CN102193059B - Conveying mechanism of probe card, conveying method of probe card and probe device - Google Patents
Conveying mechanism of probe card, conveying method of probe card and probe device Download PDFInfo
- Publication number
- CN102193059B CN102193059B CN201110038311.3A CN201110038311A CN102193059B CN 102193059 B CN102193059 B CN 102193059B CN 201110038311 A CN201110038311 A CN 201110038311A CN 102193059 B CN102193059 B CN 102193059B
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- card
- probe card
- conveying mechanism
- probe
- mounting table
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention provides a conveying mechanism of a probe card, which can ensure an enough mechanical strength for the large-size probe card and can smoothly perform a replacement operation of the probe card. The conveying mechanism of the probe card according to the invention comprises the following components: a first card conveying mechanism (11) which conveys the probe card; and a second card conveying mechanism (12) which conveys the probe card (56) between the first card conveying mechanism (11) and an insertion ring (54), wherein, the first card conveying mechanism (11) is provided with a card holding tool (13) which is provided at a side of a head rotation driving mechanism (57) and transfers the probe card (56) between the first card conveying mechanism (11) and the second card conveying mechanism (12) and can advance and retreat. The second card conveying mechanism (12) is provided with the following components: a carrying platform (52) which conveys the probe card (56) between the first card conveying mechanism (11) and the insertion ring (54); and a first lifting mechanism, a second lifting mechanism and a third lifting mechanism (16A,16B,16C) which are provided at the periphery of the carrying platform (52), are seperated from one another for a preset distance and are mounted through a liftable mode.
Description
Technical field
The present invention relates to the conveying mechanism of probe card, the carrying method of probe card and probe unit, more specifically, the present invention relates to the side of the rotary drive mechanism side of the measuring head from probe unit simply to the conveying mechanism of the probe card that probe card is changed, the carrying method of probe card and probe unit.
Background technology
Probe unit generally includes: the load chamber carrying the semiconductor wafer as inspected body; The probe chamber that the electrical characteristic of carrying out semiconductor wafer checks.In load chamber, be equipped with conveying mechanism and the prealignment mechanism of semiconductor wafer, in load chamber, carry out the prealignment of semiconductor wafer during by conveying mechanism transport semiconductor wafers, give load chamber by the semiconductor wafer after prealignment.The mounting table of semiconductor wafer, aligning guide and probe card is equipped in probe chamber, the mounting table being placed with semiconductor wafer moves along X, Y, Z and θ direction, during this period, the aligning of semiconductor wafer is carried out by aligning guide, in the registered, make the probe electrical contact exactly of semiconductor wafer and probe card by mounting table, electrical characteristic inspection is carried out to semiconductor wafer.
But the kind according to semiconductor wafer suitably changes probe card.Therefore, in probe unit, be provided with the mechanism carrying probe card between the fixed part of the probe card of outside and embedded rings etc.The conveying mechanism of this probe card is such as documented in patent document 1 ~ 4.
A kind of card delivery section automatically changing mechanism for probe card is described in patent document 1.This card delivery section carries probe card between the outside and the card holding part of inside of testing fixture, but because card delivery section is arranged in testing fixture, therefore, must have special installation space for card delivery section, probe unit likely maximizes.
The mobile carrying mechanism of mobile mounting probe card between a kind of cartridge being arranged in probe unit and chuck is described in patent document 2.In the case, because the cartridge of probe card and mobile carrying mechanism are arranged in probe unit, therefore, probe unit also likely maximizes.The chuck used in this probe unit is the part of stationary probe card, has the function of carrying probe card between the delivery position and probe card erecting bed of probe card.Like this, the conveying mechanism having the fixed part of probe card concurrently is also documented in patent document 3.Probe card conveying mechanism described in patent document 3 carries probe card between the outside and the fixed part of probe card of probe unit, therefore, when carrying probe card, under the state opening the shutter door being positioned at side, carries probe card.
A kind of probe card conveying mechanism is described in patent document 4.This probe card conveying mechanism comprises: the transfer dish of conveying probe card; Transfer dish is moved the guide rail of guiding to throughput direction; The mounting table of probe card is carried between transfer dish and the installation portion of probe card.Herein, transfer dish and guide rail are arranged on a side of probe unit according to the mode that can fold, and when carrying probe card, transfer dish and guide rail being erected and after keeping level, the probe card be positioned on transfer dish is delivered to mounting table.In the case, probe card conveying mechanism is arranged on the front of the passage side of probe unit according to the mode that can fold, therefore, without the need to special installation space in probe unit, the miniaturization of probe unit can be realized, and, mechanism is simple, with low cost.
Patent document 1 Japanese Unexamined Patent Publication 2008-016676 publication
Patent document 2 Japanese Unexamined Patent Publication 6-045416 publication
Patent document 3 Japanese Unexamined Patent Publication 2003-177158 publication
Patent document 4 Japanese Unexamined Patent Publication 2001-024039 publication
Summary of the invention
Invent technical task to be solved
But, in the probe card conveying mechanism described in patent document 4, because transfer dish and guide rail fold, therefore, when large-scale and overweight probe card, if erect transfer dish and guide rail and make it be in level, so, mechanical strength will be not enough, in addition, due to transfer dish and guide rail outstanding to passage side, therefore, there is technical problem in the operability in narrow passage.In the case, also open shutter door and then carry probe card, therefore, particularly when the probe unit that the low temperature carrying out subzero about 50 DEG C checks, door is opened when carrying probe card, exist in a large amount of outside air accesss to plant, being set to frosting above the mounting table etc. of low temperature, such problem of freezing.
