CN102236451A - Touch panel and manufacturing method thereof - Google Patents
Touch panel and manufacturing method thereof Download PDFInfo
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- CN102236451A CN102236451A CN2010101701301A CN201010170130A CN102236451A CN 102236451 A CN102236451 A CN 102236451A CN 2010101701301 A CN2010101701301 A CN 2010101701301A CN 201010170130 A CN201010170130 A CN 201010170130A CN 102236451 A CN102236451 A CN 102236451A
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- control circuit
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- contact panel
- panel
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Abstract
The invention relates to a touch panel and a manufacturing method thereof. The touch panel disclosed by the invention comprises a panel and a conductive frame, wherein a touch circuit is formed on the first side of the panel; and the conductive frame is formed on the circumference of the first side along the touch circuit. The invention also discloses a manufacturing method of the touch panel. In the invention, the touch circuit of the touch panel is integrated on the panel, so that the number of substrates to be attached is reduced, therefore, the problems caused by attaching the substrates can be reduced, and the overall thickness of the touch panel can be effectively reduced.
Description
Technical field
The present invention relates to a kind of contact panel, relate in particular to a kind of capacitance type touch-control panel.
Background technology
Figure 1A shows conventional condenser contact panel 100, outside liquid crystal, colored filter, touch-control circuit need have at least one extra glass substrate 101, has indium tin oxide 102,103 as sensing cell and driver element in described glass substrate both sides, its at the middle and upper levels indium tin oxide 102 be arranged perpendicular with lower floor's indium tin oxide 103, and 104 configurations of glass substrate 101 and panel UV film optical cement 105 utilizes vacuum mode that glass substrate 101 and panel 104 are fitted again.Figure 1B is the sectional view that shows this conventional condenser contact panel.
Because the compact demand of electronic installation, many hand-held electronic devices carry for convenience, more require integral thickness more frivolous.And in traditional contact panel, the substrate of panel and touch-control circuit is independent separately, has increased the integral thickness of electronic installation, therefore, is badly in need of a kind of structure and technology that can the integrated package substrate.
In addition, owing to may have contaminant particles on each substrate, the bubble that when substrate attaching, may cause, and the alignment issues of substrate attaching, all will influence the qualification rate of electronic installation manufacturing process, and contact area is big more, the degree of difficulty of applying is high more, therefore, be badly in need of a kind of structure and technology that can reduce substrate demand in the contact panel.
Summary of the invention
For effectively reducing the substrate quantity of electronic installation, the present invention is integrated into the touch-control circuit of contact panel on the panel, needs the substrate quantity of applying with minimizing, thereby can reduce the problem that substrate attaching causes, and effectively reduce the contact panel integral thickness.
One embodiment of the invention disclose a kind of contact panel, comprise panel, are formed with touch-control circuit on first side of described panel; And conductive bezels, along described touch-control circuit be formed at described first side around on.
Another embodiment of the present invention discloses a kind of method that forms contact panel, comprises with laser beam marking to be pre-formed indium tin oxide patterning on first side of panel, to form touch-control circuit; And first conductive material is printed onto along described touch-control circuit described panel described first side around on, to form conductive bezels.
Description of drawings
Figure 1A shows the conventional condenser contact panel;
Figure 1B shows the sectional view of conventional condenser contact panel;
Fig. 2 shows contact panel according to an embodiment of the invention;
Fig. 3 shows contact panel according to another embodiment of the present invention;
Fig. 4 shows contact panel according to another embodiment of the present invention;
Fig. 5 shows contact panel and the synoptic diagram that couples of flexible circuit according to another embodiment of the present invention;
Fig. 6 shows contact panel according to another embodiment of the present invention;
Fig. 7 A shows the method for contact panel formed according to the present invention to Fig. 7 C;
Fig. 8 A shows the method for the touch-control circuit part of contact panel formed according to the present invention to Fig. 8 F;
Fig. 9 A shows the conductive bezels of contact panel formed according to the present invention and the method for picture frame part to Fig. 9 E;
Figure 10 shows the contact panel of another embodiment of the present invention;
Figure 11 A shows the method for contact panel formed according to the present invention to Figure 11 C; And
Figure 12 A shows contact panel according to another embodiment of the present invention to Figure 12 C.
