CN102231377B - High color rendering light emitting diode and manufacture method thereof - Google Patents
High color rendering light emitting diode and manufacture method thereof Download PDFInfo
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- CN102231377B CN102231377B CN2010105941501A CN201010594150A CN102231377B CN 102231377 B CN102231377 B CN 102231377B CN 2010105941501 A CN2010105941501 A CN 2010105941501A CN 201010594150 A CN201010594150 A CN 201010594150A CN 102231377 B CN102231377 B CN 102231377B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Provided is a high color rendering light emitting diode, comprising a support and a support pin. A blue ray LED chip and a red ray LED chip are fixedly arranged in a cup chamber. The blue ray LED chip is connected with the red ray LED chip in series. The blue ray LED chip and the red ray LED chip which are connected in series are connected to the support pin. The cup chamber is provided with yellow fluorescent glue which covers the blue ray LED chip and the red ray LED chip. According to the invention, a crimson color is added in the spectrum and the problem that an R9 test index is too low can be effectively solved.
Description
Technical field
The present invention relates to led technology, especially a kind of light-emitting diode of high-color rendering and manufacturing approach thereof.
Background technology
Development and continuous progress in science and technology along with economic society; And the improving constantly of light-emitting diode field industrialization level; The LED illumination is also popularized gradually, and also more and more to the LED lighting of various professional domains in the market, have relatively high expectations to light in these fields; Particularly especially there is the requirement of high reproducibility in places such as exhibition room, gallery, office to color.
Weigh the quality of the color reducibility of light source, generally represent with color rendering index, form (seeing the following form) by 14 indexs, through the contrast to each color, relatively its similarity forms through calculating comprehensively again.
| Ri | The color that daylight shows down | Ri | The color that daylight shows down |
| R1 | Light grayish red light gray is red | R8 | Light reddish purple grey violet is red |
| R2 | Dark grayish yellow dull gray is yellow | R9 | Strong red is dark red |
| R3 | Strong yellow green is deep yellow green | R10 | Strong yellow is deep yellow |
| R4 | The medium yellow green of Moderate yellowish green | R11 | Strong green is dark green |
| R5 | Light bluish green bluish-green | R12 | Strong blue is dark blue |
| R6 | Light blue is light blue | R13 | The light pink Huang of Light yellowish pink |
| R7 | Light violet dutch blue | R14 | Leaf green leaf is green |
Table 1 color rendering index index table
The color rendering index of light source thinks to be fit to the illumination in all places greater than 85, yet; Traditional white light LEDs generally adds yellow fluorescent powder by blue-light LED chip and is made; The white light of being sent out has only blue light and yellow spectrum, and spectral width is less and be discontinuous spectrum, can't be all real reduction of all colors; Particularly, cause its color rendering index effectively to improve because common white light lacks dark red spectrum.In addition, for White LED with high color rendering property, also has a kind of manufacture method: can in fluorescent glue, add red fluorescence powder; To reach the effect of spectrally compensating, still, because the launching efficiency of red fluorescence powder is not high; Can make the whole luminous efficiency of LED illuminating lamp reduce; Still not enough to some extent on the serviceability, satisfied not the lighting requirement of professional domain, be unfavorable for the application and the popularization of LED illuminating lamp on the whole.
Summary of the invention
The object of the present invention is to provide a kind of color reducibility good, possess the light-emitting diode and the manufacturing approach thereof of high-color rendering.
The technical scheme that the present invention is adopted for its technical problem of solution is:
A kind of light-emitting diode of high-color rendering; Comprise support and support pin; Support is provided with a glass chamber, indoor blue-light LED chip and the red LED chip of being set with of cup, and said blue-light LED chip and red LED chip are in series; The blue-light LED chip of series connection and red LED chip connect the support pin, the indoor yellow fluorescent glue that covers blue-light LED chip and red LED chip that is provided with of said cup.
Excite the fluorescent material in the yellow fluorescent glue after above-mentioned blue-light LED chip is luminous, send gold-tinted, gold-tinted is 1:4 ~ 1:8 with the white light of blue light gained and the light flux ratio of red LED chip ruddiness again.