The present invention produces to solve above-mentioned technical task, its object is to, even provide a kind of larger probe card also can guarantee enough mechanical strengths, successfully can carry out the conveying mechanism of probe card of the replacement operation of probe card, the carrying method of probe card and probe unit simultaneously.In addition, the present invention can also provide a kind of and also can suppress frosting, the conveying mechanism of icing probe card, the carrying method of probe card and probe unit significantly when low temperature inspection.
Solve the technological means of problem
The conveying mechanism of the probe card described in technical scheme 1 of the present invention, is characterized in that, comprising: the first card conveying mechanism carrying described probe card in order to load and unload probe card on the embedded rings of probe unit; And between described first card conveying mechanism and described embedded rings, carry the second card conveying mechanism of described probe card, described first card conveying mechanism has: be arranged on and make measuring head rotate the rotary drive mechanism side to described embedded rings and between described first card conveying mechanism and described second card conveying mechanism, carry out the card holder that can retreat of the handing-over of described probe card, described second card conveying mechanism has: the mounting table of carrying described probe card between described first card conveying mechanism and described embedded rings; With around described mounting table, according to mutually vacating the interval of regulation and the mode that can be elevated arranges and join the elevating mechanism of described probe card between described first card conveying mechanism and described mounting table.
The conveying mechanism of the probe card described in technical scheme 2 of the present invention, it is characterized in that, on the basis of technical scheme 1, described first card conveying mechanism is configured in the outside of shutter door, described shutter door is used for opening or closing the opening portion of the side of the described rotary drive mechanism side being formed in described probe unit, and described shutter door only just opens described opening portion when the card holder of described first card conveying mechanism passes in and out in described probe unit.
The conveying mechanism of the probe card described in technical scheme 3 of the present invention, is characterized in that, on the basis of technical scheme 1 or technical scheme 2, described first card conveying mechanism has: the multiple substrates be stacked; With the straight ahead driving mechanism making each substrate straight ahead described, described card holder is arranged on the described substrate of the superiors, the straight ahead by described straight ahead driving mechanism.
Probe card conveying mechanism described in technical scheme 4 of the present invention, is characterized in that, on the basis any one of technical scheme 1 ~ technical scheme 3, described first card conveying mechanism and described elevating mechanism have the sensor for detecting described probe card respectively.
Probe card conveying mechanism described in technical scheme 5 of the present invention, is characterized in that, on the basis any one of technical scheme 1 ~ technical scheme 4, described elevating mechanism has the positioning element positioned described probe card.
Probe card carrying method described in technical scheme 6 of the present invention, it is characterized in that, the method comprises: rotate in the first card conveying mechanism of the rotary drive mechanism side of the embedded rings to described probe unit and arrange the operation of probe card being arranged at the measuring head making probe unit use; The card holder straight ahead of described first card conveying mechanism, is delivered to the operation of the second card conveying mechanism arranged in described probe unit by described probe card; The supporter of multiple elevating mechanisms of described second card conveying mechanism rises, and then supports the operation of described probe card; The mounting table and the described multiple elevating mechanism that arrange in the inner side of described multiple elevating mechanism rise integratedly, then accept described probe card from described card holder, while the described card holder operation that retreats from described mounting table; Be elevated integratedly with described mounting table and described elevating mechanism, described probe card delivered to the operation of described embedded rings.
Probe card carrying method described in technical scheme 7 of the present invention, it is characterized in that, on the basis of technical scheme 6, when taking off the described probe card be installed in described embedded rings, described probe card, according to the operation contrary with above-mentioned operation, is carried from described embedded rings to described rotary drive mechanism side by first, second card conveying mechanism described.
Probe card carrying method described in technical scheme 8 of the present invention, it is characterized in that, on the basis of technical scheme 6 or technical scheme 7, in the side of the described rotary drive mechanism side of described probe unit, shutter door is set, when utilizing first, second card conveying mechanism described to carry described probe card, described shutter door is opened.
Probe unit described in technical scheme 9 of the present invention, is characterized in that, comprising: be installed in embedded rings middle probe card; The mounting table of the inspected body arranged according to the mode that can move to below described probe card; In order to described probe card conducting, make described measuring head rotate to the rotary drive mechanism of described embedded rings; In order to mount and dismount described probe card, between described rotary drive mechanism and described embedded rings, carry the conveying mechanism of the probe card of described probe card, the probe card conveying mechanism of conveying mechanism according to any one of technical scheme 1 ~ 5 of described probe card is formed.
Invention effect
According to the present invention, even a kind of larger probe card can be provided also to guarantee enough mechanical strengths, successfully can carry out the conveying mechanism of probe card of the replacement operation of probe card, the carrying method of probe card and probe unit simultaneously.In addition, can also provide a kind of and also can suppress frosting, the conveying mechanism of icing probe card, the carrying method of probe card and probe unit significantly when low temperature inspection.
Accompanying drawing explanation
Fig. 1 (a), (b) are the figure of the embodiment representing probe unit of the present invention respectively, a () represents that probe card is by the top view of state be positioned in the card holder of probe card conveying mechanism, (b) is its side view.
Fig. 2 (a), (b) are the figure representing the first card conveying mechanism that the probe card conveying mechanism shown in Fig. 1 uses respectively, a () is the stereogram of the state represented when arranging probe card, top view when (b) is conveying probe card.
Fig. 3 (a), (b) are the figure representing the second card conveying mechanism that probe card conveying mechanism uses respectively, and (a) is its top view, and (b) is the side view representing the action of lifting probe card from mounting table.
Fig. 4 (a), (b) are the figure being illustrated respectively in the shutter door that the side of the rotary drive mechanism side of the probe unit shown in Fig. 1 is installed, a () is the front view from inner face representing shutter door closed condition, (b) is the front view from inner face representing shutter door open mode.
