CN102214634A - 一种用于红外接收器封装的铝支架 - Google Patents

一种用于红外接收器封装的铝支架 Download PDF

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CN102214634A
CN102214634A CN2011101398417A CN201110139841A CN102214634A CN 102214634 A CN102214634 A CN 102214634A CN 2011101398417 A CN2011101398417 A CN 2011101398417A CN 201110139841 A CN201110139841 A CN 201110139841A CN 102214634 A CN102214634 A CN 102214634A
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aluminium
infrared remote
remote receiver
packing
bracket
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杨家象
刘文东
姜勇
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HARBIN HEG TECHNOLOGY DEVELOPMENT Co Ltd
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HARBIN HEG TECHNOLOGY DEVELOPMENT Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

一种用于红外接收器封装的铝支架，选择0.10-0.50mm的铝带，通过机械冲压或化学蚀刻的方式制成红外接收器支架，然后在专用电镀生产线上镀覆功能性电镀层。这里所说的铝带，可以是纯铝，也可以是含有锰、铜、硅、锌、镁等其他材料的铝合金，这些铝或铝合金材料经过多次的热处理，如回火，退火，硬化等，达到不同的硬度。本发明涉及一种铝材质红外接收器的封装支架，它具有良好的导电、导热、热匹配、机械性能和耐腐蚀性能。较低的封装应力有利于提高封装产品的合格率和可靠性，降低了产品在客户端的使用失效率。由于比重轻，所以成本低廉。

