud speaker and PCB, need not in the injection moulding process of second housing, to embed metal, can design arbitrarily, adjust and/or revise connection line according to actual condition, thereby make that the processing of second housing is simpler, and the assembling process of acoustic module is more prone to, and the assembly cost of reliable in structure, acoustics module is also lower.In addition, the width of the sheet metal that the width that adopts the metal electrical cable that the LDS technology forms embeds in the conventional acoustic module, almost not influence of cabling design to the antenna of electronic equipment, therefore further improve the flexibility ratio of the antenna design of electronic equipment, thereby can guarantee the radio-frequency performance of antenna.And the tie point of the connection line of the outside, back sound chamber of acoustics module can arbitrarily be adjusted according to the layout needs of mainboard, and to the electron circuit layout of mainboard with highly can not exert an influence.
Embodiment 2
Manufacture method to the acoustics module of one embodiment of the invention describes below.This acoustics module comprises loud speaker 203, first housing 201 and second housing 202.First housing 201 can adopt common injection molding apparatus, mould or other technology and injection moulding.But second housing 202 can be raw material with the material of laser activation, adopts common injection molding apparatus, mould or other technology and injection moulding, and its shape can arbitrarily design as required.And set in advance through hole 211 on this second housing 202.
The number of through hole 211 can be one or more, and only example has gone out two through holes 211 in Fig. 2.Described through hole can be designed as different shape, for example be circular port, square hole etc., but the present invention is not limited to this.In addition, for the ease of focussed laser beam through hole is shone (activation), in the present embodiment preferably with via design be: (this moment, the longitudinal section of described through hole for example can be " || " shape more than or equal to the aperture of the part away from from the end of through hole from the aperture of the nearer part in the end of through hole, "〉＜" different shape such as shape or ") (" shape), perhaps, the aperture of through hole increases gradually or reduces (this moment, the longitudinal section of through hole for example can be for falling " eight " word or different shape such as " eight " word just) from the end to end of this through hole, but is not limited to these shapes.
Fig. 7 is described to be the manufacture method flow chart of the acoustics module of one embodiment of the invention.As shown in Figure 7, this method comprises the steps:
Step S701 carries out the laser irradiation to the part on the two sides of described second housing 202, forms to run through connection line pattern described through hole, activation.
If have a plurality of through holes, can form at least one connection line pattern at each through hole.The shape of this connecting line pattern can design flexible or modification.
In embodiments of the present invention, can control the width of the metallic circuit that forms at the connection line pattern by the width of connecting line in the control connection line pattern.For example, when the electronic equipment with acoustics module does not possess antenna, to the width of metallic circuit in the acoustics module without limits, can arbitrarily design the width of connection line in the connection line pattern thus.And when in electronic equipment, needing antenna is set, can form thinner connection line, thereby form thinner metallic circuit at connection line, so that this metal level can be ignored for the influence of the radio-frequency performance of antenna in the electronic equipment under the acoustics module.The shape of connecting line pattern can flexible design.Therefore, in the present embodiment, the width of metallic circuit can design as required.For example, when needs are considered the influencing of antenna, the width of connection line or metallic circuit in the connection line pattern can be limited in 0.1～5mm, for example the width of metallic circuit is set to any one value (as 0.2mm, 0.5mm, 1.0mm or 2.0mm etc.) or any one scope (as 0.5～2.0mm, 0.2～3.0mm or 1～4.0mm etc.) in 0.1～5mm neatly, but as above numeral is example only, and the present invention is not limited to this.
Step S702, depositing metal layers on described connection line pattern forms the metallic circuit structure that is used for connecting described loud speaker and printed circuit board (PCB) that runs through described through hole thus.
Described metal level (being metallic circuit) 212 can directly form in the line pattern of laser activation by methods such as plating.Owing to belong to the technology of comparative maturity at the regional plated metal of laser activation, therefore save description to its ins and outs at this, obscure of the present invention in order to avoid cause.As Fig. 4 a and Fig. 4 b as seen, behind deposition step, through hole is metallized, and be formed with the metallic circuit that runs through through hole 211 at the front and back of second housing.The material of described metal level can be single-layer metal, also can be the combination of more multi-layered different metal or alloy, and wherein said metal includes but not limited to Cu, Ni, Au, Sn, Sn/Pb, Ag and/or Ag/Pd etc.
Before depositing, can at first clean second housing, to remove the residue that after the laser irradiation, produces at second housing.
Step S703 is filled with in described through hole for the filler of the described through hole of sealing or in the outside of described through hole and forms the cover layer that covers described through hole.
When adopting cover layer to cover metallized through hole, described cover layer for example can be the label that has viscose glue, sealing strip, gasket seal etc., but the present invention is not limited to this.This cover layer can be arranged on any one or both sides of second housing.
When adopting the filler filling vias, filler for example can be sealing plug, fluid sealant or other viscosity or non-sticky encapsulant, but the present invention is not limited to this.
