CN102244088B - OLED (organic light emitting devices) screen body packaging method - Google Patents
OLED (organic light emitting devices) screen body packaging method Download PDFInfo
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Abstract
The invention provides a method for packaging an OLED (organic light emitting diode) screen body comprising the following steps: a) preparing packaging sheets, arranging a plurality of through holes on the packaging sheets, forming a plurality of packaging holes; b) dispensing on the packaging sheets, dispensing zone being arranged at one side of the through hole which is housed by a notch; c) preparing the substrate, preparing an anode layer, an organic layer and a cathode layer on the substrate; d) under the inert gas or vacuum environment, packaging the packaging sheets on the substrate by using a packaging glue; and e) incising along an edge of the through hole of the packaging sheet far away from a packaging pit, and obtaining the OLED screen body. By using the OLED screen body with the packaging structure, liquid oxygen can be effectively prevented to be sealed in a corresponding space in a packaging process, thus leads are prevented from electrocorrosion, and the service life of the screen body is prolonged.
Description
Technical field
The present invention relates to the organic light emitting display technical field, relate in particular to a kind of OLED screen body method for packing.
Background technology
Along with the arriving of Development of Multimedia Technology and information-intensive society, more and more higher to the flat-panel monitor performance demands.Newly occurred three kinds of displays in recent years: plasma display, Field Emission Display and display of organic electroluminescence have all remedied the deficiency of cathode ray tube and LCD to a certain extent.Wherein, display of organic electroluminescence have from main light emission, low-voltage direct drive, solidify entirely, a series of advantage such as the visual angle is wide, color is abundant, compare with LCD, display of organic electroluminescence does not need backlight, the visual angle is big, power is low, and its response speed can reach 1000 times of LCD, and manufacturing cost but is lower than the LCD of equal resolution.Therefore, display of organic electroluminescence has broad application prospects, and is regarded as one of extremely competitive following flat panel display.
Organic electroluminescence device (Organic Light Emitting Devices, abbreviation OLED) basic structure is: in the confined space of a glass substrate and cap formation organic light-emitting units is set, organic light-emitting units comprises each layers such as anode, organic luminous layer, negative electrode, anode, negative electrode are drawn by lead-in wire in the non-light-emitting area position, carry out nation with integrated circuit (IC) or flexible PCB (FPC) and decide.
In the prior art, generally adopt in the mode that is electrically connected,, treat after intact surely IC of nation or the FPC Yi Bian the space of screen body electrical connection is all exposed, with various glue it is covered again, the problem of Cun Zaiing is like this, covers in the various glue processes, may also water oxygen be sealed in the corresponding space simultaneously, and the lead-in wire that is used to conduct electricity on the screen body is not only tiny, and be subjected to the corrosion of water oxygen easily, in the use, the water oxygen in the seal cavity may cause the galvano-cautery of lead-in wire.
Therefore, be necessary to provide a kind of OLED screen body method for packing, to address the above problem.
Summary of the invention
The object of the present invention is to provide a kind of OLED screen body method for packing that prevents to go between and corrode.
Concrete technical scheme is as follows:
A kind of OLED screen body method for packing, the cap that described OLED screen body comprises substrate and is located at the substrate top, cap comprises center main portion, at least one sidepiece of described substrate surface is provided with the lead-in wire zone, the lead-in wire zone comprises in order to nation decides the first area of IC or FPC and the second area adjacent with the first area, cap also is provided with from center main portion stretches the extension in order to the covering second area of formation towards an epitaxial lateral overgrowth, and described method for packing may further comprise the steps:
A) prepare case chip, dig at the case chip upside and establish some through holes, form some caps;
B) carry out a glue on case chip, described glue application region territory is positioned at through hole one side has a recess to accommodate described through hole;
C) prepared substrate prepares anode layer, organic layer and cathode layer on substrate;
D) under inert gas or vacuum environment, utilize packaging plastic to be packaged on the aforesaid substrate case chip;
E) cutting is cut along the edge of case chip through hole away from the encapsulation hole, obtains OLED screen body.
Further, be provided with the encapsulation hole in the described glue application region territory.
