CN102189305B - Device for thermally connecting electronic and/or mechanical components and method for testing a thermal connection - Google Patents
Device for thermally connecting electronic and/or mechanical components and method for testing a thermal connection Download PDFInfo
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- CN102189305B CN102189305B CN201110039294.5A CN201110039294A CN102189305B CN 102189305 B CN102189305 B CN 102189305B CN 201110039294 A CN201110039294 A CN 201110039294A CN 102189305 B CN102189305 B CN 102189305B
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Abstract
The invention relates to a device (1) for thermally connecting an electronic and/or mechanical component (7) to at least one first side (3) of a substrate (2), comprising a substrate holding device and/or a substrate transport unit (5) and at least one energy source (6) for emitting a radiation or energy pulse (26) to and directed at a combustible substance (8) that can be placed between a contact surface (14) of the component (7) and a connection surface (15) on the first side (3) of the substrate (2), wherein at least one sensor element (20) for detecting energy (25) released during the reaction of the combustible substance (8) is provided. The invention further relates to a pick-and-place machine having such a device (1) and to a method for testing the thermal connection of a contact surface (14) of an electronic and/or mechanical component (7) to a connection surface (15) on at least one first side (3) of a substrate (2).
Description
Technical field
The present invention relates to a kind of according to claim 1 as described in the preamble, for by electronics and/or machinery the thermally coupled device at least one first side of substrate of element.In addition the invention still further relates to a kind of automatic assembling machine and a kind of for checking the method on the thermally coupled joint face at least one first side of substrate of contact-making surface of element electronics and/or machinery.
Background technology
In mounting technology, the element of electronics is arranged on substrate, particularly on circuit board.This carries out by means of being welded to connect especially, and wherein scolder is placed between each assembly and this sandwich structure heats especially in smelting furnace.At this, prove problematicly, bear harmful heat link position and each components, wherein possible especially thermally sensitive assembly cause damage.On the other hand, if be welded to connect with assembly, temperature that particularly heat sensitive assembly loads is not when enough high, the problem existing is, the link position of acquisition is very weak and may get loose.Current prior art is, using the metallic film application active, heat release for example being formed by the aluminium lamination of several nanometer thickness only and nickel dam as for solder flux, not only for low fusibility also for the thermal source of the scolder of high fusibility.
If by means of the contact-making surface at element electronics and/or machinery be called the metallic film active, nanostructured being placed between the joint face of connection gasket on substrate, or complete and be welded to connect by activator metal film, utilize so conventional optical inspection method, as AOI (automatic visual inspection), microscope, X-ray method or ultrasonic method only can be very difficult or according to these methods, can not check in process of production this being welded to connect with the embodiment conforming with the regulations completely.Special in element electronics and/or machinery is when fully or almost entirely covering is welded to connect, this is problematic.
Summary of the invention
Therefore the object of the invention is to, propose to be used for by thermally coupled a kind of device and a kind of automatic assembling machine at least one first side of substrate of element electronics and/or machinery, because the reaction of combustible has formed and has been welded to connect between the contact-making surface of element and the joint face on substrate, this device and automatic assembling machine can realize simple and reliably butt welding tap in succession performing check.Proposed in addition a kind of simple and reliably, for checking the hot linked method between the joint face on contact-making surface and the substrate of element electronics and/or machinery, this is thermally coupled because the reaction that is arranged on the combustible between contact-making surface and joint face forms.
This object according to the present invention by a kind of have according to feature described in independent claims 1, for the thermally coupled device at least one first side of substrate of element electronics and/or machinery is realized, and by a kind of have the automatic assembling machine of feature according to claim 10 and by a kind of have according to feature described in independent claims 11, for checking, the method on the thermally coupled joint face at least one first side of substrate of contact-making surface of element electronics and/or machinery is realized.The feature that the present invention is other and details are provided by dependent claims, description and accompanying drawing.With contact the described feature of device according to the present invention and details and be also applicable to apparently according to automatic assembling machine of the present invention and the method according to this invention at this, and anyway as the same respectively, thereby replacing property ground is with reference to the disclosure that is relevant to invention various aspects all the time.
According to a first aspect of the invention, this object by a kind of for by electronics and/or machinery the thermally coupled device at least one first side of substrate of element realize, this device has base plate keeping device and/or substrate transferring unit and at least one for by radiation or energy pulse is issued to and in alignment with the energy source that can be placed on the combustible between the contact-making surface of element and the joint face on the first side of substrate, at least one is wherein set for survey the sensor element of the energy discharging when combustible reacts.
By this device can the hot linked generation of direct basis check whether realize all for generation of hot linked precondition.Design at least one for survey the sensor element of the energy discharging when combustible reacts, can determine whether thus completely to complete and be welded to connect.The energy discharging when combustible reacts for place, welding position conform with the regulations or against regulation be judgment basis for thermally coupled.If at least one sensor element has been determined, do not release energy or only discharge a small amount of energy, therefore this has indicated wrong being welded to connect between the joint face on the contact-making surface of element and the first side of substrate.
