CN102198616A - Plane grinding method for engineering ceramic workpiece - Google Patents
Plane grinding method for engineering ceramic workpiece Download PDFInfo
- Publication number
- CN102198616A CN102198616A CN 201110095682 CN201110095682A CN102198616A CN 102198616 A CN102198616 A CN 102198616A CN 201110095682 CN201110095682 CN 201110095682 CN 201110095682 A CN201110095682 A CN 201110095682A CN 102198616 A CN102198616 A CN 102198616A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- grinding
- engineering ceramics
- face
- engineering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention belongs to the field of grinding and processing of ceramics, and particularly relates to a plane grinding method for an engineering ceramic workpiece. The method is characterized in that: the to-be-processed end face of the engineering ceramic workpiece is pressed by using the end face of a rotary grinding wheel, the bottom plane of the engineering ceramic workpiece is used as a positioning surface, attached to a workpiece head flat plate and ground, and the engineering ceramic workpiece is positioned and placed on the workpiece head flat plate through pins. The plane grinding method for the engineering ceramic workpiece does not need sticking, sucking or clamping, and is very simple, time-saving and reliable; and the workpiece is 'clamped' only by using a grinding force.
Description
Technical field
The invention belongs to the grinding field of pottery, be specifically related to engineering ceramics workpiece planarization method for grinding.
Background technology
The magnetic force vacuum sucking method is used on ferrous metal grinding plane always, and glass and electronic ceramics are used clamping workpiece grinding planes such as mull technique, optical cement method always.If these methods are applied to the clamping on structural ceramics part grinding plane, what have can't clamp, and what have is not best method.
Be unsuitable for non-magnetic pottery as the magnetic force method; The optical cement method requires locating surface extremely smooth smooth, reaches that molecular attraction can firmly bond together workpiece and optical cement instrument and clamping work pieces between the surface.So clamping workpiece was used when the optical cement method was unsuitable for corase grind, correct grinding and general polishing grinding; As for mull technique, essential bonding earlier before clamping, the cleaning of also must coming unstuck after the processing, time-consuming, and because there is binding agent to be applied between workpiece and the anchor clamps, as the adhesive-coated inequality, also can influence the depth of parallelism between locating surface and the machined surface, other need extra vacuum equipment and adsorption tool as vacuum suction; Machinery clamping method also must manufacture and design special fixture, and the depth of parallelism is difficult for guaranteeing between locating surface and machined surface.
Summary of the invention
Purpose of the present invention be exactly deficiency at existing flat surface grinding method, a kind of simple, engineering ceramics workpiece planarization method for grinding reliably is provided.
For solving above technical problem, the technical solution used in the present invention is: engineering ceramics workpiece planarization method for grinding, its difference is: use the abrasive wheel end face that rotates to press to the end face to be processed of engineering ceramics workpiece, with engineering ceramics workpiece baseplane is that locating surface develops workpiece head square position and carries out grinding, and described engineering ceramics workpiece lies on the workpiece head square position by the pin location.
By above scheme, described pin shelves are in the periphery of workpiece.
By above scheme, described engineering ceramics workpiece has hanging hole, and described pin passes its hanging hole.
By above scheme, the contacted card material of described workpiece head square position and engineering ceramics workpiece is a pottery.
By above scheme, described engineering ceramics workpiece is single work piece.
By above scheme, described engineering ceramics workpiece is a plurality of processing, adds the man-hour abrasive wheel end face and pushes down the big portion of a plurality of workpiece end face to be processed all the time.
By above scheme, described engineering ceramics workpiece is structural ceramics or function ceramics.
Engineering ceramics workpiece planarization method for grinding of the present invention need not glue, need not inhale, need not press from both sides, and is the simplest, saves time most and reliably, only utilizes grinding force " clamping " workpiece.
The principle of grinding force " clamping " workpiece: grinding force can be divided into orthogonal three component, promptly along the tangential tangential grinding force Ft of workpiece, and the normal grinding force F vertical with abrasive wheel end face
N, and along workpiece grinding force Fa radially because emery wheel " cutter tooth " thus be the effect that the negative rake workpiece is subjected to very big normal force, normal grinding force F
NGreater than tangential grinding force Ft.Common F
N/ Ft (grinding force ratio) is in the 1.5-3 scope, and what need proposition a bit is that grinding force is not only relevant with the sharp keen degree of emery wheel, and different with being ground the properties of materials difference.F during the grinding ordinary steel for example
N/ Ft=1.6-1.8, F during the grinding quench hardening steel
N/ Ft=1.9-2.6, F during grinding casting iron
N/ Ft=2.7-3.2, F during the grinding structural ceramics
N/ Ft=3.5-22, visible material is more crisp, and grinding force compares F
N/ Ft is bigger.
