CN102236451B - Touch panel and manufacturing method thereof - Google Patents
Touch panel and manufacturing method thereof Download PDFInfo
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- CN102236451B CN102236451B CN201010170130.1A CN201010170130A CN102236451B CN 102236451 B CN102236451 B CN 102236451B CN 201010170130 A CN201010170130 A CN 201010170130A CN 102236451 B CN102236451 B CN 102236451B
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Abstract
The invention relates to a touch panel and a manufacturing method thereof. The touch panel disclosed by the invention comprises a panel and a conductive frame, wherein a touch circuit is formed on the first side of the panel; and the conductive frame is formed on the circumference of the first side along the touch circuit. The invention also discloses a manufacturing method of the touch panel. In the invention, the touch circuit of the touch panel is integrated on the panel, so that the number of substrates to be attached is reduced, therefore, the problems caused by attaching the substrates can be reduced, and the overall thickness of the touch panel can be effectively reduced.
Description
Technical field
The present invention relates to a kind of contact panel, particularly relate to a kind of capacitance type touch-control panel.
Background technology
Figure 1A shows conventional condenser contact panel 100, outside liquid crystal, colored filter, touch-control circuit need have at least one extra glass substrate 101, there is in described glass substrate both sides the indium tin oxide 102,103 as sensing cell and driver element, indium tin oxide 102 and lower floor's indium tin oxide 103 are arranged perpendicular at the middle and upper levels for they, and between glass substrate 101 and panel 104, configuring UV film optical cement 105, glass substrate 101 and panel 104 are fitted by recycling vacuum mode.Figure 1B is the sectional view of this conventional condenser contact panel of display.
Due to the demand that electronic installation is compact, many hand-held electronic devices conveniently carry, and more require that integral thickness is more frivolous.And in traditional contact panel, the substrate of panel and touch-control circuit is independent separately, add the integral thickness of electronic installation, therefore, be badly in need of a kind of can the structure of integrated package substrate and technique.
In addition, due to may contaminant particles be there is in each substrate, the bubble that may cause when substrate attaching, and the alignment issues of substrate attaching, all will affect the qualification rate of electronic installation manufacturing process, and contact area is larger, the degree of difficulty of laminating is higher, therefore, a kind of structure and the technique that can reduce substrate demand in contact panel is badly in need of.
Summary of the invention
For effectively reducing the substrate quantity of electronic installation, the touch-control circuit of contact panel is integrated on panel by the present invention, to reduce the substrate quantity needing laminating, thus can reduce the problem that substrate attaching causes, and effectively reduces contact panel integral thickness.
One embodiment of the invention disclose a kind of contact panel, comprise panel, and the first side of described panel is formed with touch-control circuit; And conductive bezels, be formed at along described touch-control circuit in the surrounding of described first side.
Another embodiment of the present invention discloses a kind of method forming contact panel, comprises and will be previously formed in the indium tin oxide patterning on the first side of panel, to form touch-control circuit with laser beam marking; And the first conductive material is printed onto in the surrounding of described first side of described panel, to form conductive bezels along described touch-control circuit.
Accompanying drawing explanation
Figure 1A shows conventional condenser contact panel;
Figure 1B shows the sectional view of conventional condenser contact panel;
Fig. 2 shows contact panel according to an embodiment of the invention;
Fig. 3 display contact panel according to another embodiment of the present invention;
Fig. 4 display contact panel according to another embodiment of the present invention;
The schematic diagram that Fig. 5 display contact panel according to another embodiment of the present invention and flexible circuit couple;
Fig. 6 display contact panel according to another embodiment of the present invention;
Fig. 7 A to Fig. 7 C shows the method for contact panel formed according to the present invention;
Fig. 8 A to Fig. 8 F shows the method for the touch-control circuit part of contact panel formed according to the present invention;
Fig. 9 A to Fig. 9 E shows the conductive bezels of contact panel formed according to the present invention and the method for picture frame part;
Figure 10 shows the contact panel of another embodiment of the present invention;
Figure 11 A to Figure 11 C shows the method for contact panel formed according to the present invention; And
Figure 12 A to Figure 12 C shows contact panel according to another embodiment of the present invention.