Step S704 is arranged on the front portion of loud speaker 203 with described first housing 201, and sound chamber before forming between first housing and loud speaker.Wherein, first housing 201 is provided with the sender in described preceding sound chamber.
Concrete, loud speaker 203 front ends directly can be bonded on first housing 201 of sender 204 or for example the packing ring 206(by double-sided belt glue as bubble cotton or other flexible material for compression) be bonded on first housing 201 of sender 204.At this moment, the front end of loud speaker 203 can form preceding sound chamber 208 with casing 201 and packing ring 206.
Step S705 is arranged on the rear portion of described loud speaker with described second housing, makes loud speaker and metal connection line on second housing form conduction and is connected.
For example, loud speaker 203 can be connected with the connection gasket of the second housing front metal circuit 212 by contact 207.
Step S706 closely is connected second housing with first housing, to form the back sound chamber of sealing at the rear portion of described loud speaker.
Particularly, namely shown in Figure 3 as Fig. 2, loud speaker 203 can limit with packing ring 206, first housing and second housing and form sound chamber, back.Though have through hole on second housing, because the through hole after the metallization is sealed, therefore can be so that sound chamber, back be the back sound chamber of sealing.
In the present embodiment owing to adopted the LDS technology to form to connect the connecting structure for electrical equipment of loud speaker and PCB, need not in the injection moulding process of second housing, to embed metal, can design arbitrarily, adjust and/or revise connection line according to actual condition, thereby make that the processing of second housing is simpler, and the assembling process of acoustic module is more prone to, and the assembly cost of reliable in structure, acoustics module is also lower.In addition, the width of the sheet metal that the width that adopts the metal electrical cable that the LDS technology forms embeds in the conventional acoustic module, almost not influence of cabling design to the antenna of electronic equipment, therefore further improve the flexibility ratio of the antenna design of electronic equipment, thereby can guarantee the radio-frequency performance of antenna.And the tie point of the connection line of the outside, back sound chamber of acoustics module can arbitrarily be adjusted according to the layout needs of mainboard, and to the electron circuit layout of mainboard with highly can not exert an influence.
What note is that though in above description, each step is that order is described, but should be clear, the order of each above step is not fixed, and the sequencing of some step can be adjusted and some step can walk abreast carries out, and for example step S706 can carry out with step S705 is parallel.And for example, step S705 can carry out before step S704, and step S706 can carry out with step S704 is parallel when step S705 is before step S704.In addition, between above-mentioned some step, can also insert other step.But this does not influence enforcement of the present invention, and all should contain within the scope of the invention.
In addition, the time sequencing of describing during method of the present invention is not limited to is to specifications carried out, also can according to other time sequencing ground, carry out concurrently or independently.Therefore, the execution sequence of the method for describing in this specification is not construed as limiting technical scope of the present invention.
One of ordinary skill in the art will appreciate that all or part of step that realizes in above-described embodiment method can instruct relevant hardware to finish by program, this program can be stored in the computer read/write memory medium, such as ROM/RAM, magnetic disc, CD etc.
In the above in the description to the specific embodiment of the invention, can in one or more other execution mode, use in identical or similar mode at the feature that a kind of execution mode is described and/or illustrated, combined with the feature in other execution mode, or the feature in alternative other execution mode.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is specific embodiments of the invention; and be not intended to limit the scope of the invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. acoustics module, this acoustics module comprises loud speaker, first housing and second housing,
Described first housing is arranged on the front portion of loud speaker, and sound chamber before being formed with between described first housing and described loud speaker, and described first housing is provided with the sender in described preceding sound chamber; Described second housing is arranged on the rear portion of described loud speaker and closely is connected with described first housing, forms sound chamber, back at the rear portion of described loud speaker; It is characterized in that:
But described second housing is formed by the material of laser activation;
Described second housing is provided with through hole;
Run through connection line pattern described through hole, activation via laser irradiation formation on the two sides of described second housing;
Deposit metal level on the described connection line pattern, form the metallic circuit structure that is used for connecting described loud speaker and printed circuit board (PCB) that runs through described through hole thus; And
The outside that is filled with in the described through hole for the filler that seals described through hole or described through hole is formed with the cover layer that covers described through hole, makes that sound chamber, described back is the back sound chamber of sealing.
2. acoustics module according to claim 1 is characterized in that:
Being shaped as from the aperture of the nearer part in the end of through hole more than or equal to the aperture of the part away from from the end of through hole of described through hole; Perhaps
The aperture of described through hole increases gradually or reduces from the end to end of this through hole.
3. acoustics module according to claim 1 is characterized in that:
The width of described metallic circuit is 0.1～5mm.
4. acoustics module according to claim 1 is characterized in that:
Described filler is sealing plug or fluid sealant; Described cover layer is sealing strip, sealing gasket or the label that has viscose glue.
