CN102238863A - Electronic component mounting device, mounting method and circuit board height data editing device - Google Patents
Electronic component mounting device, mounting method and circuit board height data editing device Download PDFInfo
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- CN102238863A CN102238863A CN2011101076199A CN201110107619A CN102238863A CN 102238863 A CN102238863 A CN 102238863A CN 2011101076199 A CN2011101076199 A CN 2011101076199A CN 201110107619 A CN201110107619 A CN 201110107619A CN 102238863 A CN102238863 A CN 102238863A
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- circuit board
- electronic component
- memory unit
- data
- measuring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides an electronic component mounting device, a mounting method and a circuit board height data editing device. Height determination of the circuit board can be conducted at an appropriate determination position in the circuit board. A work manager selects pictures from a display menu of a monitor, and selects a set menu relevant to the determination position of the height level of a printing circuit board. If the printing circuit board to be set is selected from the display menu, CPU displays the printing circuit board on the monitor, figures DG of a plurality of electronic components disposed on the printing circuit board and figures MG of determination points. When seeing the picture, the work manager operates a mouse to move a cursor to the determination point figure MG1, and a menu frame will be displayed as a picture by clicking a left button due to the fact that the determination point figure MG1 overlaps the component figure DG1. By clicking a right button on a "deletion", data relevant to the determination point MG1 will be deleted from the determination position data stored in RAM.
Description
Technical field
The present invention relates to measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil electronic element installation device, electronic component mounting method and with the circuit board height measuring position data editor that locates relevant of measuring the height level of circuit board by height level's determinator.
Background technology
The electronic element installation device that adsorption mouth is installed to after element supply device takes out electronic component on the printed circuit board (PCB) is for example open patent documentation 1 grade.And, generally in minimum electronic component, sometimes when mounted because the bending of printed circuit board (PCB), can take place not install and bring back, breaking of electronic component or splashing of scolder.Therefore, utilize the height level's of printed circuit board (PCB)s such as laser displacement gauge determinator,, carry out the decline control of adsorption mouth when mounted based on its measurement result.
[patent documentation 1] (Japan) spy opens the 2006-286707 communique
[patent documentation 2] (Japan) spy opens the 2008-166472 communique
But, when measuring the height level of circuit board,, less-than-ideal situation is arranged also in this locates sometimes even if pre-determined locating of will measuring.For example, this vicious situation or in the electronic element installation device of upstream, electronic component has been installed of locating, this electronic components mounted and when in the electronic element installation device in its downstream, measuring locate too near or overlapping situation etc., can not accurately measure, less-than-ideal situation is also arranged in this locates sometimes.
Summary of the invention
Therefore, the objective of the invention is to can be in circuit board be fit to locate on carry out the elevation measurement of circuit board.
Therefore, the 1st invention is a kind of electronic element installation device, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that, be provided with in this electronic element installation device:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
Eliminate parts,, eliminate the measuring position data corresponding of storing in described the 3rd memory unit with this unwanted measuring point figure according to selection to the unwanted measuring point figure that shows on this monitor.
The 2nd invention is a kind of electronic element installation device, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that, be provided with in this electronic element installation device:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
The change parts, according to the selection of wanting to move the measuring point figure locate to showing on this monitor, change store in described the 3rd memory unit want the corresponding measuring position data of measuring point figure that move with this.
The 3rd invention is in the 1st or the 2nd invention, it is characterized in that according to each kind of described circuit board, described installation data is stored in described the 1st memory unit, and described measuring position storage is at described the 3rd memory unit.
The 4th invention is a kind of electronic component mounting method, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that
Based on measuring position data about a plurality of measuring positions of the component data of the relevant feature which electronic component is installed to the installation data of which position, the relevant size that comprises each electronic component of whole electronic components of installing on the described circuit board and the relevant height level who is used to measure described circuit board, make monitor show the element figure of described each electronic component on the installation site and on the measuring position, show the measuring point figure
Select the unwanted measuring point figure that shows on this monitor,
Eliminate the measuring position data corresponding with this unwanted measuring point figure of this selection.