Embodiment
Fig. 2 shows disclosed a kind of contact panel 200, has touch-control circuit 201, and it is formed at the first side of panel 203.And conductive bezels 202 is formed in the surrounding of the first side along touch-control circuit 201.In general application, the first side of described panel 203 towards the inside of electronic installation, namely towards liquid crystal and colored filter, or other display module.
In a preferred embodiment, panel 203 is formed by glass, plastics (such as PET) or other optical clear substrate, has the function of optical property and protection touch-control circuit.
In another preferred embodiment, the conductive bezels 202 of contact panel 200 is printed on the first side of panel 203 with opaque electrically conductive ink, opaque electrically conductive ink may include conductive carbon, conductive carbide or elargol etc., the mode of wire mark or spray printing is utilized to be formed on the first side of panel 203, and be formed with conducting wire in wherein, thus the signal that transmission touch-control circuit produces.
In another preferred embodiment, the touch-control circuit 201 of contact panel 200 includes sensing cell, driver element and (between sensing cell, between driver element, between sensing cell and driver element and peripheral control unit) circuit of interconnecting therebetween.In another embodiment, sensing cell, driver element and the formation of circuit that interconnects therebetween utilize laser beam marking mode patterning to be previously formed in indium tin oxide (ITO) on panel 203 on first side.
Fig. 3 shows the embodiment of another contact panel 300, is formed with touch-control circuit 301 and conductive bezels 302, and is formed with grooving 304 at the edge of its second side in the first side of its panel 303.Grooving 304 can be designed to the signal of touch-control circuit 301 is connected to outside controller, and this contact panel comprises picture frame further, and be configured in described grooving, wherein said picture frame is printed with opaque insulating material.In addition, correspondingly, the method forming this contact panel is included in described grooving and forms picture frame.
Fig. 4 shows the embodiment of another contact panel 400, and it has controller 407 outside touch-control circuit 401.In a preferred embodiment, contact panel 400 has the flexible circuit 406 be configured between touch-control circuit 401 and controller 407, with transmission of control signals and touching signals between touch-control circuit 401 and controller 407.
Fig. 5 shows in the picture frame 502 of contact panel 500 and forms porose 508, and is printed in hole 508 by spray printing mode by conductive material, to form conductive spacer 509.And conductive spacer 509 also can be commodity sign or other design for aesthetic, and flexible circuit 506 can be coupled by conductive spacer 509, the touch-control circuit 501 of contact panel 500 can be made to be coupled by flexible circuit 506 and peripheral control unit.
Fig. 6 shows disclosed another kind of contact panel 600, has touch-control circuit 601, and it is formed at the first side of panel 603, and in addition, conductive bezels 602 and picture frame 604 are also formed at the first side of panel 603, and picture frame 604 is enclosed in outside conductive bezels 602.
In a preferred embodiment, the picture frame 604 of contact panel 600 is formed by wire mark or spray printing with insulating material, described insulating material is black or opaque ink, and conductive bezels 602 formed by wire mark or spray printing with opaque electrically conductive ink, touch-control circuit 601 comprises sensing cell, driver element and interconnection circuit therebetween, and it utilizes laser beam marking mode to be previously formed in the indium tin oxide on panel 603 first side with patterning.First side of above-mentioned panel 603 towards the inside of electronic installation, namely towards liquid crystal and colored filter, or other display module.
Fig. 7 shows the method that the present invention forms contact panel, as Fig. 7 A to Fig. 7 B, pass through laser beam marking, indium tin oxide patterning on contact panel 700 first side will be previously formed in, to form touch-control circuit 701, conductive material is printed onto in the surrounding of the first side of contact panel 700 along described touch-control circuit 701, to form conductive bezels 702 by Fig. 7 C display.