This substrate is a kind of circuit board particularly, and it is delivered to regulation operating position by base plate keeping device or substrate transferring unit can process substrate in this operating position.In addition the thickness of substrate can be different.Preferably, unfertile land designs substrate or circuit board relatively.It can be substrate assembling different elements.Therefore can be by particularly electronics with mechanical element but can be also that other element is thermally coupled on substrate.
This device has at least one energy source, and this energy source is designed for and sends radiation or energy pulse and make its aligning.Radiation for example can have infrared radiation or laser beam.Therefore energy source for example can send the energy pulse of laser pulse form.In addition energy pulse can be electric pulse or pressure pulse.At least one energy source is designed for radiation or energy pulse in alignment with the combustible between the joint face being placed on the contact-making surface of element and the first side of substrate.
For by means of combustible, particularly by means of being for example that the combustible film of nanostructured metallic film, active and forming between the contact-making surface of electronic component and the joint face of substrate or connection gasket connects, the combustible that can comprise scolder simultaneously must be placed on the correct position of substrate, that is to say on joint face.On combustible or on the combustible film of active nanostructured, by element connecting portion, that is to say that the contact-making surface of element is correspondingly arranged on correct position, thereby can make the contact-making surface of element be pressed on the combustible film of combustible, particularly active nanostructured, so that again can be by combustible or combustible thin film on the joint face on substrate by the assembly head of automatic assembling machine, particularly automatic assembling machine.When the contact-making surface of element being arranged according to rules on combustible or combustible film and combustible or combustible film are arranged on the joint face on substrate, combustible or combustible film can react and produce the necessary heat of welding when they being activated by radiation or by energy pulse.Certainly, precondition is on the contact-making surface of element, on the joint face of substrate and/or among combustible or combustible film or on it, has solder flux.In the reaction of combustible, energy for example, discharges with the form of radiation, thermal-radiating form and visible ray discharges with the form of flash of light, can survey this radiation by least one sensor element.By utilizing at least one sensor element to survey the energy discharging, can show whether occur enough or combustible reaction completely.In other words, by survey the energy that discharges and and then the reaction of surveying combustible can determine whether combustible is arranged on the tram between the joint face on the contact-making surface of element and the first side of substrate, this be because the radiation of at least one energy source or energy pulse in order to activate combustible very accurately in alignment with target area and therefore only have when combustible film when combustible or active nanostructured is enough accurately to be placed and correspondingly react in the target area of radiation or energy pulse, could there is the reaction of combustible.
Advantageously, for by the device on thermally coupled at least one first side at substrate of element electronics and/or machinery, directly by thermally coupled element, on substrate, can illustrating and realize connection later.This explanation can realize for each independent being welded to connect uniquely.Especially, can be relevant to each quality being welded to connect by least one sensor element describes.
A particularly preferred improvement project according to the present invention can propose in device, on the first side of substrate and/or on the second side of substrate, at least one sensor element is set.For example one or more sensor elements can be arranged on the first side of substrate.To this alternatively or additionally, one or more sensor elements can be arranged on the second side of substrate.The layout of one or more sensor elements depends on especially, and how the energy discharging when combustible reacts gives off.If the energy discharging is in side radiation between substrate and element, at least one sensor element is preferably arranged on the first side of substrate so, that is to say and is arranged on the position that is provided with element.If substrate for example has a hole, radiation or energy pulse pass through base plate alignment combustible from below by this hole, so likely, the energy discharging when combustible reacts is radiated the second side of substrate, the side that deviates from element of substrate by hole.In this case preferably, at least one sensor element be arranged in substrate below, on the second side of substrate.
In addition a device preferably, in this device, at least one sensor element is designed for and surveys heat radiation and/or light radiation.So at least one sensor element can detect when combustible reacts discharge, for example, with the visible ray of the form of flash of light.
According to a particularly preferred improvement project of the present invention, in device, can propose, at least one sensor element is designed for duration and/or the intensity of energy, particularly heat radiation and/or light radiation that detection discharges.By duration and/or the intensity of surveying the energy discharging, can and and then be that the quality being welded to connect illustrates reliably about the quality of the reaction of combustible especially.