A kind of manufacturing method for LED of high-color rendering may further comprise the steps:
The invention has the beneficial effects as follows: the mode of the blue-light LED chip that the present invention adopted and red LED chip series connection, and cooperate yellow fluorescent glue, the absorption energy that is stimulated transits to excitation state (non-steady state) in being fed back into the process of ground state because light-emitting phosphor is an object; Form with light is emitted energy, and well-known, the short more energy of emission wavelength is high more; It is exactly a process of changing light with luminous energy that fluorescent material is stimulated luminous, and can only be high-octane light displacement low-energy light, because the wavelength of blue light is less than gold-tinted; Yellow wavelengths is again greater than ruddiness, so the light that sends of blue-light LED chip gold-tinted that fluorescent material is sent, final mixed and penetrate white light; The light that red LED chip sends then can not excite yellow fluorescent glue to send any visible light, and therefore final irradiation comes out to be equivalent in spectrum, add peony into the light of white light and ruddiness mixing; Can effectively improve the low problem of R9 test index, and the present invention need not add red fluorescence powder, to the not influence of brightness of product; And, because blue-light LED chip and red LED chip be placed in the same glass of chamber, and cover fluorescent material simultaneously; From outside watch and the common LED of being as good as, and glow color is even; Colo(u)r breakup can not appear, problem such as hot spot is inhomogeneous.The form of the chip series connection that the present invention adopted does not need other peripheral circuits, can directly connect power supply, normally uses through the rated voltage electric current, and is simple in structure, and result of use is good.
Description of drawings
Further specify below in conjunction with accompanying drawing and embodiment:
Fig. 1 is circuit theory diagrams of the present invention;
Fig. 2 is the end view of first kind of execution mode of the present invention;
Fig. 3 is the vertical view of first kind of execution mode of the present invention;
Fig. 4 is the end view of second kind of execution mode of the present invention;
Fig. 5 is a spectral curve of the present invention.
Embodiment
Like Fig. 1, Fig. 2 ~ shown in Figure 4, the light-emitting diode of a kind of high-color rendering provided by the present invention comprises support 1 and support pin 2; Like Fig. 2, shown in Figure 3, support 1 can adopt SMD, and is also can employing as shown in Figure 4 direct insertion; Select for use according to different occasions, support 1 is provided with glass chamber 11, wherein; Cup chamber 11 internal fixation are provided with blue-light LED chip 3 and red LED chip 4, and this blue-light LED chip 3 adopts the form that is in series with red LED chip 4, generally can be connected surely by wire nation; Be blue-light LED chip 3 as a solder joint, red LED chip 4 is welded together by metal wire as another solder joint; The two poles of the earth of last two chips that will connect again are connected to two stands pin 2, by support pin 2 extraction electrodes, connect electricity and use with support pin 2; Usually the rated voltage of blue-light LED chip 3 is at 3.0 ~ 3.5V, and the rated voltage of red LED chip 4 adopts the forward current of 20mA then at 1.8 ~ 2.2V; Can guarantee normal use of the present invention, and not need other peripheral control circuits, use very convenient.
Chip setting of the present invention; Can adopt blue-light LED chip 3 to be and be horizontally placed in glass chamber 11, and red LED chip 4 is with the two poles of the earth structure in cup chamber 11 that is vertical setting, for SMD support 1 with the two poles of the earth; A support pin 2 is directly introduced in 11 bottoms, its glass chamber; One of red LED chip 4 belows extremely can be directly and this support pin 2 fixedly install, form annexation, a utmost point of top is then connected a utmost point of blue-light LED chip 3 by metal wire; Blue-light LED chip 3 also connects another support pin 2 by metal wire, draws at the two poles of the earth of cascaded structure really with the general; For direct insertion support 1,11 of its glass chambers are arranged on support pin 2, so extremely directly being fixedly connected in the tea cup with a cover chamber 11 of red LED chip 4 belows, and it is identical that other connect rule; Because blue-light LED chip 1 and red LED chip 2 needs to guarantee that polarity towards identical, generally have two kinds to connect method, a kind of is a positive pole very of red LED chip 4 belows; Its top one negative pole very then; Be connected with the positive pole of blue-light LED chip 3, the negative pole of blue-light LED chip 3 then connects another support pin 2, and another kind connects method; It then is a negative pole very of red LED chip 4 belows; Then its top one is very anodal, is connected with the negative pole of blue-light LED chip 3, and the positive pole of blue-light LED chip 3 then connects another support pin 2; Two kinds connect method, and the positive-negative polarity of its two stands pin 2 is just opposite, need during use to note distinguishing.
