CN102214492B - Method for making concave-surface X-ray focusing pinhole - Google Patents
Method for making concave-surface X-ray focusing pinhole Download PDFInfo
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- CN102214492B CN102214492B CN 201110155042 CN201110155042A CN102214492B CN 102214492 B CN102214492 B CN 102214492B CN 201110155042 CN201110155042 CN 201110155042 CN 201110155042 A CN201110155042 A CN 201110155042A CN 102214492 B CN102214492 B CN 102214492B
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Abstract
The invention discloses a method for making a concave-surface X-ray focusing pinhole. The method comprises the following steps of: preparing a substrate; coating photoresist on the substrate and photoetching the photoresist with different doses of electron beams to form a convex-surface photoresist pattern with a cylinder in the center; electroplating an Au layer on the formed photoresist pattern; etching the substrate from the back of the substrate till penetrating through the substrate; and removing the photoresist to form the concave-surface X-ray focusing pinhole. The method for making the concave-surface X-ray focusing pinhole has the advantages of simpleness in process, low making cost, high production efficiency and capability of providing HSQ (hydrogen silsesquioxane) process with higher uniformity and can be used for making the concave-surface X-ray focusing pinholes.
Description
Technical field
The present invention relates to the diffraction optical element manufacture technology field, relate in particular to a kind of method of making concave-surface X-ray focusing pinhole.
Background technology
X ray is because its wavelength is short, thereby transmission is difficult to by force focus on, and technology in the past utilizes zone plate or photon screen to focus on often, and such zone plate or photon screen often all are planes.Thereby concave, still again owing to its surperficial concave surface characteristic is difficult to make in technique because its surperficial focus characteristics can better focus on.
Summary of the invention
The technical matters that (one) will solve
In view of this, fundamental purpose of the present invention is to provide a kind of method of making concave-surface X-ray focusing pinhole, to reduce the manufacture difficulty of concave surface.
(2) technical scheme
For achieving the above object, the invention provides a kind of method of making concave-surface X-ray focusing pinhole, the method comprises:
Make substrate;
Resist coating on substrate carries out photoetching with the electron beam of various dose to this photoresist, and the formation center has the photoetching offset plate figure of the convex surface of cylinder;
In the photoetching offset plate figure that the forms Gold plated Layer that powers on;
Carry out etching from the back side of substrate, until penetrate substrate; And
The formation concave-surface X-ray focusing pinhole removes photoresist.
In the such scheme, the step of described making substrate comprises: the positive spin-on polyimide film at smooth silicon chip, and then use wet etching from silicon chip back side silicon to be eroded, form the Kapton of hollow out; Adopt electron beam evaporation method to evaporate chromium/gold layer at Kapton, form substrate.In described chromium/gold layer, the thickness of chromium is 5nm, and the thickness of gold is 10nm.
In the such scheme, described on substrate resist coating, electron beam with various dose carries out photoetching to this photoresist, the step of photoetching offset plate figure that the formation center has the convex surface of cylinder comprises: spin coating thickness is the electron beam resist of 600nm on the chromium of substrate/gold layer, and baking makes its drying in baking oven; Then adopt the electron beam of various dose that this photoresist is carried out photoetching, the dosage of electron beam be in the middle of dosage be the donut that dosage increases gradually around 0, until reach the dosage of removing fully; After exposure, use developer solution to develop, the formation center has the photoetching offset plate figure of the convex surface of cylinder on the final silicon chip, and this photoetching offset plate figure reduces towards periphery gradually from the centre, and the annulus of photoetching does not form a cylindrical glue post in the centre.
In the such scheme, described photoetching offset plate figure forming powers in the step of Gold plated Layer, is to adopt electric plating method to form the gold layer at photoresist, gold depositing on the photoetching offset plate figure gradually, by around slowly to the centre diffusion, until flush with photoresist.
In the such scheme, etching is carried out at the described back side from substrate, until penetrate the step of substrate, comprising: from the back side of substrate polyimide is carried out etching, and continue etching until the chromium of window area/gold layer is etched away fully.
In the such scheme, described removing photoresist forms the step of concave-surface X-ray focusing pinhole, comprising: place the liquid that removes photoresist to remove photoresist substrate, form the golden film of concave surface, the middle not circular aperture of glue cylindricality of photoetching of this gold film is finished the making of concave-surface X-ray focusing pinhole.