According to another preferred improvement project of the present invention, in device, can propose, at least one sensor element is arranged on the assembly head of device or on plane platform, this plane platform is arranged on the below that remains on the substrate on base plate keeping device and/or substrate transferring unit.Particularly advantageously a device, in this device, at least one sensor element is arranged on this device movingly.By at least one sensor element being arranged on the assembly head of this device, can make this device towards the motion of each portion of being welded to connect through plan.That is to say, by sensor element and being connected with simple mode and method of assembly head guaranteeing that sensor element is arranged near rigging position and and then is arranged near implemented thermally coupled.If at least one energy source be arranged in plane platform, namely at least can the plane platform of two dimensional motion, particularly have in the navigation system of plane-servo-stepper motor, its midplane tablecloth put remain on substrate on base plate keeping device and/or substrate transferring unit below, so also advantageously at least one sensor element is arranged on substrate below, particularly plane platform.In other words, plane platform preferably can two dimension or three-dimensional motion.Preferably be arranged in the energy source on plane platform and be arranged in equally the correspondingly portion of being welded to connect two-dimentional or that dimensionally plan towards the each process motion of sensor element on plane platform.That is to say, energy source and sensor element can move to the below in the each hole in substrate by movable plane platform, to make radiation or energy pulse be aimed at and led or survey the energy discharging when combustible reacts by hole separately.Plane platform advantageously moves in horizontal plane, so that all positions can be moved on X-/Y-bearing of trend.Additionally can propose, plane platform also can be vertically, namely in Z-side, move upward, the party upwards plane platform towards substrate motion or from substrate motion, leave.
Another preferred improvement project according to the present invention can propose in this device, determining device is set for determining, and when whether element electronics and/or machinery be pressed on combustible, and/or whether and when at least one energy source send radiation or energy source pulse, and coupling apparatus (Verknuepfungseinrichtung) is set for combining by the measurement result of the definite measured value of determining device and at least one sensor element.Determining device for example can be determined at motion and/or the thrust of measuring element on combustible or on combustible film of device head in Z-direction.In addition determining device can design like this, and determining device is determined the radiation of at least one energy source or duration and the intensity of energy pulse, particularly radiation or energy pulse.Coupling apparatus combines the measurement result of the information of determining device or determined measured value and at least one sensor element, thereby can explain in precise term according to existing information, element whether as be connected with substrate planning.Coupling apparatus can be realized, can be for each connected element testing and record for forming be welded to connect special and at length until the necessary condition of single welding position level.By by the information of determining device, the for example position of assembly head in Z-direction, the drive current of assembly head is measured or vacuum measurement combines as the index of the element in this position and the measurement result of at least one sensor element, this sensor element measure light radiation and and then indirectly survey the reaction of the combustible film of nanostructured combustible or active, in conjunction with by send radiation or energy pulse for activating combustible or combustible film definite time point, and the information that binding member just in time assembles, can determine whether to meet all for welding necessary precondition and particularly how meeting well this precondition.That is to say, after connection procedure, can carry out immediately about the implemented detailed description being welded to connect.This explanation is carried out for each being welded to connect individually.When correspondingly assessing, also can be to the quality about parameter, for example explanation of thrust, reaction time and intensity and point of response is tested.
Particularly advantageously a device, in this device, adjusting device is set, this adjusting device depends on the measurement result of at least one sensor element or depends on that the result that the measurement result of the measured value of determining device and at least one sensor element is combined controls at least one energy source for being issued to combustible by the radiation through upgrading or through the energy pulse upgrading.That is to say, do not implement or low quality implement to be welded to connect, so by adjusting device, can again control at least one energy source, thereby this energy source again by radiation or energy pulse in alignment with combustible.This adjusting device can be upgraded non-existent or wrong being welded to connect immediately.For example when at least one sensor element, determined that duration of the energy, the particularly light radiation that discharged that discharge and undercapacity are when enough, adjusting device can repeat to control at least one energy source.Particularly advantageously, the measurement result of at least one sensor element and the measured value of determining device, the thrust of for example element or the position of assembly head, by adjusting device, be used for judgement and be welded to connect, to then control at least one energy source under certain condition for being issued to combustible by the radiation through upgrading or through the energy pulse upgrading.
In addition a device is preferably provided with the measurement result of measurement result for recording at least one sensor element or at least one sensor element and the record cell of the measured value that draws by determining device in this device.This can realize the manufacture of substrate is monitored, and particularly can prove being uniquely welded to connect of substrate.So can also be recorded in by record cell the energy discharging in combustible or the reaction of combustible film except intensity, duration and compactedness, about the information of the intensity of radiation or energy pulse, about the locating information of assembly head and and then be about the locating information of element or the information of the thrust of element on combustible or on combustible film.
By record cell and adjusting device, can realize, if determined the fault of the reaction of combustible or inadequate reaction of combustible on a position by the measurement of at least one sensor element, by send through renewal, particularly stronger energy pulse is realized the initial reaction of combustible or reaction completely subsequently, introduces to a certain extent thus troubleshooting procedure.Adjusting device and record cell can be realized, and can be welded to connect very reliably maybe and can sort out being welded to connect accurately of mistake.
According to a second aspect of the invention, this object realizes by a kind of automatic assembling machine, this automatic assembling machine have for by electronics and/or machinery the thermally coupled device at least the first side of substrate of element, wherein this device has base plate keeping device and/or substrate transferring unit and at least one for by radiation or energy pulse is issued to and in alignment with the energy source that can be placed on the combustible between the contact-making surface of element and the joint face on the first side of substrate, and wherein for the thermally coupled device at least one first side of substrate of element electronics and/or machinery is designed according to a first aspect of the invention.
Have such design device, also referred to as the automatic assembling machine putting together machines, can realize, according between the contact-making surface of element and the joint face of substrate, produce thermally coupled can Direct Test whether meet all for producing hot linked precondition.By the possibility of measurement and the record being welded to connect subsequently, automatic assembling machine can prove the substrate of assembling, the particularly quality of the circuit board of assembling reliably.Especially, this automatic assembling machine can be assemblied in element on substrate in high quality, this is to be welded to connect because may automatically improve every kind by least one sensor element and adjusting device.
According to a third aspect of the invention we, this object realizes the method on the thermally coupled joint face at least one first side of substrate of contact-making surface of element electronics and/or machinery for checking by a kind of, wherein the method is characterized in that following method step:
A) combustible is arranged between the contact-making surface of element and the joint face of substrate,
B) at least one energy source sends radiation or energy pulse, and by radiation/energy pulse in alignment with the combustible packing into the form of combustible film activity, nanostructured especially, wherein solder flux is arranged on the contact-making surface of element, on the joint face of substrate and/or in combustible
Whether c) radiation or energy pulse are being issued to after combustible, at least one sensor element has been surveyed, because the reaction of combustible has discharged energy.This method can especially simply and reliably check electronics and/or machinery the contact-making surface of element and at least one first side of substrate on joint face between thermally coupled.By measuring, send the energy discharging after radiation or energy pulse, can derive very simply the quality being welded to connect.Advantageously, at least one sensor element has been surveyed the heat radiation and/or the light radiation that in the reaction of combustible or combustible film activity, nanostructured, discharge.Can check immediately whether meet all preconditions that are welded to connect for generation according to the generation being welded to connect thus, for example position of enough combustibles, combustible, enough solder flux, the position of solder flux, or the position of element.
Advantageously, at least one sensor element is also surveyed duration and/or the intensity of discharged energy, particularly heat radiation and/or light radiation.Can especially accurately determine thus reaction and and then be the quality being welded to connect.
Another preferred improvement project according to the present invention can propose in method, determining device is determined, and when whether element electronics and/or machinery be pressed on combustible, and/or whether and when at least one energy source send radiation or energy pulse, and coupling apparatus will combine by the measurement result of the determined measured value of determining device and at least one sensor.Determining device for example can be obtained the position of assembly head in Z-direction and/or element in combustible or the thrust on combustible film.Additionally or alternatively, determining device can be obtained duration and the intensity of radiation or energy pulse.Especially, determining device also can illustrate the time point existing about thrust or send radiation or the time point of energy pulse.
Coupling apparatus combines the measurement result of the information of determining device or determined measured value and at least one sensor element, thus can the information based on existing accurately illustrate element whether as be connected with substrate planning.Coupling apparatus can and at length record all being welded to connect for substrate uniqueness.By the measurement result of the information of determining device and at least one sensor element is combined and can be described about each being welded to connect in high quality.That is to say to check simply for best between element and substrate to be welded to connect whether met all preconditions.Especially, can after connection procedure, about being welded to connect of enforcement, be described in detail immediately.
Another preferred improvement project according to the present invention can propose in the method, and adjusting device depends on the measurement result of at least one sensor or depends on that the result that the measurement result of the measured value of determining device and at least one sensor element is combined controls at least one energy source for being issued to combustible by the radiation through upgrading or through the energy pulse upgrading.If do not implement or low quality implement to be welded to connect, by adjusting device, again control at least one energy source so, thus energy source again by radiation or energy pulse in alignment with combustible.Adjusting device can be upgraded non-existent or wrong being welded to connect immediately.For example, when having determined, when the duration of the energy that discharges when combustible reacts, the particularly light radiation that discharged and undercapacity, adjusting device can repeat to control at least one energy source.
In addition a kind of method is preferred, in the method the measurement result of at least one sensor element of recording unit records or the measurement result of at least one sensor element and the measured value that draws by determining device.This can realize the monitoring of the production to substrate, particularly can prove being uniquely welded to connect of substrate.So record cell can also be recorded in the energy discharging in combustible or the reaction of combustible film except intensity, duration and compactedness, about the information of the intensity of radiation or energy pulse, about the locating information of assembly head with and then be the locating information of element or the information of the thrust of element on combustible or on combustible film.
In addition a kind of method is preferred, in the method by combustible, particularly combustible active, heat release, with the form of the film of nanostructured, particularly between the contact-making surface of form insertion element and the joint face of substrate with the metallic film of nanostructured.
Accompanying drawing explanation
Below explain with reference to the accompanying drawings the present invention and its improvement project with and advantage.Schematically illustrated respectively:
Fig. 1 is according to the side view of the first enforcement variant of the device of structural principle of the present invention, and this device is used for thermally coupled in the first side of substrate element electronics and/or machinery,
Fig. 2 is according to the side view of the second enforcement variant of the device of structural principle of the present invention, and this device is used for thermally coupled in the first side of substrate element electronics and/or machinery,
Fig. 3 is according to the side view of the 3rd enforcement variant of the device of structural principle of the present invention, and this device is used for thermally coupled the first side at substrate of element electronics and/or machinery.
The element with identical function and working method illustrates with identical reference number respectively in 3 at Fig. 1.
The specific embodiment
In Fig. 1 to 3, according to structural principle according to the present invention, in side-looking, there is shown for by three different enforcement variants of the thermally coupled device 1 on substrate of element electronics and/or machinery.
In Fig. 1, schematically in side-looking, there is shown the first enforcement variant of the device 1 at least one first side 3 for element 7 electronics and/or machinery being connected to substrate 2.Substrate 2, particularly circuit board layout, on substrate transferring unit 5, or are kept by base plate transfer device 5.This substrate 2 remain between the movable transmission cheek 17 of substrate transferring unit 5 and fixing transmission cheek 16 or on.Element 7 has two contact-making surfaces 14.Substrate 2 has corresponding joint face 15, and the contact-making surface 14 of element 7 is fixed on this joint face.For the contact-making surface of element 7 14 being fixed on the joint face 15 of substrate 2, between each contact-making surface 14 and corresponding joint face 15, arranged the particularly combustible 8 of combustible film 13 forms.Additionally, solder flux be separately positioned on the contact-making surface 14 of element 7, on the joint face 15 of substrate 2 and/or in combustible 8 or on it or in combustible film 13 or on it.Energy source 6 is issued to by radiation or energy pulse 26 combustible 8 being arranged between the contact-making surface 14 of element 7 and the joint face 15 of substrate 2 respectively.Combustible 8 is designed to active, thereby makes this combustible react and release energy 25 when radiation or energy pulse 26 occur.The energy discharging 25 that is specifically designed to heat radiation and/or light radiation can be measured by sensor element 20.Sensor element 20 can derive thus combustible 8 occurred or nonevent reaction under certain condition, and and then derive being welded to connect of implementing for element 7 being fixed on substrate 2.Sensor element 20 is arranged in like this for by the thermally coupled element device 1 on substrate, and this sensor element can easily be measured discharged energy 25 when combustible 8 reacts.Because the energy discharging 25, the particularly flash of light that produced, conventionally laterally, namely parallelly or approximate be parallel to substrate 2 radiation, therefore sensor element 20 is preferably arranged in to the side of element 7.
In Fig. 2 schematically side-looking there is shown for element 7 electronics and/or machinery is connected to substrate 2, particularly the device 1 at least one first side 3 of circuit board second implements variant.Contrary with the enforcement variant of the device 1 shown in Fig. 1, at second of device 1, to implement in variant, at least one sensor element 20 is arranged in the below of substrate 2.Radiation or the energy pulse 25 in the hole 18 by guiding in substrate 2 touch combustible 8 or the combustible film 13 the contact-making surface 14 of element 7 and the joint face 15 of substrate 2.That is to say, from bottom or from the second side 4 of substrate 2, combustible 8 or combustible film 13 are loaded to radiation or energy pulse 26.The energy 25 discharging in the reaction of combustible 8 is penetrated back by the hole 18 in substrate 2, thereby the sensor element 20 that is arranged in the below of substrate 2 can be surveyed discharged energy 25.
Below base plate transfer device 5 or the arranged beneath of substrate 2 movingly place plane platform 10.The installing space 19 of plane platform 10 is shown in broken lines in automatic assembling machine.On plane platform 10, arranged collimator 12 and be fixed on (being deflectiometry component form at this) deflecting element 9 on collimator.Near plane platform 10, energy source 6 form of laser generator (here with) is arranged in device 1.The laser beam being sent by laser generator 6 sends collimator 12 to by flexible light wave guide 11.Before laser beam touches deflecting element 9, laser beam is orientated in parallel with each other in collimator 12.Deflecting element 9 guides parallel laser beam in the direction of substrate 2 or in the direction of the second side 4 of substrate 2.Deflecting element 9 is orientated like this, and laser beam is through the hole 18 in substrate 2, until laser beam touches the combustible 8 on the first side 3 that is arranged in substrate 2.Element 7 is transported on the first side 3 of substrate 2 by the unshowned holding device of assembly head, so that thermally coupled at this place and substrate 2.This element 7 is had to contact-making surface 14, and this contact-making surface is preferably designed to formed or had a solder flux by solder flux.On the first side 3 of substrate 2, arranged equally the contact-making surface 15 equally preferably with solder flux.Between two contact-making surfaces 14,15, arranged the combustible film 13 with combustible 8.Preferably, combustible film 13 is thin metallic films active, heat release.Laser beam penetrates the contact-making surface 15 on the first side 3 of substrate 2, until this laser beam touches combustible 8 in combustible film 13 and by its activation.By activating combustible 8, give off energy 25, heat particularly, this heat is used for melting solder flux.Element 7 can be thermally coupled with the first side 3 of substrate 2 thus.Plane platform 10 is preferably arranged in movingly and is parallel in the plane that substrate 2 is orientated.Utilization+Y or-Y shows the possible direction of motion of plane platform 10.Deflecting element 9 is arranged in movably on plane platform 10 in this wise, thereby can realizes the combustible 8 that activates combustible film 13 from " below ".By this special layout of substrate 2 and special design, can realize, can simply and safely activate the combustible 8 active, heat release of film 13 between the first side 3 and the element 7 of substrate 2, and not damage element 7.