Further, described encapsulation is cheated and is rectangle.
Further, cap comprises center main portion, at least one sidepiece of described substrate surface is provided with the lead-in wire zone, the lead-in wire zone comprises in order to nation decides the first area of IC and the second area adjacent with the first area, and described cap also is provided with the extension in order to the covering second area of stretching formation from center main portion towards an epitaxial lateral overgrowth.
Further, the corresponding setting of described recess with the first area.
Further, described first area is rectangular or trapezoidal, and described center main portion and second area roughly are concave shape on the whole.
As can be seen from the above technical solutions, in this kind OLED screen body encapsulating structure, cap is by being provided with extension, the second area in lead-in wire zone is covered encapsulation, can avoid effectively in the encapsulation process water oxygen being sealed in the corresponding space, thereby avoid lead-in wire that galvano-cautery takes place, prolong the useful life of screen body, simultaneously, the fixed regional substrate intensity of nation in the time of can also increasing screen body sliver.
Description of drawings
Figure 1 shows that the schematic side view of OLED screen body of the present invention.
Figure 2 shows that the schematic top plan view of substrate in the OLED screen body of the present invention.
Figure 3 shows that the elevational schematic view of cap in the OLED screen body of the present invention.
Figure 4 shows that the production method schematic diagram of case chip in the OLED method for packing of the present invention.
Figure 5 shows that OLED method for packing mid point glue mode schematic diagram of the present invention.
Wherein, 100 are OLED screen body; 1 is substrate; 11 are the lead-in wire zone; 12 is the packaging plastic zone; 13 is light-emitting zone; 111 is the first area; 112 is second area; 113 are lead-in wire; 2 is cap; 21 is center main portion; 22 is extension; 23 is recess; 24 is the packaging plastic zone; 25 are the encapsulation hole; 300 is case chip; 31 are the encapsulation hole; 32 is through hole; 33 is the glue application region territory; 34 is recess.
Embodiment
In order to make the purpose, technical solutions and advantages of the present invention clearer, describe the present invention below in conjunction with the drawings and specific embodiments.
Ginseng Figure 1 shows that the end view schematic diagram of OLED screen body 100 preferred forms of the present invention, OLED screen body 100 comprises substrate 1 and is located at the cap 2 of substrate 1 top, described substrate 1 upwards prepares successively anode layer, organic layer and cathode layer, and organic layer comprises hole transmission layer, luminescent layer and electron transfer layer.Described substrate 1 is generally and is glass substrate, and described cap 2 is glass packaging lid or metallic packaging lid or Plastic Package lid.
Ginseng Figure 2 shows that the schematic top plan view of substrate 1 in the OLED screen body 100 of the present invention, described substrate 1 surface is provided with a lead-in wire zone 11, lead-in wire zone comprise in order to nation decide IC or FPC first area 111 and with the second area 112 of first area 111 adjacent settings, first area 111 is provided with some lead-in wires 113, and described lead-in wire 113 can link to each other with external circuit.Be provided with the both sides of being located at first area 111 of 112, two second area 112 symmetries of two second areas in the present embodiment, first area 111 and second area 112 are the rectangle setting, and the width of first area 111 equates with the width of second area 112.Be reserved with packaging plastic zone 12 on the substrate 1, packaging plastic zone 12 roughly is concave shape on the whole.Also be provided with light-emitting zone 13 on the substrate 1, described light-emitting zone 13 is enclosed by packaging plastic zone 12 and lead-in wire zone 11 and forms, and the projection of light-emitting zone 13 on substrate 1 is rectangular.