Fig. 5 (a) ~ (d) is illustrated respectively in the process chart joining the action of probe card between the first card conveying mechanism of the probe card conveying mechanism shown in Fig. 2 and the second card conveying mechanism.
Symbol description
10 probe card conveying mechanisms
11 first probe card conveying mechanisms
12 second probe card conveying mechanisms
13 card holders
14A, 14B, 14C, 14D substrate
15A, 15B, 15C, 15D straight ahead driving mechanism
16A, 16B, 16C elevating mechanism
50 probe units
52 mounting tables
51C shutter door
Detailed description of the invention
Below, the embodiment according to Fig. 1 ~ Fig. 5 illustrates the present invention.
Probe card conveying mechanism (hereinafter referred to as " conveying mechanism ") 10 of present embodiment, as shown in Fig. 1 (a), (b), is arranged in the probe unit 50 of present embodiment, and uses when changing probe card.
As shown in Fig. 1 (a), (b), the probe unit 50 of present embodiment comprises: the load chamber (not shown) of transport semiconductor wafers (not shown); With the detecting chamber 51 that the electrical characteristic of carrying out semiconductor wafer checks, in load chamber, under the control of control device (not shown), prealignment semiconductor wafer, then carries to detecting chamber 51, carries out the electrical characteristic inspection of semiconductor wafer in detecting chamber 51.Detecting chamber 51 comprises: according to the mounting table 52 (with reference to Fig. 3) that can arrange along the mode of X, Y, Z and θ direction movement; Above this mounting table 52, be fixed on the embedded rings 54 in the hole 53A of the substantial middle position being formed at a plate 53; By the probe card 56 that clip tool 55 is kept dismantledly relative to embedded rings 54; With the front of detecting chamber 51 (right side of Fig. 1 (a)) for benchmark, be arranged on left surface (downside of Fig. 1 (a)) and make the head rotary drive mechanism 57 that measuring head (not shown) rotates.Head rotary drive mechanism 57 comprises: the driving shaft 57A linked with measuring head; With the drive motors (not shown) making this driving shaft 57A rotary actuation, the instruments such as drive motors are incorporated in shell 57B.Passage is formed in the front of probe unit 50.The revolution space of head rotary drive mechanism 57 is formed at the left surface of probe unit 50.In addition, in Fig. 1 (a), 56A is the strengthening part strengthening probe card 56.
When the electrical characteristic of carrying out semiconductor wafer checks, in detecting chamber 51, in mounting table 52 along during the movement of X, Y, Z and θ direction, aimed at by the probe (not shown) of aligning guide (not shown) to multiple electrode pad of semiconductor wafer and probe card 56, then, the dial feed carrying out semiconductor wafer implements the electrical characteristic inspection of semiconductor wafer.When a kind of inspection of semiconductor wafer terminates, when carrying out the electrical characteristic inspection of different semiconductor wafers, change probe card 56.Now use conveying mechanism 10.Below, conveying mechanism 10 is described.
As shown in Fig. 1 (a), (b), the conveying mechanism 10 of present embodiment is arranged on the pedestal 58 of the probe unit 50 below the driving shaft 57A being formed at a rotary drive mechanism 57.As shown in the drawing, this conveying mechanism 10 comprises: the first card conveying mechanism 11 (with reference to Fig. 2) carrying probe card 56 between in the pedestal 58 protruding outside and detecting chamber 51 of detecting chamber 51; And between the first card conveying mechanism 11 and embedded rings 54, carry the second card conveying mechanism 12 (with reference to Fig. 3) of probe card 56, carry probe card 56 under control of the control means.When probe card 56 is installed on embedded rings 54, first card conveying mechanism 11 is by the lateral delivered inside of probe card 56 from detecting chamber 51, second card conveying mechanism accepts probe card 56 from the first card conveying mechanism 11, is then delivered to the installation position of the probe card 56 of embedded rings 54.Embedded rings by clamping part fix by the second card conveying mechanism 12 the probe card 56 of carrying.When pulling down probe card 56 from embedded rings 54, conveying mechanism 10 carries probe card 56 in the opposite direction along with side when installing probe card 56.
As shown in Fig. 2 (a), (b), the first card conveying mechanism 11 comprises: the card holder 13 of clamping probe card 56 (representing clip tool 55 in Fig. 2 (a)); According to first, second, third, fourth substrate 14A, 14B, 14C, the 14D overlapped from the mode of downside support card holder 13 multiple (being 4 pieces in Fig. 2 (a)); Make first, second, third, fourth straight ahead driving mechanism 15A, 15B, 15C, 15D of substrate 14A, 14B, 14C beyond card holder 13 and orlop straight ahead individually respectively.
As shown in Fig. 2 (b), card holder 13 has: a pair card holding member 13A of elongated shape; The connecting member 13B of a pair card holding member 13A is linked at cardinal extremity; To be separately positioned on a pair card holding member 13A and to embed the alignment pin 13C for locating in the recess (not shown) of clip tool 55; For the card sensor 13D of detector probe card 56, by card sensor 13D, the probe card 56 be arranged in card holder 13 is detected with the inner side being arranged on each alignment pin 13C.
