CN102190282A - MEMS (Micro Electro Mechanical System) packaging structure and manufacturing method thereof - Google Patents
MEMS (Micro Electro Mechanical System) packaging structure and manufacturing method thereof Download PDFInfo
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- CN102190282A CN102190282A CN2010101434781A CN201010143478A CN102190282A CN 102190282 A CN102190282 A CN 102190282A CN 2010101434781 A CN2010101434781 A CN 2010101434781A CN 201010143478 A CN201010143478 A CN 201010143478A CN 102190282 A CN102190282 A CN 102190282A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 title abstract description 3
- 239000012528 membrane Substances 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract 4
- 238000007789 sealing Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 17
- 230000003287 optical effect Effects 0.000 description 3
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- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
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- 230000002889 sympathetic effect Effects 0.000 description 1
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Abstract
The invention relates to an MEMS (Micro Electro Mechanical System) packaging structure and a manufacturing method thereof. An MEMS chip is arranged in a chip bonding region of a carrier, a plurality of wires are electrically connected with bonding pads of the MEMS chip and connecting pads of the carrier, a wire-cladded glue film is arranged on the bonding pads of the MEMS chip so as to completely wrap one ends of the wires, which are connected with the welding pads, a cover body is arranged on the MEMS chip through the wire-cladded glue film and form a first chamber with the MEMS chip, sealing glue covers the carrier, the MEMS chip, the wire-cladded glue film, the wires and a part of cover body, and a window of the cover body is exposed.
Description
Technical field
The present invention is about a kind of chip-packaging structure and manufacture method thereof, in detail, and about a kind of mems chip encapsulating structure and manufacture method thereof.
Background technology
With reference to figure 1, it shows the schematic diagram of known mems chip encapsulating structure.This known mems chip encapsulating structure 100 comprises: a substrate 101, a mems chip 102, drive chip 103, several wires 104 and a lid 105.This substrate 101 has several connection pads 106, and this mems chip 102 and this driving chip 103 are arranged on the surface of this substrate 101.These leads 104 electrically connect this mems chip 102 and this driving chip 103, this mems chip 102 and part connection pad 106 and this driving chip 103 and part connection pad 106 respectively.
This lid 105 is arranged on this substrate 101 and covers this mems chip 102, this driving chip 103 and these leads 104, and forms a room 107 with this substrate 101.And this lid 105 has a perforation 108, and this room 107 of these perforation 108 conductings is with extraneous.In the known mems chip encapsulating structure 100 of Fig. 1, this mems chip 102 is a micro-electro-mechanical microphone chip, and this room 107 then is a sympathetic response space, and this perforation 108 is as the path of voice signal turnover.
In above-mentioned known mems chip encapsulating structure 100; because this lid 105 is arranged on this substrate 101 to cover this mems chip 102; this drives chip 103 and these leads 104; it not only causes integral core chip package 100 to have bigger size; and because of this mems chip 102 and this driving chip 103 and these leads 104 these chips 102 of connection; 103 with the naked protection that places in this room 107 and be not subjected to adhesive body of the contact of these connection pads 106; extraneous moisture and pollution easily see through this perforation 108 and enter this room 107 or the influence of other external force; may make these chips 102; 103 and the contact of lead 104 produce oxidation or destruction, and reliability is descended.
Therefore, be necessary to provide the mems chip encapsulating structure and the manufacture method thereof of a kind of innovation and tool progressive in fact, to address the above problem.
Summary of the invention
The invention provides a kind of mems chip encapsulating structure, it comprises: a carrier, a mems chip, several wires, a line coat glued membrane (FOW; Film-over-wire), a lid and an adhesive body.This carrier definition has a chip bonding area, and has several connection gaskets, and these connection gaskets are positioned at outside this chip bonding area.This mems chip is arranged at this chip bonding area, and this mems chip has a sensing area and several weld pads, and these weld pads are positioned at the periphery of this sensing area.These leads electrically connect these weld pads and these connection gaskets.This line coats glued membrane and is arranged on these weld pads, connects an end of these weld pads to coat these leads fully.This lid coats glued membrane via this line and is arranged on this mems chip, forms one first chamber with this mems chip, and this lid has a window.This adhesive body covers this carrier, this mems chip, these leads, this line coating glued membrane and this lid of part, and appears this window.