Ginseng Figure 3 shows that the elevational schematic view of cap 2 in the OLED screen body 100 of the present invention, described cap 2 comprises center main portion 21, and from center main portion 21 stretch towards an epitaxial lateral overgrowth formation in order to covered substrate 1 on the extension 22 of second area 112, form recesses 23 in the middle of described two extensions 22.The housing wire shaped in packaging plastic zone 12 is identical on the housing line of described cap 2 and the substrate 1.Be reserved with packaging plastic zone 24 on the cap 2 equally, packaging plastic zone 24 roughly is concave shape on the whole.The encapsulation hole 25 that is provided with certain depth is being dug by cap 2 central authorities towards a side of substrate 1, substrate 1 upwardly extending organic layer and cathode layer can be accommodated in encapsulation hole 25.The second area 112 corresponding settings in lead-in wire zone 11 on extension 22 on the described cap 2 and the substrate 1, the first area 111 corresponding settings in lead-in wire zone 11 on recess 23 on the cap 2 and the substrate 1, packaging plastic zone 12 corresponding settings on packaging plastic on the described cap 2 zone 24 and the substrate 1, the encapsulation on the described cap 2 cheat 25 with substrate 1 on light-emitting zone 13 corresponding settings.
During encapsulation, with cap 2 and substrate 1 corresponding placement, therefore packaging plastic zone 24 on the cap 2 and the packaging plastic zone 12 on the substrate 1 match, packaging plastic zone 12 on zone 24 of the packaging plastic on the packaging plastic 2 and substrate 1 encapsulates fixing by ultra-violet curing packaging plastic (UV glue), encapsulation has only on the metacoxal plate 1 outside first area 111 is exposed to, all packed lid 2 encapsulation of remainder.
A substrate 1 is provided with a lead-in wire zone 11 in the present embodiment, the first lead-in wire zone 111 rectangular settings, but according to different demands, can be provided with two or more lead-in wires zone on the substrate 1, and first area 111 also is not limited to rectangle, also can be set to other shapes such as for example trapezoidal, only need that the lead portion that need link to each other with external circuit is exposed to cap and get final product outward.
The method for packing of OLED screen body 100 may further comprise the steps in the above-mentioned preferred forms:
A) ginseng is shown in Figure 4, prepares case chip 300, digs at case chip 300 upsides and establishes some through holes 32, forms some caps;
B) ginseng is shown in Figure 5, carries out a glue on case chip 300, and described glue application region territory 33 is positioned at through hole one side has a recess 34 to accommodate described through hole 32;
C) prepared substrate prepares anode layer, organic layer and cathode layer on substrate;
D) under inert gas or vacuum environment, utilize packaging plastic to be packaged on the aforesaid substrate case chip 300;
E) cutting is cut along the edge of case chip through hole away from the encapsulation hole, obtains OLED screen body.
Ginseng Fig. 4, shown in Figure 5 also digs on the case chip 300 and is provided with some encapsulation hole 31, and described encapsulation hole 31 is positioned at 33 inside, glue application region territory of the side of through hole 32, and encapsulation hole 31 is rectangular.
Same, 1 through hole 32 that is provided with of 31 correspondences is cheated in each encapsulation in above-mentioned method for packing, through hole 32 and recess 34 all are set to be rectangle, but according to different demands, each encapsulation hole can be corresponding be provided with two or more through holes, the shape of described through hole 32 and recess 34 also is not limited only to rectangle, also can be set to other shapes such as for example trapezoidal, 34 need of recess are accommodated through hole 32, and the lead portion that need are linked to each other with external circuit is exposed to cap and gets final product outward.
In this kind OLED screen body structure and the method for packing thereof, cap 2 is by being provided with extension 22, the second area 112 in lead-in wire zone 11 is covered encapsulation, can avoid effectively in the encapsulation process water oxygen being sealed in the corresponding space, thereby avoid lead-in wire that galvano-cautery takes place, prolonged the useful life of screen body, simultaneously, the fixed regional substrate intensity of nation in the time of can also increasing screen body sliver.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being made, is equal to replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (6)
1. an OLED shields the body method for packing, the cap that described OLED screen body comprises substrate and is located at the substrate top, cap comprises center main portion, at least one sidepiece of described substrate surface is provided with the lead-in wire zone, the lead-in wire zone comprises in order to nation decides the first area of IC or FPC and the second area adjacent with the first area, cap also is provided with from center main portion stretches the extension in order to the covering second area of formation towards an epitaxial lateral overgrowth, it is characterized in that described method for packing may further comprise the steps:
A) prepare case chip, dig at the case chip upside and establish some through holes, form some caps;
B) carry out a glue on case chip, described glue application region territory is positioned at through hole one side has a recess to accommodate described through hole;
C) prepared substrate prepares anode layer, organic layer and cathode layer on substrate;
D) under inert gas or vacuum environment, utilize packaging plastic to be packaged on the aforesaid substrate case chip;
E) cutting is cut along the edge of case chip through hole away from the encapsulation hole, obtains OLED screen body.