As shown in Fig. 2 (a), (b), the first straight ahead driving mechanism 15A of card holder 13 by configuring on first substrate 14A, along the throughput direction straight ahead of probe card 56 on first substrate 14A.This first straight ahead driving mechanism 15A such as has: the two pair roller 15A configured in the front and back of the throughput direction both sides of first substrate 14A
1; Be wound on two pair roller 15A respectively
1on endless belt 15A
2; With at endless belt 15A
2inner side and endless belt 15A
2the pair of guide rails 15A arranged abreast
3, pair of guide rails 15A
3the groove formed with the lower surface at a pair card holding member 13A engages.The roller 15A of front and back
1, 15A
1in one form driven roller, another forms driven voller.Endless belt 15A
2linked by the lower surface of connecting piece (not shown) with a pair card holding member 13A.Therefore, if the first straight ahead driving mechanism 15A drives, endless belt 15A
2by two pair roller 15A
1rotate, so, card holder 13 by connecting piece on first substrate 14A along with pair of guide rails 15A
3from first substrate 14A along the throughput direction straight ahead of probe card 56.
In addition, as shown in Fig. 2 (b), first substrate 14A is also arranged through the reseting sensor 14A of the connecting member 13B test card holder 13 of card holder 13
1, reseting sensor 14A
1detect the card holder 13 resetted on first substrate 14A.
As shown in Fig. 2 (a), the tip side of first substrate 14A is divided into two strands to support a pair card holding member 13A.As shown in Fig. 2 (a), (b), the second straight ahead driving mechanism 15B of this first substrate 14A by configuring on second substrate 14B, along the throughput direction straight ahead of probe card 56 on second substrate 14B.This second straight ahead driving mechanism 15B such as has: at cylinder mechanism 15B such as the cylinders that the roughly centre position of the width of second substrate 14B configures along throughput direction
1; With at cylinder mechanism 15B
1both sides and cylinder mechanism 15B
1the pair of guide rails 15B configured abreast
2, pair of guide rails 15B
2the groove formed with the lower surface at first substrate 14A engages.Herein, cylinder mechanism 15B
1masthead end and the lower surface of first substrate 14A link.Therefore, if the cylinder mechanism 15B of the second straight ahead driving mechanism 15B
1drive, so, first substrate 14A just on second substrate 14B, along pair of guide rails 15B
2to the throughput direction straight ahead of probe card 56.
As shown in Fig. 2 (b), second substrate 14B is provided with the turnover sensor 14B for detecting first substrate 14A
1, by turnover sensor 14B
1do not detect first substrate 14A, thus card holder 13 is detected along the turnover of throughput direction by first substrate 14A.
As shown in Fig. 2 (a), the three straight ahead driving mechanism 15C of second substrate 14B by configuring on the 3rd substrate 14C, along the throughput direction straight ahead of probe card 56 on the 3rd substrate 14C.3rd straight ahead driving mechanism 15C has: the pair of rolls 15C configured in the front and back of the inner side of the 3rd substrate 14C
1; Be wound on pair of rolls 15C respectively
1on endless belt 15C
2; With at endless belt 15C
2both sides, with endless belt 15C
2the pair of guide rails 15C arranged abreast
3, pair of guide rails 15C
3the groove formed with the lower surface at second substrate 14B engages.Same with the first straight ahead driving mechanism 15A, pair of rolls 15C
1be made up of driven roller and driven voller.Therefore, if the 3rd straight ahead driving mechanism 15C starts to drive, endless belt 15C
2by pair of rolls 15C
1rotate, so, second substrate 14B just on the 3rd substrate 14C, along pair of guide rails 15C
3from second substrate 14B to the throughput direction straight ahead of probe card 56.
In addition, as shown in Fig. 2 (b), with the 3rd substrate 14C on the first substrate 14A of second substrate 14B, the reseting sensor 14A of test card holder 13 is set
1, reseting sensor 14A
1reset on the second substrate 14B of test card holder 13.
As shown in Fig. 2 (a), the four straight ahead driving mechanism 15D of the 3rd substrate 14C by configuring on tetrabasal 14D, along the throughput direction straight ahead of probe card 56 on tetrabasal 14D.Same with the second straight ahead driving mechanism 15B, the 4th straight ahead driving mechanism 15D has: cylinder mechanism 15D
1; With at cylinder mechanism 15D
1both sides, with cylinder mechanism 15D
1the pair of guide rails 15D set up abreast
2, pair of guide rails 15D
2the groove formed with the lower surface at the 3rd substrate 14C engages.Therefore, if the cylinder 15D of the 4th straight ahead driving mechanism 15D
1start drive, so, the 3rd substrate 14C just on tetrabasal 14D, along pair of guide rails 15D
2to the throughput direction straight ahead of probe card 56.
On tetrabasal 14D, detect the front and back pair of sensors 14D of the straight ahead of the 3rd substrate 14C
3be separately positioned on the front and back of throughput direction, the sensor 14D of front and back
3detect the 3rd substrate 14C, and detect the 3rd substrate 14C from tetrabasal 14D along the straight ahead of the front and back of throughput direction.This tetrabasal 14D is fixed on the pedestal 58 outstanding to head rotary drive mechanism 57 side from detecting chamber 51.
First card conveying mechanism 11, in detecting chamber 51, carries out the handing-over of probe card 56 between the second card conveying mechanism 12.As shown in Fig. 3 (a), (b), this second card conveying mechanism 12 has: along the mounting table 52 of horizontal direction and above-below direction movement; With around mounting table 52, circumferentially separate such as three first, second, third elevating mechanisms 16A, 16B, 16C of equally spaced arranging, in mounting table 52, carried out the handing-over of probe card 56 by first, second, third elevating mechanism 16A, 16B, 16C.Mounting table 52 is for loading semiconductor wafer.
As shown in Fig. 3 (a), (b), first, second, third elevating mechanism 16A, 16B, 16C is all formed based on cylinder mechanism, and arranges at the masthead end of cylinder mechanism and be used for the supporter 16A of supporting probe card 56
1, 16B
1, 16C
1.As shown in Fig. 3 (a), (b), first, second elevating mechanism 16A, 16B have the supporter different from the 3rd elevating mechanism 16C.