The 5th invention is a kind of electronic component mounting method, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that
Based on measuring position data about a plurality of measuring positions of the component data of the relevant feature which electronic component is installed to the installation data of which position, the relevant size that comprises each electronic component of whole electronic components of installing on the described circuit board and the relevant height level who is used to measure described circuit board, make monitor show the element figure of described each electronic component on the installation site and on the measuring position, show the measuring point figure
That selects to show on this monitor wants to move the measuring point figure that locates,
Change and this of this selection are wanted the corresponding measuring position data of measuring point figure that move.
The 6th invention is a kind of circuit board height measuring position data editor, and is relevant with locating of the height level who measures circuit board by height level's determinator, it is characterized in that, is provided with in this circuit board height measuring position data editor:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
Eliminate parts,, eliminate the measuring position data corresponding of storing in described the 3rd memory unit with this unwanted measuring point figure according to selection to the unwanted measuring point figure that shows on this monitor.
The 7th invention is a kind of circuit board height measuring position data editor, and is relevant with locating of the height level who measures circuit board by height level's determinator, it is characterized in that, is provided with in this circuit board height measuring position data editor:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
The change parts, according to the selection of wanting to move the measuring point figure locate to showing on this monitor, change store in described the 3rd memory unit want the corresponding measuring position data of measuring point figure that move with this.
On the locating of the present invention being fit in circuit board, can carry out the elevation measurement of circuit board, when the installation of electronic component, can carry out controlling with the decline of the crooked corresponding adsorption mouth of circuit board.
Description of drawings
Fig. 1 is the plane graph of automatic electronic component mounting device.
Fig. 2 is the controlling party block diagram.
Fig. 3 is the figure of expression installation data.
Fig. 4 is the figure of expression element configuration data.
Fig. 5 is the figure of expression element database data.
Fig. 6 is the figure of the mensuration coordinate data of indication circuit plate ID " 001 ".
Fig. 7 is the figure of expression flow chart.
Fig. 8 is the figure of picture displayed on the expression monitor.
Label declaration
1 electronic element installation device
5 location divisions
7A, 7B installation head
17A, B, C, D adsorption mouth
18 height level's determinators
30 CPU
32 RAM
34 monitors
35 touch panel switch
39 mouses
The P printed circuit board (PCB)
Embodiment
Below based on figure, the electronic element installation device about the production line that is configured on printed circuit board (PCB) installing electronic component illustrates execution mode.Fig. 1 is the plane graph of electronic element installation device 1, and walking abreast on the board 2 of this erecting device 1 is provided with a plurality of element feeding units 3 that are used for various electronic components are offered respectively one by one its element taking-up portion (element absorption extracting position).Between 3 groups of opposed element feeding units, be provided with supply conveying appliance (conveyer) 4, location division 5 and discharge conveying device (conveyer) 6.Described supply conveying appliance 4 will be transported to described location division 5 as the printed circuit board (PCB) P of the circuit board of accepting from the upstream side device, after in location division 5, having realized on this circuit board P of positioning and fixing electronic component being installed by not shown detent mechanism, be carried to and discharge conveying device 6, be carried to downstream unit via this discharge conveying device 6.
8A, 8B are a pair of arms long on the directions X, driving by y-axis motor 9 makes helical axis 10 rotations respectively, along the guide rod (guide) 11 of pair of right and left, above the element absorption extracting position of printed circuit board (PCB) P and element feeding unit 3, move to the Y direction separately.
In each arm 8A, 8B, at its length direction, be to be provided with installation head 7A, the 7B that moves along guide rod (not shown) by X-axis motor 12 on the directions X respectively.In each installation head 7A or 7B, carried two respectively and be used to make two adsorption mouth 17A, 17B or the up and down spindle motor up and down 13 of 17C, 17D, and carried respectively and be used to make its θ spindle motor 14 around the vertical axis rotation.Therefore, each adsorption mouth of two installation head 7A, 7B can move to directions X and Y direction, can rotate around vertical axis, and can be up and down.