Fig. 8 A to Fig. 8 F shows other embodiment that the present invention forms the touch-control circuit part of contact panel.Fig. 8 A display provides substrate, it can be glass, plastics or other transparent optical substrate, Fig. 8 B is presented on substrate and forms one deck indium tin oxide, and Fig. 8 C shows by laser beam marking formation touch-control circuit 801, and wherein touch-control circuit comprises sensing cell, driver element and interconnection circuit therebetween.In Fig. 8 D, form optical coating further on established touch-control circuit 801, described optical coating can be coated on touch-control circuit 801 by insulating material in the mode such as roll extrusion or spin coated.In a preferred embodiment, optical coating can be polymethylmethacrylate (PMMA) or photo anti-corrosion agent material, makes optical coating become insulation course 8011 between touch-control circuit,
Fig. 8 E display utilizes laser beam marking with patterned insulation layer 8011 further, simultaneously also can the indium tin oxide of patterning lower floor, to form through hole.8F display utilizes spray printing mode, by electrically conductive ink spray printing in through hole, to form the interconnection circuit 8012 in touch-control circuit, wherein form the electrically conductive ink of interconnection circuit 8012 and can comprise conducting polymer or other contains nano metal particles, such as poly-(dioctyl-bis-thiophenol) (PEDOT), nm of gold, Nano Silver etc.
In an embodiment, indium tin oxide 801 thickness be previously formed in above-mentioned Fig. 8 F on substrate is about 20nm, the thickness of insulation course 8011 is on 1.5 μm, the PEDOT thickness forming interconnection circuit 8012 is about 600nm, wherein PEDOT form the region of interconnection circuit size be about long 800 μm and wide 300 μm, be about long 200 μm and wide 10 μm in the size of the Zhong Nei bonding pad, region of interconnection circuit.In addition, can apply in the superiors of touch-control circuit the insulation course that a layer thickness is about 1.5 μm again, can be optical coating, to protect touch-control circuit.
Fig. 9 A to Fig. 9 E shows the present invention and forms the conductive bezels of contact panel and other embodiment of picture frame part.Fig. 9 A display provides transparent substrates, and the side of substrate is pre-formed with indium tin oxide 901, by laser beam marking, and indium tin oxide layer described in patterning.Fig. 9 B shows, and the indium tin oxide 901 of patterning forms picture frame 904.In a preferred embodiment, opaque ink can be printed on the indium tin oxide 901 of patterning by wire mark mode by picture frame 904, and is formed in substrate outer rim.In another preferred embodiment, the opaque ink forming picture frame 904 is a kind of insulating material.
The indium tin oxide 901 that Fig. 9 C is presented at patterning forms conductive bezels 902 in the scope of picture frame 904, and makes picture frame 904 be configured at the periphery of conductive bezels 902.In a preferred embodiment, the ink forming conductive bezels 902 can comprise conductive carbon.
Fig. 9 D shows further and is printed on conductive bezels 902 and picture frame 904 by spray printing mode by electrically conductive ink, to form metal lead wire 905, can transmit the signal of touch-control circuit in contact panel.In a preferred embodiment, the material of metal lead wire comprises silver.
Insulating material is formed covering metal lead-in wire by Fig. 9 E display further, and to protect the metal lead wire of signal transmission, and described insulating material is identical with the insulating material forming picture frame 904.
In an embodiment, the area size of picture frame of conducting electricity is about long 2300 μm and wide 300 μm; The width of metal lead wire is about 70 μm, and the spacing between metal lead wire is about 130 μm.
Figure 10 shows the preferred embodiments of the present invention, and utilize disclosed method to form contact panel 1000, it comprises touch-control circuit 1001, conductive bezels 1002, picture frame 1004 and metal lead wire 1005.Wherein formation method and Fig. 9 A to Fig. 9 E roughly the same, do not repeat in addition.
Figure 11 A to Figure 11 C shows other embodiment that the present invention forms contact panel further.Figure 11 A shows patterned metal is at the first preformed indium tin oxide in side of substrate, to form touch-control circuit 1101, in wire mark mode, opaque insulating material is printed on edges of substrate in touch-control circuit 1101 periphery, form picture frame 1104, and form conductive bezels 1102 in picture frame 1104 scope.
Conductive material is printed on conductive bezels 1102 and picture frame 1104 by another preferred embodiment of the present invention, to form metal lead wire 1105, can transmit the signal of touch-control circuit in contact panel.In a preferred embodiment, the material of metal lead wire comprises silver.
Another embodiment of the present invention, prints peelable glue in touch-control circuit region, then is formed in touch-control circuit 1101 with insulating material, to form the insulation course 1106 in touch-control circuit 1101, and covering metal lead-in wire 1105, to protect metal lead wire.In a preferred embodiment, described insulating material can be the optical coating by PVD evaporation monox or printing.As Figure 11 B shows, further, peelable glue is removed, with patterned insulation layer 1106.
Figure 11 C shows another embodiment of the present invention, insulation course 1106 further in touch-control circuit 1101 prints peelable glue, in evaporation mode, indium tin oxide is formed on insulation course 1106, then removes peelable glue, make the interconnection circuit 1107 in the indium tin oxide formation touch-control circuit of evaporation.
In an embodiment, contact panel as shown in figure 11, wherein on substrate, preformed indium tin oxide thickness is about 20nm, and the thickness of insulation course 1106 is about 1.5 μm, and the indium tin oxide thickness forming the interconnection circuit 1107 in touch-control circuit is about 40nm; The width of metal lead wire is about 70 μm, and the spacing between metal lead wire is about 130 μm; The area size of conduction picture frame is about long 2300 μm and wide 300 μm, and the size in this region can be less; The size in the region of indium tin oxide interconnection circuit is about long 800 μm and wide 300 μm, and in the zone, the size of bonding pad is about long 200 μm and wide 10 μm.In addition, can apply in the superiors of touch-control circuit the insulation course that a layer thickness is about 1.5 μm again, can be optical coating, to protect touch-control circuit.
The another preferred embodiment of the present invention forms a kind of simple contact panel, as illustrated in fig. 12, the substrate of indium tin oxide is pre-formed by laser beam marking, depict several sensing region 1201, and formed in sensing region 1201 periphery conductive bezels 1202, Figure 12 A be presented at the simple contact panel back side can by the controller of the external contact panel outside of flexible circuit 1203.Figure 12 C shows, this simple contact panel, can show the signal of multiple different position of touch, for the contact panel of Figure 12 A and 12C, is divided into the contact panel of 4 sensing regions, can process the signal of nearly 9 position of touch 1205.
Because touch-control circuit has directly been formed at the below of panel by disclosed contact panel, therefore do not need extra substrate.Except reducing the number of substrate, and then reducing outside the thickness of contact panel, more can simplify assembling flow path and cost, and promoting qualification rate.
Although technology contents of the present invention and feature are as mentioned above, but those skilled in the art still can carry out many changes and amendment when not deviating from teaching of the present invention and disclosure.Therefore, scope of the present invention is not defined in the embodiment disclosed, and comprises and do not deviate from other change of the present invention and amendment, its for as appended claims the scope that contained.
Claims (14)
1. a capacitance type touch-control panel, it comprises:
Only one piece of panel, the first side of the inside towards electronic installation of described panel is formed with touch-control circuit; And
Conductive bezels, be formed in the surrounding of described first side along described touch-control circuit, wherein said touch-control circuit comprises sensing cell, driver element and interconnection circuit therebetween, thus makes described capacitance type touch-control panel not need extra substrate.
2. capacitance type touch-control panel according to claim 1, it comprises grooving further, is formed at the second side relative to described first side, in order to the Signal transmissions that produced by described touch-control circuit to peripheral control unit.
3. capacitance type touch-control panel according to claim 2, it comprises picture frame further, and be configured in described grooving, wherein said picture frame is printed with opaque insulating material.
4. capacitance type touch-control panel according to claim 1, wherein said conductive bezels is printed on described first side of described substrate with opaque electrically conductive ink, and is formed with conducting wire in wherein, thus transmits the signal that described touch-control circuit produces.