Embodiment
Fig. 2 shows disclosed a kind of contact panel 200, has touch-control circuit 201, and it is formed at first side of panel 203.And conductive bezels 202 along touch-control circuit 201 be formed at first side around on.In general application, first side of described panel 203 is towards the inside of electronic installation, promptly towards liquid crystal and colored filter, or other display module.
In a preferred embodiment, panel 203 is formed by glass, plastics (for example PET) or other optical clear substrate, has the function of optical property and protection touch-control circuit.
In another preferred embodiment, the conductive bezels 202 of contact panel 200 is printed on first side of panel 203 with opaque electrically conductive ink, opaque electrically conductive ink may include conductive carbon, conductive carbide or elargol etc., utilize the mode of wire mark or spray printing to be formed on first side of panel 203, and be formed with the conducting wire in wherein, thereby the transmission signal that touch-control circuit produced.
In another preferred embodiment, the touch-control circuit 201 of contact panel 200 includes sensing cell, driver element and (between sensing cell, between driver element, between sensing cell and driver element and peripheral control unit) circuit of interconnecting therebetween.In another embodiment, sensing cell, driver element and the formation of the circuit of interconnection therebetween are to utilize laser beam marking mode patterning to be pre-formed indium tin oxide (ITO) on first side on the panel 203.
Fig. 3 shows the embodiment of another contact panel 300, is formed with touch-control circuit 301 and conductive bezels 302 in first side of its panel 303, and is formed with grooving 304 at the edge of its second side.Grooving 304 can be designed to the signal of touch-control circuit 301 is connected to controller outside.
Fig. 4 shows the embodiment of another contact panel 400, and it has controller 407 outside touch-control circuit 401.In a preferred embodiment, contact panel 400 has the flexible circuit 406 that is disposed between touch-control circuit 401 and the controller 407, with transmission of control signals and touching signals between touch-control circuit 401 and controller 407.
Fig. 5 shows and forms porosely 508 in the picture frame 502 of contact panel 500, and by the spray printing mode conductive material is printed in the hole 508, to form conductive spacer 509.And conductive spacer 509 also can be commodity sign or other design for aesthetic, and can couple flexible circuit 506 by conductive spacer 509, and the touch-control circuit 501 of contact panel 500 is coupled by flexible circuit 506 and peripheral control unit.
Fig. 6 shows disclosed another kind of contact panel 600, has touch-control circuit 601, and it is formed at first side of panel 603, and in addition, conductive bezels 602 and picture frame 604 also are formed at first side of panel 603, and picture frame 604 is enclosed in outside the conductive bezels 602.
In a preferred embodiment, the picture frame 604 of contact panel 600 forms by wire mark or spray printing with insulating material, described insulating material is black or opaque ink, and conductive bezels 602 is formed by wire mark or spray printing with opaque electrically conductive ink, touch-control circuit 601 comprises sensing cell, driver element and interconnection circuit therebetween, and it utilizes the laser beam marking mode to be pre-formed indium tin oxide on panel 603 first sides with patterning.First side of above-mentioned panel 603 is towards the inside of electronic installation, promptly towards liquid crystal and colored filter, or other display module.
Fig. 7 shows that the present invention forms the method for contact panel, as Fig. 7 A to Fig. 7 B, pass through laser beam marking, with the indium tin oxide patterning that is pre-formed on contact panel 700 first sides, to form touch-control circuit 701, Fig. 7 C show with conductive material be printed onto along described touch-control circuit 701 contact panel 700 first side around on, to form conductive bezels 702.