The present invention provides a kind of manufacture method of mems chip encapsulating structure in addition, may further comprise the steps: a carrier (a) is provided, and this carrier definition has a chip bonding area, and has several connection gaskets, and these connection gaskets are positioned at outside this chip bonding area; (b) at least one chip is set in this chip bonding area, this at least one chip comprises a mems chip at least, and this mems chip has a sensing area and several weld pads, and these weld pads are positioned at the periphery of this sensing area; (c) electrically connect these weld pads and these connection gaskets respectively with several wires; (d) line is set and coats glued membrane on these weld pads, connect an end of these weld pads to coat these leads fully; (e) lid is set and coats on the glued membrane in this line, this lid has a window, and this lid and this mems chip form one first chamber; And (f) cover this carrier, this mems chip, this line coating glued membrane, these leads and this lid of part, and appear this window with adhesive body.
In mems chip encapsulating structure of the present invention and manufacture method thereof; this line coats glued membrane and is arranged on these weld pads; and coat the end that these leads connect these weld pads fully; by this; this line coating glued membrane and this adhesive body can provide the contact protective effect of these leads and these weld pads and these connection gaskets, make itself and air and aqueous vapor isolated, produce oxidation to prevent it; and can prevent the influence of external force, therefore improve the reliability of mems chip encapsulating structure.Moreover, this lid coats glued membrane via this line and is arranged on this little electrical chip, and the top board that these weld pads are positioned at this lid is projected within the projected area scope of an imaginary plane at these weld pad places, so can effectively dwindle the lid size providing under the suitable first cavity volume demand, in addition, the projected area that the top board of this lid is projected to this imaginary plane is bigger, can more reduce the overall package body thickness, the invention provides the more elasticity of volume design of this first chamber, and this carrier of the present invention can further be provided with depression, can increase the volume (action space of mems chip) of second chamber, to improve the sensitivity of this mems chip.
Description of drawings
Fig. 1 shows the schematic diagram of known mems chip encapsulating structure;
Fig. 2 A shows that one covers the schematic diagram of window that material covers the lid of first embodiment of the invention mems chip encapsulating structure at least;
Fig. 2 B shows the schematic diagram of first embodiment of mems chip encapsulating structure of the present invention;
Fig. 3 shows the schematic diagram on the other hand of first embodiment of mems chip encapsulating structure of the present invention;
Fig. 4 shows the schematic diagram of second embodiment of mems chip encapsulating structure of the present invention;
Fig. 5 shows the schematic diagram of the 3rd embodiment of mems chip encapsulating structure of the present invention;
Fig. 6 shows the schematic diagram of the 4th embodiment of mems chip encapsulating structure of the present invention;
Fig. 7 shows the schematic diagram of the 5th embodiment of mems chip encapsulating structure of the present invention;
Fig. 8 shows the schematic diagram of the 6th embodiment of mems chip encapsulating structure of the present invention;
Fig. 9 shows the schematic diagram on the other hand of the 6th embodiment of mems chip encapsulating structure of the present invention; And
Figure 10 shows the flow chart of mems chip method for packing of the present invention.
The specific embodiment
With reference to figure 2B, it shows the schematic diagram of first embodiment of mems chip encapsulating structure of the present invention.In the present embodiment, this mems chip encapsulating structure comprises: a carrier 1, a mems chip 2, several wires 3, a line coat glued membrane (FOW; Film-over-wire) 4, one lid 5 and an adhesive body 7.This carrier 1 comprises a chip bonding area 11 and several connection gaskets 12, and these connection gaskets 12 are positioned at outside this chip bonding area 11.
In the present embodiment, this carrier 1 is the lead frame of four limit flat non-connection pin encapsulation (QFN).This lead frame has a chip bearing seat and several pins, these pins be arranged at this chip bearing seat around.This chip bonding area 11 is positioned at this chip bearing seat, and these connection gaskets 12 are positioned at these pins.
This mems chip 2 is arranged at this chip bonding area 11, and this mems chip 2 has a sensing area 21 and several weld pads 211, and these weld pads 211 are positioned at the periphery of this sensing area 21.In the present embodiment, this mems chip 2 is arranged at this chip bonding area 11 via an adhesion layer 9.
These leads 3 electrically connect these weld pads 211 to these connection gaskets 12.This line coats glued membrane 4 and is arranged on these weld pads 211, to coat an end of these leads 3 these weld pads 211 of connection fully.This lid 5 coats glued membrane 4 via this line and is arranged on this mems chip 2, and it has a window 51, and forms one first chamber 6 with this mems chip 2.This line coats glued membrane 4 these leads 3 is formed protective effect, makes this lid 5 can not touch these leads 3.
In the present embodiment, this lid 5 is metal material or silicon materials, and this lid 5 has a ringwall 53 and a top board 52.This ringwall 53 connects this top board 52, and this ringwall 53 is arranged at this line and coats on the glued membrane 4.The plane that defines these weld pad 211 places is an imaginary plane (not shown), and preferably, these weld pads 211 are positioned within the projected area scope that this top board 52 is projected to this imaginary plane.
Be noted that this mems chip 2 can be the micro-electro-mechanical microphone chip, wherein this sensing area 21 has a vibration film, and this vibration film below has a recess 22, and this recess 22 forms one second chamber 8 (with reference to figure 2B) with this carrier 1; Perhaps, this mems chip 2 can be micro optical chip, and wherein this sensing area 21 is a photographic department, and this window 51 is a light-permeable zone (with reference to figure 3).
This adhesive body 7 covers this carrier 1, this mems chip 2, these leads 3, this line coating glued membrane 4 and this lid 5 of part, and appears this window 51.In the present embodiment, this adhesive body 7 is higher than this top board and forms a sunk structure 71.
With reference to figure 4, it shows the schematic diagram of second embodiment of mems chip encapsulating structure of the present invention.The mems chip encapsulating structure of present embodiment and the mems chip encapsulating structure of first embodiment (Fig. 2 B) are roughly the same, and its difference is in the structure of lid 5.In the present embodiment, the ringwall 53 of this lid 5 comprises a vertical component 531 and a horizontal component 532.One end of this horizontal component 532 is arranged at this line and coats on the glued membrane 4, this vertical component 531 connects the other end and this top board 52 of this horizontal component 532, the plane that defines these weld pad 211 places is an imaginary plane (not shown), makes these weld pads 211 be positioned within the projected area scope that this top board 52 is projected to this imaginary plane.
In the present embodiment, the area of this lid 5 is greater than the area of this mems chip 2, that is these weld pads 211 are positioned within the projected area scope that this top board 52 is projected to this imaginary plane.Compared to first embodiment, if form first chamber 6 of same volume, the lid design of present embodiment can reduce the overall package body thickness, and provides more elasticity at the volume design of first chamber 6.The mems chip encapsulating structure same section of other and first embodiment is with the same components symbolic representation, and no longer given unnecessary details at this.
With reference to figure 5, it shows the schematic diagram of the 3rd embodiment of mems chip encapsulating structure of the present invention.The mems chip encapsulating structure of present embodiment and the mems chip encapsulating structure of first embodiment (Fig. 2 B) are roughly the same, its difference is in this carrier 1 and more comprises a depression 111, it is positioned at this chip bonding area 11, this adhesion layer 9 more comprises an open-work 91, this open-work 91 is communicated with this recess 22 and this depression 111, to form this second chamber 8.The mems chip encapsulating structure same section of other and first embodiment is with the same components symbolic representation, and no longer given unnecessary details at this.
Therefore wherein, this second chamber 8 has bigger volume, provides this mems chip 2 bigger action space.For example, this mems chip 2 is a micro-electro-mechanical microphone chip, and 8 of bigger this second chambers provide vibration film bigger resonator, and has more improved the sensitivity of micro-electro-mechanical microphone chip.
With reference to figure 6, it shows the schematic diagram of the 4th embodiment of mems chip encapsulating structure of the present invention.The mems chip encapsulating structure of present embodiment and the mems chip encapsulating structure of first embodiment (Fig. 2 B) are roughly the same, its difference be in, this carrier 1 is a substrate in the present embodiment, and these connection gaskets 12 are positioned on this substrate and are arranged at outside this chip bonding area 11 (defining as dotted line).In the present embodiment, this mems chip 2 is the micro-electro-mechanical microphone chip, will be understood that, this mems chip 2 also can be micro optical chip as shown in Figure 3.In addition, the lid 5 of this mems chip encapsulating structure also can be lid 5 as shown in Figure 4.
With reference to figure 7, it shows the schematic diagram of the 5th embodiment of mems chip encapsulating structure of the present invention.The mems chip encapsulating structure (Fig. 5) of the mems chip encapsulating structure of present embodiment and the 3rd embodiment is roughly the same, its difference be in, this carrier 1 is a substrate in the present embodiment, and these connection gaskets 12 are positioned on this substrate and are arranged at outside this chip bonding area 11 (defining as dotted line).In the present embodiment, this mems chip 2 is the micro-electro-mechanical microphone chip, will be understood that, this mems chip 2 also can be micro optical chip as shown in Figure 3.In addition, the lid 5 of this mems chip encapsulating structure also can be lid 5 as shown in Figure 4.
In the 4th and the 5th embodiment, substrate as this carrier 1 can be selected from following group: an organic substrate (organic substrate), a ceramic substrate (ceramic substrate), a glass epoxy substrate (glass epoxysubstrate), a FR-4 substrate, a FR-5 substrate, a fibre strengthening substrate (fiber-reinforced substrate), a BT resin (bismaleimide triazine resin, BT resin) substrate.
With reference to figure 8, it shows the schematic diagram of the 6th embodiment of mems chip encapsulating structure of the present invention.The mems chip encapsulating structure of present embodiment and the mems chip encapsulating structure of first embodiment (Fig. 2 B) are roughly the same, and its difference is in the mems chip encapsulating structure of the 6th embodiment and more comprises one second chip 10.In the present embodiment, this second chip 10 is arranged at this chip bonding area 11, and several wires comprises several first leads 31, several second leads 32 and several privates 33.These first leads 31 electrically connect this mems chip 2 these weld pads 211 partly to this second chip 10, these second leads 32 electrically connect this second chip 10 to these connection gaskets 12, and these privates 33 electrically connect these weld pads 211 partly to these connection gaskets 12.Wherein, this second chip 10 is logic chip or special IC (ASIC) chip.
In other embodiments, this carrier 1 can more comprise a depression 111, and this adhesion layer 9 more comprises an open-work 91, and this open-work 91 is communicated with this recess 22 and this depressions 111, to form this second chamber 8 (as shown in Figure 9, can with reference to the 3rd embodiment shown in Figure 5).In Fig. 8 and Fig. 9, this carrier 1 is the lead frame of one or four limit flat non-connection pin encapsulation, will be understood that this carrier 1 also can be a substrate.
Figure 10 shows the flow chart of mems chip method for packing of the present invention.Below cooperate the mems chip encapsulating structure in the various embodiments described above to be described in detail.Cooperate refer step S81, Fig. 2 A and Fig. 2 B, a carrier 1 is provided, this carrier 1 definition has a chip bonding area 11, and has several connection gaskets 12, and these connection gaskets 12 are positioned at outside this chip bonding area 11.Wherein, this carrier 1 can be the lead frame of one or four limit flat non-connection pin encapsulation, and this chip bonding area 11 is positioned at the chip bearing seat of lead frame, and these connection gaskets 12 are positioned at the pin of lead frame; Or this carrier 1 can be a substrate, and these connection gaskets 12 are positioned on this substrate and are arranged at outside the chip bonding area.
Refer step S82 is provided with at least one chip in this chip bonding area 11, and this at least one chip comprises a mems chip 2 (Fig. 2 B-7) at least, and this at least one chip also can comprise a mems chip 2 and one second chip (Fig. 8-9).This mems chip 2 has a sensing area 21 and several weld pads 211, and these weld pads 211 are positioned at the periphery of this sensing area 21.Preferably, this mems chip 2 is arranged at this chip bonding area 11 via an adhesion layer 9 in step S82.
Refer step S83 electrically connects these weld pads 211 and these connection gaskets 12 respectively with several wires 3.
Refer step S84 is provided with a line and coats glued membrane 4 on these weld pads 211, to coat an end of these leads 3 these weld pads 211 of connection fully.
Refer step S85 is provided with a lid 5 and coats on the glued membrane 4 in this line, and this lid 5 has a window 51, and this lid 5 forms one first chamber 6 with this mems chip 2.
Refer step S86 covers this carrier 1, this mems chip 2, this line coating glued membrane 4, these leads 3 and this lid 5 of part with adhesive body 7, and appears this window 51.In the present embodiment, step S86 may further comprise the steps: step S861 covers the window 51 (with reference to figure 2A) that material 13 covers this lid 5 at least with one; Step S862 covers this carrier 1, this mems chip 2, this line coating glued membrane 4, these leads 3 and part this lid 5 (with reference to figure 2A) with this adhesive body 7; And step S863, remove this covering material 13, with the window 51 (with reference to figure 2B) that appears this lid 5.Will be understood that this covering material 13 can only cover these window 51 places (that is also being coated with this adhesive body 7 on the top board 52 of this lid 5 except that these window 51 places).