Because normal grinding force F
NMuch larger than tangential grinding force Ft (being main cutting force), F
NWorkpiece that produces and the frictional force between workpiece head square position make workpiece be adjacent to the square position greater than grinding main cutting force Ft.Do not produce mobilely when the flat surface grinding, this just is equivalent to workpiece bottom location, adds to be ground power " clamping " man-hour reliably, thereby successfully carries out grinding.
Description of drawings
Fig. 1 overlooks the mounting structure schematic diagram for the ceramic disk workpiece;
Fig. 2 overlooks the mounting structure schematic diagram for pottery fan template workpiece;
Fig. 3 be harden guiding principle square workpiece overlook the mounting structure schematic diagram;
Fig. 4 analyses and observe the mounting structure schematic diagram for the side of ceramic disk workpiece.
Tool is stopped embodiment
Further specify the specific embodiment of the invention below in conjunction with accompanying drawing.
As Fig. 1-shown in Figure 4, engineering ceramics workpiece planarization method for grinding, the end face of the emery wheel 1 of use rotation is pressed to the end face to be processed of engineering ceramics workpiece 2, with the baseplane of engineering ceramics workpiece 2 is that locating surface develops workpiece head square position 3 and carries out grinding, and described engineering ceramics workpiece 2 lies on the workpiece head square position 3 by pin 4 location.
Example 1: engineering ceramics workpiece planarization method for grinding such as Fig. 1, shown in Figure 4, engineering ceramics workpiece 2 has hanging hole 2-1, and described pin 4 passes its hanging hole 2-1, and the engineering ceramics workpiece 2 of collar plate shape hangs on the pin 4 on the workpiece head square position 3.Pin 4 centers are concentric with workpiece head square position 3, and engineering ceramics workpiece 2 just hanger bearing does not play the centering effect on pin 4, do not play clamping action yet.Engineering ceramics workpiece 2 is pressed to abrasive wheel end face in a cup emery wheel end face ring center line alignment pieces center, and emery wheel is with the linear velocity grinding work piece of 20-40 meter per second, and workpiece is finished the grinding on plane with 100-200 rev/min rotating speed feeding.
Do not have the frock clamping work pieces during grinding, only depend on the poor of different directions grinding force size, make frictional force between workpiece and the workpiece head square position greater than main cutting force, thereby can not slide adding the man-hour workpiece, flat surface grinding can be carried out smoothly.
My company
(aperture among the external diameter * thickness *)
Etc. the ceramic disk of specification, two planes need grinding, and flatness, the depth of parallelism all require in the 0.01mm, adopt grinding force " clamping " workpiece planarization method for grinding, all can meet the demands, and simple to operate, efficient is high.
For example
Two planes of product, 0.2 millimeter of correct grinding surplus is from being suspended on engineering ceramics workpiece 2 on the pin 4, the starting lathe finishes to grinding, takes off workpiece, and counter-rotating workpiece grinding another side needs 30 second time altogether, dimensional accuracy, flatness, the depth of parallelism all in 0.01mm, roughness Ra0.6um.
Clamping workpiece is very simple, anchor clamps are round piece head square positions, centre, round piece head square position embeds the earthenware slab of a 100*100*10mm, polish with the skive of itself on the lathe, eliminate end face run-out, the alignment pin of packing at the center then, the hole alignment pins of engineering ceramics workpiece hangs up, the abrasive wheel end face of rotation is pressed to workpiece, and the locating surface that workpiece develops anchor clamps carries out grinding.Do not find ceramic disk skidding on anchor clamps in the grinding, fully can stable mass and produce efficiently.
Example 2: as shown in Figure 2,
Fanning strip, the two-sided surplus 0.2mm of structural ceramics.As shown in Figure 3,100 * 50 * 10mm square, T8 hardened steel, two-sided surplus 0.1mm.Above-mentioned two class flat panel workpieces are processed on horizontal or vertical end face disk grinder, engineering ceramics workpiece planarization method for grinding such as Fig. 2, shown in Figure 3,4 grades of peripheries at engineering ceramics workpiece 2 of pin, emery wheel 1 end face are pressed to engineering ceramics workpiece 2 and are developed workpiece head square position 3 and carry out grinding.Dimensional accuracy, flatness, the depth of parallelism are in 0.01mm, and roughness 0.6-0.8 μ mRa loads and unloads and the time on processing two sides is 1 minute, the working (machining) efficiency height.
Above-mentioned ceramic workpiece flat surface grinding method can select to carry out single-piece work, also can select many processing carrying out simultaneously, adds the man-hour abrasive wheel end face and pushes down the big portion of a plurality of workpiece end face to be processed all the time.
Above-mentioned engineering ceramics workpiece can be selected structural ceramics or function ceramics.
The present invention not only is suitable for workpiece of each processing, and many processing simultaneously, is just adding the major part that requires man-hour abrasive wheel end face to push down to be processed of whole workpiece all the time.
Above embodiment is preferred embodiment of the present invention, is not any type of restriction is done in invention, and every foundation technological essence of the present invention all still belongs in protection scope of the present invention any simple modification, equivalent variations and modification that above embodiment did.