The 16th, the component recognition video camera is taken the electronic component of the adsorption mouth 17A, the 17B that keep utensil as element, 17C, the last adsorbed maintenance of 17D.The 18th, the laser displacement gauge equal altitudes level determination device that is provided with on described installation head 7A, 7B arrives printed circuit board (PCB) P with laser radiation, thereby measures the height level who has been carried out the printed circuit board (PCB) P of location by described location division 5 by receiving its reverberation.
Below, in the controlling party block diagram of Fig. 2, each key element of electronic element installation device 1 is by CPU (CPU) 30 unified controls, and ROM (read-only memory) 31 of the program that storage is relevant with this control and RAM (random access memory) 32 of store various kinds of data connect via bus 33.In addition, CPU30 is last has connected the monitor 34 of display-operation picture etc. and as the touch panel switch 35 of the input block that forms via interface 36 in the display frame of this monitor 34.In addition, described y-axis motor 9 grades are via drive circuit 38, interface 36 and be connected to described CPU30.In addition,, perhaps touch panel switch 35 is carried out pressing operation, can carry out various settings by using mouse 39 as input block.
In described RAM32, each kind of printed circuit board (PCB) P has been stored the relevant installation data of installation with the electronic component of an electronic element installation device 1 of the production line that constitutes printed circuit board (PCB) P, to each its erection sequence (each step number), X coordinate, Y coordinate and the angle information of the installation coordinate of each electronic component in printed circuit board (PCB) P, the config. number information of each element feeding unit 3 etc. have been stored.
In addition, except that the installation data that has only this electronic element installation device 1 to handle, as production line and parallel being provided with under the situation of many electronic element installation devices 1, the relevant installation data of the installation of all electronic components of go up installing with this printed circuit board (PCB) P, in other words, the installation data that is made of each installation data sums (with reference to Fig. 3) of parallel all each electronic element installation devices that are provided with also is stored among the described RAM32.In addition, for convenience of explanation, simplify being made as the installation data that is used to install 4 electronic components.
In addition, stored among the described RAM32 each electronic component corresponding with the element feeding unit config. number of described each element feeding unit 3 of this electronic element installation device a kind of information, be the arrangements of components data, but as production line and parallel being provided with under the situation of many electronic element installation devices 1, the configuration data of each of these many electronic element installation devices 1 (configuration data that is example with 3 electronic element installation devices shown in Fig. 4) is stored among the described RAM32.
And then, to the element ID of electronic components mounted in all electronic element installation devices each, the relevant component library data (with reference to Fig. 5) such as kind of taking in band of taking in have been stored with the length of the directions X of electronic component, Y direction, to electronic component.
In addition, because the bending of described printed circuit board (PCB) P etc. causes the height level to have nothing in common with each other according to the position among the printed circuit board (PCB) P, a plurality of height levels' the data that locate (with reference to Fig. 6 that locates of expression circuit board ID " 001 ") also each kind of printed circuit board (PCB) P have been stored among the described RAM32.In addition, corresponding with 4 electronic components simplifiedly and be made as 4 and locate for convenience of explanation, this locates and for example equally spaced sets on directions X, Y direction, has stored this data that locate.
The 37th, be connected to the recognition process unit of described CPU30 via interface 36, the identification of taking the image that obtains by described component recognition video camera 16 is handled and is carried out in this recognition process unit 37, and result is delivered to CPU30.That is, CPU30 so that it discerns processing (calculating of position offset etc.) to the image of taking by component recognition video camera 16, and obtains identification result from recognition process unit 37 to recognition process unit 37 output indications.