As shown in Fig. 3 (a), (b), at the supporter 16A of first, second elevating mechanism 16A, 16B
1, 16B
1upper surface be formed with the supporting surface 16A of support card fixture 55 respectively
2, 16B
2with than each supporting surface 16A
2, 16B
2low low plane 16A
3, 16B
3.As shown in Fig. 3 (b), at each low plane 16A
3, 16B
3on, be embedded in the alignment pin 16A in the recess 55A that the lower surface of clip tool 55 is formed
4, 16B
4with each supporting surface 16A
2, 16B
2adjacent and establish.These alignment pins 16A
4, 16B
4according to from each supporting surface 16A
2, 16B
2height outstanding upward, is formed accordingly with the alignment pin 13C of card holder 13, and embeds in the recess 55A of clip tool 55, towards the direction that probe card 56 is arranged on embedded rings 54 can being positioned.In addition, as shown in Fig. 3 (b), the alignment pin 16A of first, second elevating mechanism 16A, 16B
4, 16B
4the height of below or its height identical with the height of the mounting surface of mounting table 52 is set at initial position.
As shown in Fig. 3 (a), at each low plane 16A
3, 16B
3on, the card detecting sensor 16A whether detector probe card 56 exists
5, 16B
5respectively with supporting surface 16A
2, 16B
2adjacent and establish.At the supporter 16C of the 3rd elevating mechanism 16C
1on be only formed with supporting surface 16C
2, at this supporting surface 16C
2on alignment pin or sensor are not set.Be separated with the mounting surface of mounting table 52 by the top of multiple probe 56A of the probe card 56 of first, second, third elevating mechanism 16A, 16B, 16C support, would not damage like this (with reference to Fig. 5).In addition, the respective supporting surface of first, second, third elevating mechanism 16A, 16B, 16C is all set to identical height.
When the second card conveying mechanism 12 joins probe card between it and the first card conveying mechanism 11 or embedded rings 54, if the card detecting sensor 16A of first, second elevating mechanism 16A, 16B
5, 16B
5detect probe card 56, so, the supporter 16A of first, second, third elevating mechanism 16A, 16B, 16C
1, 16B
1, 16C
1will synchronously rise respectively, the alignment pin 16A of first, second elevating mechanism 16A, 16B
4, 16B
4embed in the recess 55A of clip tool 55, lifting by each supporting surface 16A from the card holder 13 of the first card conveying mechanism 11
2, 16B
2, 16C
2after the probe card 56 supported, first, second, third elevating mechanism 16A, 16B, 16C under this state and mounting table 52 rise in embedded rings 54 integratedly.Start working at the clamp system of this position embedded rings 54, probe card 56 is fixed in embedded rings 54 by clip tool 55.
When not using the first card conveying mechanism 11, first, second, third, fourth substrate is vertically stacked, card holder 13 is at the first substrate superimposed layer of the superiors, and immediately below the driving shaft 57A being incorporated in a rotary drive mechanism 57, relative with the side (sidewall) of detecting chamber 51.As shown in Fig. 4 (a), (b), at formation opening portion, the top 51B of the sidewall 51A of the relative detecting chamber 51 of the first card conveying mechanism 11.This sidewall 51A is provided with the shutter door 51C for opening and closing opening portion 51B.This shutter door 51C is driven up and down by the driving mechanism for opening or closing 51D be made up of a pair cylinder etc. of the left and right sides setting in face within it, thus opens or closes opening portion 51B.In addition, arrange opening and closing sensor 51F at the inner surface of sidewall 51A, this opening and closing sensor 51F is by detecting the opening and closing confirming shutter door 51C to the detected portion 51E of the bottom being arranged at shutter door 14.When not using the first card conveying mechanism 11, this shutter door 51C closes opening portion 51B, by detecting chamber 51 and external environment.
Minimal aperture area required when opening portion 51B is formed as carrying probe card 56, namely, card holder 13 and first substrate 14A only by area, when carry probe card 56 time supply dry air, make outside air enter as far as possible and be set in the detecting chamber 51 of malleation.Particularly when the low temperature carrying out semiconductor wafer checks, because the mounting table in detecting chamber 51 is set to the low temperature of such as subzero 50 DEG C, therefore, if outside air enters, so, in mounting table 52 grade will frosting, freeze, therefore, must, to its operation of thawing, disposal ability be caused to decline.For this point, in the present embodiment, because opening portion 51B forms minimal area, and the conveying mechanism 10 of probe card achieves automation, therefore, probe card 56 can not only be carried at short notice, shorten the replacement operation of probe card 56, and can suppress and prevent to freeze in mounting table 52 etc.
Below, with reference to Fig. 1 ~ Fig. 5, an embodiment of the carrying method using the probe card of the present invention of the conveying mechanism 10 of the probe card of present embodiment is described.When probe card 56 is arranged on embedded rings 54, first, under control of the control means, the the 3rd, the 4th straight ahead driving mechanism 15C, 15D of first card conveying mechanism 11 synchronously drives, 3rd substrate 14C on tetrabasal 14D to the direction straight ahead of the sidewall 51A away from detecting chamber 51, meanwhile, second substrate 14B on the 3rd substrate 14C to the direction straight ahead identical with the 3rd substrate 14C, if the sensor 14D on tetrabasal 14D
3detect the top of the 3rd substrate 14C, so, the 3rd, the 4th straight ahead driving mechanism 15C, 15D will stop, and the first card conveying mechanism 11 becomes the state shown in Fig. 1 (a).Now, first, second straight ahead driving mechanism 15A, 15B do not drive, and therefore, card holder 13 and second substrate 14B are in the state being stacked and being accommodated on the 3rd substrate 14C.In this case, as shown in Fig. 1 (a), with alignment pin 13C for benchmark, card holder 13 loads probe card 56.So, even if card holder 13 extends to the outside of detecting chamber 51, owing to being the revolution space of measuring head herein, therefore, the passage of the face side of probe unit 50 can not be hindered.