Be noted that, if the mems chip encapsulating structure is as Fig. 5, Fig. 7 or mems chip encapsulating structure shown in Figure 9, then step S81 comprises one in addition in the step of this chip bonding area 11 formation one depression 111, step S82 comprises one in addition in the step of this adhesion layer 9 formation one open-work 91, and this open-work 91 is communicated with this depression 111, makes and forms one second chamber 8 between this mems chip 2 and this carrier 1.
In addition, if the mems chip encapsulating structure comprises this mems chip 2 and one second chip 10, then in step S82, this second chip 10 and this mems chip 2 are arranged at this chip bonding area 11, in step S83, other comprise with several first leads 31 electrically connect these second chips 10 and this mems chip 2 step, electrically connect the step of these connection gaskets of part and this second chip 10 with several second leads 32, and electrically connect the step (please refer to Fig. 8 and Fig. 9) of these connection gaskets of part and this mems chip 2 with several privates 33.
In mems chip encapsulating structure of the present invention and manufacture method thereof; this line coats glued membrane 4 and is arranged on these weld pads 211; and cover the end that these leads 3 connect these weld pads 211; by this; this line coats glued membrane 4 and this adhesive body 7 can provide the contact protective effect of these leads 3 with these weld pads 211 and these connection gaskets, makes itself and air and aqueous vapor isolated, produces oxidation to prevent it; and can prevent the influence of external force, therefore improve the reliability of mems chip encapsulating structure.Moreover, this lid 5 coats glued membrane 4 via this line and is arranged on this little electrical chip 2, and these weld pads 211 are positioned within the projected area scope of imaginary plane that this top board 52 is projected to these weld pad 211 places, so can effectively dwindle the lid size providing under suitable first chamber, 6 volume requirements, in addition, the projected area that the top board 52 of this lid 5 is projected to this imaginary plane bigger (that is the area of this top board 52 is bigger), can more reduce the overall package body thickness, the invention provides the more elasticity of volume design of this first chamber 6, and the depression 111 of this carrier 1 of the present invention and the open-work 91 of this adhesion layer 9, more can increase the volume (action space of mems chip 2) of this second chamber 8, to improve the sensitivity of this mems chip 2.
The foregoing description only is explanation principle of the present invention and effect thereof, and unrestricted the present invention.Therefore practising makes amendment to the foregoing description and change in the personage of this technology does not still take off spirit of the present invention.Interest field of the present invention should be listed as claims.
Claims (15)
1. mems chip encapsulating structure comprises:
One carrier, definition has a chip bonding area, and has several connection gaskets, and these connection gaskets are positioned at outside this chip bonding area;
One mems chip is arranged at this chip bonding area, and this mems chip has a sensing area and several weld pads, and these weld pads are positioned at the periphery of this sensing area;
Several wires electrically connects these weld pads and these connection gaskets;
One line coats glued membrane, is arranged on these weld pads, connects an end of these weld pads to coat these leads fully;
One lid coats glued membrane via this line and is arranged on this mems chip, forms one first chamber with this mems chip, and this lid has a window; And
One adhesive body covers this carrier, this mems chip, these leads, this line coating glued membrane and this lid of part, and appears this window.
2. mems chip encapsulating structure as claimed in claim 1, wherein this lid has a ringwall and a top board, and this ringwall connects this top board, and this ringwall is arranged at this line and coats on the glued membrane.
3. mems chip encapsulating structure as claimed in claim 2, the plane that wherein defines these weld pad places is an imaginary plane, these weld pads are positioned within the projected area scope that this top board is projected to this imaginary plane.
4. mems chip encapsulating structure as claimed in claim 2, wherein this ringwall comprises a vertical component and a horizontal component, one end of this horizontal component is arranged at this line and coats on the glued membrane, this vertical component connects the other end and this top board of this horizontal component, the plane that defines these weld pad places is an imaginary plane, makes these weld pads be positioned within the projected area scope that this top board is projected to this imaginary plane.
5. mems chip encapsulating structure as claimed in claim 2, wherein this adhesive body is higher than this top board and forms a sunk structure.
6. mems chip encapsulating structure as claimed in claim 1, wherein this carrier is the lead frame of four limit flat non-connection pin encapsulation, this lead frame has a chip bearing seat and several pins, these pins be arranged at this chip bearing seat around, this chip bonding area is positioned at this chip bearing seat, and these connection gaskets are positioned at these pins.