Below based on flowchart text shown in Figure 7 when generating installation data described later, when the type of printed circuit board (PCB) switches etc., about the height level's of printed circuit board (PCB) P the action that locates and set by above structure.At first, select picture, select the setting menu (step S01) that locates relevant with the height level of printed circuit board (PCB) P thereby job management person carries out pressing operation display menu on monitor 34 to mouse 39 or touch panel switch 35.Then, if from the printed circuit board (PCB) P that selects here to set, then as shown in Figure 8, (center of circle is the center that locates to CPU30, and circle is of a size of measuring point (radius for example is the size of 2mm) (step S02) at the element figure DG of a plurality of electronic components that show this printed circuit board (PCB) P on the monitor 34, install on printed circuit board (PCB) P and the measuring point figure MG of measuring point.
Promptly, CPU30 from RAM32 read the installation data (with reference to Fig. 3) corresponding with the printed circuit board (PCB) P that selects, with the data that locate (with reference to Fig. 6) of the height level of the relevant component library data (Fig. 4) of electronic components mounted, this printed circuit board (PCB) P on the printed circuit board (PCB) P of this selection, showing the element figure DG of a plurality of electronic components of installing on the printed circuit board (PCB) P and the measuring point figure MG (with reference to Fig. 8) of measuring point on the monitor 34.
Therefore, job management person can delete a plurality of unwanted measuring points by operation mouse 39, and calibration setup is carried out in the position of the measuring point that can proofread and correct needs.That is, beginning, job management person sees picture shown in Figure 8, judges whether to exist unwanted measuring point (step S03).Then, there is not unwanted measuring point then to transfer to step S04 if be judged as, but, and only the measuring point of necessity is repeated to be used to delete the action (step S06) of this unwanted measuring point if being judged as unwanted measuring point then selects (appointment) unwanted measuring point (step S05).
Specifically, for example the top-right measuring point figure MG1 of Fig. 8 is overlapping on element figure DG1, therefore be judged as under the situation that does not need this measuring point figure MG1, thereby job management person operates mouse 39 cursor is moved to after measuring point figure MG1 goes up, if click left button, then can show the menu box that to select " deletion " and " moving " by picture, therefore if operation mouse 39 and cursor is moved to click right button in " deletion " of this demonstration, then CPU30 controls to delete this measuring point figure MG1.Thereby, the deletion data relevant in the height level's of this printed circuit board (PCB) P that from RAM32, stores the data that locate with measuring point MG1.
At this moment, the electronic component corresponding with element figure DG1 has been installed to this printed circuit board (PCB) P in the electronic element installation device in the upstream, under the position of the electronic component of this installation and the overlapping situation that locates will in this electronic element installation device 1 in its downstream, measure the time, locating before the deletion is unsatisfactory, therefore will delete.That is, measuring point figure MG1 becomes the input operation switch portion that can delete the data of measuring point by click.
In addition, when existing under a plurality of adjacent unwanted situations about locating, also can be by the operation of described mouse 39, a plurality of the locating that the circle residence shows, this a plurality of locating of deletion simultaneously as range of choice.
Then, by this deletion, do not have unwanted measuring point then to transfer to step S04 if be judged as, then job management person judges whether to exist the measuring point that needs the correcting determination position.At this moment, for example the upper left measuring point figure MG2 of Fig. 8 and element figure DG2 are too approaching, thereby being judged as locating of this measuring point MG2 needs under the situation of correction, job management person operates mouse 39 cursor is moved to after measuring point MG2 goes up, thereby click left button and select this measuring point figure MG2 (step S07), and only the measuring point of necessity is repeated to be used to proofread and correct the action (step S08) of this measuring point that need proofread and correct.
Specifically, as previously mentioned, if select (appointment) measuring point figure MG2, then can show the menu box that to select " deletion " and " moving " by picture, therefore if job management person operates mouse 39 cursor is moved on " moving " of this demonstration and click right button, then CPU30 controls to show and can import the frame of amount of movement to each of directions X, Y direction.
Therefore, the pressing operation of " numerical key " switch portion, "+" switch portion and "-" switch portion by the touch panel switch 35 that shows simultaneously can be to each input amount of movement of directions X, Y direction.At this moment, all directions are imported to "+" direction (implication that adds, about directions X represent picture to right, about Y direction indication picture upward to), "-" direction (implication that subtracts, the direction left of representing picture about directions X, when the amount of movement downward direction about Y direction indication picture), " decision " switch portion of touch panel switch 35 are pressed operation, then control the data rewriting that locates that makes after moving and be stored among the RAM32.In addition, by the rewriting of the data that locate, the display position of measuring point figure MG2 also can change, and that can determine to move and change locates.
That is, measuring point figure MG2 becomes and can move the input operation switch portion of the data that change measuring point by clicking selection.As mentioned above, each measuring point figure forms the switch portion that can delete measuring point, and also becomes the switch portion of the position that can change measuring point.
In addition, in Fig. 8, also can cursor be moved on the measuring point figure MG2 and after selecting at operation mouse 39, moving cursor under the state that drags, thus measuring point figure MG is moved the data based shift position that locates and changing to any direction.
And, height level's determinator 18 is to printed circuit board (PCB) P with laser radiation, measure the height level's of printed circuit board (PCB) P device by receiving its reverberation, but owing between the light of light that shines and reception, have certain angle, therefore measuring point and electronic component too near and under the unmeasured situation, for example if do not separate about 2mm under the then unmeasured situation, because the radius of the measuring point figure MG among Fig. 8 is 2mm, therefore in this picture, also its amount of movement can be surmised, therefore suitable amount of movement can be set at.
At this moment, the electronic component corresponding with element figure DG2 has been installed to this printed circuit board (PCB) P in the electronic element installation device of upstream, under the position of the electronic component of this installation and the too approaching situation that locates will in this electronic element installation device 1 in its downstream, measure the time, locating before moving is unsatisfactory, therefore will move.
As mentioned above, as if the locate relevant setting of end with the height level of printed circuit board (PCB) P, the height level's of the printed circuit board (PCB) P that then can be fit to mensuration, when the installation of electronic component based on this measurement result, for carrying out decline control based on CPU30 with adsorption mouth 17A, 17B, spindle motor up and down 13 that 17C, 17D are corresponding.At this moment, can use measurement result in the corresponding measuring point about an installation elements, also can use based on the measurement result in a plurality of measuring points of correspondence, at this moment also consider the mean value of the height level in these a plurality of measuring points of application etc. about an installation elements.
If the production of this printed circuit board (PCB) P action is described, then at first accept and when being present on the supply conveying appliance 4, the printed circuit board (PCB) P on the supply conveying appliance 4 is moved to location division 5 from upstream side device (not shown) as printed circuit board (PCB) P.
At this moment, this printed circuit board (PCB) P stop stops on the alignment pin (not shown) as the stopping means of the benchmark in the circuit board carrying direction.Then, Z folder (clamp) mechanism (not shown) action can make the level of short transverse of printed circuit board (PCB) P certain, carries out the location of the above-below direction of printed circuit board (PCB) P, can fix behind the location of carrying out three-dimensional.
And then, in a plurality of grooves of supporting (back up) base (not shown), inserted the required fulcrum post of printed circuit board (PCB) P that to produce, by the rising of this support plinth, the back side butt of this fulcrum post and printed circuit board (PCB) P, this circuit board P is so that its maintenance level in the pushing supporting.
Like this, the location action of printed circuit board (PCB) P finishes, if CPU30 judges the situation of this location, then CPU30 reads locating of first height level corresponding with this printed circuit board (PCB) P that store among the RAM32, thereby control X-axis motor 12 and y-axis motor 9 move to first top that locates with height level's determinator 18.
Then, first height level in locating that height level's determinator 18 is measured the printed circuit board (PCB) P that located by described location division 5, the height level during described CPU30 locates this first stores RAM32 into.Then, similarly, CPU30 reads locating of second of storing among the RAM32 and the 3rd (owing to having deleted one) height level, thereby control X-axis motor 12 and y-axis motor 9 move to this top that locates with height level's determinator 18.
As mentioned above, the measurement result corresponding with aforesaid all (3) measuring points all is stored among the RAM32, therefore when the installation of electronic component, carried out the decline control of adsorption mouth 17A, 17B, 17C, 17D based on this measurement result by CPU30.