(3) beneficial effect
Can find out from technique scheme, the present invention has following beneficial effect:
1, the method for making concave-surface X-ray focusing pinhole provided by the invention is that a kind of technique is simple, low cost of manufacture, production efficiency be high, and the method for the HSQ technique of higher homogeneity can be provided, and can finish the focusing aperture with concave surface and make.
2, the method for making concave-surface X-ray focusing pinhole provided by the invention, the HSQ glue of employing has very high resolution, adopts HSQ technique to improve greatly accurate rate, guarantees the homogeneity of concave surface, thereby more widely application prospect is arranged.
3, the method for making concave-surface X-ray focusing pinhole provided by the invention can be produced expeditiously concave and focus on aperture, and this concave focuses on aperture with respect to the aperture on plane, and the concave surface aperture has stronger focusing effect, has larger application prospect.
Description of drawings
Fig. 1 is the method flow diagram of making concave-surface X-ray focusing pinhole provided by the invention;
Fig. 2 is for carrying out the schematic diagram of electron beam exposure to substrate base according to the embodiment of the invention;
Fig. 3 is cull and dose relationship schematic diagram;
Fig. 4 is pictorial diagram after developing;
Fig. 5 is the schematic diagram of figure after electroplating, and yellow is the gold layer;
Fig. 6 focuses on the schematic diagram of aperture for the concave surface of finally finishing.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
The method of making concave-surface X-ray focusing pinhole provided by the invention adopts HSQ technique that the susceptibility of electron beam is made concave-surface X-ray focusing pinhole.As shown in Figure 1, Fig. 1 is the method flow diagram of making concave-surface X-ray focusing pinhole provided by the invention, and the method comprises:
Step 1: make substrate;
Step 2: resist coating on substrate, with the electron beam of various dose this photoresist is carried out photoetching, the formation center has the photoetching offset plate figure of the convex surface of cylinder;
Step 3: in the photoetching offset plate figure that the forms Gold plated Layer that powers on;
Step 4: carry out etching from the back side of substrate, until penetrate substrate; And
Step 5: the formation concave-surface X-ray focusing pinhole removes photoresist.
Based on the method for making concave-surface X-ray focusing pinhole shown in Figure 1, Fig. 2 to Fig. 6 shows the process chart of making concave-surface X-ray focusing pinhole according to the embodiment of the invention.
As shown in Figure 2, then the positive spin-on polyimide film at smooth silicon chip uses wet etching from silicon chip back side silicon to be eroded, and forms the Kapton of hollow out.Adopt electron beam evaporation method at the Kapton evaporation chromium Cr/ of front side of silicon wafer gold Au layer, wherein the thickness of Cr is 5nm, the thickness of Au is 10nm, the about 600nm of spin coating electron beam resist HSQ on chromium Cr/ gold Au layer then, and baking makes its drying in baking oven; Then use electron beam to carry out photoetching, and during photoetching the dosage of electron beam be in the middle of dosage be the donut that dosage increases gradually around 0, until reach the dosage of removing fully.As shown in Figure 3, be the curve of dosage and residual photoresist.Along with the increase of dosage, photoresist remnants reduce gradually.
As shown in Figure 4, after exposure, use developer solution to develop, the photoetching offset plate figure that forms on the final silicon chip is the middle hillside shape figure that reduces towards periphery, and the annulus of middle not photoetching forms a glue post.
After this at the enterprising electroplating of the photoetching offset plate figure of substrate gold, and because the homogeneity of electroplating is better, thus gold depositing on the substrate gradually, by around slowly to the centre diffusion, until flush with photoresist, as shown in Figure 5.
From the back side of silicon chip polyimide is carried out etching, and continue etching until the chromium of window area/gold layer is etched away fully, then substrate is placed the liquid removal photoresist HSQ that removes photoresist, thereby form the final figure that is formed by gold, as shown in Figure 6.The middle not circular aperture of glue cylindricality of photoetching is namely finished the making of concave-surface X-ray focusing pinhole, and aperture is coated with layer of metal chromium thin film, layer of gold film at the 2 inches diameter silicon chip, forms the aperture of concave surface in lighttight metallic film central authorities.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a method of making concave-surface X-ray focusing pinhole is characterized in that, the method comprises:
Make substrate;
Resist coating on substrate carries out photoetching with the electron beam of various dose to this photoresist, and the formation center has the photoetching offset plate figure of the convex surface of cylinder;
In the photoetching offset plate figure that the forms Gold plated Layer that powers on;
Carry out etching from the back side of substrate, until penetrate substrate; And
The formation concave-surface X-ray focusing pinhole removes photoresist.