If probe card 56 is positioned in card holder 13, the reverse driving of the 3rd, the 4th straight ahead driving mechanism 15C, 15D, card holder 13 and first, second, third substrate 14A, 14B, 14C return initial position, so, sensor 14D
3detect the 3rd substrate, temporarily overlapping up and down.Then the shutter door 51C of the sidewall 51A of detecting chamber 51 is opened by driving mechanism for opening or closing 51D, simultaneously, first, second straight ahead driving mechanism 15A, 15B start to drive, card holder 13 and first substrate 14A are only passed in and out at a certain distance by opening portion 51B in detecting chamber 51, when probe card 56 in card holder 13 arrives directly over the mounting table 52 of the second card conveying mechanism 12, first, second straight ahead driving mechanism 15A, 15B stop.
As shown in Fig. 5 (a), if probe card 56 arrives directly over mounting table 52, so, as shown in this figure (b), first, second, third elevating mechanism 16A, 16B, 16C starts to drive, each supporter 16A
1, 16B
1, 16C
1supporting surface 16A
2, 16B
2rise and exceed the mounting surface of mounting table 52.Even if each supporter 16A
1, 16B
1, 16C
1arrive rising end, each alignment pin 16A
4, 16B
4also clip tool 55 can not be arrived.Then, the lift drive mechanism of mounting table 52 starts to drive, and mounting table 52 and each elevating mechanism 16A, 16B, 16C rise integratedly, as shown in this figure (c), and the alignment pin 16A of first, second elevating mechanism 16A, 16B
4, 16B
4embed respectively in the recess 55A of clip tool 55, meanwhile, each supporter 16A
1, 16B
1, 16C
1supporting surface 16A
2, 16B
2contact with the lower surface of clip tool 55, with stable state supporting probe card 56.And, if mounting table 52 and each elevating mechanism 16A, 16B, 16C rise integratedly, so, as shown in this figure (d), risen from card holder 13 by the probe card 56 that each elevating mechanism 16A, 16B, 16C support, end probe card 56 is from card holder 13 to the handing-over of the second card conveying mechanism 12.Now, the first card conveying mechanism 11 starts to drive, and card holder 13 and first substrate 14A retreat and return initial position, and meanwhile, shutter door 51C closes opening portion 51B, by interior for detecting chamber 51 and external environment.
Then, if mounting table 52 and each elevating mechanism 16A, 16B, 16C rise integratedly, so, probe card 56 enters in embedded rings 54.In this case, in embedded rings 54, clamp system is started working, and probe card 56 is fixed in embedded rings 54, the installation of end probe card 56, and meanwhile, mounting table 52 and each elevating mechanism 16A, 16B, 16C decline, and return initial position respectively.Now, if probe card 56 is not arranged on embedded rings 54, but stay on the second card conveying mechanism 12, so, can be confirmed this by card sensor 13D.
When changing probe card 56 after the inspection terminating semiconductor wafer, the first card conveying mechanism 11 starts to drive, and meanwhile, shutter door 51C opens opening portion 51B, and as mentioned above, card holder 13 and first substrate 14A are passed in and out in detecting chamber 51 by opening portion 51B.Meanwhile, the second card conveying mechanism 12 starts to drive, and mounting table 52 rises towards embedded rings 54, meanwhile, and the supporter 16A of first, second, third elevating mechanism 16A, 16B, 16C
1, 16B
1, 16C
1rise to rising end, accept probe card 56.Then, with under the state of each elevating mechanism 16A, 16B, 16C supporting probe card 56, mounting table 52 declines integratedly, and arrive standby card holder 13, probe card 56 is kept by card holder 13.And, each supporter 16A of each elevating mechanism 16A, 16B, 16C
1, 16B
1, 16C
1decline, join probe card 56 from the second card conveying mechanism 12 to card holder 13, then, if card holder 13 and first substrate 14A retreat, and exit to the outside of detecting chamber 51, so, shutter door 51C will close opening portion 51B, by interior for detecting chamber 51 and external environment.
In the first card conveying mechanism 11, after card holder 13 and first substrate 14A return initial position, three, the 4th straight ahead driving mechanism 15C, 15D drives, card holder 13 becomes the state shown in Fig. 2 (a), if remove probe card 56 from card holder 13, so, the 3rd, the 4th straight ahead driving mechanism 15C, 15D will reversely drive, card holder 13 returns initial position, the dismounting of end probe card 56.
As discussed above, according to the present embodiment, the the first card conveying mechanism 11 forming the conveying mechanism 10 of probe card is arranged on a rotary drive mechanism 57 side, therefore, even if probe card 56 maximizes, also the first card conveying mechanism 11 can be utilized in the revolution space of head rotary drive mechanism 57 to carry probe card 56, successfully probe card 56 is changed to embedded rings 54, and, first card conveying mechanism 11 is flatly configured on pedestal 58, therefore, the conveying operations of probe card 56 is stablized, and can guarantee the mechanical strength of the first card conveying mechanism 11 fully.