Claims (7)
1. engineering ceramics workpiece planarization method for grinding, it is characterized in that: use the abrasive wheel end face that rotates to press to the end face to be processed of engineering ceramics workpiece, with engineering ceramics workpiece baseplane is that locating surface develops workpiece head square position and carries out grinding, and described engineering ceramics workpiece lies on the workpiece head square position by the pin location.
2. engineering ceramics workpiece planarization method for grinding as claimed in claim 1 is characterized in that: described pin shelves are in the periphery of workpiece.
3. engineering ceramics workpiece planarization method for grinding as claimed in claim 1 is characterized in that: described engineering ceramics workpiece has hanging hole, and described pin passes its hanging hole.
4. as claim 1 or 2 or 3 described engineering ceramics workpiece planarization method for grinding, it is characterized in that: the contacted card material of described workpiece head square position and engineering ceramics workpiece is pottery.
5. the method for engineering ceramics workpiece planarization as claimed in claim 1 grinding is characterized in that: described engineering ceramics workpiece is single work piece.
6. the method for engineering ceramics workpiece planarization as claimed in claim 1 grinding is characterized in that: described engineering ceramics workpiece is a plurality of processing, adds the man-hour abrasive wheel end face and pushes down the big portion of a plurality of workpiece end face to be processed all the time.
7. the method for engineering ceramics workpiece planarization as claimed in claim 1 grinding is characterized in that: described engineering ceramics workpiece is structural ceramics or function ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110095682 CN102198616B (en) | 2011-04-18 | 2011-04-18 | Plane grinding method for engineering ceramic workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110095682 CN102198616B (en) | 2011-04-18 | 2011-04-18 | Plane grinding method for engineering ceramic workpiece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102198616A true CN102198616A (en) | 2011-09-28 |
| CN102198616B CN102198616B (en) | 2013-07-17 |
Family
ID=44659744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110095682 Expired - Fee Related CN102198616B (en) | 2011-04-18 | 2011-04-18 | Plane grinding method for engineering ceramic workpiece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102198616B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030278A (en) * | 1995-12-08 | 2000-02-29 | Tokyo Seimitsu Co., Ltd. | Surface machining method and apparatus |
| CN101407035A (en) * | 2007-10-10 | 2009-04-15 | 株式会社迪思科 | Grinding method for wafer |
| CN201350595Y (en) * | 2009-02-06 | 2009-11-25 | 洛阳轴研科技股份有限公司 | Polishing device for end surface of bearing ring |
-
2011
- 2011-04-18 CN CN 201110095682 patent/CN102198616B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030278A (en) * | 1995-12-08 | 2000-02-29 | Tokyo Seimitsu Co., Ltd. | Surface machining method and apparatus |
| CN101407035A (en) * | 2007-10-10 | 2009-04-15 | 株式会社迪思科 | Grinding method for wafer |
| CN201350595Y (en) * | 2009-02-06 | 2009-11-25 | 洛阳轴研科技股份有限公司 | Polishing device for end surface of bearing ring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102198616B (en) | 2013-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201026589Y (en) | Magnetorheological device for grinding and polishing plane surface | |
| CN201026588Y (en) | Magnetorheological apparatus for grinding and polishing curved surface | |
| KR20120102046A (en) | Polishing device for polygonal column member, and method for polishing same | |
| CN103111918A (en) | Method for finishing upper groove and narrow slit of workpiece | |
| CN106273005A (en) | Cutting tool and the assembling structure of cutting tool | |
| JP2019059020A (en) | Working grindstone | |
| KR100690660B1 (en) | Processing tool of surface pattern and processing method of using thereof | |
| CN203426874U (en) | Resin binder and ceramic binder composite cubic boron nitride plane grinding wheel | |
| JP2011224666A (en) | Cutting device | |
| CN102198616B (en) | Plane grinding method for engineering ceramic workpiece | |
| CN101722409B (en) | Cutter machining method and grinder for grinding cutter | |
| CN201271822Y (en) | Clamping tool for machining gem outer arc surface | |
| CN202716159U (en) | Clamping device of inclined undersurface workpiece | |
| TWM585686U (en) | Magnetic grinding machine | |
| CN203141327U (en) | Combined diamond grinding wheel | |
| CN209850545U (en) | Surface grinding machine for processing prismatic workpiece | |
| CN208961718U (en) | A kind of multi-angle polished lathe | |
| CN210499659U (en) | Composite plane polishing unit for processing expansion material | |
| CN203371401U (en) | Handheld grinding wheel sheet | |
| JP6812068B2 (en) | Processing method | |
| CN106514481A (en) | Double-surface grinding equipment | |
| CN202087841U (en) | High-speed automatic chamfering machine | |
| CN205996716U (en) | Reduce the piece knife sanding apparatus of emery wheel idle period | |
| CN110153882A (en) | A kind of rock sample fixture for surface grinding machine | |
| US20180009084A1 (en) | Abrading Disc |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20200418 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |