CN102192905B - 电路板检测装置及电路板检测方法 - Google Patents
电路板检测装置及电路板检测方法 Download PDFInfo
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- CN102192905B CN102192905B CN 201010127311 CN201010127311A CN102192905B CN 102192905 B CN102192905 B CN 102192905B CN 201010127311 CN201010127311 CN 201010127311 CN 201010127311 A CN201010127311 A CN 201010127311A CN 102192905 B CN102192905 B CN 102192905B
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- Prior art keywords
- circuit board
- conductive layer
- core
- photoresist
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001514 detection method Methods 0.000 title claims abstract description 62
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 76
- 238000005530 etching Methods 0.000 claims abstract description 42
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 5
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 4
- -1 copper amine Chemical class 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 9
- 239000007864 aqueous solution Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010127311 CN102192905B (zh) | 2010-03-19 | 2010-03-19 | 电路板检测装置及电路板检测方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201010127311 CN102192905B (zh) | 2010-03-19 | 2010-03-19 | 电路板检测装置及电路板检测方法 |
Publications (2)
Publication Number | Publication Date |
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CN102192905A CN102192905A (zh) | 2011-09-21 |
CN102192905B true CN102192905B (zh) | 2013-05-01 |
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Application Number | Title | Priority Date | Filing Date |
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CN 201010127311 Expired - Fee Related CN102192905B (zh) | 2010-03-19 | 2010-03-19 | 电路板检测装置及电路板检测方法 |
Country Status (1)
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CN (1) | CN102192905B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136512A (en) * | 1997-10-29 | 2000-10-24 | International Business Machines Corporation | Method of forming resistors |
CN101262736A (zh) * | 2007-03-05 | 2008-09-10 | 日东电工株式会社 | 布线电路基板及其制造方法 |
TW201132972A (en) * | 2010-03-26 | 2011-10-01 | Foxconn Advanced Tech Inc | Apparatus and method for testing printed circuit board |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003198099A (ja) * | 2001-12-28 | 2003-07-11 | Mitsubishi Paper Mills Ltd | プリント配線板の作製方法 |
-
2010
- 2010-03-19 CN CN 201010127311 patent/CN102192905B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6136512A (en) * | 1997-10-29 | 2000-10-24 | International Business Machines Corporation | Method of forming resistors |
CN101262736A (zh) * | 2007-03-05 | 2008-09-10 | 日东电工株式会社 | 布线电路基板及其制造方法 |
TW201132972A (en) * | 2010-03-26 | 2011-10-01 | Foxconn Advanced Tech Inc | Apparatus and method for testing printed circuit board |
Non-Patent Citations (1)
Title |
---|
JP特开2003-198099A 2003.07.11 |
Also Published As
Publication number | Publication date |
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CN102192905A (zh) | 2011-09-21 |
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C06 | Publication | ||
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C53 | Correction of patent for invention or patent application | ||
CB02 | Change of applicant information |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO Free format text: FORMER OWNER: FUKUI PRECISION ASSEMBLY (SHENZHEN) CO., LTD. Effective date: 20140829 |
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Free format text: CORRECT: ADDRESS; FROM: 518103 SHENZHEN, GUANGDONG PROVINCE TO: 066000 QINHUANGDAO, HEBEI PROVINCE |
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Effective date of registration: 20140829 Address after: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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