Behind good blue-light LED chip 3 of cup chamber 11 internal fixation and red LED chip 4, apply yellow fluorescent glue 5 again and encapsulate, wherein; The principle that the present invention adopted is that the light that blue-light LED chip 3 sends can excite yellow fluorescent glue; With its mixed, finally penetrate white light, the light that red LED chip 4 sends then can not mix with yellow fluorescent glue; Therefore final irradiation comes out to reach and improved color developing of the present invention into the light of white light and ruddiness mixing; According to the requirement of colour temperature, the brightness of red LED chips 4 of the present invention and the brightness of white light can be adjusted in certain limit, and in general, colour temperature is low more; The shared ratio of red light is big more, and its spectral curve is seen Fig. 5, can find out; Obtain high-color rendering white-light, can be cooperated by three primary colors (R is red, G is green, B blue) to form, the flux ratio of each coloured light is about R:G:B=1:4.5907:0.0601; Wavelength is respectively 700nm, 546.1nm, 435.8nm, but in actual production, the blue light output of 435.8nm is lower; Main flow is generally used the blue light of 440-465nm, and G light generally replaces with the green-yellow light that blue-light excited fluorescent material sent, and the emission spike generally is between the 520-580nm; But the emission spike is short more, and fluorescent material efficient is low more, so fluorescent material generally adopts more than the emission spike 560nm; The ruddiness of 700nm because this wave band brightness of chip material decision can't improve, generally is that 610-640nm, especially 618-625nm are main so add red light chips, and the ratio of luminous flux has any to be changed, but concrete the variation not quite.So as preferred implementation, among the present invention, the white light and red LED chip 4 ruddiness of gained are mixed in blue-light LED chip 3 luminous backs with yellow fluorescent glue 5 light flux ratio, general desirable 1:4 ~ 1:8.
The light-emitting diode of high-color rendering of the present invention, its manufacturing can realize through following step:
It is thus clear that the present invention has added dark red in white-light spectrum, can effectively improve the low problem of R9 test index, and need not add red fluorescence powder, the not influence of brightness of product; And because blue-light LED chip and red LED chip are placed in the same bowl glass, and cover fluorescent material simultaneously, from outside watch and common LED is as good as, and glow color is even, colo(u)r breakup can not occur.
More than preferable enforcement of the present invention is specified; Certainly; The present invention can also adopt the form different with above-mentioned execution mode; These do not constitute any restriction to this execution mode, and those of ordinary skill in the art should belong in protection scope of the present invention conversion of under the prerequisite of spirit of the present invention, being done that is equal to or corresponding the change.
Claims (2)
1. the light-emitting diode of a high-color rendering; It is characterized in that: comprise support (1) and support pin (2); Support (1) is provided with a glass chamber (11); Cup chamber (11) internal fixation is provided with blue-light LED chip (3) and red LED chip (4), and said blue-light LED chip (3) is in series with red LED chip (4), and blue-light LED chip of series connection (3) and red LED chip (4) connect support pin (2); Be provided with the yellow fluorescent glue (5) that covers blue-light LED chip (3) and red LED chip (4) in the said cup chamber (11); Excite the fluorescent material in the yellow fluorescent glue (5) after said blue-light LED chip (3) is luminous, send gold-tinted, gold-tinted is 1:4～1:8 with the white light of blue light gained and the light flux ratio of red LED chip (4) ruddiness again.
2. the light-emitting diode of a kind of high-color rendering according to claim 1, it is characterized in that: said blue-light LED chip (3) and red LED chip (4) connect through wire nation surely.
3. the light-emitting diode of a kind of high-color rendering according to claim 2; It is characterized in that: a utmost point of blue-light LED chip (3) is connected with a utmost point on red LED chip (4) top through metal wire; Another utmost point connects a support pin (2) through metal wire, and a utmost point of said red LED chip (4) bottom and another support pin (2) are fixed together.
4. the light-emitting diode of a kind of high-color rendering according to claim 1, it is characterized in that: said support (1) is patch type bracket or direct insertion support.