Thereby, be transported on the printed circuit board (PCB) P of location division 5, according to the installation data of storing among the RAM32, adsorption mouth 17A, 17B, 17C, element feeding unit 3 absorption from regulation among the 17D are taken out and are answered electronic components mounted, and by component recognition video camera 16 tops, thereby take each electronic component that absorption keeps on the described adsorption mouth, and discern processing by recognition process unit 37, on the installation coordinate of installation data, consider the component recognition result and the correction position skew based on its result, and on one side each electronic component is installed on the printed circuit board (PCB) P, but aforesaid measurement result based on the height level of the described printed circuit board (PCB) P corresponding with the installation site of described electronic component, for with adsorption mouth 17A, 17B, 17C, the spindle motor up and down 13 of 17D correspondence carries out the decline control based on CPU30.That is, reduce slippage when upwards curved, increase slippage downwards when curved on the contrary.
In addition, before the timing of measuring the height level of printed circuit board (PCB) P is made as and electronic component is installed on to the printed circuit board (PCB) P that has had good positioning, each of this printed circuit board (PCB) P that will produce is carried out, but be not limited thereto, can use various mensuration regularly, the type that for example can be accompanied by printed circuit board (PCB) P switches, and the printed circuit board (PCB) P that will produce at first after this type is switched carries out, and also can carry out by the regulation number of the printed circuit board (PCB) P that will produce or by the stipulated time of production time.
Therefore, the present invention is by the elevation measurement position of change printed circuit board (PCB) P, thereby can be made as suitable locating, when the installation of electronic component, can carry out decline control with the crooked corresponding adsorption mouth of printed circuit board (PCB), therefore can be installed to reliably on the printed circuit board (PCB) P, can prevent bringing back when not installing, breaking of electronic component or splashing of scolder.
Embodiments of the present invention as above have been described, but can realize various replacement examples for a person skilled in the art based on above-mentioned explanation, revise or distortion, the present invention comprises aforesaid various replacement example, revises or distortion in the scope that does not break away from its aim.
Claims (7)
1. electronic element installation device, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that, be provided with in this electronic element installation device:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
Eliminate parts,, eliminate the measuring position data corresponding of storing in described the 3rd memory unit with this unwanted measuring point figure according to selection to the unwanted measuring point figure that shows on this monitor.
2. electronic element installation device, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that, be provided with in this electronic element installation device:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
The change parts, according to the selection of wanting to move the measuring point figure locate to showing on this monitor, change store in described the 3rd memory unit want the corresponding measuring position data of measuring point figure that move with this.
3. electronic element installation device as claimed in claim 1 or 2 is characterized in that,
According to each kind of described circuit board, described installation data is stored in described the 1st memory unit, and described measuring position storage is at described the 3rd memory unit.
4. electronic component mounting method, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that
Based on measuring position data about a plurality of measuring positions of the component data of the relevant feature which electronic component is installed to the installation data of which position, the relevant size that comprises each electronic component of whole electronic components of installing on the described circuit board and the relevant height level who is used to measure described circuit board, make monitor show the element figure of described each electronic component on the installation site and on the measuring position, show the measuring point figure
Select the unwanted measuring point figure that shows on this monitor,
Eliminate the measuring position data corresponding with this unwanted measuring point figure of this selection.
5. electronic component mounting method, measure the height level of circuit board by height level's determinator, and based on this measurement result, when element keeps utensil to be installed on the described circuit board after element supply device takes out electronic component, carry out the decline control that described element keeps utensil, it is characterized in that
Based on measuring position data about a plurality of measuring positions of the component data of the relevant feature which electronic component is installed to the installation data of which position, the relevant size that comprises each electronic component of whole electronic components of installing on the described circuit board and the relevant height level who is used to measure described circuit board, make monitor show the element figure of described each electronic component on the installation site and on the measuring position, show the measuring point figure
That selects to show on this monitor wants to move the measuring point figure that locates,
Change and this of this selection are wanted the corresponding measuring position data of measuring point figure that move.