2. OLED screen body method for packing as claimed in claim 1 is characterized in that: be provided with the encapsulation hole in the described glue application region territory.
3. OLED screen body method for packing as claimed in claim 2, it is characterized in that: described encapsulation hole is rectangle.
4. OLED screen body method for packing as claimed in claim 1, it is characterized in that: cap comprises center main portion, at least one sidepiece of described substrate surface is provided with the lead-in wire zone, the lead-in wire zone comprises in order to nation decides the first area of IC and the second area adjacent with the first area, and described cap also is provided with the extension in order to the covering second area of stretching formation from center main portion towards an epitaxial lateral overgrowth.
5. OLED screen body method for packing as claimed in claim 4 is characterized in that: the corresponding setting with the first area of described recess.
6. OLED screen body method for packing as claimed in claim 5, it is characterized in that: described first area is rectangular or trapezoidal, and described center main portion and second area roughly are concave shape on the whole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110179321 CN102244088B (en) | 2011-06-29 | 2011-06-29 | OLED (organic light emitting devices) screen body packaging method |
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| CN 201110179321 CN102244088B (en) | 2011-06-29 | 2011-06-29 | OLED (organic light emitting devices) screen body packaging method |
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| CN102244088A CN102244088A (en) | 2011-11-16 |
| CN102244088B true CN102244088B (en) | 2013-07-31 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105449113B (en) * | 2014-08-14 | 2018-02-23 | 固安翌光科技有限公司 | One kind screen body cap, screen body and the encapsulation of screen body and cutting method |
| CN104460092A (en) * | 2014-12-25 | 2015-03-25 | 厦门天马微电子有限公司 | Display panel, display device and manufacturing method of display panel |
| CN106773213B (en) * | 2017-01-03 | 2020-02-18 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| CN109307957A (en) * | 2017-07-27 | 2019-02-05 | 昆山维信诺科技有限公司 | A kind of case chip and packaging method |
| CN113219737B (en) * | 2021-04-20 | 2022-06-07 | 绵阳惠科光电科技有限公司 | Display panel and display device |
| CN114360371B (en) * | 2021-11-30 | 2023-11-07 | 昆山国显光电有限公司 | Display screen assembly and display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100409723C (en) * | 2002-05-28 | 2008-08-06 | 伊斯曼柯达公司 | Luminous lighting device with organic light-emitting diode layer |
| CN202120916U (en) * | 2011-06-29 | 2012-01-18 | 昆山工研院新型平板显示技术中心有限公司 | Organic light-emitting diode screen body capable of preventing erosion of lead |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101272332B1 (en) * | 2006-07-26 | 2013-06-07 | 삼성디스플레이 주식회사 | Organic light emitting diode display |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100409723C (en) * | 2002-05-28 | 2008-08-06 | 伊斯曼柯达公司 | Luminous lighting device with organic light-emitting diode layer |
| CN202120916U (en) * | 2011-06-29 | 2012-01-18 | 昆山工研院新型平板显示技术中心有限公司 | Organic light-emitting diode screen body capable of preventing erosion of lead |
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Owner name: KUNSHAN GUOXIAN OPTOELECTRONICS CO., LTD. Free format text: FORMER OWNER: KUNSHAN INDUSTRY RESEARCH ACADEMY NOVEL FLAT PANEL DISPLAY TECHNOLOGY CENTER CO., LTD. Effective date: 20150320 |
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Effective date of registration: 20150320 Address after: 215300, No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, 4 Patentee after: Kunshan Guo Xian Photoelectric Co., Ltd. Address before: 215300, 188, Feng Feng Road, hi tech Zone, Kunshan, Jiangsu, Suzhou Patentee before: Kunshan Industry Research Academy Novel Flat Panel Display Technology Center Co., Ltd. |