5. the manufacturing method for LED of a high-color rendering as claimed in claim 1 is characterized in that may further comprise the steps:
Step 1 is arranged on blue-light LED chip (3) and red LED chip (4) in the cup chamber (11) of support (1);
Step 2 couples together a utmost point of a utmost point of blue-light LED chip (3) and red LED chip (4), forms the series connection form, and the blue-light LED chip that is cascaded (3), red LED chip (4) are connected with support pin (2);
Step 3 is coated with in cup chamber (11) and applies yellow fluorescent powder glue (5).
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105941501A CN102231377B (en) | 2010-12-18 | 2010-12-18 | High color rendering light emitting diode and manufacture method thereof |
| EP11169984.9A EP2466639A3 (en) | 2010-12-18 | 2011-06-15 | A high-color rendering LED and manufacturing method thereof |
| US13/204,159 US20120194059A1 (en) | 2010-12-18 | 2011-08-05 | High-color rendering led and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105941501A CN102231377B (en) | 2010-12-18 | 2010-12-18 | High color rendering light emitting diode and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102231377A CN102231377A (en) | 2011-11-02 |
| CN102231377B true CN102231377B (en) | 2012-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105941501A Expired - Fee Related CN102231377B (en) | 2010-12-18 | 2010-12-18 | High color rendering light emitting diode and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120194059A1 (en) |
| EP (1) | EP2466639A3 (en) |
| CN (1) | CN102231377B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI466343B (en) | 2012-01-06 | 2014-12-21 | Phostek Inc | Light-emitting diode device |
| CN103199163B (en) * | 2012-01-06 | 2016-01-20 | 华夏光股份有限公司 | Light-emitting diode assembly |
| EP2749709B1 (en) | 2012-12-27 | 2016-10-05 | Helios Trading, naamloze Vennootschap | Awning with light strip |
| CN103606615A (en) * | 2013-10-17 | 2014-02-26 | 上舜照明（中国）有限公司 | Ceramic surface LED-mounted encapsulation structure and encapsulation method thereof |
| DE102014101215A1 (en) * | 2014-01-31 | 2015-08-06 | Osram Opto Semiconductors Gmbh | Surface-mountable multi-chip component |
| CN113054083A (en) * | 2019-12-27 | 2021-06-29 | 英特美光电（苏州）有限公司 | 5000k ultra-high display spectrum fluorescent powder |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6577073B2 (en) * | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
| JP2003249693A (en) * | 2002-02-25 | 2003-09-05 | Seiwa Electric Mfg Co Ltd | Led lamp |
| US20050099808A1 (en) * | 2003-11-12 | 2005-05-12 | Cheng Tzu C. | Light-emitting device |
| TWI274209B (en) * | 2004-07-16 | 2007-02-21 | Chi Lin Technology Co Ltd | Light emitting diode and backlight module having light emitting diode |
| CN101308837A (en) * | 2007-05-17 | 2008-11-19 | 先进开发光电股份有限公司 | Light source in warm color |
| JP5346448B2 (en) * | 2007-06-07 | 2013-11-20 | シャープ株式会社 | LIGHT EMITTING DEVICE AND CAMERA MOBILE MOBILE WITH THE SAME |
| CN101325193B (en) * | 2007-06-13 | 2010-06-09 | 先进开发光电股份有限公司 | Encapsulation body of LED |
| CN201117655Y (en) * | 2007-10-25 | 2008-09-17 | 俊光科技有限公司 | Led |
| KR101562772B1 (en) * | 2008-03-31 | 2015-10-26 | 서울반도체 주식회사 | Light emitting divece for white light of incandescent color |
| JP2010147306A (en) * | 2008-12-19 | 2010-07-01 | Mitsubishi Electric Corp | Light emitting device, and lighting fixture and display instrument using the light emitting device |
-
2010
- 2010-12-18 CN CN2010105941501A patent/CN102231377B/en not_active Expired - Fee Related
-
2011
- 2011-06-15 EP EP11169984.9A patent/EP2466639A3/en not_active Withdrawn
- 2011-08-05 US US13/204,159 patent/US20120194059A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP2466639A2 (en) | 2012-06-20 |
| CN102231377A (en) | 2011-11-02 |
| US20120194059A1 (en) | 2012-08-02 |
| EP2466639A3 (en) | 2014-09-24 |
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