5. the equipment with acoustics module is characterized in that, described equipment is provided with as any described acoustics module among the claim 1-4.
6. equipment according to claim 5 is characterized in that, described printed circuit board (PCB) be connected with described metallic circuit by conductive contact.
7. the manufacture method of an acoustics module, this acoustics module comprises loud speaker, first housing and second housing, it is characterized in that, but described second housing is formed by the material of laser activation and described second housing is provided with through hole, described method comprises the steps:
The laser irradiation is carried out in the part on the two sides of described second housing, run through connection line pattern described through hole, activation with formation;
Depositing metal layers on described connection line pattern forms the metallic circuit structure that is used for connecting described loud speaker and printed circuit board (PCB) that runs through described through hole thus; And
In described through hole, be filled with for the filler of the described through hole of sealing or in the outside of described through hole and form the cover layer that covers described through hole;
Described first housing is arranged on the front portion of loud speaker, and sound chamber before between described first housing and described loud speaker, forming, described first housing is provided with the sender in described preceding sound chamber;
Described second housing is arranged on the rear portion of described loud speaker; And
Described second housing closely is connected with described first housing, to form the back sound chamber of sealing at the rear portion of described loud speaker.
8. method according to claim 7 is characterized in that:
Being shaped as from the aperture of the nearer part in the end of through hole more than or equal to the aperture of the part away from from the end of through hole of described through hole; Perhaps
The aperture of described through hole increases gradually or reduces from the end to end of this through hole.
9. method according to claim 7 is characterized in that:
The width of described metallic circuit is 0.1～5mm.
10. method according to claim 7 is characterized in that:
Described filler is sealing plug or fluid sealant; Described cover layer is sealing strip, sealing gasket or the label that has viscose glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010176244 CN102244830B (en) | 2010-05-13 | 2010-05-13 | Acoustic module, preparation method thereof and equipment with acoustic module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010176244 CN102244830B (en) | 2010-05-13 | 2010-05-13 | Acoustic module, preparation method thereof and equipment with acoustic module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102244830A CN102244830A (en) | 2011-11-16 |
| CN102244830B true CN102244830B (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010176244 Expired - Fee Related CN102244830B (en) | 2010-05-13 | 2010-05-13 | Acoustic module, preparation method thereof and equipment with acoustic module |
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| CN (1) | CN102244830B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102665378B (en) * | 2012-05-18 | 2016-04-20 | 上海安费诺永亿通讯电子有限公司 | Realize the method for plastic parts inner surface and the mutual conducting of outer surface |
| CN106416288B (en) * | 2013-12-12 | 2019-11-08 | 诺基亚技术有限公司 | Loudspeaker housing with integrally formed electric conductor |
| CN105208488A (en) * | 2015-09-21 | 2015-12-30 | 广东欧珀移动通信有限公司 | Closed type loudspeaker and electronic terminal |
| CN105228062A (en) * | 2015-09-21 | 2016-01-06 | 广东欧珀移动通信有限公司 | A kind of closed loudspeaker and electric terminal |
| CN106060727A (en) * | 2016-06-07 | 2016-10-26 | 广东欧珀移动通信有限公司 | Loudspeaker component and mobile terminal |
| CN108040310B (en) * | 2017-11-29 | 2020-02-14 | 维沃移动通信有限公司 | Mobile terminal |
| CN108055627A (en) * | 2018-01-19 | 2018-05-18 | 西安易朴通讯技术有限公司 | A kind of loudspeaker assembly and terminal device |
| CN109040923A (en) * | 2018-08-13 | 2018-12-18 | 上海创功通讯技术有限公司 | Welding bell group and mobile terminal containing it |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914948A (en) * | 2004-04-13 | 2007-02-14 | 松下电器产业株式会社 | Speaker device |
| CN101416531A (en) * | 2006-03-30 | 2009-04-22 | 峰力公司 | Wireless audio signal receiver device for a hearing instrument |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101004961B1 (en) * | 2008-06-20 | 2011-01-04 | 주식회사 이엠따블유 | Mobile communication device and manufacturing method of the same |
-
2010
- 2010-05-13 CN CN 201010176244 patent/CN102244830B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914948A (en) * | 2004-04-13 | 2007-02-14 | 松下电器产业株式会社 | Speaker device |
| CN101416531A (en) * | 2006-03-30 | 2009-04-22 | 峰力公司 | Wireless audio signal receiver device for a hearing instrument |
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| Publication number | Publication date |
|---|---|
| CN102244830A (en) | 2011-11-16 |
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Address after: 100176 No. 14 Fairview street, Beijing economic and Technological Development Zone Applicant after: Sunway caike communication technology (Beijing) Co., Ltd. Address before: 100176 No. 14 Fairview street, Beijing economic and Technological Development Zone Applicant before: Laird Technologies (Beijing) Co., Ltd. |
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