This device can be realized, by very little hole 18, for example perforation or through hole apply plating, utilize " from below " laser beam to activate the combustible 8 in the combustible film 13 that is typically designed to nano thin-film of placing herein, this hole is introduced or is introduced in substrate 2 in the region of the joint face 15 of needs welding.For example, if the substrate 2 using is enough thin, is film substrate, so even can cancel hole 18 or perforation.Then the laser beam that used through hole 18 self and simultaneously nano thin-film Activation Activity, heat release, be in this locational combustible 8.Alternatively also can substitute combustible film 13 or nano thin-film and for example light the solder paste layer that is mixed with combustible particle.
For laser beam correspondingly being located, in putting together machines that element is assembled or automatic assembling machine, smooth plane platform 10 has been installed, this plane platform can make the deflectiometry parts 9 of laser beam being assembled and being upward deflected very accurately be positioned at the below of hole 18 or target area, and combustible film 13 or nano thin-film are arranged in this target area.The method is also particularly suitable for two parts by thermal process, as welding connects, and in this thermal process, link position is between the parts of needs connections hidingly.In this case, substrate 2 is penetrated by laser beam, and combustible film 13 and solder flux activity, heat release are arranged on the first side of this substrate.This penetrating depended on the material that forms substrate 2, or by very thin perforation or can in the case of applicable material, directly utilize laser beam without perforation realize.At this, laser generator 6 can be arranged in plane platform 10 sides and laser beam and import to collimator 12 and deflectiometry parts 9 by light wave guide 11 movably, and for example loop line in hawser of this light wave guide utilization is laid.
In order to utilize identical put together machines or identical automatic assembling machine assembles combustible film activity, heat release, they are similar to element 7 and encapsulate like that and preferably by supplying module, provide.
In Fig. 3 schematically side-looking there is shown for element 7 electronics and/or machinery is connected to substrate 2, particularly the device 1 at least one first side 3 of circuit board the 3rd implements variant.The 3rd of device 1 is implemented variant substantially corresponding to according to the first enforcement variant of the device 1 of Fig. 1, is wherein additionally provided with determining device 21, coupling apparatus 22, adjusting device 23 and record cell 24.
Determining device 21 is for determining whether and when element 7 electronics and/or machinery is pressed in combustible 8, and/or whether and when at least one energy source 6 sends radiation or energy pulse 26.Coupling apparatus can make to combine by the measurement result of the determined measured value of determining device 21 and sensor element 20.Following content can be very accurately described thus, as the present situation being welded to connect between element 7 and substrate 2, be correctly or mistakenly to have implemented this to be welded to connect.
Determining device 21 for example can be measured motion and/or measuring element 7 thrust on combustible film 13 of assembly head in Z-direction.In addition, determining device 21 can be measured radiation or intensity and the duration of energy pulse 26 on combustible 8.By in coupling apparatus 22 by these measured values with the measurement result of sensor element 20, the measurement of discharged energy 25 is combined, can very accurately and at length describe this, whether element 7 conforms with the regulations and is connected with substrate 2.Therefore can be described in detail for each independent being welded to connect, whether meet for the necessary precondition of being welded to connect of the best.
Adjusting device 23 can depend on that result that the measurement result of sensor element 20 or the measurement result by the measured value of determining device 21 and sensor element 20 combine controls energy source 6 for will or being transmitted into combustible 8 through the energy pulse 26 upgrading through the radiation upgraded.If do not implement or low-quality enforcement is welded to connect, can again control energy source 6 by adjusting device 23 so, thereby energy source makes radiation or energy pulse 26 in alignment with corresponding combustible 8 again.Adjusting device 23 for example can realize upgrades wrong being welded to connect immediately automatically.
Reference number table
The 1 hot linked device for element electronics and/or machinery
2 substrates
The first side of 3 substrates
The second side of 4 substrates
5 substrate transferring units
6 energy sources
7 elements
8 combustibles
9 deflecting elements/deflectiometry parts
10 plane platforms
11 light wave guides
12 collimators
13 combustible films
The contact-making surface of 14 elements
15 contact-making surfaces on substrate
16 fixing transmission cheeks
17 movable transmission cheeks
18 holes in substrate
The installing space of 19 plane platforms
20 sensor elements
21 determining devices
22 coupling apparatus
23 adjusting devices
24 record cells
25 energy/the light radiation that discharge
26 radiation/energy pulse
Claims (28)
- One kind for by electronics and/or machinery the thermally coupled device (1) at least one first side (3) of substrate (2) of element (7), described device has base plate keeping device and/or substrate transferring unit (5) and at least one for by radiation or energy pulse (26) is issued to and in alignment with the energy source (6) that can be placed on the combustible (8) between the contact-making surface (14) of described element (7) and the joint face (15) on described first side (3) of described substrate (2), it is characterized in that, at least one is set for survey the sensor element (20) of the energy (25) discharging when described combustible (8) reacts, wherein, determining device (21) is set for determining, and when whether element (7) described electronics and/or machinery be pressed on described combustible (8), and/or whether and when described at least one energy source (6) sends described radiation or described energy pulse (26), and coupling apparatus (22) is set for combining by the measurement result of the definite measured value of described determining device (21) and described at least one sensor element (20).