5. capacitance type touch-control panel according to claim 1, the formation of wherein said sensing cell, described driver element and interconnection circuit is therebetween formed at the indium tin oxide on described first side of described substrate by laser beam marking.
6. capacitance type touch-control panel according to claim 1, wherein said panel formed by least following one: glass, plastics, optical clear substrate.
7. capacitance type touch-control panel according to claim 1, it comprises flexible circuit and controller further, and wherein said controller is coupled by described flexible circuit with described touch-control circuit.
8. capacitance type touch-control panel according to claim 3, it comprises metal lead wire further, is formed on described picture frame, in order to transmit the signal that described touch-control circuit produces.
9. capacitance type touch-control panel according to claim 1, it comprises organic conductive layers further, to form the interconnection circuit in described touch-control circuit.
10. form a method for capacitance type touch-control panel, this capacitance type touch-control panel only comprises one piece of panel, and described method comprises:
With the indium tin oxide patterning that laser beam marking will be previously formed on the first side of the inside towards electronic installation of described panel, to form touch-control circuit; And
First conductive material is printed onto in the surrounding of described first side of described panel along described touch-control circuit, to form conductive bezels,
The step wherein forming described touch-control circuit comprises formation sensing cell, driver element and interconnection circuit therebetween, thus makes described capacitance type touch-control panel not need extra substrate.
11. methods according to claim 10, it forms grooving, in order to the Signal transmissions that produced by described touch-control circuit to peripheral control unit at described panel relative to the second side periphery of described first side further.
12. methods according to claim 11, it forms picture frame further in described grooving.
13. methods according to claim 12, it forms metal lead wire further on described conductive bezels and described picture frame, in order to transmit the signal that described touch-control circuit produces.
14. methods according to claim 10, it forms interconnection circuit further by organic conductive material in described touch-control circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010170130.1A CN102236451B (en) | 2010-04-30 | 2010-04-30 | Touch panel and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010170130.1A CN102236451B (en) | 2010-04-30 | 2010-04-30 | Touch panel and manufacturing method thereof |
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| CN102236451A CN102236451A (en) | 2011-11-09 |
| CN102236451B true CN102236451B (en) | 2015-04-29 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102707849B (en) * | 2012-02-01 | 2015-07-08 | 南京点触智能科技有限公司 | Manufacturing method for capacitive type touch screen |
| CN102750059A (en) * | 2012-05-28 | 2012-10-24 | 杭州安费诺飞凤通信部品有限公司 | Capacitive touch screen and manufacture method thereof |
| CN103293750B (en) * | 2012-12-14 | 2016-05-11 | 上海天马微电子有限公司 | A kind of embedded touch-screen color membrane substrates and manufacture method thereof |
| CN104375704B (en) * | 2014-11-13 | 2017-12-19 | 蓝思科技（长沙）有限公司 | UV films inductor, its preparation method and touch screen |
| CN104639687B (en) * | 2015-01-30 | 2016-03-02 | 深圳市中兴移动通信有限公司 | Mobile terminal and display unit thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101089803A (en) * | 2006-06-14 | 2007-12-19 | 阿尔卑斯电气株式会社 | Input device |
| CN101308430A (en) * | 2008-07-11 | 2008-11-19 | 深圳市德普特光电显示技术有限公司 | Electric resistance type touch screen and method of manufacture |
| CN101553776A (en) * | 2007-02-08 | 2009-10-07 | 夏普株式会社 | Touch panel apparatus and method for manufacturing the same |
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2010
- 2010-04-30 CN CN201010170130.1A patent/CN102236451B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101089803A (en) * | 2006-06-14 | 2007-12-19 | 阿尔卑斯电气株式会社 | Input device |
| CN101553776A (en) * | 2007-02-08 | 2009-10-07 | 夏普株式会社 | Touch panel apparatus and method for manufacturing the same |
| CN101308430A (en) * | 2008-07-11 | 2008-11-19 | 深圳市德普特光电显示技术有限公司 | Electric resistance type touch screen and method of manufacture |
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| CN102236451A (en) | 2011-11-09 |
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