Description

一种用于红外接收器封装的铝支架
(一)技术领域
本发明涉及半导体器件及其加工工艺领域，特别地涉及红外接收器支架的材料及其加工、封装工艺领域。
(二)背景技术
铜材料具有良好的导电性能、良好的导热性能、良好的热匹配性能、良好的机械性能以及良好的耐腐蚀性能，所以，半导体器件的支架多半采用铜材料作为基材；近年来，由于铜材的价格飞涨，人们不得不开始选择铁或者铁的合金作为半导体器件支架的基材；红外接收器支架材料的选择、演变历程与上述过程相同，即，最初整个产业都选择铜作为支架的基材，铜材料的价格超过人民币4万元/吨后，国内、外相关企业纷纷开始采用铁或者铁合金作为红外接收器支架的基材。
铁或者铁合金材料作为红外接收器的支架基材尚存在一些不足，耐腐蚀性差就是其突出的缺陷，即，通俗说法的容易生锈。电子元器件的支架一旦生锈，就会严重地降低支架引脚的易焊性，导致“假焊”、“虚焊”等焊接不良现象的发生，给整机装配过程带来麻烦，也给整机出厂后的长期稳定性埋下隐患！支架生锈还可能导致“短路”、“断路”等质量事故的发生。所以，焊接不良一直是导致整机失效的第一杀手，选择性能更好的替代材料成为半导体产业共同关注的问题。
红外接收器是实现家电红外遥控的基础元器件，被广泛应用于电视机、空调机、DVD播放器、机顶盒及遥控电子玩具等领域。
红外接收器主要由红外光电接收二极管芯片、放大器IC芯片、金属内引线、金属支架、以及环氧树脂封装体等构成。通过金属内引线与芯片铝电极之间的金属键合、与金属支架之间的金属键合，使红外接收器芯片的电极连接到了红外接收器的外引脚上。
红外接收器工作在低电压、低电流条件下，其功耗通常只有1～5mW，所以，在选择红外接收器支架材料的时候，我们可以忽略导电性能和导热性能，而主要考虑是否具备良好的热匹配性能、良好的机械性能以及良好的耐腐蚀性能。铝通常情况下不会生锈，也容易加工成型，所以，铝具有良好的耐腐蚀性能以及良好的机械性能；环氧树脂的热膨胀系数(线)为60×10-6/℃、铝的热膨胀系数(线)为24.7×10-6/℃、铜的热膨胀系数(线)为17.6×10-6/℃、铁的热膨胀系数(线)为12.5×10-6/℃，显然铝与环氧树脂的热匹配性更好；与铁相比铝的硬度更低，有利于与金属内引线的键合；铝的比重大约是铜或者铁的比重的三分之一，而铁的价格大约是铝价格的三分之一，所以，采用铝作为红外接收器支架的基材时，其采购成本与采用铁材料时的采购成本相若。
总之，采用铝或者铝合金作为红外接收器支架的基材，实现了在基本上不增加采购成本的情况下提高了红外接收器支架的性能。
(三)发明内容
本发明涉及一种铝材质红外接收器的封装支架，它具有良好的导电、导热、热匹配、机械性能和耐腐蚀性能。较低的封装应力有利于提高封装产品的合格率和可靠性，降低了产品在客户端的使用失效率。由于比重轻，所以成本低廉。
本发明采用了以下技术方案：
选择铝或者铝合金代替金属铜和金属铁用于制造红外接收器支架。经过表面处理在铝基材表面形成多层功能性金属镀层，以利于金属内引线与铝支架之间的金属键合、也有利于实现与环氧树脂的低应力封装。
选择0.10-0.50mm的铝带，通过机械冲压或化学蚀刻的方式制成红外接收器支架，然后在专用电镀生产线上镀覆功能性电镀层。其工艺流程：超声波清洗--碱腐蚀--酸腐蚀--浸锌酸盐-退锌-二次浸锌酸盐-退锌-碱性化学镍-焦磷酸镀铜-低应力镍-镀氰铜-预镀银-选择性镀银(或全银)--退银-铜保护(银保护)。
这里所说的铝带，可以是纯铝，也可以是含有锰、铜、硅、锌、镁等其他材料的铝合金，这些铝或铝合金材料经过多次的热处理，如回火，退火，硬化等，达到不同的硬度。
本发明的优点在于：
本发明涉及一种铝材质红外接收器的封装支架，它具有良好的导电、导热、热匹配、机械性能和耐腐蚀性能。较低的封装应力有利于提高封装产品的合格率和可靠性，降低了产品在客户端的使用失效率。由于比重轻，所以成本低廉。
(四)附图说明：
图1本发明一种用于红外接收器封装的铝支架的结构图；
图2本发明一种用于红外接收器封装的铝支架的的剖面图；
图3本发明一种用于红外接收器封装的铝支架的原理图；
图4本发明一种用于红外接收器封装的铝支架的贴片式封装剖面图；
图5本发明一种用于红外接收器封装的铝支架的贴片式封装原理图。
(五)具体实施方式：
下面结合附图对本发明做更详细的描述：
结合图1，本发明一种用于红外接收器封装的铝支架的结构，选择0.4mm纯铝带，在高速冲床上，冲制BY-7型红外接收器支架1。
结合图2，本发明一种用于红外接收器封装的铝支架在BY-7型支架1上按照上述已知的电镀流程镀覆功能性镀层2，银镀层厚度控制在3.0微米。
结合图3本发明一种用于红外接收器封装的铝支架，上述经过表面处理的铝支架再经过清洗、切断、校平便可用于红外接收器的固晶、焊线和封装，图中3为IC芯片，4接收二极管芯片，5为内引线。
结合图4本发明一种用于红外接收器封装的铝支架，在贴片式支架6上按照上述已知的电镀流程镀覆功能性镀层2，镀层厚度控制在3.0微米。
结合图5本发明一种用于红外接收器封装的铝支架，在上述经过表面处理的铝支架在经过清洗、切断、校平后便可用于固晶、焊线和封装，图中3为IC芯片，4为接收二极管芯片，5为内引线、6为贴片式铝支架。

Claims (2)

1.一种用于红外接收器封装的铝支架，由红外接收器支架(1)、功能性镀层(2)组成，其特征在于：红外接收器支架(1)采用铝或者铝合金作为基材；
2.根据权利要求1所述的一种用于红外接收器封装的铝支架其特征还在于红外接收器铝支架(1)表面经过表面处理后在其表面形成多层功能性镀层(2)，用于后续的红外接收器金属内引线的键合。
CN2011101398417A 2011-05-27 2011-05-27 一种用于红外接收器封装的铝支架 Pending CN102214634A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102943291A (zh) * 2012-10-18 2013-02-27 中国电子科技集团公司第十研究所 铝合金管壳可焊性与防护性表面处理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101073152A (zh) * 2004-12-20 2007-11-14 半导体元件工业有限责任公司 具有下置引脚的电子封装和方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101073152A (zh) * 2004-12-20 2007-11-14 半导体元件工业有限责任公司 具有下置引脚的电子封装和方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102943291A (zh) * 2012-10-18 2013-02-27 中国电子科技集团公司第十研究所 铝合金管壳可焊性与防护性表面处理方法

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Application publication date: 20111012