7. mems chip encapsulating structure as claimed in claim 1, wherein this mems chip is the micro-electro-mechanical microphone chip, and this sensing area has a vibration film, and this vibration film below has a recess, and this recess and this carrier form one second chamber.
8. mems chip encapsulating structure as claimed in claim 7 more comprises an adhesion layer, is arranged between this mems chip and this carrier.
9. mems chip encapsulating structure as claimed in claim 8, wherein this carrier more comprises a depression, and this adhesion layer more comprises an open-work, and this open-work is communicated with this recess and this depression, to form this second chamber.
10. mems chip encapsulating structure as claimed in claim 1, more comprise one second chip, be arranged at this chip bonding area, wherein these leads comprise several first leads, several second leads and several privates in addition, these first leads electrically connect these weld pads to this second chip, these second leads electrically connect this second chip to these connection gaskets, and these privates electrically connect this mems chip to these connection gaskets.
11. the manufacture method of a mems chip encapsulating structure may further comprise the steps:
(a) provide a carrier, this carrier definition has a chip bonding area, and has several connection gaskets, and these connection gaskets are positioned at outside this chip bonding area;
(b) at least one chip is set in this chip bonding area, this at least one chip comprises a mems chip at least, and this mems chip has a sensing area and several weld pads, and these weld pads are positioned at the periphery of this sensing area;
(c) electrically connect these weld pads and these connection gaskets respectively with several wires;
(d) line is set and coats glued membrane on these weld pads, connect an end of these weld pads to coat these leads fully;
(e) lid is set and coats on the glued membrane in this line, this lid has a window, and this lid and this mems chip form one first chamber; And
(f) cover this carrier, this at least one chip, this line coating glued membrane, these leads and this lid of part with adhesive body, and appear this window.
12. as the method for claim 11, wherein step (f) may further comprise the steps:
(f1) cover the window that material covers this lid at least with one;
(f2) cover this carrier, this at least one chip, this line coating glued membrane and this lid of part with this adhesive body; And
(f3) remove this covering material, to appear the window of this lid.
13. as the method for claim 11, wherein in step (b), utilize an adhesion layer, to fix this mems chip in this chip bonding area.
14. method as claim 13, wherein step (a) comprises that in addition one forms the step of a depression in this chip bonding area, step (b) comprises that in addition one forms the step of an open-work in this adhesion layer, and this open-work is communicated with this depression, makes and forms one second chamber between this mems chip and this carrier.
15. method as claim 11, wherein in step (b), this at least one chip comprises this mems chip and one second chip, this second chip is arranged at this chip bonding area, in step (c), other comprises the step that electrically connects step, electric connection these connection gaskets of part and this second chip of this second chip and this mems chip with these leads, and electrically connects the step of these connection gaskets of part and this mems chip.
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| CN2010101434781A CN102190282A (en) | 2010-03-03 | 2010-03-03 | MEMS (Micro Electro Mechanical System) packaging structure and manufacturing method thereof |
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| CN2010101434781A CN102190282A (en) | 2010-03-03 | 2010-03-03 | MEMS (Micro Electro Mechanical System) packaging structure and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104076529A (en) * | 2014-05-13 | 2014-10-01 | 冠研（上海）企业管理咨询有限公司 | Intelligent spectacles with microphone or microphone array |
| CN105280561A (en) * | 2014-05-27 | 2016-01-27 | 英飞凌科技股份有限公司 | MEMS sensor structure based on lead frame |
| CN106744646A (en) * | 2016-12-20 | 2017-05-31 | 苏州晶方半导体科技股份有限公司 | MEMS chip encapsulating structure and method for packing |
| CN104229723B (en) * | 2013-06-20 | 2019-03-22 | 罗伯特·博世有限公司 | The component and its manufacturing method of wafer-class encapsulation form |
| DE102022202299A1 (en) | 2022-03-08 | 2023-09-14 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical component and corresponding manufacturing process |
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| CN104076529B (en) * | 2014-05-13 | 2016-04-27 | 冠研（上海）专利技术有限公司 | Be configured with the intelligent glasses of microphone or microphone array |
| CN105280561A (en) * | 2014-05-27 | 2016-01-27 | 英飞凌科技股份有限公司 | MEMS sensor structure based on lead frame |
| CN106744646A (en) * | 2016-12-20 | 2017-05-31 | 苏州晶方半导体科技股份有限公司 | MEMS chip encapsulating structure and method for packing |
| DE102022202299A1 (en) | 2022-03-08 | 2023-09-14 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical component and corresponding manufacturing process |
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