6. a circuit board height measuring position data editor is relevant with locating of the height level who measures circuit board by height level's determinator, it is characterized in that, is provided with in this circuit board height measuring position data editor:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
Eliminate parts,, eliminate the measuring position data corresponding of storing in described the 3rd memory unit with this unwanted measuring point figure according to selection to the unwanted measuring point figure that shows on this monitor.
7. a circuit board height measuring position data editor is relevant with locating of the height level who measures circuit board by height level's determinator, it is characterized in that, is provided with in this circuit board height measuring position data editor:
The 1st memory unit, about whole electronic components of installing on the described circuit board, the relevant installation data which electronic component is installed to which position of storage;
The 2nd memory unit, to each kind of described electronic component, storage is relevant to comprise the component data of feature of the size of this electronic component;
The 3rd memory unit, storage is relevant to be used to measure the height level's of described circuit board the measuring position data of a plurality of measuring positions;
Monitor, based on the described measuring position data of storing in described component data of storing in the described installation data of storing in described the 1st memory unit, described the 2nd memory unit and described the 3rd memory unit, showing the element figure of described each electronic component on the installation site and on the measuring position, showing the measuring point figure; And
The change parts, according to the selection of wanting to move the measuring point figure locate to showing on this monitor, change store in described the 3rd memory unit want the corresponding measuring position data of measuring point figure that move with this.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010103225A JP5409502B2 (en) | 2010-04-28 | 2010-04-28 | Electronic component mounting apparatus, electronic component mounting method, and board height data editing apparatus |
| JP103225/10 | 2010-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102238863A true CN102238863A (en) | 2011-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101076199A Pending CN102238863A (en) | 2010-04-28 | 2011-04-28 | Electronic component mounting device, mounting method and circuit board height data editing device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5409502B2 (en) |
| KR (1) | KR101335207B1 (en) |
| CN (1) | CN102238863A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108372081A (en) * | 2017-01-31 | 2018-08-07 | 阿尔法设计株式会社 | Apparatus for coating, coating method, program |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3634099B1 (en) * | 2017-05-24 | 2023-03-15 | Fuji Corporation | Measurement position determination device |
| WO2021181556A1 (en) * | 2020-03-11 | 2021-09-16 | 株式会社Ｆｕｊｉ | Substrate height measuring device and substrate height measuring method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1366449A (en) * | 2000-12-04 | 2002-08-28 | 松下电器产业株式会社 | Method and equipment of inspecting installation quality of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3914299B2 (en) * | 1997-07-18 | 2007-05-16 | 松下電器産業株式会社 | Arrangement method of substrate support pins |
| JP4959967B2 (en) * | 2005-09-30 | 2012-06-27 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
| US7809461B2 (en) * | 2005-11-29 | 2010-10-05 | Panasonic Corporation | Working apparatus and working method for circuit board |
| JP2008166472A (en) * | 2006-12-28 | 2008-07-17 | Hitachi High-Tech Instruments Co Ltd | Electronic component mounting apparatus |
| JP4887205B2 (en) * | 2007-04-26 | 2012-02-29 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting method and electronic component mounting apparatus |
-
2010
- 2010-04-28 JP JP2010103225A patent/JP5409502B2/en active Active
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2011
- 2011-04-27 KR KR1020110039487A patent/KR101335207B1/en active IP Right Grant
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1366449A (en) * | 2000-12-04 | 2002-08-28 | 松下电器产业株式会社 | Method and equipment of inspecting installation quality of circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108372081A (en) * | 2017-01-31 | 2018-08-07 | 阿尔法设计株式会社 | Apparatus for coating, coating method, program |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110120240A (en) | 2011-11-03 |
| KR101335207B1 (en) | 2013-11-29 |
| JP2011233738A (en) | 2011-11-17 |
| JP5409502B2 (en) | 2014-02-05 |
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Application publication date: 20111109 |