According to the present embodiment, first card conveying mechanism 11 is arranged on the outside of shutter door 51C, this shutter door 51C is used for opening or closing the opening portion 51B formed on the sidewall 51A of head rotary drive mechanism 57 side, shutter door 51C only just opens opening portion 51B when the card holder 13 of the first card conveying mechanism 11 passes in and out in detecting chamber 51, therefore, can not only suppress in outside air intrusion detection room 51, but also the frosting in mounting table 52 when low temperature checks can be prevented, freeze, thus the disposal ability of inspection can be improved.
According to the present embodiment, the first card conveying mechanism 11 has: first, second, third, fourth substrate 14A, 14B, 14C, 14D of lamination; With first, second, third, fourth straight ahead driving mechanism 15A, 15B, 15C, the 15D making each substrate straight ahead, because card holder 13 is arranged on first substrate 14A, and utilize each straight ahead driving mechanism straight ahead, therefore, the miniaturization of the conveying mechanism 10 of probe card can not only be realized, and the automation of the conveying operations of probe card 56 can be realized.
According to the present embodiment, the first card conveying mechanism 11 and first, second elevating mechanism 16A, 16B have sensor 13D, 16A of detector probe card 56 respectively
5, 16B
5, therefore, in first, second card conveying mechanism 11,12, can reliably detector probe card 56, and can reliably prevent the conveying of probe card 56 from omitting.In addition, first, second elevating mechanism 16A, 16B has the alignment pin 16A of probe card 56
4, 16B
4, therefore, can not only reliably carry out the location of probe card 56 on embedded rings 54, and reliably can prevent the handling mistake of probe card 56.
In addition, the present invention is not limited to above-mentioned embodiment, suitably can design as required and change each inscape.
Claims (7)
1. a conveying mechanism for probe card, is characterized in that, comprising:
First card conveying mechanism of conveying probe card, for loading and unloading described probe card on the embedded rings of probe unit; With
The second card conveying mechanism of described probe card is carried, wherein between described first card conveying mechanism and described embedded rings
Described probe card is kept relative to described embedded rings dismantledly by clip tool,
Described first card conveying mechanism has: be arranged on and make measuring head rotate the rotary drive mechanism side to described embedded rings and between described first card conveying mechanism and described second card conveying mechanism, carry out the card holder that can retreat of the handing-over of described probe card; Multiple substrates of lamination; With the straight ahead driving mechanism making described each substrate straight ahead, described card holder is arranged on the described substrate of the superiors, and by described straight ahead driving mechanism straight ahead,
Described second card conveying mechanism has: the mounting table of carrying described probe card between described first card conveying mechanism and described embedded rings; And according to being spaced from each other predetermined distance and the mode that can be elevated arranges and join first, second, third elevating mechanism of described probe card between described first card conveying mechanism and described mounting table around described mounting table,
Described first, second, third elevating mechanism is all formed based on cylinder mechanism, and arranges at the masthead end of cylinder mechanism the supporter being used for supporting described probe card,
The supporting surface and the low plane lower than each supporting surface that support described clip tool is formed respectively at the upper surface of the supporter of first, second elevating mechanism described, on each low plane, be embedded in alignment pin in the recess that the lower surface of described clip tool is formed adjacent with each supporting surface and establish
On each low plane, detect card detecting sensor that whether described probe card exist adjacent with supporting surface respectively and establish.
2. the conveying mechanism of probe card as claimed in claim 1, is characterized in that:
Described first card conveying mechanism is configured in the outside of shutter door, the opening portion that this shutter door is formed on the side of the described rotary drive mechanism side of described probe unit for opening and closing, wherein, described shutter door only just opens described opening portion when the card holder of described first card conveying mechanism passes in and out in described probe unit.
3. the conveying mechanism of probe card as claimed in claim 1 or 2, is characterized in that:
Described first card conveying mechanism has the sensor for detecting described probe card.
4. a carrying method for probe card, is characterized in that, comprising:
The operation of probe card is set in the first card conveying mechanism, described first card conveying mechanism is arranged on the rotary drive mechanism side that the measuring head that probe unit is used rotates the embedded rings to described probe unit, and described probe card is kept relative to described embedded rings dismantledly by clip tool;
The card holder straight ahead of described first card conveying mechanism, is delivered to the operation of the second card conveying mechanism be arranged in described probe unit by described probe card;
The supporter of multiple elevating mechanisms of described second card conveying mechanism rises, and supports the operation of described probe card;
The mounting table and the described multiple elevating mechanism that are arranged on the inner side of described multiple elevating mechanism rise integratedly, accept described probe card from described card holder, and the operation that described card holder retreats from described mounting table; With
Described mounting table and described elevating mechanism are elevated integratedly, described probe card are delivered to the operation of described embedded rings,
Multiple elevating mechanisms of described second card conveying mechanism refer to around described mounting table according to being spaced from each other predetermined distance and the mode that can be elevated arranges and join first, second, third elevating mechanism of described probe card between described first card conveying mechanism and described mounting table
Described first, second, third elevating mechanism is all formed based on cylinder mechanism, and arranges at the masthead end of cylinder mechanism the supporter being used for supporting described probe card,
The supporting surface and the low plane lower than each supporting surface that support described clip tool is formed respectively at the upper surface of the supporter of first, second elevating mechanism described, on each low plane, be embedded in alignment pin in the recess that the lower surface of described clip tool is formed adjacent with each supporting surface and establish
On each low plane, detect card detecting sensor that whether described probe card exist adjacent with supporting surface respectively and establish.
5. the carrying method of probe card as claimed in claim 4, is characterized in that:
When unloading the described probe card of installing on described embedded rings, described probe card, through the operation contrary with above-mentioned operation, is transported to described rotary drive mechanism side from described embedded rings by described first card conveying mechanism and the second card conveying mechanism.