2. the method for making concave-surface X-ray focusing pinhole according to claim 1 is characterized in that, the step of described making substrate comprises:
Then positive spin-on polyimide film at smooth silicon chip uses wet etching from silicon chip back side silicon to be eroded, and forms the Kapton of hollow out;
Adopt electron beam evaporation method to evaporate chromium/gold layer at Kapton, form substrate.
3. the method for making concave-surface X-ray focusing pinhole according to claim 2 is characterized in that, in described chromium/gold layer, the thickness of chromium is 5nm, and the thickness of gold is 10nm.
4. the method for making concave-surface X-ray focusing pinhole according to claim 1, it is characterized in that, described on substrate resist coating, with the electron beam of various dose this photoresist is carried out photoetching, the step of photoetching offset plate figure that the formation center has the convex surface of cylinder comprises:
Spin coating thickness is the electron beam resist of 600nm on the chromium of substrate/gold layer, and baking makes its drying in baking oven; Then adopt the electron beam of various dose that this photoresist is carried out photoetching, the dosage of electron beam be in the middle of dosage be the donut that dosage increases gradually around 0, until reach the dosage of removing fully; After exposure, use developer solution to develop, the formation center has the photoetching offset plate figure of the convex surface of cylinder on the final silicon chip, and this photoetching offset plate figure reduces towards periphery gradually from the centre, and the annulus of photoetching does not form a cylindrical glue post in the centre.
5. the method for making concave-surface X-ray focusing pinhole according to claim 1, it is characterized in that, described photoetching offset plate figure forming powers in the step of Gold plated Layer, to adopt electric plating method to form the gold layer at photoresist, gold depositing on the photoetching offset plate figure gradually, by spreading to the centre slowly on every side, until flush with photoresist.
6. the method for making concave-surface X-ray focusing pinhole according to claim 2 is characterized in that, etching is carried out at the described back side from substrate, until penetrate the step of substrate, comprising:
From the back side of substrate polyimide is carried out etching, and continue etching until the chromium of window area/gold layer is etched away fully.
7. the method for making concave-surface X-ray focusing pinhole according to claim 1 is characterized in that, described removing photoresist forms the step of concave-surface X-ray focusing pinhole, comprising:
Place the liquid that removes photoresist to remove photoresist substrate, form the golden film of concave surface, the middle not circular aperture of glue cylindricality of photoetching of this gold film is finished the making of concave-surface X-ray focusing pinhole.
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| JPH0570267A (en) * | 1991-09-12 | 1993-03-23 | Mitsubishi Electric Corp | X ray reflecting mirror and its manufacture |
| US7365909B2 (en) * | 2002-10-17 | 2008-04-29 | Xradia, Inc. | Fabrication methods for micro compounds optics |
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| US5978445A (en) * | 1994-10-27 | 1999-11-02 | Forschungszentrum Karlsruhe Gmbh | Spectrometer for X-radiation |
| JP2000098100A (en) * | 1998-09-21 | 2000-04-07 | Nikon Corp | Soft x-ray parallel flux forming device |
| CN1786741A (en) * | 2005-12-07 | 2006-06-14 | 乐孜纯 | Process for mfg. one-dimensional X ray refracted diffraction micro structural component of polymethyl methyl acrylate material |
| CN101221829A (en) * | 2008-01-07 | 2008-07-16 | 浙江工业大学 | Production method for nano focusing X ray lens combination |
| CN101846874A (en) * | 2009-03-25 | 2010-09-29 | 中国科学院微电子研究所 | X-ray photolithographic mask with through hole |
| JP5070267B2 (en) * | 2009-09-18 | 2012-11-07 | コリア プラント サービス アンド エンジニアリング カンパニー リミテッド | Steam generator secondary side dual type lansing device |
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