Fig. 8 A shows that to Fig. 8 F the present invention forms other embodiment of the touch-control circuit part of contact panel.Fig. 8 A shows provides substrate, it can be glass, plastics or other transparent optical substrate, Fig. 8 B is presented at and forms one deck indium tin oxide on the substrate, and Fig. 8 C shows that wherein touch-control circuit comprises sensing cell, driver element and interconnection circuit therebetween by laser beam marking formation touch-control circuit 801.In Fig. 8 D, further on established touch-control circuit 801, form optical coating, described optical coating can be in modes such as roll extrusion or spin coateds insulating material to be coated on the touch-control circuit 801.In a preferred embodiment, optical coating can be polymethylmethacrylate (PMMA) or photo anti-corrosion agent material, makes optical coating become insulation course 8011 between touch-control circuit,
Fig. 8 E shows and further to utilize laser beam marking with patterned insulation layer 8011, and indium tin oxide that also can patterning lower floor simultaneously is to form through hole.8F shows the spray printing mode of utilizing, with the electrically conductive ink spray printing in through hole, to form the interconnection circuit 8012 in the touch-control circuit, the electrically conductive ink that wherein forms interconnection circuit 8012 can comprise conducting polymer or other contains nano metal particles, for example poly-(dioctyl-two thiophenols) (PEDOT), nm of gold, Nano Silver or the like.
In an embodiment, be pre-formed the about 20nm of indium tin oxide 801 thickness on substrate among above-mentioned Fig. 8 F, the thickness of insulation course 8011 is on 1.5 μ m, the PEDOT thickness that forms interconnection circuit 8012 is about 600nm, wherein the size in the zone of interconnection circuit that PEDOT forms is about long 800 μ m and wide 300 μ m, in the zone of interconnection circuit in the size of bonding pad be about and grow 200 μ m and wide 10 μ m.In addition, can apply the insulation course that a layer thickness is about 1.5 μ m again in the superiors of touch-control circuit, can be optical coating, with the protection touch-control circuit.
Fig. 9 A shows that to Fig. 9 E the present invention forms the conductive bezels of contact panel and other embodiment of picture frame part.Fig. 9 A shows provides transparent substrates, has been pre-formed indium tin oxide 901 on a side of substrate, by laser beam marking, and the described indium tin oxide layer of patterning.Fig. 9 B shows, forms picture frame 904 on the indium tin oxide 901 of patterning.In a preferred embodiment, picture frame 904 can be printed on opaque printing ink on the indium tin oxide 901 of patterning by the wire mark mode, and is formed on the substrate outer rim.In another preferred embodiment, the opaque ink of formation picture frame 904 is a kind of insulating material.
Fig. 9 C is presented at and forms conductive bezels 902 on the indium tin oxide 901 of patterning in the scope of picture frame 904, and makes picture frame 904 be disposed at the periphery of conductive bezels 902.In a preferred embodiment, the printing ink of formation conductive bezels 902 can comprise conductive carbon.
Fig. 9 D further demonstration is printed on electrically conductive ink on conductive bezels 902 and the picture frame 904 by the spray printing mode, to form metal lead wire 905, can transmit the signal of touch-control circuit in the contact panel.In a preferred embodiment, the material of metal lead wire comprises silver.
Fig. 9 E demonstration further forms insulating material and covers metal lead wire, and with the metal lead wire of protection transmission signals, and described insulating material is identical with the insulating material that forms picture frame 904.
In an embodiment, the area size of conduction picture frame is about long 2300 μ m and wide 300 μ m; The width of metal lead wire is about 70 μ m, and distance is about 130 μ m between between metal lead wire.
Figure 10 shows the preferred embodiments of the present invention, utilizes disclosed method to form contact panel 1000, and it comprises touch-control circuit 1001, conductive bezels 1002, picture frame 1004 and metal lead wire 1005.Wherein form method and Fig. 9 A roughly the same, do not give unnecessary details in addition to Fig. 9 E.
Figure 11 A shows further that to Figure 11 C the present invention forms other embodiment of contact panel.Figure 11 A shows patterned metal is at the preformed indium tin oxide of first side of substrate, to form touch-control circuit 1101, in the wire mark mode opaque insulating material is printed on edges of substrate in touch-control circuit 1101 peripheries, form picture frame 1104, and in picture frame 1104 scopes, form conductive bezels 1102.
Another preferred embodiment of the present invention is printed on conductive material on conductive bezels 1102 and the picture frame 1104, to form metal lead wire 1105, can transmit the signal of touch-control circuit in the contact panel.In a preferred embodiment, the material of metal lead wire comprises silver.
Another embodiment of the present invention is printed peelable glue in the touch-control circuit zone, be formed on touch-control circuit 1101 with insulating material again, with the insulation course 1106 in the formation touch-control circuit 1101, and covers metal lead wire 1105, with the protection metal lead wire.In a preferred embodiment, described insulating material can be the optical coating by PVD evaporation monox or printing.Show as Figure 11 B, further, peelable glue is removed, with patterned insulation layer 1106.