- 2. device according to claim 1 (1), is characterized in that, described at least one sensor element (20) is arranged on second side (4) of the upper and/or described substrate (2) in described first side (3) of described substrate (2).
- 3. device according to claim 1 and 2 (1), is characterized in that, described at least one sensor element (20) is designed for surveys heat radiation and/or light radiation.
- 4. device according to claim 1 and 2 (1), is characterized in that, described at least one sensor element (20) is designed for duration and/or the intensity of the energy (25) of surveying described release.
- 5. device according to claim 4 (1), is characterized in that, the energy (25) of described release is heat radiation and/or light radiation.
- 6. device according to claim 3 (1), is characterized in that, described at least one sensor element (20) is designed for duration and/or the intensity of the energy (25) of surveying described release.
- 7. device according to claim 6 (1), is characterized in that, the energy (25) of described release is heat radiation and/or light radiation.
- 8. device according to claim 1 and 2 (1), it is characterized in that, described at least one sensor element (20) be arranged on the assembly head of described device (1) or plane platform (10) upper, described plane platform is arranged on the below that remains on the described substrate (2) on described base plate keeping device and/or substrate transferring unit (5).
- 9. device according to claim 7 (1), it is characterized in that, described at least one sensor element (20) be arranged on the assembly head of described device (1) or plane platform (10) upper, described plane platform is arranged on the below that remains on the described substrate (2) on described base plate keeping device and/or substrate transferring unit (5).。
- 10. device according to claim 1 and 2 (1), it is characterized in that, adjusting device (23) is set, and described adjusting device depends on the described measurement result of described at least one sensor element (20) or depends on that the result that the described measurement result of the described measured value of described determining device (21) and described at least one sensor element (20) is combined controls described at least one energy source (6) for being issued to described combustible (8) by the radiation through upgrading or through the energy pulse (26) upgrading.
- 11. devices according to claim 9 (1), it is characterized in that, adjusting device (23) is set, and described adjusting device depends on the described measurement result of described at least one sensor element (20) or depends on that the result that the described measurement result of the described measured value of described determining device (21) and described at least one sensor element (20) is combined controls described at least one energy source (6) for being issued to described combustible (8) by the radiation through upgrading or through the energy pulse (26) upgrading.
- 12. devices according to claim 1 and 2 (1), it is characterized in that, record cell (24) is set, for the described measured value that records the described described measurement result of at least one sensor element (20) or the described measurement result of described at least one sensor element (20) and draw by described determining device (21).
- 13. devices according to claim 11 (1), it is characterized in that, record cell (24) is set, for the described measured value that records the described described measurement result of at least one sensor element (20) or the described measurement result of described at least one sensor element (20) and draw by described determining device (21).
- 14. devices according to claim 1 and 2 (1), is characterized in that, described at least one sensor element (20) is arranged on described device movingly.
- 15. devices according to claim 13 (1), is characterized in that, described at least one sensor element (20) is arranged on described device movingly.
- 16. 1 kinds of automatic assembling machines, have according to the device designing described in any one in claim 1 to 15 (1).
- 17. 1 kinds for checking the method on the thermally coupled joint face (15) at least one first side (3) of substrate (2) of contact-making surface (14) of element (7) electronics and/or machinery, and described method is characterised in that following method step:A) combustible (8) is arranged between the described contact-making surface (14) of described element (7) and the described joint face (15) of described substrate (2),B) at least one energy source (6) sends radiation or energy pulse (26), and by described radiation/described energy pulse in alignment with described combustible (8), wherein solder flux is arranged in the upper and/or described combustible (8) of described contact-making surface (14) the described joint face (15) upper, described substrate (2) of described element (7)C) described radiation or described energy pulse (26) are being issued to after described combustible (8), at least one sensor element (20) has been surveyed, whether because the reaction of described combustible (8) has discharged energy (25), wherein, determining device (21) is determined, and when whether element (7) described electronics and/or machinery be pressed on described combustible (8), and/or whether and when described at least one energy source (6) sends described radiation or described energy pulse (26), and coupling apparatus (22) will combine by the measurement result of the definite measured value of described determining device (21) and described at least one sensor element (20).
- 18. methods according to claim 17, is characterized in that, described at least one sensor element (20) is surveyed heat radiation and/or light radiation.
- 19. according to the method described in claim 17 or 18, it is characterized in that, described at least one sensor element (20) is surveyed duration and/or the intensity of the energy (25) of described release.