6. the carrying method of the probe card as described in claim 4 or 5, is characterized in that:
Arrange shutter door in the side of the described rotary drive mechanism side of described probe unit, when carrying described probe card by described first card conveying mechanism and the second card conveying mechanism, described shutter door is opened.
7. a probe unit, is characterized in that, comprising:
Be arranged on the probe card on embedded rings; The mounting table of the inspected body arranged according to the mode that can move to below described probe card; Measuring head is rotated to described embedded rings with the rotary drive mechanism with described probe card conducting; And between described rotary drive mechanism and described embedded rings, carry described probe card to load and unload the conveying mechanism of the probe card of described probe card, wherein
The probe card conveying mechanism of conveying mechanism according to any one of claims 1 to 3 of described probe card is formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-028521 | 2010-02-12 | ||
| JP2010028521A JP5517344B2 (en) | 2010-02-12 | 2010-02-12 | Probe card transport mechanism, probe card transport method, and probe apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102193059A CN102193059A (en) | 2011-09-21 |
| CN102193059B true CN102193059B (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110038311.3A Active CN102193059B (en) | 2010-02-12 | 2011-02-12 | Conveying mechanism of probe card, conveying method of probe card and probe device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5517344B2 (en) |
| KR (1) | KR101272449B1 (en) |
| CN (1) | CN102193059B (en) |
| TW (1) | TWI506287B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102507996B (en) * | 2011-09-27 | 2014-02-26 | 沈玉良 | Probe card lifting mechanism |
| JP5970218B2 (en) * | 2012-03-26 | 2016-08-17 | 東京エレクトロン株式会社 | Probe device |
| JP6054150B2 (en) * | 2012-11-22 | 2016-12-27 | 日本電子材料株式会社 | Probe card case and probe card transport method |
| KR101503143B1 (en) * | 2013-01-31 | 2015-03-18 | 세메스 주식회사 | Apparatus for transferring a probe card and method of transferring a probe card |
| JP6220596B2 (en) * | 2013-08-01 | 2017-10-25 | 東京エレクトロン株式会社 | Prober |
| JP6271257B2 (en) * | 2014-01-08 | 2018-01-31 | 東京エレクトロン株式会社 | Substrate inspection apparatus and probe card transfer method |
| KR102335827B1 (en) | 2014-12-24 | 2021-12-08 | 삼성전자주식회사 | apparatus for loading a prove card and system for managing the prove card with the unit |
| JP6523838B2 (en) * | 2015-07-15 | 2019-06-05 | 東京エレクトロン株式会社 | Probe card transfer apparatus, probe card transfer method and probe apparatus |
| CN106873195B (en) * | 2015-12-11 | 2020-10-30 | De&T株式会社 | Probe unit replacing device |
| JP6861580B2 (en) * | 2017-06-05 | 2021-04-21 | 東京エレクトロン株式会社 | Inspection equipment and inspection system |
| JP7186647B2 (en) * | 2019-03-22 | 2022-12-09 | 東京エレクトロン株式会社 | Conveyor |
| KR102480726B1 (en) * | 2020-12-31 | 2022-12-26 | 주식회사 쎄믹스 | Prober system with probe card changer |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161173A (en) * | 1987-12-16 | 1989-06-23 | Tokyo Electron Ltd | Probe card automatic exchanging method for probe device |
| JP2575074B2 (en) * | 1991-08-13 | 1997-01-22 | 東京エレクトロン株式会社 | Wafer prober |
| JP2606554Y2 (en) * | 1992-01-17 | 2000-11-27 | 株式会社東京精密 | Probing equipment |
| JPH10308424A (en) * | 1997-05-08 | 1998-11-17 | Tokyo Electron Ltd | Probe card clamp mechanism and probe device |
| JP4104099B2 (en) * | 1999-07-09 | 2008-06-18 | 東京エレクトロン株式会社 | Probe card transport mechanism |
| JP4798595B2 (en) * | 2001-08-07 | 2011-10-19 | 東京エレクトロン株式会社 | Probe card transfer device and probe card transfer method |
| JP4123408B2 (en) * | 2001-12-13 | 2008-07-23 | 東京エレクトロン株式会社 | Probe card changer |
| JP4875332B2 (en) * | 2005-09-21 | 2012-02-15 | 東京エレクトロン株式会社 | Probe card transfer assist device and inspection equipment |
| WO2007074509A1 (en) * | 2005-12-27 | 2007-07-05 | Advantest Corporation | Tcp handler and method of aligning connector in tcp handler |
| US20080016676A1 (en) * | 2006-07-18 | 2008-01-24 | Jones Robert M | Automatic winder for an inside brushless stator |
| KR100847577B1 (en) * | 2006-12-27 | 2008-07-21 | 세크론 주식회사 | Probe tester for wafer |
| JP5049419B2 (en) * | 2007-07-25 | 2012-10-17 | 東京エレクトロン株式会社 | Probe card carriage and probe card handling method using the carriage |
-
2010
- 2010-02-12 JP JP2010028521A patent/JP5517344B2/en active Active
-
2011
- 2011-02-11 KR KR1020110012135A patent/KR101272449B1/en active IP Right Grant
- 2011-02-11 TW TW100104495A patent/TWI506287B/en active
- 2011-02-12 CN CN201110038311.3A patent/CN102193059B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110093712A (en) | 2011-08-18 |
| KR101272449B1 (en) | 2013-06-07 |
| TWI506287B (en) | 2015-11-01 |
| TW201144835A (en) | 2011-12-16 |
| CN102193059A (en) | 2011-09-21 |
| JP2011165995A (en) | 2011-08-25 |
| JP5517344B2 (en) | 2014-06-11 |
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