Figure 11 C shows another embodiment of the present invention, further print peelable glue on the insulation course in touch-control circuit 1,101 1106, in the evaporation mode indium tin oxide is formed on the insulation course 1106, removes peelable glue again, make the indium tin oxide of evaporation form interconnection circuit 1107 in the touch-control circuit.
In an embodiment, contact panel as shown in figure 11, wherein preformed indium tin oxide thickness is about 20nm on substrate, and the thickness of insulation course 1106 is about 1.5 μ m, and the indium tin oxide thickness that forms the interconnection circuit 1107 in the touch-control circuit is about 40nm; The width of metal lead wire is about 70 μ m, and the spacing between metal lead wire is about 130 μ m; The area size of conduction picture frame is about long 2300 μ m and wide 300 μ m, and this regional size can be littler; The size in the zone of indium tin oxide interconnection circuit is about long 800 μ m and wide 300 μ m, in the zone in the size of bonding pad be about and grow 200 μ m and wide 10 μ m.In addition, can apply the insulation course that a layer thickness is about 1.5 μ m again in the superiors of touch-control circuit, can be optical coating, with the protection touch-control circuit.
The another preferred embodiment of the present invention is to form a kind of simple contact panel, shown in Figure 12 A, be pre-formed the substrate of indium tin oxide by laser beam marking, depict several sensing regions 1201, and at the sensing region 1201 peripheral conductive bezels 1202 that form, Figure 12 A is presented at the simple contact panel back side can pass through flexible circuit 1203 external contact panel controller outside.Figure 12 C shows, this simple contact panel can show the signal of a plurality of different position of touch, is example with the contact panel of Figure 12 A and 12C, is divided into the contact panel of 4 sensing regions, can handle the nearly signal of 9 position of touch 1205.
Because disclosed contact panel directly has been formed at touch-control circuit the below of panel, therefore do not need extra substrate.Except the number of minimizing substrate, and then reduce outside the thickness of contact panel, more can simplify assembling flow path and cost, and promote qualification rate.
Though technology contents of the present invention and feature are as mentioned above, yet the those skilled in the art still can carry out many variations and modification under the situation that does not deviate from teaching of the present invention and disclosure.Therefore, scope of the present invention is not to be defined in the embodiment that has disclosed, does not deviate from other variation of the present invention and revises and comprise, its scope for containing as appended claims.
Claims (16)
1. contact panel, it comprises:
Panel is formed with touch-control circuit on first side of described panel; And
Conductive bezels, along described touch-control circuit be formed at described first side around on.
2. contact panel according to claim 1, it further comprises grooving, is formed at second side with respect to described first side, is transferred to peripheral control unit in order to the signal that described touch-control circuit is produced.
3. contact panel according to claim 2, it further comprises picture frame, is disposed in the described grooving, and wherein said picture frame is printed with opaque insulating material.
4. contact panel according to claim 1, wherein said conductive bezels is printed on described first side of described substrate with opaque electrically conductive ink, and is formed with the conducting wire in wherein, thereby transmits the signal that described touch-control circuit produces.
5. contact panel according to claim 1, wherein said touch-control circuit comprise sensing cell, driver element and interconnection circuit therebetween.
6. contact panel according to claim 5, the formation of wherein said sensing cell, described driver element and interconnection circuit therebetween are formed at the indium tin oxide on described first side of described substrate by laser beam marking.
7. contact panel according to claim 1, wherein said panel is formed by following at least institutes: glass, plastics, optical clear substrate.
8. contact panel according to claim 1, it further comprises flexible circuit and controller, and wherein said controller and described touch-control circuit are by described flexible circuit coupling.
9. contact panel according to claim 3, it further comprises metal lead wire, is formed on the described picture frame, in order to transmit the signal that described touch-control circuit produces.
10. contact panel according to claim 1, it further comprises organic conductive layers, to form the interconnection circuit in the described touch-control circuit.