- 20. methods according to claim 19, is characterized in that, the energy (25) of described release is heat radiation and/or light radiation.
- 21. according to the method described in claim 17 or 18, it is characterized in that, adjusting device (23) depends on the described measurement result of described at least one sensor element (20) or depends on that the result that the described measurement result of the described measured value of described determining device (21) and at least one sensor element (20) is combined controls described at least one energy source (6) for being issued to described combustible (8) by the radiation through upgrading or through the energy pulse (26) upgrading.
- 22. methods according to claim 20, it is characterized in that, adjusting device (23) depends on the described measurement result of described at least one sensor element (20) or depends on that the result that the described measurement result of the described measured value of described determining device (21) and at least one sensor element (20) is combined controls described at least one energy source (6) for being issued to described combustible (8) by the radiation through upgrading or through the energy pulse (26) upgrading.
- 23. according to the method described in claim 17 or 18, it is characterized in that the described described measurement result of at least one sensor element (20) of record cell (24) record or the described measurement result of described at least one sensor element (20) and the described measured value drawing by described determining device (21).
- 24. methods according to claim 22, it is characterized in that the described described measurement result of at least one sensor element (20) of record cell (24) record or the described measurement result of described at least one sensor element (20) and the described measured value drawing by described determining device (21).
- 25. according to the method described in claim 17 or 18, it is characterized in that, described combustible (8) is inserted between the described contact-making surface (14) of described element (7) and the described joint face (15) of described substrate (2) with the form of the film of nanostructured.
- 26. methods according to claim 24, is characterized in that, described combustible (8) is inserted between the described contact-making surface (14) of described element (7) and the described joint face (15) of described substrate (2) with the form of the film of nanostructured.
- 27. methods according to claim 25, is characterized in that, described combustible (8) is combustible active, heat release, and the film of described nanostructured is the metallic film of nanostructured.
- 28. methods according to claim 26, is characterized in that, described combustible (8) is combustible active, heat release, and the film of described nanostructured is the metallic film of nanostructured.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE201010010193 DE102010010193A1 (en) | 2010-03-04 | 2010-03-04 | Placement machine device for thermal connection of electronic and/or mechanical components to side of printed circuit board, has supply for emitting and aligning pulse, and sensor element measuring energy set free with reaction of fuel |
| DE102010010193.1 | 2010-03-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102189305A CN102189305A (en) | 2011-09-21 |
| CN102189305B true CN102189305B (en) | 2014-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110039294.5A Expired - Fee Related CN102189305B (en) | 2010-03-04 | 2011-02-16 | Device for thermally connecting electronic and/or mechanical components and method for testing a thermal connection |
Country Status (2)
| Country | Link |
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| CN (1) | CN102189305B (en) |
| DE (1) | DE102010010193A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011116259A1 (en) * | 2011-10-18 | 2013-04-18 | Giesecke & Devrient Gmbh | Contacting an antenna |
| CN111086826A (en) * | 2018-10-23 | 2020-05-01 | 无锡品冠物联科技有限公司 | E-commerce delivery scanner |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3834147A1 (en) * | 1988-10-07 | 1990-04-12 | Systec Digital Analog Tech | Soldering method for connecting electronic and/or mechanical components to a printed circuit board, and additive and a laser soldering device |
| CN101394997A (en) * | 2006-03-24 | 2009-03-25 | 派克汉尼芬公司 | Reactive foil assembly |
| CN101621920A (en) * | 2008-07-04 | 2010-01-06 | 西门子电子集成系统有限责任两合公司 | Automatic assembling machine and assembling method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63144860A (en) * | 1986-12-09 | 1988-06-17 | Toshiba Corp | Automatic brazing device |
| DE3939812C2 (en) * | 1989-12-01 | 1993-11-11 | Deutsche Aerospace | Laser soldering system for SMD elements |
| US8882301B2 (en) * | 2007-08-31 | 2014-11-11 | Nanofoil Corporation | Method for low temperature bonding of electronic components |
-
2010
- 2010-03-04 DE DE201010010193 patent/DE102010010193A1/en not_active Withdrawn
-
2011
- 2011-02-16 CN CN201110039294.5A patent/CN102189305B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3834147A1 (en) * | 1988-10-07 | 1990-04-12 | Systec Digital Analog Tech | Soldering method for connecting electronic and/or mechanical components to a printed circuit board, and additive and a laser soldering device |
| CN101394997A (en) * | 2006-03-24 | 2009-03-25 | 派克汉尼芬公司 | Reactive foil assembly |
| CN101621920A (en) * | 2008-07-04 | 2010-01-06 | 西门子电子集成系统有限责任两合公司 | Automatic assembling machine and assembling method |
Non-Patent Citations (1)
| Title |
|---|
| JP昭63-144860A 1988.06.17 |
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| CN102189305A (en) | 2011-09-21 |
| DE102010010193A1 (en) | 2011-09-08 |
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