11. a method that forms contact panel, it comprises:
To be pre-formed indium tin oxide patterning on first side of panel with laser beam marking, to form touch-control circuit; And
First conductive material is printed onto along described touch-control circuit described panel described first side around on, to form conductive bezels.
12. comprising, method according to claim 11, the step that wherein forms described touch-control circuit form sensing cell, driver element and interconnection circuit therebetween.
13. method according to claim 11, it further at the second side periphery formation grooving of described panel with respect to described first side, is transferred to peripheral control unit in order to the signal that described touch-control circuit is produced.
14. method according to claim 13, it further forms picture frame in described grooving.
15. method according to claim 14, it further forms metal lead wire on described conductive bezels and described picture frame, in order to transmit the signal that described touch-control circuit produces.
16. method according to claim 11, it further forms interconnection circuit by organic conductive material in described touch-control circuit.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010170130.1A CN102236451B (en) | 2010-04-30 | 2010-04-30 | Touch panel and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010170130.1A CN102236451B (en) | 2010-04-30 | 2010-04-30 | Touch panel and manufacturing method thereof |
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| CN102236451A true CN102236451A (en) | 2011-11-09 |
| CN102236451B CN102236451B (en) | 2015-04-29 |
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| CN201010170130.1A Active CN102236451B (en) | 2010-04-30 | 2010-04-30 | Touch panel and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707849A (en) * | 2012-02-01 | 2012-10-03 | 南京点面光电有限公司 | Manufacturing method for capacitive type touch screen |
| CN102750059A (en) * | 2012-05-28 | 2012-10-24 | 杭州安费诺飞凤通信部品有限公司 | Capacitive touch screen and manufacture method thereof |
| CN103293750A (en) * | 2012-12-14 | 2013-09-11 | 上海天马微电子有限公司 | Embedded touch screen colored film substrate and manufacturing method thereof |
| CN104375704A (en) * | 2014-11-13 | 2015-02-25 | 蓝思科技（长沙）有限公司 | UV film sensor, manufacturing method of UV film sensor and touch control screen |
| CN104639687A (en) * | 2015-01-30 | 2015-05-20 | 深圳市中兴移动通信有限公司 | Mobile terminal and display device thereof |
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| CN101089803A (en) * | 2006-06-14 | 2007-12-19 | 阿尔卑斯电气株式会社 | Input device |
| CN101308430A (en) * | 2008-07-11 | 2008-11-19 | 深圳市德普特光电显示技术有限公司 | Electric resistance type touch screen and method of manufacture |
| CN101553776A (en) * | 2007-02-08 | 2009-10-07 | 夏普株式会社 | Touch panel apparatus and method for manufacturing the same |
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2010
- 2010-04-30 CN CN201010170130.1A patent/CN102236451B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101089803A (en) * | 2006-06-14 | 2007-12-19 | 阿尔卑斯电气株式会社 | Input device |
| CN101553776A (en) * | 2007-02-08 | 2009-10-07 | 夏普株式会社 | Touch panel apparatus and method for manufacturing the same |
| CN101308430A (en) * | 2008-07-11 | 2008-11-19 | 深圳市德普特光电显示技术有限公司 | Electric resistance type touch screen and method of manufacture |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707849A (en) * | 2012-02-01 | 2012-10-03 | 南京点面光电有限公司 | Manufacturing method for capacitive type touch screen |
| CN102750059A (en) * | 2012-05-28 | 2012-10-24 | 杭州安费诺飞凤通信部品有限公司 | Capacitive touch screen and manufacture method thereof |
| CN103293750A (en) * | 2012-12-14 | 2013-09-11 | 上海天马微电子有限公司 | Embedded touch screen colored film substrate and manufacturing method thereof |
| CN103293750B (en) * | 2012-12-14 | 2016-05-11 | 上海天马微电子有限公司 | A kind of embedded touch-screen color membrane substrates and manufacture method thereof |
| CN104375704A (en) * | 2014-11-13 | 2015-02-25 | 蓝思科技（长沙）有限公司 | UV film sensor, manufacturing method of UV film sensor and touch control screen |
| CN104639687A (en) * | 2015-01-30 | 2015-05-20 | 深圳市中兴移动通信有限公司 | Mobile terminal and display device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102236451B (en) | 2015-04-29 |
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